CN112272495A - High-strength copper alloy heat conduction pipe with high heat conductivity for electronic product - Google Patents
High-strength copper alloy heat conduction pipe with high heat conductivity for electronic product Download PDFInfo
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- CN112272495A CN112272495A CN202011142019.1A CN202011142019A CN112272495A CN 112272495 A CN112272495 A CN 112272495A CN 202011142019 A CN202011142019 A CN 202011142019A CN 112272495 A CN112272495 A CN 112272495A
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- copper alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The invention belongs to the technical field of alloy and manufacturing, and particularly relates to a high-strength copper alloy heat-conducting pipe with high heat conductivity for an electronic product, which comprises the following components in percentage by mass: 0.5 to 0.8 percent of Cr; 0.2 to 0.26 percent of Ni; 0.05 to 0.4 percent of Zr; 0.03-0.05% of Nb; 0.06-0.07% of Mg; 0.04-0.08% of Fe; 0.01 to 0.03 percent of Sn; 0.01 to 0.05 percent of Ag; rh, 0.01-0.05%; 0.04 to 0.12 percent of Ce; 0.02-0.03% of P; cu, the balance; and the sum of the mass percentages of Ag and Rh is within the range of 0.06 +/-0.002. The copper alloy heat conduction pipe provided by the invention has the advantages of good stability, high mechanical strength, good heat conduction effect, good plasticity, simple preparation process and economic comprehensive cost, can be filled with cooling liquid or volatile heat conduction medium, and is suitable for efficient heat dissipation of various electronic products.
Description
Technical Field
The invention belongs to the technical field of alloy and manufacturing, and particularly relates to a high-strength copper alloy heat-conducting pipe with high heat conductivity for electronic products.
Background
With the rapid development of the technology industry, the integration level of various electronic products is higher and higher, and the functions are more and more complex. Meanwhile, the heat dissipation problem of various heating elements is more and more prominent, and becomes one of the main limitations for further improving the performance of electronic products. Electronic components are generally fragile, and the electronic components are easily damaged due to insufficient heat dissipation. The heat conducting pipe is a common basic component in various heat radiating devices, and a heat conducting medium can be filled in the heat conducting pipe to realize the rapid heat transfer. In the implementation process, the various copper alloy heat conduction pipes provided by the prior art are difficult to take into consideration in the aspects of heat conduction performance, mechanical performance, stability and the like, and meanwhile, the design aspect of the heat conduction pipe configuration is required to be improved. The heat conductivity limits the rate of heat transferring to the periphery through the pipe wall of the heat conduction pipe, the tensile strength and the yield strength limit the wall thickness of the heat conduction pipe and the maximum pressure of an internal working medium, the elongation limit the plasticity of the heat conduction pipe and have important influence on later processing, and the quality of the configuration design has important influence on a heat dissipation passage and the reliability. In the past, how to provide a heat conduction pipe with outstanding comprehensive performance is an important issue to be solved urgently in the field of electronic technology.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the high-strength copper alloy heat-conducting pipe with high heat conductivity for the electronic product.
In order to achieve the purpose, the invention is realized by the following technical scheme: a high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.5-0.8％；
Ni，0.2-0.26%；
Zr，0.05-0.4％；
Nb，0.03-0.05％；
Mg，0.06-0.07％；
Fe，0.04-0.08%；
Sn，0.01-0.03%；
Ag，0.01-0.05％；
Rh，0.01-0.05％；
Ce，0.04-0.12％；
P，0.02-0.03％；
cu, the balance;
and the sum of the mass percentages of Ag and Rh is within the range of 0.06 +/-0.002.
Further, the above-mentioned high-strength copper alloy heat conduction pipe with high thermal conductivity for electronic products is preferably composed of the following components by mass percent:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.02％；
Rh，0.04％；
Ce，0.07％；
P，0.02％；
cu, balance.
Further, the high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
During the preparation process, the smelting temperature is preferably in the range of 1180-1230 ℃; the extrusion temperature is preferably within 945 +/-2 ℃; the cooling liquid used in the water cooling step is preferably nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is preferably within the range of 570 +/-3 ℃; the time of the aging treatment is preferably within the range of 80-120 min; the aging treatment preferably uses an atmosphere with a hydrogen content of 0.2 + -0.02% by volume and a nitrogen content as the remainder.
Furthermore, the section of the high-strength copper alloy heat conduction pipe with high heat conductivity for the electronic product is 8-shaped, the inner wall of the heat conduction pipe is smooth, and the outer wall of the heat conduction pipe is also integrally provided with a group of heat dissipation fin plates along the length direction of the pipe.
Has the advantages that: the invention provides a high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products, which has the advantages of good stability, high mechanical strength, good heat conduction effect, good plasticity, simple preparation process and economic comprehensive cost, can be filled with cooling liquid or volatile heat conduction media, and is suitable for efficient heat dissipation of various electronic products.
Drawings
Fig. 1 is a perspective view of the present invention.
Detailed Description
The invention will be further illustrated by the following specific examples, which are given for the purpose of illustration only and are not intended to be limiting.
Example 1
A high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.5％；
Ni，0.26%；
Zr，0.05％；
Nb，0.03％；
Mg，0.06％；
Fe，0.04%；
Sn，0.01%；
Ag，0.01％；
Rh，0.05％；
Ce，0.04％；
P，0.02％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is 1180 ℃; the extrusion temperature is within 945 +/-2 ℃; the cooling liquid used in the water cooling step is a nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is within 570 +/-3 ℃; aging treatment time is 80 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
The copper alloy heat-conducting pipe provided by the embodiment has excellent material performance, the heat transfer coefficient reaches 335W/m.K at room temperature, the heat transfer coefficient is 40-80% higher than that of the conventional copper alloy, the tensile strength reaches 1150MPa, the tensile strength is 25-40% higher than that of the conventional copper alloy, the elongation rate reaches 15%, the elongation rate is 90-150% higher than that of the conventional copper alloy, the yield strength reaches 1060MPa, and the yield strength is 25-35% higher than that of the conventional copper alloy.
Example 2
A high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.8％；
Ni，0.2%；
Zr，0.4％；
Nb，0.05％；
Mg，0.07％；
Fe，0.08%；
Sn，0.03%；
Ag，0.05％；
Rh，0.01％；
Ce，0.12％；
P，0.03％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is in the range of 1230 ℃; the extrusion temperature is within 945 +/-2 ℃; the cooling liquid used in the water cooling step is a nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is within 570 +/-3 ℃; aging treatment time is 120 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
The copper alloy heat pipe provided by the embodiment has excellent material performance, the heat transfer coefficient reaches 320W/m.K at room temperature, the heat transfer coefficient is 35-80% higher than that of the conventional copper alloy, the tensile strength reaches 1180MPa, the elongation is 25-40% higher than that of the conventional copper alloy, the elongation is 14%, the elongation is 80-135% higher than that of the conventional copper alloy, the yield strength reaches 1065MPa, and the yield strength is 25-35% higher than that of the conventional copper alloy.
Example 3
A high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.02％；
Rh，0.04％；
Ce，0.07％；
P，0.02％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is 1210 ℃; the extrusion temperature is within 945 +/-2 ℃; the cooling liquid used in the water cooling step is a nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is within 570 +/-3 ℃; aging treatment time is 105 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
The copper alloy heat pipe provided by the embodiment has excellent material performance, the heat transfer coefficient reaches 340W/m.K at room temperature, the heat transfer coefficient is higher than that of the conventional copper alloy by 40-80%, the tensile strength reaches 1195MPa, the elongation is higher than that of the conventional copper alloy by 30-40%, the elongation is higher than 17%, the elongation is higher than that of the conventional copper alloy by 100-180%, and the yield strength is 1070MPa, and the elongation is higher than that of the conventional copper alloy by 25-40%.
In this embodiment, the cross section of the heat pipe is 8-shaped as shown in fig. 1; the outer wall is also provided with a group of radiating fins along the length direction of the tube.
Comparative example 1
A copper alloy heat conduction pipe comprises the following components in percentage by mass:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.05％；
Rh，0.06％；
Ce，0.07％；
P，0.02％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is 1210 ℃; the extrusion temperature is within 945 +/-2 ℃; the cooling liquid used in the water cooling step is a nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is within 570 +/-3 ℃; aging treatment time is 105 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
The heat transfer coefficient of the copper alloy heat pipe provided by the embodiment is 320W/m.K, the tensile strength is 825MPa, the elongation is 9 percent, and the yield strength is 740MPa at room temperature.
Comparative example 2
A high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.02％；
Rh，0.04％；
Ce，0.07％；
P，0.02％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is 1210 ℃; the extrusion temperature is within 945 +/-2 ℃; water is used as cooling liquid used in the water cooling step, and the temperature of the aging treatment is within the range of 570 +/-3 ℃; aging treatment time is 105 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
The heat transfer coefficient of the copper alloy heat pipe provided in this example was 185W/m.K, the tensile strength was 1120MPa, the elongation was 14%, and the yield strength was 965MPa at room temperature.
Comparative example 3
A high-strength copper alloy heat conduction pipe with high heat conductivity for electronic products comprises the following components in percentage by mass:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.02％；
Rh，0.04％；
Ce，0.07％；
P，0.02％；
cu, balance.
In this embodiment, the heat conducting pipe is prepared by smelting, casting, extruding, water cooling and aging treatment. Specifically, the components are proportioned according to the proportion, the proportioned components are smelted at high temperature and cast into a strip-shaped blank with a circular cross section, the blank is extruded in a die to form a pipe body with a specific cross section, and the pipe body is subjected to water cooling and aging treatment to obtain a finished heat conduction pipe.
In the embodiment, the smelting temperature is 1210 ℃; the extrusion temperature is within 945 +/-2 ℃; the cooling liquid used in the water cooling step is a nano carbohydrate solution with the mass percentage of 0.052-0.065%; the temperature of the aging treatment is within 570 +/-3 ℃; aging treatment time is 105 min; the atmosphere for aging treatment was nitrogen.
The heat transfer coefficient of the copper alloy heat pipe provided in this embodiment is 205W/m · K, the tensile strength 990Mpa, the elongation 13%, and the yield strength 915Mpa at room temperature.
Examples 1, 2 and 3 of the present invention all achieved excellent overall performance. Comparative examples 1, 2 and 3 differ from example 3 in the content of Ag and Rh, the kind of coolant, and the atmosphere of aging treatment, respectively, but their properties are significantly different from example 3. In the invention, the matching relation of Ag and Rh contents, the type of the cooling liquid and the aging treatment atmosphere play a key role in improving the performance.
The above embodiments are merely preferred embodiments of the present invention, and it should be noted that, for those skilled in the art, several modifications can be made without departing from the principle of the present invention, and these modifications should also be regarded as the protection scope of the present invention.
Claims (9)
1. A high strength copper alloy heat pipe that is used for high thermal conductivity of electronic product which characterized in that: the composite material comprises the following components in percentage by mass:
Cr，0.5-0.8％；
Ni，0.2-0.26%；
Zr，0.05-0.4％；
Nb，0.03-0.05％；
Mg，0.06-0.07％；
Fe，0.04-0.08%；
Sn，0.01-0.03%；
Ag，0.01-0.05％；
Rh，0.01-0.05％；
Ce，0.04-0.12％；
P，0.02-0.03％；
cu, the balance;
and the sum of the mass percentages of Ag and Rh is within the range of 0.06 +/-0.002.
2. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 1, wherein: the composite material comprises the following components in percentage by mass:
Cr，0.65％；
Ni，0.23%；
Zr，0.24％；
Nb，0.042％；
Mg，0.06％；
Fe，0.05%；
Sn，0.026%；
Ag，0.02％；
Rh，0.04％；
Ce，0.07％；
P，0.02％；
cu, balance.
3. The high-strength copper alloy heat pipe of high thermal conductivity for electronic products as recited in claim 1 or 2, wherein: the alloy is prepared by smelting, casting, extruding, water cooling and aging treatment.
4. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 3, wherein: the smelting temperature is in the range of 1180 ℃ and 1230 ℃.
5. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 3, wherein: the extrusion temperature was within 945. + -. 2 ℃.
6. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 3, wherein: the cooling liquid used in the water cooling step is nano carbohydrate solution with the mass percentage of 0.052-0.065%.
7. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 6, wherein: the temperature of the aging treatment is within 570 +/-3 ℃; the time of the aging treatment is within the range of 80-120 min; in the aging treatment atmosphere, the volume percentage of hydrogen is 0.2 +/-0.02 percent, and the balance is nitrogen.
8. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 3, wherein: the cross section is 8-shaped.
9. The high-strength copper alloy heat conductive pipe with high thermal conductivity for electronic products as claimed in claim 8, wherein: the outer wall is also provided with a group of radiating fins along the length direction of the tube.
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| CN202011142019.1A CN112272495A (en) | 2020-10-23 | 2020-10-23 | High-strength copper alloy heat conduction pipe with high heat conductivity for electronic product |
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Citations (7)
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|---|---|---|---|---|
| JPH0372045A (en) * | 1989-08-14 | 1991-03-27 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy having excellent adhesion for oxidized film |
| CN1786237A (en) * | 2004-12-08 | 2006-06-14 | 刘少光 | High strength high conductivity heat resistant copper alloy and its mannfacturing method |
| CN102560191A (en) * | 2010-12-09 | 2012-07-11 | 北京有色金属研究总院 | High-performance elastic copper alloy and preparation and processing method thereof |
| CN104060120A (en) * | 2014-07-03 | 2014-09-24 | 兰宝琴 | Method for preparing high-strength copper alloy wire rods |
| CN106399751A (en) * | 2016-10-13 | 2017-02-15 | 龙岩学院 | Preparing method for high-strength and high-conductivity copper alloy |
| CN107760920A (en) * | 2017-10-11 | 2018-03-06 | 河南科技大学 | A kind of hot copper alloy of high-strength highly-conductive and preparation method thereof |
| CN108149062A (en) * | 2018-02-10 | 2018-06-12 | 中南大学 | A kind of strong high conductive copper alloy of superelevation and preparation method thereof |
-
2020
- 2020-10-23 CN CN202011142019.1A patent/CN112272495A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372045A (en) * | 1989-08-14 | 1991-03-27 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy having excellent adhesion for oxidized film |
| CN1786237A (en) * | 2004-12-08 | 2006-06-14 | 刘少光 | High strength high conductivity heat resistant copper alloy and its mannfacturing method |
| CN102560191A (en) * | 2010-12-09 | 2012-07-11 | 北京有色金属研究总院 | High-performance elastic copper alloy and preparation and processing method thereof |
| CN104060120A (en) * | 2014-07-03 | 2014-09-24 | 兰宝琴 | Method for preparing high-strength copper alloy wire rods |
| CN106399751A (en) * | 2016-10-13 | 2017-02-15 | 龙岩学院 | Preparing method for high-strength and high-conductivity copper alloy |
| CN107760920A (en) * | 2017-10-11 | 2018-03-06 | 河南科技大学 | A kind of hot copper alloy of high-strength highly-conductive and preparation method thereof |
| CN108149062A (en) * | 2018-02-10 | 2018-06-12 | 中南大学 | A kind of strong high conductive copper alloy of superelevation and preparation method thereof |
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