CN112269147A - Detection device - Google Patents
Detection device Download PDFInfo
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- CN112269147A CN112269147A CN202011120435.1A CN202011120435A CN112269147A CN 112269147 A CN112269147 A CN 112269147A CN 202011120435 A CN202011120435 A CN 202011120435A CN 112269147 A CN112269147 A CN 112269147A
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- 238000001514 detection method Methods 0.000 title claims abstract description 107
- 238000005070 sampling Methods 0.000 claims abstract description 147
- 238000012545 processing Methods 0.000 claims abstract description 100
- 238000012360 testing method Methods 0.000 claims description 157
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 10
- 238000013507 mapping Methods 0.000 description 10
- 230000003321 amplification Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
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Abstract
The embodiment of the invention provides a detection device, and relates to the technical field of detection. The detection device comprises a detection module, a sampling module and a processing module, wherein the detection module, the sampling module and the processing module are sequentially and electrically connected, and the detection module is electrically connected with a device to be detected; the sampling module is used for acquiring the state information of the device to be detected through the detection module and transmitting the state information to the processing module; the processing module is used for determining whether the device to be tested is in a fault state according to the state information. The production efficiency and the maintenance efficiency of the device to be tested can be improved.
Description
Technical Field
The invention relates to the technical field of detection, in particular to a detection device.
Background
Various electronic devices (such as mobile phones, tablet computers, notebook computers, etc.) on the market today need to be Printed with a Printed Circuit Board (PCB) to form a PCB (Printed Circuit Board assembly) of a bare Board, and the electronic devices need to be inspected when they fail.
The current common maintenance method is that a universal meter is used for carrying out point-to-point test to judge whether a short circuit condition exists, and the problems of low production efficiency and low maintenance efficiency exist.
Disclosure of Invention
The invention aims to provide a detection device which can improve the production efficiency and the maintenance efficiency of a device to be detected.
Embodiments of the invention may be implemented as follows:
the embodiment of the invention provides a detection device, which comprises a detection module, a sampling module and a processing module, wherein the detection module, the sampling module and the processing module are sequentially and electrically connected, and the detection module is electrically connected with a device to be detected;
the sampling module is used for acquiring the state information of the device to be detected through the detection module and transmitting the state information to the processing module;
and the processing module is used for determining whether the device to be tested is in a fault state or not according to the state information.
In an optional embodiment, the detection module includes a power supply, a first resistor and a first sampling resistor, the first resistor and the first sampling resistor are connected in series between a positive electrode of the power supply and a first end of the device under test, a negative electrode of the power supply is electrically connected to a second end of the device under test, and the first sampling resistor is further electrically connected to the sampling module;
the sampling module is also used for collecting the state information of the device to be tested through the first sampling resistor.
In an optional embodiment, the detection module further includes a second resistor, a third resistor, a second sampling resistor, and a first switch, the first resistor is configured to be electrically connected to the positive electrode of the power supply through a first pin of the first switch, the second resistor is electrically connected to the positive electrode of the power supply through a second pin of the first switch, the third resistor is configured to be electrically connected to the positive electrode of the power supply through a third pin of the first switch, the second resistor is further electrically connected to the first end of the device under test, the third resistor is electrically connected to the first end of the device under test through the second sampling resistor, and the second sampling resistor is further electrically connected to the sampling module;
the sampling module is used for collecting the state information of the device to be tested through the first sampling resistor when the first resistor is communicated with the positive electrode of the power supply through the first pin of the first switch and the third resistor is not communicated with the positive electrode of the power supply through the third pin of the first switch tube;
the sampling module is also used for collecting the state information of the device to be tested through the second sampling resistor when the first resistor passes through the first pin of the first switch and the anode of the power supply is not communicated, and the third resistor passes through the third pin of the first switch tube and the anode of the power supply is communicated.
In an optional embodiment, the sampling module includes an operational amplifier, a fourth resistor, a fifth resistor, a sixth resistor, and a seventh resistor, an inverting input terminal of the operational amplifier is electrically connected to a first terminal of the first sampling resistor and a first terminal of the second sampling resistor through the fourth resistor, a non-inverting input terminal of the operational amplifier is electrically connected to a second terminal of the first sampling resistor and a second terminal of the second sampling resistor through the fifth resistor, an output terminal of the operational amplifier is electrically connected to the processing module, an output terminal of the operational amplifier is electrically connected to the inverting input terminal of the operational amplifier through the sixth resistor, and the non-inverting input terminal of the operational amplifier is grounded through the seventh resistor.
In an optional embodiment, the detection device further comprises a prompt module, and the processing module is electrically connected with the prompt module;
the processing module is further used for sending a prompt signal to control the prompt module to work when the device to be tested is judged to be in a fault state.
In an optional embodiment, the prompting module comprises a buzzer, and the processing module is electrically connected with the buzzer;
the processing module is further used for sending the prompt signal to control the buzzer to send out prompt sound when the device to be tested is judged to be in a fault state.
In an optional embodiment, the prompting module further comprises an LED lamp, and the processing module is electrically connected to the LED lamp;
the processing module is further used for sending the prompt signal to control the LED lamp to send abnormal prompt light when the device to be tested is judged to be in a fault state.
In an optional embodiment, the number of the detection modules and the number of the sampling modules are multiple, the device under test includes multiple test points, the multiple detection modules and the multiple sampling modules are electrically connected in a one-to-one correspondence, and each sampling module is electrically connected with the processing module;
the sampling module is used for acquiring the state information of the test point corresponding to the sampling module through the detection module corresponding to the sampling module and transmitting the state information to the processing module;
and the processing module is used for determining whether each test point is in a fault state or not according to the state information corresponding to each test point.
In an optional embodiment, the detection device further comprises a display module, and the processing module is electrically connected with the display module;
the processing module is further used for displaying the state information corresponding to each test point through the display module.
In an optional embodiment, the detection device further includes a connector, and the detection module is electrically connected to the device under test through the connector.
The embodiment of the invention provides a detection device, which comprises a detection module, a sampling module and a processing module, wherein the detection module, the sampling module and the processing module are sequentially and electrically connected, and the detection module is electrically connected with a device to be detected; the sampling module is used for acquiring the state information of the device to be detected through the detection module and transmitting the state information to the processing module; the processing module is used for determining whether the device to be tested is in a fault state according to the state information. Therefore, whether the device to be tested has faults or not can be automatically detected through the detection device, and the point-to-point test is not needed to be manually carried out by using a universal meter. And the detection device can be applied to the device to be detected in the actual production and manufacturing process and also can be applied to the device to be detected after the fault, so that the production efficiency and the maintenance efficiency are greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a detection apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another detecting device according to an embodiment of the present invention;
FIG. 3 is a schematic view of another detecting device according to an embodiment of the present invention;
FIG. 4 is a schematic circuit diagram of a detecting device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an acquisition module of a detection apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a processing module of a detection apparatus according to an embodiment of the present invention.
Icon: 100-a detection device; 110-a detection module; 120-a sampling module; 130-a processing module; 140-a prompt module; 141-a buzzer; 142-an LED lamp; 150-a display module; 160-connector; 170-dial switch; 180-a memory; 190-a power supply module; 200-a device under test; 210-a test point; r1 — first resistance; r2 — second resistance; r3 — third resistance; r4-fourth resistor; r5-fifth resistor; r6-sixth resistance; r7 — seventh resistor; rc1 — first sampling resistance; rc 2-second sampling resistor; k-a first switch; u1-transporting and placing device; VCC-power supply.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, the present embodiment provides a schematic structural diagram of a detection apparatus 100, where the detection apparatus 100 includes a detection module 110, a sampling module 120, and a processing module 130, the detection module 110, the sampling module 120, and the processing module 130 are sequentially electrically connected, and the detection module 110 is electrically connected to a device under test 200.
In this embodiment, the sampling module 120 is configured to collect the status information of the device under test 200 through the detection module 110, and transmit the status information to the processing module 130; the processing module 130 is configured to determine whether the device under test 200 is in a fault state according to the state information.
It can be understood that the device under test 200 may be an electronic device such as a mobile phone, a tablet, and a notebook, and may also be a PCBA in an electronic device such as a mobile phone, a tablet, and a notebook.
Wherein the status information includes path status information and short circuit status information. The processing module 130 may determine that the device under test 200 is not in the fault state according to the path state information; the processing module 130 may determine that the device under test 200 is in a fault state according to the short-circuit state information, and the fault state may indicate that the short-circuit fault occurs in the device under test 200.
Therefore, the detection device 100 can automatically detect whether the device under test 200 has a short-circuit fault, and a universal meter is not needed to manually perform point-to-point test. The detection device 100 can be applied to the device under test 200 in the actual production and manufacturing process, and can also be applied to the device under test 200 after the fault, so that the production efficiency and the maintenance efficiency are greatly improved.
As shown in fig. 2, in order to enable the staff member to know whether the device under test 200 is in the fault state in time, on the basis of the detection apparatus 100 shown in fig. 1, the detection apparatus 100 further includes a prompt module 140, and the processing module 130 is electrically connected to the prompt module 140. The processing module 130 is further configured to send a prompt signal to control the prompting module 140 to operate when it is determined that the device under test 200 is in the fault state. The cue signal may be a continuous high level signal (e.g., a continuous 5V high level signal), or may be a PWM (Pulse width modulation) level signal.
It is understood that the prompt module 140 includes a buzzer 141, and the processing module 130 is electrically connected to the buzzer 141. The processing module 130 is further configured to send a prompt signal to control the buzzer 141 to send a prompt tone when it is determined that the device under test 200 is in the fault state.
When the processing module 130 receives that the state information provided by the sampling module 120 is the short-circuit state information, the processing module 130 not only determines that the device under test 200 is in the fault state, but also sends a prompt signal to the buzzer 141 to control the buzzer 141 to send a prompt tone.
In this embodiment, the prompt module 140 may further include an LED lamp 142, and the processing module 130 is electrically connected to the LED lamp 142. The processing module 130 is further configured to send a prompt signal to control the LED lamp 142 to send an abnormal prompt light when it is determined that the device under test 200 is in the fault state.
It can be understood that when the processing module 130 receives that the status information provided by the sampling module 120 is short-circuit status information, the processing module 130 not only determines that the device under test 200 is in a fault status, but also sends a prompt signal to the LED lamp 142 to control the LED lamp 142 to emit abnormal prompt light, which may be red prompt light.
And the processing module 130 may further send a switching signal to the LED lamp 142 when receiving that the status information provided by the sampling module 120 is the access status information, so as to control the LED lamp 142 to emit normal prompt light, where the normal prompt light may be green prompt light. The switching signal may be a low level signal, for example, a 0V low level signal.
In this embodiment, the detecting module 110 and the sampling module 120 are provided in plural numbers, the device under test 200 includes a plurality of test points 210, the plurality of detecting modules 110 and the plurality of sampling modules 120 are electrically connected in a one-to-one correspondence, and each sampling module 120 is electrically connected to the processing module 130.
It is understood that the sampling module 120 is configured to collect the status information of the test point 210 corresponding thereto through the detection module 110 corresponding thereto, and transmit the status information to the processing module 130; the processing module 130 is configured to determine whether each test point 210 is in a failure state according to the state information corresponding to each test point 210.
In this embodiment, the plurality of test points 210 may be various power supply terminals, voltage-stabilized power input/output terminals, digital signal circuits, analog signal circuits, and the like. Wherein, various power supply ends can be: DC (Direct Current, DC Power supply), LDO (low dropout regulator), PMU (Power Management Unit), battery, and the like. The digital signal circuit may be: USB (Universal Serial Bus), LCD (Liquid Crystal Display), and the like. The analog signal circuit may be: sensors, etc.
In this embodiment, the detecting apparatus 100 can realize multi-path point-to-point automatic detection, and sequentially detect the circuit states of the test points 210. For example, if the device under test 200 includes a first test point 210, a second test point 210, and a third test point 210. The number of the corresponding detection modules 110 and the number of the corresponding sampling modules 120 are 3, and the detection modules are respectively the first detection module 110, the second detection module 110, the third detection module 110, the first sampling module 120, the second sampling module 120, and the third sampling module 120. Then, the first test point 210, the first detection module 110 and the first sampling module 120 are electrically connected in sequence, the second test point 210, the second detection module 110 and the second sampling module 120 are electrically connected in sequence, the third test point 210, the third detection module 110 and the third sampling module 120 are electrically connected in sequence, and the first sampling module 120, the second sampling module 120 and the third sampling module 120 are all electrically connected to the processing module 130.
It is understood that the first sampling module 120 is configured to collect the status information of the first test point 210 through the first detection module 110, and transmit the status information of the first test point 210 to the processing module 130; the second sampling module 120 is configured to collect the state information of the second test point 210 through the second detection module 110, and transmit the state information of the second test point 210 to the processing module 130; the third sampling module 120 is configured to collect the status information of the third test point 210 through the third detecting module 110, and transmit the status information of the third test point 210 to the processing module 130. The processing module 130 is configured to determine whether the first test point 210 is in a failure state according to the state information of the first test point 210, determine whether the second test point 210 is in a failure state according to the state information of the second test point 210, and determine whether the third test point 210 is in a failure state according to the state information of the third test point 210.
In order to facilitate the staff to know the test point 210 with the short-circuit fault, as shown in fig. 2, the detection apparatus 100 further includes a display module 150, and the processing module 130 is electrically connected to the display module 150. The processing module 130 is further configured to display the status information corresponding to each test point 210 through the display module 150.
It is understood that the processing module 130 can display the status information of each test point 210 on the display module 150 according to the classification and the number according to the pins connected to different collection modules and the preset mapping table.
For example, as shown in fig. 3, a display diagram of the display module 150 is shown. The state information can be classified into a plurality of categories according to the types of the test points 210, if the test points 210 are power supply terminals, the category of the state information corresponding to the test points 210 can be P, and a letter P is correspondingly displayed on the display module 150; if the test point 210 is a digital signal circuit, the type of the state information corresponding to the test point 210 may be D, and a letter D is correspondingly displayed on the display module 150; if the test point 210 is an analog signal circuit, the type of the state information corresponding to the test point 210 may be a type a, and the letter a is correspondingly displayed on the display module 150. If there are a plurality of test points 210 for power supply terminals, the status information corresponding to the plurality of test points 210 can be distinguished by numerical numbers. For example, there are 3 test points 210 of the power supply terminal, which can be represented as three status information corresponding to the test points 210 of the power supply terminal by P1, P2, and P3, respectively. Similarly, the n pieces of state information corresponding to the test points 210 of the digital signal circuits may be represented by D1 to Dn, or the n pieces of state information corresponding to the test points 210 of the analog signal circuits may be represented by a1 to An.
The specific principle that the processing module 130 displays the state information of each test point 210 on the display module 150 according to the classification and the number according to the pins connected to different acquisition modules and the preset mapping relation table may be: if the device under test 200 includes two test points 210 (which may be named a first test point 210 and a second test point 210, respectively) that are power supply terminals, two test points 210 (which may be named a third test point 210 and a fourth test point 210, respectively) that are digital signal circuits, and two test points 210 (which may be named a fifth test point 210 and a sixth test point 210, respectively) that are analog signal circuits. The number of the detection modules 110 and the number of the sampling modules 120 are respectively 6, which are the first detection module 110, the second detection module 110, the third detection module 110, the fourth detection module 110, the fifth detection module 110, the sixth detection module 110, the first sampling module 120, the second sampling module 120, the third sampling module 120, the fourth sampling module 120, the fifth sampling module 120, and the sixth sampling module 120. And the first sampling module 120, the second sampling module 120, the third sampling module 120, the fourth sampling module 120, the fifth sampling module 120, and the sixth sampling module 120 are electrically connected to a first pin, a second pin, a third pin, a fourth pin, a fifth pin, and a sixth pin of the processing module 130, respectively.
The first test point 210, the first detection module 110, the first sampling module 120 and a first pin of the processor are electrically connected in sequence, the second test point 210, the second detection module 110, the second sampling module 120 and a second pin of the processor are electrically connected in sequence, the third test point 210, the third detection module 110, the third sampling module 120 and a third pin of the processor are electrically connected in sequence, the fourth test point 210, the fourth detection module 110, the fourth sampling module 120 and a fourth pin of the processor are electrically connected in sequence, the fifth test point 210, the fifth detection module 110, the fifth sampling module 120 and a fifth pin of the processor are electrically connected in sequence, and the sixth test point 210, the sixth detection module 110, the sixth sampling module 120 and a sixth pin of the processor are electrically connected in sequence.
After the electrical connection relationship among the test point 210, the detection module 110, the sampling module 120 and the processor is determined, the worker may write the correspondence relationship between the test point 210 and the pin of the processing module 130 into the processing module 130 in the form of a relational mapping table. The mapping table records that a first pin of the processing module 130 corresponds to the first test point 210, a second pin of the processing module 130 corresponds to the second test point 210, a third pin of the processing module 130 corresponds to the third test point 210, a fourth pin of the processing module 130 corresponds to the fourth test point 210, a fifth pin of the processing module 130 corresponds to the fifth test point 210, and a sixth pin of the processing module 130 corresponds to the sixth test point 210.
If the second pin of the processing module 130 receives the status information, the processing module 130 may determine that the status information is the status information of the second test point 210 according to the pin relationship between the test point 210 and the processing module 130 recorded in the relationship mapping table. The processing module 130 displays the status information of the second testing point 210 on the display module 150 according to the category and the number.
Further, in order to facilitate the electrical connection between the device under test 200 and the detection device 100, as shown in fig. 2, the detection device 100 further includes a connector 160, and the detection module 110 is electrically connected to the device under test 200 through the connector 160.
It is understood that all test points 210 of the device under test 200 are connected to the connector 160, and the test module 110 is electrically connected to all test points 210 through the connector 160. The use of the connector 160 has advantages of high applicability and good stability.
In another embodiment, the testing device 100 can be electrically connected to the testing points 210 of the device under test 200 through copper pins in a one-to-one correspondence.
In this embodiment, since the device under test 200 can be different types of electronic devices, the test points 210 of the different types of electronic devices are different. Therefore, the detecting device 100 further includes a dial switch 170, and the dial switch 170 is electrically connected to the processing module 130. The processing module 130 selects the corresponding mapping table through the dial switch 170 to match different types of devices under test 200.
It is understood that the processing module 130 stores a mapping table corresponding to each type of the device under test 200 in advance. The dial switch 170 may respond to operator operations and provide switching instructions to the processing module 130; the processing module 130 selects the mapping table corresponding to the dut 200 according to the switching instruction. So that the detection device 100 can be matched with various types of devices to be detected 200, and the applicability of the detection device 100 is improved.
To facilitate understanding of the operation principle of the detection apparatus 100, fig. 4 is a schematic diagram of an implementable circuit of the detection apparatus 100. The detection module 110 includes a power source VCC, a first resistor R1 and a first sampling resistor Rc1, the first resistor R1 and the first sampling resistor Rc1 are connected in series between the positive electrode of the power source VCC and the first end of the device under test 200, the negative electrode of the power source VCC is electrically connected to the second end of the device under test 200, and the first sampling resistor Rc1 is further electrically connected to the sampling module 120; the sampling module 120 is further configured to collect the state information of the device under test 200 through the first sampling resistor Rc 1.
In this embodiment, if the device under test 200 is in the on state, the circuit formed by the power VCC, the first resistor R1, the first sampling resistor Rc1 and the device under test 200 is not closed, and the sampling module 120 is configured to acquire the on state information at a low level through the first sampling resistor Rc 1. If the device under test 200 is in a short-circuit state, the circuit formed by the power VCC, the first resistor R1, the first sampling resistor Rc1 and the device under test 200 is closed, and the sampling module 120 is configured to acquire high-level short-circuit state information through the first sampling resistor Rc 1.
In another embodiment, in order to improve the applicability of the detection apparatus 100, the detection module 110 may be designed to have multiple ranges to acquire different ranges of status information, so as to improve the acquisition range of the status information. As shown in fig. 4, the detection module 110 further includes a second resistor R2, a third resistor R3, a second sampling resistor Rc2, and a first switch K, the first resistor R1 is configured to be electrically connected to the positive electrode of the power VCC through the first pin of the first switch K, the second resistor R2 is electrically connected to the positive electrode of the power VCC through the second pin of the first switch K, the third resistor R3 is configured to be electrically connected to the positive electrode of the power VCC through the third pin of the first switch K, the second resistor R2 is further electrically connected to the first end of the device under test 200, the third resistor R3 is electrically connected to the first end of the device under test 200 through the second sampling resistor Rc2, and the second sampling resistor Rc2 is further electrically connected to the sampling module 120.
It can be understood that the sampling module 120 is configured to collect the state information of the device under test 200 through the first sampling resistor Rc1 when the first resistor R1 is connected to the positive electrode of the power VCC through the first pin of the first switch K, and the third resistor R3 is not connected to the positive electrode of the power VCC through the third pin of the first switch K; the sampling module 120 is further configured to acquire the state information of the device under test 200 through the second sampling resistor Rc2 when the first resistor R1 is not connected to the positive electrode of the power VCC through the first pin of the first switch K and the third resistor R3 is connected to the positive electrode of the power VCC through the third pin of the first switch K.
The resistance values of the first resistor R1 and the third resistor R3 should be different. Since the resistances of the first resistor R1 and the third resistor R3 are different, the values of the state information of the same test point 210 of the device under test 200 acquired through the first sampling resistor Rc1 and the second sampling resistor Rc2 are different. For example, if the resistance of the first resistor R1 is greater than the resistance of the third resistor R3, the value of the state information of a test point 210 of the dut 200 acquired by the first sampling resistor Rc1 is smaller than the value of the state information of the same test point 210 of the dut 200 acquired by the second sampling resistor Rc 2. That is, when the resistance value of the first resistor R1 is set to be greater than the resistance value of the second resistor R2, a small range of the sensing module 110 can be obtained through the first resistor R1, and a large range of the sensing module 110 can be obtained through the second resistor R2.
When the first resistor R1 is connected to the positive electrode of the power source VCC through the first pin of the first switch K, and the third resistor R3 is not connected to the positive electrode of the power source VCC through the third pin of the first switch K, the power source VCC, the first switch K, the first resistor R1, the first sampling resistor Rc1, the second resistor R2, and the device under test 200 form a loop. When the first resistor R1 is not connected to the positive electrode of the power VCC through the first pin of the first switch K, and the third resistor R3 is connected to the positive electrode of the power VCC through the third pin of the first switch K, the power VCC, the first switch K, the third resistor R3, the second sampling resistor Rc2, the second resistor R2, and the device under test 200 form a loop.
As shown in fig. 4, the sampling module 120 includes an operational amplifier U1, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, and a seventh resistor R7, an inverting input terminal of the operational amplifier U1 is electrically connected to both a first end of the first sampling resistor Rc1 and a first end of the second sampling resistor Rc2 through the fourth resistor R4, a non-inverting input terminal of the operational amplifier U1 is electrically connected to both a second end of the first sampling resistor Rc1 and a second end of the second sampling resistor Rc2 through the fifth resistor R5, an output terminal of the operational amplifier U1 is electrically connected to the processing module 130, an output terminal of the operational amplifier U1 is electrically connected to an inverting input terminal of the operational amplifier U1 through the sixth resistor R6, and a non-inverting input terminal of the operational amplifier U1 is grounded through the seventh resistor R7.
In this embodiment, the circuit formed by the operational amplifier U1, the fourth resistor R4, the fifth resistor R5, the sixth resistor R6 and the seventh resistor R7 may be a differential amplifier circuit. The opamp U1 may employ a current collection chip of INA180A3IDBVR type. For ease of understanding, fig. 5 is a schematic diagram of an internal structure of the handler U1 that can be implemented.
It is understood that the sampling module 120 is used for performing amplification processing on the state information, and the amplification factor of the sampling module 120 can be set through the model selection of the fourth resistor R4, the fifth resistor R5, the sixth resistor R6 and the seventh resistor R7. The state information after the enlargement process can be formulated
Indicating that Vout represents the state information after the amplification process, R4 represents the resistance value of the fourth resistor R4, R5 represents the resistance value of the fifth resistor R5, R6 represents the resistance value of the sixth resistor R6, R7 represents the resistance value of the seventh resistor R7, V1 represents the voltage value of the first end of the first sampling resistor Rc1 or the first end of the second sampling resistor Rc2, and V2 represents the voltage value of the second end of the first sampling resistor Rc1 or the second end of the second sampling resistor Rc 2.
After obtaining the amplified state information, the processing module 130 converts the amplified state information into a processable digital signal through an internal ADC (analog-to-digital conversion), converts the digital signal into an actually measured resistance value, compares the actually measured resistance value with a preset theoretical short-circuit range value, and determines that the state information is short-circuit state information and the corresponding test point 210 is in a short-circuit state if the actually measured resistance value is within the theoretical short-circuit range value; the processing module 130 also controls the buzzer 141 to emit a warning sound and controls the LED lamp 142 to emit an abnormal warning light, so that the short circuit state information is displayed through the display module 150. If the actually measured resistance value is not within the theoretical short-circuit range value, the state information is judged to be the access state information, and the corresponding test point 210 is in the access state; and the processing module 130 displays the actually measured resistance value through the display module 150, and controls the LED lamp 142 to emit a normal prompt light.
In another embodiment, the processing module 130 may further compare the actual measured resistance value with a preset normal range value, and if the actual measured resistance value is within the normal range value, it is determined that the state information is the path state information, and the impedance of the corresponding test point 210 is within the error range. If the actually measured resistance value is not within the normal range value and the short circuit range value, it is determined that the state information is the access state information, and the impedance of the corresponding test point 210 is not within the error range.
In this embodiment, the processing module 130 may adopt an MCU (micro controller Unit) chip of model STM32G031C8U 6. As an embodiment, as shown in fig. 6, it is a schematic diagram of the internal structure of the processing module 130. The ADC shown in fig. 6 is a built-in ADC of the processing module 130, and the GPIOs shown in fig. 6 are pins of the processing module 130 and electrically connected to the sampling module 120 through the GPIOs.
Further, in this embodiment, the detecting apparatus 100 further includes a memory 180, and the memory 180 is configured to store data such as a mapping table, a preset normal range value, and a preset short circuit range value. The detection module 110 further includes a power module 190, and the power module 190 is configured to supply power to the detection module 110, the sampling module 120, the processing module 130, the memory 180, the prompting module 140, the display module 150, the dial switch 170, and the like.
In summary, the embodiment of the present invention provides a detection apparatus, when performing a test, the detection apparatus first accesses a device to be tested, and tunes a dial switch to select parameters such as a relation mapping table of a corresponding type of the accessed device to be tested; then, the detection device is powered on, the detection device is reset after being powered on, the receiving and collecting module collects the state information of the device to be detected through the detection module, and whether the device to be detected is in a fault state is determined according to the state information; when the device to be tested is in a fault state, a prompt signal is sent to control the buzzer to send a prompt tone, the LED lamp is controlled to send abnormal prompt light, and the state information corresponding to each test point is displayed through the display module.
Therefore, whether the device to be tested has faults or not can be automatically detected through the detection device, and the point-to-point test is not needed to be manually carried out by using a universal meter. And the detection device can be applied to the device to be detected in the actual production and manufacturing process and also can be applied to the device to be detected after the fault, so that the production efficiency and the maintenance efficiency are greatly improved.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The detection device is characterized by comprising a detection module, a sampling module and a processing module, wherein the detection module, the sampling module and the processing module are sequentially and electrically connected, and the detection module is electrically connected with a device to be detected;
the sampling module is used for acquiring the state information of the device to be detected through the detection module and transmitting the state information to the processing module;
and the processing module is used for determining whether the device to be tested is in a fault state or not according to the state information.
2. The device according to claim 1, wherein the detection module comprises a power source, a first resistor and a first sampling resistor, the first resistor and the first sampling resistor are connected in series between a positive pole of the power source and a first end of the device under test, a negative pole of the power source is electrically connected to a second end of the device under test, and the first sampling resistor is further electrically connected to the sampling module;
the sampling module is also used for collecting the state information of the device to be tested through the first sampling resistor.
3. The testing device of claim 2, wherein the testing module further comprises a second resistor, a third resistor, a second sampling resistor, and a first switch, the first resistor is configured to be electrically connected to the positive pole of the power source through a first pin of the first switch, the second resistor is configured to be electrically connected to the positive pole of the power source through a second pin of the first switch, the third resistor is configured to be electrically connected to the positive pole of the power source through a third pin of the first switch, the second resistor is further electrically connected to the first end of the device under test, the third resistor is electrically connected to the first end of the device under test through the second sampling resistor, and the second sampling resistor is further electrically connected to the sampling module;
the sampling module is used for collecting the state information of the device to be tested through the first sampling resistor when the first resistor is communicated with the positive electrode of the power supply through the first pin of the first switch and the third resistor is not communicated with the positive electrode of the power supply through the third pin of the first switch tube;
the sampling module is also used for collecting the state information of the device to be tested through the second sampling resistor when the first resistor passes through the first pin of the first switch and the anode of the power supply is not communicated, and the third resistor passes through the third pin of the first switch tube and the anode of the power supply is communicated.
4. The detection device according to claim 3, wherein the sampling module includes an operational amplifier, a fourth resistor, a fifth resistor, a sixth resistor, and a seventh resistor, an inverting input terminal of the operational amplifier is electrically connected to both the first terminal of the first sampling resistor and the first terminal of the second sampling resistor through the fourth resistor, a non-inverting input terminal of the operational amplifier is electrically connected to the second terminal of the first sampling resistor and the second terminal of the second sampling resistor through the fifth resistor, an output terminal of the operational amplifier is electrically connected to the processing module, an output terminal of the operational amplifier is electrically connected to the inverting input terminal of the operational amplifier through the sixth resistor, and a non-inverting input terminal of the operational amplifier is grounded through the seventh resistor.
5. The detection device of claim 1, further comprising a prompt module, the processing module being electrically connected to the prompt module;
the processing module is further used for sending a prompt signal to control the prompt module to work when the device to be tested is judged to be in a fault state.
6. The detection device according to claim 5, wherein the prompt module includes a buzzer, and the processing module is electrically connected to the buzzer;
the processing module is further used for sending the prompt signal to control the buzzer to send out prompt sound when the device to be tested is judged to be in a fault state.
7. The detection device according to claim 5, wherein the prompt module further comprises an LED lamp, and the processing module is electrically connected with the LED lamp;
the processing module is further used for sending the prompt signal to control the LED lamp to send abnormal prompt light when the device to be tested is judged to be in a fault state.
8. The testing device of claim 1, wherein said testing module and said sampling module are provided in plurality, said device under test comprises a plurality of testing points, a plurality of said testing modules and a plurality of said sampling modules are electrically connected in a one-to-one correspondence, each of said sampling modules is electrically connected to said processing module;
the sampling module is used for acquiring the state information of the test point corresponding to the sampling module through the detection module corresponding to the sampling module and transmitting the state information to the processing module;
and the processing module is used for determining whether each test point is in a fault state or not according to the state information corresponding to each test point.
9. The detection device of claim 8, further comprising a display module, wherein the processing module is electrically connected to the display module;
the processing module is further used for displaying the state information corresponding to each test point through the display module.
10. The test device of claim 1, further comprising a connector through which the test module is electrically connected to the device under test.
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Application publication date: 20210126 |