CN112240460A - Semiconductor heat dissipation support - Google Patents

Abstract

The invention discloses a semiconductor heat dissipation support which comprises a connecting piece, a supporting piece and a clamping piece, wherein the supporting piece is used for fixing a game handle, the clamping piece is used for fixing electronic equipment, the supporting piece is rotatably connected with one end of the connecting piece, the other end of the connecting piece is rotatably connected with the clamping piece, the clamping piece comprises a clamping upper cover, a bottom shell and a refrigerating device arranged in the bottom shell, the clamping upper cover is arranged at the top of the bottom shell, the refrigerating device comprises a semiconductor refrigerating piece, a metal cooling fin and a heat dissipation fan, the semiconductor refrigerating piece, the metal cooling fin and the heat dissipation fan are sequentially arranged in the bottom shell from top to bottom, and the semiconductor refrigerating piece and the heat dissipation fan are both electrically connected with a main. The game handle and the electronic equipment (mobile phone) can be clamped simultaneously through the supporting piece and the clamping piece, heat can be dissipated for the clamped electronic equipment (mobile phone), functions of the support are enriched, and experience effects of users are greatly improved.

Description

Semiconductor heat dissipation support

Technical Field

The invention relates to the technical field of supports, in particular to a semiconductor heat dissipation support.

Background

In modern life, many electronic devices such as mobile phones and tablet computers are supported on a support to liberate hands when users like to use the electronic devices. The existing electronic equipment is easy to generate heat when playing games, and if the heat is not dissipated in time, the circuit in the electronic equipment is easy to age, so that the service life of the electronic equipment is shortened. Especially, when a large 3D game is operated, the operation power consumption of the mobile phone is extremely high, and the CPU/GPU of the mobile phone is automatically lowered due to high temperature, so that the game performance and experience are seriously influenced. Most businesses have begun to develop heat-dissipating racks.

But in current electronic equipment heat dissipation support, mostly be with the fan heat extraction, it is limited to electronic equipment's cooling, and the cooling effect is not good.

The above disadvantages need to be improved.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a semiconductor heat dissipation bracket.

The technical scheme of the invention is as follows:

a semiconductor heat dissipation bracket comprises a connecting piece, a supporting piece for fixing a game handle and a clamping piece for fixing electronic equipment, wherein the supporting piece is rotatably connected with one end of the connecting piece, the other end of the connecting piece is rotatably connected with the clamping piece,

the clamping piece comprises a clamping upper cover, a bottom shell and a refrigerating device arranged in the bottom shell, the clamping upper cover is arranged at the top of the bottom shell, the refrigerating device comprises a semiconductor refrigerating piece, a metal radiating fin and a radiating fan, the semiconductor refrigerating piece, the metal radiating fin and the radiating fan are sequentially arranged in the bottom shell from top to bottom, and the semiconductor refrigerating piece and the radiating fan are all electrically connected with a main control board in the bottom shell.

According to the invention of the above scheme, the bottom of the metal radiating fin is provided with a plurality of radiating fins.

Furthermore, the heat dissipation fan is fixed at the bottom of the metal heat dissipation plate, and the heat dissipation fan is surrounded by the plurality of heat dissipation fins.

Furthermore, a first fixing hole is formed in the heat dissipation fan, a first fixing column matched with the first fixing hole is arranged at the bottom of the metal heat dissipation fin, and screws sequentially penetrate through the first fixing hole and the first fixing column to fix the heat dissipation fan at the bottom of the metal heat dissipation fin.

According to the invention of the scheme, the bottom of the bottom shell is provided with a plurality of first heat dissipation holes matched with the heat dissipation fan, and the side wall of the bottom shell is provided with a plurality of second heat dissipation holes.

According to the invention of the scheme, the bottom shell is provided with the USB interface, and the USB interface is electrically connected with the main control board.

According to the invention of the above scheme, the clamping upper cover comprises an upper cover main body, a first adjusting part and a second adjusting part, the first adjusting part is arranged on the upper side of the upper cover main body and is connected with the upper cover main body in a sliding mode, and the second adjusting part is arranged on the lower side of the upper cover main body and is connected with the upper cover main body in a sliding mode.

Furthermore, the upper cover main part includes apron and bottom plate, be provided with on the bottom plate with semiconductor refrigeration piece matched with opening, semiconductor refrigeration piece is located in the opening, the apron sets up the top of bottom plate and will the opening covers.

Furthermore, a first sliding groove is formed in the upper side of the cover plate, a first sliding portion is arranged on the first adjusting portion, and the first sliding portion is arranged in the first sliding groove and can slide in the first sliding groove;

the lower side of the cover plate is provided with a second sliding groove, a second sliding portion is arranged on the second adjusting portion, and the second sliding portion is arranged in the second sliding groove and can slide in the second sliding groove.

Furthermore, a first spring is arranged in the first sliding chute, one end of the first spring is fixed with the bottom of the first sliding chute, and the other end of the first spring is fixed with the first sliding part;

and a second spring is arranged in the second sliding groove, one end of the second spring is fixed with the bottom of the second sliding groove, and the other end of the second spring is fixed with the second sliding part.

Furthermore, a first baffle is arranged on the first adjusting part, and a second baffle is arranged on the second adjusting part.

Furthermore, a first notch gasket is arranged on the first baffle plate, and a second notch gasket is arranged on the second baffle plate.

Furthermore, a second fixing hole is formed in the metal radiating fin, a second fixing column matched with the second fixing hole is arranged in the bottom shell, and screws sequentially penetrate through the second fixing hole and the second fixing column to fix the metal radiating fin in the bottom shell.

Furthermore, a third fixing hole is formed in the cover plate, a third fixing column matched with the third fixing hole is arranged in the bottom shell, a screw sequentially penetrates through the third fixing hole and the third fixing column to fix the cover plate on the top of the bottom shell, and the cover plate covers the third fixing hole.

According to the invention of the scheme, the bottom of the bottom shell is provided with a first rotating shaft connecting part, one end of the connecting piece is provided with a second rotating shaft connecting part, and the first rotating shaft connecting part is connected with the second rotating shaft connecting part through a first bolt;

and/or, be provided with third pivot connecting portion on the support piece, the other end of connecting piece is provided with fourth pivot connecting portion, third pivot connecting portion with fourth pivot connecting portion pass through second bolted connection.

The outer side of the second rotating shaft connecting part is provided with a circle of uniformly distributed first limiting convex blocks, and the inner side of the first rotating shaft connecting part is provided with a circle of uniformly distributed first limiting grooves matched with the first limiting convex blocks.

And/or the outer side of the fourth rotating shaft connecting part is provided with a circle of second limiting convex blocks which are uniformly distributed, and the inner side of the third rotating shaft connecting part is provided with a circle of second limiting grooves which are uniformly distributed and matched with the second limiting convex blocks.

According to the invention of the above scheme, the support member is provided with the shoulder pad.

Further, a first gasket is arranged below the shoulder pad.

According to the invention of the above scheme, the support member is provided with a hole site.

Further, a second gasket is arranged below the hole position.

The invention according to the scheme has the advantages that:

1. the game handle and the electronic equipment (mobile phone) can be clamped simultaneously through the supporting piece and the clamping piece, heat can be dissipated for the clamped electronic equipment (mobile phone), functions of the support are enriched, and experience effects of users are greatly improved;

2. according to the invention, by utilizing the refrigeration characteristic of the semiconductor refrigeration sheet, the cold end quickly dissipates heat for the clamped electronic equipment (mobile phone), and the heat at the hot end is dissipated out in time through the metal heat dissipation sheet and the heat dissipation fan, so that the heat dissipation efficiency of the electronic equipment is improved, and the experience effect of a user is better;

3. the design of the heat radiating fins at the bottom of the metal heat radiating fin can increase the heat radiating area and improve the heat radiating effect, and the heat radiating fan is fixed in the hollow area surrounded by the heat radiating fins, so that the structure of the clamping piece can be more compact while the heat radiating effect is improved, and the volume of the clamping piece is effectively reduced;

4. the clamping piece can be flexibly adjusted according to different sizes of the electronic equipment, so that different requirements of users are met, and the experience effect of the users is better;

5. according to the invention, the supporting piece and the clamping piece can be adjusted to a proper angle through the connecting piece, so that the height of the clamped electronic equipment can be adjusted to meet the requirements of different users, and the experience effect of the users is better;

6. the invention has simple structure, convenient and flexible use and low cost.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

FIG. 2 is an exploded view of the structure of the present invention II;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is a schematic diagram of the present invention;

FIG. 5 is a schematic structural diagram of a metal heat sink of the present invention;

FIG. 6 is a schematic view of another aspect of the metal heat sink of the present invention;

FIG. 7 is a schematic structural diagram of a heat dissipation fan according to the present invention;

FIG. 8 is a schematic structural diagram of the bottom case of the present invention;

FIG. 9 is a schematic view of the structure of the clamping cover of the present invention;

FIG. 10 is a schematic view of another aspect of the present invention;

FIG. 11 is an exploded view of the structure of the clamping cover of the present invention;

FIG. 12 is a schematic view of the structure of the supporting member of the present invention.

In the context of the figures, it is,

1. a connecting member;

11. a second rotating shaft connecting part; 12. a first bolt; 13. a fourth rotating shaft connecting part; 14. a second bolt; 111. a first limit bump; 131. a second limit bump;

2. a support member;

21. a third shaft connecting part; 22. shoulder pads; 23. a first gasket; 24. hole site; 211. a second limit groove;

3. a clamping member;

31. clamping the upper cover;

311. an upper cover main body; 3111. a cover plate; 3112. a base plate; 31111. an opening; 31112. a first chute; 31113. a second chute; 31114. a first spring; 31115. a second spring; 31116. a third fixing hole;

312. a first adjusting section; 3121. a first sliding section; 3122. a first baffle plate; 31221. a first notched shim;

313. a second regulating part; 3131. a second sliding section; 3132. a second baffle; 31321. a second notched shim;

32. a bottom case; 321. a first heat dissipation hole; 322. a second heat dissipation hole; 323. a USB interface; 324. a second fixed column; 325. a third fixing column; 326. a first rotating shaft connecting part; 3261. a first limit groove;

33. a semiconductor refrigeration sheet;

34. a metal heat sink; 341. heat dissipation fins; 342. a second fixing hole;

35. a heat radiation fan; 351. a first fixing hole;

36. a main control board;

100. a game pad;

200. an electronic device.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected" to another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "top", "bottom", "inner", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are only for convenience of description and should not be construed as limiting the technical solution. The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. "plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 4, a semiconductor heat dissipation bracket includes a connecting member 1, a supporting member 2 for fixing a game pad 100, and a clamping member 3 for fixing an electronic device 200, wherein the supporting member 2 is rotatably connected to one end of the connecting member 1, and the other end of the connecting member 1 is rotatably connected to the clamping member 3. Support piece 2 is used for fixing game paddle 100, holder 3 can adjust in a flexible way according to the not unidimensional of electronic equipment 200, and can be stable with electronic equipment 200 centre gripping, thereby user's different demands have been satisfied, and simultaneously, because of the one end of connecting piece 1 and support piece 2 rotatable coupling, the other end and the 3 rotatable coupling of holder of connecting piece 1, can adjust support piece 2 and holder 3 to suitable angle, and then realize highly adjusting the electronic equipment 200 of centre gripping, with the demand that adapts to different users, make user's experience effect better.

Referring to fig. 2, the clamping member 3 includes a clamping upper cover 31, a bottom case 32 and a cooling device disposed in the bottom case 32, the clamping upper cover 31 is disposed on the top of the bottom case 32, the cooling device includes a semiconductor cooling plate 33, a metal heat sink 34 and a heat dissipation fan 35, the semiconductor cooling plate 33, the metal heat sink 34 and the heat dissipation fan 35 are sequentially disposed in the bottom case 32 from top to bottom, and the semiconductor cooling plate 33 and the heat dissipation fan 35 are electrically connected to a main control board 36 disposed in the bottom case 32. The cold and hot both ends of semiconductor refrigeration piece 33 form heat transfer, and the cold junction dispels the heat for the electronic equipment 200 of centre gripping on the support fast, and the heat of hot junction is dispersed through metal fin 34 and heat dissipation wind. According to the invention, the refrigeration device in the clamping piece 3 can dissipate heat for the clamped electronic equipment 200, so that the functions of the bracket are enriched, and the experience effect of a user is greatly increased; meanwhile, by utilizing the refrigeration characteristic of the semiconductor refrigeration piece, one side is refrigerated and quickly radiates heat for the clamped electronic equipment 200 (mobile phone), and the heat generated by the other side is timely radiated out through the metal radiating fin 34 and the radiating fan 35, so that the radiating effect of the electronic equipment 200 is improved, and the experience effect of a user is better.

Referring to fig. 5 and 6, in an embodiment, the bottom of the metal heat sink 34 is provided with a plurality of uniformly distributed fins 341, so as to increase the heat dissipation area and improve the heat dissipation effect. Meanwhile, the heat dissipation fan 35 is fixed at the bottom of the metal heat dissipation plate 34, and the heat dissipation fan 35 is surrounded by the plurality of heat dissipation fins 341, that is, the heat dissipation fan 35 is fixed in the hollow area surrounded by the heat dissipation fins 341, so that the structure of the clamping member 3 can be more compact while the heat dissipation effect is improved, and the volume of the clamping member 3 is effectively reduced.

Referring to fig. 5 to 7, in an embodiment, a first fixing hole 351 is formed on the heat dissipation fan 35, a first fixing post (not shown, the same below) matched with the first fixing hole 351 is formed at the bottom of the metal heat dissipation plate 34, and screws sequentially pass through the first fixing hole 351 and the first fixing post to fix the heat dissipation fan 35 at the bottom of the metal heat dissipation plate 34. In this embodiment, the number and the arrangement position of the first fixing holes 351 and the first fixing posts are not limited by the present invention, and those skilled in the art can arrange the fixing posts according to the actual situation.

Referring to fig. 8, in an embodiment, the bottom of the bottom case 32 is provided with a plurality of first heat dissipating holes 321 matching with the heat dissipating fan 35, and the sidewall of the bottom case 32 is provided with a plurality of second heat dissipating holes 322, the first heat dissipating holes 321 and the second heat dissipating holes 322 are disposed to not only reduce the weight of the bottom case 32, but also match with the heat dissipating fan 35 and the metal heat dissipating fins 34 to achieve a good heat dissipating effect.

Referring to fig. 8, in an embodiment, a USB interface 323 is disposed on the bottom case 32, the USB interface 323 is electrically connected to the main control board 36, and a user can supply power to the stand through the USB interface 323. Optionally, a rechargeable battery (not shown, the same applies below) is further disposed in the bottom case 32, the rechargeable battery is electrically connected to the main control board 36, and the rechargeable battery can be charged by an external power supply through the USB interface 323.

Referring to fig. 9 to 11, in an embodiment, the clamping cover 31 includes a cover main body 311, a first adjusting portion 312 and a second adjusting portion 313, the first adjusting portion 312 is disposed on an upper side of the cover main body 311 and slidably connected to the cover main body 311, and the second adjusting portion 313 is disposed on a lower side of the cover main body 311 and slidably connected to the cover main body 311. The clamping member 3 clamps and fixes the electronic device 200 through the first adjusting portion 312 and the second adjusting portion 313 on the upper and lower sides, so that the electronic device 200 can be stably clamped on the clamping member 3.

Referring to fig. 11, in an embodiment, the upper cover main body 311 includes a cover plate 3111 and a bottom plate 3112, an opening 31111 matched with the semiconductor chilling plate 33 is disposed on the bottom plate 3112, the semiconductor chilling plate 33 is located in the opening 31111, and the cover plate 3111 is disposed on the top of the bottom plate 3112 and covers the opening 31111.

Referring to fig. 10, in the above embodiment, the cover plate 3111 is provided with a first sliding slot 31112 at an upper side thereof, the first adjusting portion 312 is provided with a first sliding portion 3121, the first sliding portion 3121 is disposed in the first sliding slot 31112 and can slide in the first sliding slot 31112, and the first sliding slot 31112 and the first sliding portion 3121 are disposed to facilitate the sliding of the first adjusting portion 312 relative to the cover plate 3111.

A second sliding groove 31113 is provided on a lower side of the cover plate 3111, a second sliding portion 3131 is provided on the second adjusting portion 313, the second sliding portion 3131 is provided in the second sliding groove 31113 and is slidable in the second sliding groove 31113, and the second sliding groove 31113 and the second sliding portion 3131 are provided so that the second adjusting portion 313 slides with respect to the cover plate 3111.

Referring to fig. 10, in the above embodiment, a first spring 31114 is disposed in the first sliding groove 31112, one end of the first spring 31114 is fixed to the bottom of the first sliding groove 31112, and the other end of the first spring 31114 is fixed to the first sliding portion 3121. In an initial state, the first sliding portion 3121 is located at the lowest end of the first sliding groove 31112, when a pulling force is applied to the first sliding portion 3121, the first sliding portion 3121 drives the first spring 31114 to stretch gradually, a sliding distance of the first sliding portion 3121 may be determined according to a size of the electronic device 200, and the setting is simple in structure, convenient to use, and smooth in sliding.

A second spring 31115 is disposed in the second sliding groove 31113, one end of the second spring 31115 is fixed to the bottom of the second sliding groove 31113, the other end of the second spring 31115 is fixed to the second sliding portion 3131, in an initial state, the second sliding portion 3131 is located at the lowest end of the first sliding groove 31112, when a pulling force is applied to the second sliding portion 3131, the second sliding portion 3131 drives the second spring 31115 to stretch gradually, a sliding distance of the second sliding portion 3131 may be determined according to a size of the electronic device 200, and the setting is simple in structure, convenient to use, and stable in sliding.

Referring to fig. 9 and 11, in the above embodiment, the first flap 3122 is disposed on the first adjusting portion 312, and the second flap 3132 is disposed on the second adjusting portion 313, so that the electronic device 200 is stably fixed on the holder 3 through the first flap 3122 on the first adjusting portion 312 and the second flap 3132 on the second adjusting portion 313. Preferably, the first flap 3122 is provided with a first notched pad 31221, and the second flap 3132 is provided with a second notched pad 31321, which can fix the electronic device 200 more stably and better protect the electronic device 200.

Referring to fig. 5 and 8, in an embodiment, a second fixing hole 342 is formed on the metal heat sink 34, a second fixing post 324 matching with the second fixing hole 342 is formed in the bottom case 32, and a screw passes through the second fixing hole 342 and the second fixing post 324 in sequence to fix the metal heat sink 34 in the bottom case 32. In this embodiment, the number and the arrangement position of the second fixing holes 342 and the second fixing posts 324 are not limited by the present invention, and can be set by those skilled in the art according to the actual situation.

Referring to fig. 8 and 10, in an embodiment, a third fixing hole 31116 is formed on the cover plate 3111, a third fixing pillar 325 matching with the third fixing hole 31116 is formed in the bottom case 32, a screw sequentially passes through the third fixing hole 31116 and the third fixing pillar 325 to fix the cover plate 3111 on the top of the bottom case 32, and the cover plate 3111 covers the third fixing hole 31116. In this embodiment, the number and the arrangement position of the third fixing holes 31116 and the third fixing posts 325 are not limited by the present invention, and can be arranged by those skilled in the art according to the actual situation.

Referring to fig. 2, in an embodiment, a first rotating shaft connecting portion 326 is disposed at the bottom of the bottom case 32, a second rotating shaft connecting portion 11 is disposed at one end of the connecting member 1, the first rotating shaft connecting portion 326 and the second rotating shaft connecting portion 11 are connected by a first bolt 12, and an angle between the clamping member 3 and the connecting member 1 can be optionally adjusted by the first bolt 12 to meet requirements of different users, so that a user experience effect is better.

And/or, be provided with third pivot connecting portion 21 on support piece 2, the other end of connecting piece 1 is provided with fourth pivot connecting portion 13, and third pivot connecting portion 21 passes through second bolt 14 with fourth pivot connecting portion 13 and is connected, can adjust the angle between support piece 2 and the connecting piece 1 at will through second bolt 14 to adapt to different users 'demand, make user's experience effect better.

Referring to fig. 2, in the above embodiment, a circle of first limiting protrusions 111 is uniformly distributed on an outer side of the second rotating shaft connecting portion 11, a circle of first limiting grooves 3261 is uniformly distributed on an inner side of the first rotating shaft connecting portion 326 and is matched with the first limiting protrusions 111, and the arrangement of the first limiting protrusions 111 and the first limiting grooves 3261 can improve the connection stability between the first rotating shaft connecting portion 326 and the second rotating shaft connecting portion 11.

And/or, the outside of the fourth rotating shaft connecting portion 13 is provided with a circle of second limiting convex blocks 131 which are uniformly distributed, the inside of the third rotating shaft connecting portion 21 is provided with a circle of second limiting concave grooves 211 which are uniformly distributed and matched with the second limiting convex blocks 131, and the arrangement of the second limiting convex blocks 131 and the second limiting concave grooves 211 can improve the connection stability of the third rotating shaft connecting portion 21 and the fourth rotating shaft connecting portion 13.

Referring to fig. 12, in an embodiment, a shoulder pad 22 is disposed on the supporting member 2, and the shoulder pad 22 is disposed to fix the game paddle 100 more stably. The first gasket 23 is arranged below the shoulder pad 22, the first gasket 23 is a silica gel gasket, and the first gasket 23 can protect the gamepad 100.

Referring to fig. 12, in the above embodiment, a hole 24 is further disposed on the supporting member 2, and the hole 24 is disposed to reserve a USB interface 323 or other interface for the game pad 100.

In the above embodiment, a second gasket (not shown, the same applies below) is further disposed below the hole 24, the second gasket is a silica gel gasket, the second gasket is tightly attached to the bottom case 32 of the gamepad 100 in a matching manner, and the gamepad 100 is not prone to shaking after being installed, so that the stability of the support structure is improved.

The invention has the beneficial effects that:

1. according to the invention, the game handle 100 and the electronic equipment 200 (mobile phone) can be clamped simultaneously through the supporting piece 2 and the clamping piece 3, and the clamped electronic equipment 200 (mobile phone) can be cooled, so that the functions of the support are enriched, and the experience effect of a user is greatly improved;

2. according to the invention, by utilizing the refrigeration characteristic of the semiconductor refrigeration sheet, the cold end quickly radiates heat for the clamped electronic equipment 200 (mobile phone), and the heat at the hot end is timely radiated out through the metal radiating fin 34 and the radiating fan 35, so that compared with the existing fan heat radiation, the heat radiation effect on the electronic equipment 200 is improved, and the experience effect of a user is better;

3. the design of the heat dissipation fins 341 at the bottom of the metal heat dissipation sheet 34 of the present invention can increase the heat dissipation area and improve the heat dissipation effect, and because the heat dissipation fan 35 is fixed in the hollow area surrounded by the heat dissipation fins 341, the heat dissipation effect is improved, and at the same time, the structure of the clamping member 3 can be more compact, and the volume of the clamping member 3 is effectively reduced;

4. according to the invention, the semiconductor refrigeration piece 33 is arranged in the opening 31111 of the bottom plate 3112, so that the distance between the semiconductor refrigeration piece 33 and the electronic equipment 200 is shortened, the heat dissipation effect of the semiconductor refrigeration piece 33 on the electronic equipment 200 can be improved, the structure of the clamping piece 3 is more compact, and the volume of the clamping piece 3 is further reduced;

5. the clamping piece 3 can be flexibly adjusted according to different sizes of the electronic equipment 200, so that different requirements of users are met, and the experience effect of the users is better;

6. according to the invention, the supporting piece 2 and the clamping piece 3 can be adjusted to a proper angle through the connecting piece 1, so that the height of the clamped electronic equipment 200 can be adjusted to meet the requirements of different users, and the experience effect of the users is better;

7. the invention has simple structure, convenient and flexible use and low cost.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

The invention is described above with reference to the accompanying drawings, which are illustrative, and it is obvious that the implementation of the invention is not limited in the above manner, and it is within the scope of the invention to adopt various modifications of the inventive method concept and technical solution, or to apply the inventive concept and technical solution to other fields without modification.

Claims (10)

1. The semiconductor heat dissipation bracket comprises a connecting piece, a supporting piece for fixing a game handle and a clamping piece for fixing electronic equipment, wherein the supporting piece is rotatably connected with one end of the connecting piece, the other end of the connecting piece is rotatably connected with the clamping piece,

the clamping piece comprises a clamping upper cover, a bottom shell and a refrigerating device arranged in the bottom shell, the clamping upper cover is arranged at the top of the bottom shell, the refrigerating device comprises a semiconductor refrigerating piece, a metal radiating fin and a radiating fan, the semiconductor refrigerating piece, the metal radiating fin and the radiating fan are sequentially arranged in the bottom shell from top to bottom, and the semiconductor refrigerating piece and the radiating fan are all electrically connected with a main control board in the bottom shell.

2. The semiconductor heat dissipation bracket of claim 1, wherein a plurality of heat dissipation fins are disposed on the bottom of the metal heat dissipation plate.

3. The semiconductor heat sink bracket as recited in claim 2, wherein the heat sink fan is fixed to a bottom of the metal heat sink, and the heat sink fan is surrounded by the plurality of heat sink fins.

4. The semiconductor heat dissipation bracket as recited in claim 3, wherein the heat dissipation fan is provided with a first fixing hole, the bottom of the metal heat dissipation plate is provided with a first fixing post matching with the first fixing hole, and a screw passes through the first fixing hole and the first fixing post in sequence to fix the heat dissipation fan to the bottom of the metal heat dissipation plate.

5. The semiconductor heat dissipation bracket as claimed in claim 1, wherein the bottom of the bottom housing has a plurality of first heat dissipation holes matching with the heat dissipation fan, and the sidewall of the bottom housing has a plurality of second heat dissipation holes.

6. The semiconductor heat dissipation bracket according to claim 1, wherein a USB interface is disposed on the bottom shell, and the USB interface is electrically connected to the main control board.

7. The semiconductor heat dissipation bracket according to claim 1, wherein the clamping upper cover comprises an upper cover main body, a first adjustment portion disposed on an upper side of the upper cover main body and slidably connected to the upper cover main body, and a second adjustment portion disposed on a lower side of the upper cover main body and slidably connected to the upper cover main body.

8. The semiconductor heat dissipation bracket according to claim 7, wherein the upper cover main body comprises a cover plate and a bottom plate, the bottom plate is provided with an opening matched with the semiconductor refrigeration piece, the semiconductor refrigeration piece is located in the opening, and the cover plate is arranged on the top of the bottom plate and covers the opening.

9. The semiconductor heat dissipation bracket according to claim 8, wherein a first sliding groove is formed on an upper side of the cover plate, and a first sliding portion is formed on the first adjusting portion, and is disposed in the first sliding groove and can slide in the first sliding groove;

the lower side of the cover plate is provided with a second sliding groove, a second sliding portion is arranged on the second adjusting portion, and the second sliding portion is arranged in the second sliding groove and can slide in the second sliding groove.

10. The semiconductor heat dissipation bracket according to claim 9, wherein a first spring is disposed in the first sliding slot, one end of the first spring is fixed to a bottom of the first sliding slot, and the other end of the first spring is fixed to the first sliding portion;

and a second spring is arranged in the second sliding groove, one end of the second spring is fixed with the bottom of the second sliding groove, and the other end of the second spring is fixed with the second sliding part.

Images