Background
With the development of science and technology and the continuous progress of society, people have more and more requirements on image acquisition in daily life and work. The development of the 3D vision technology also brings a new development direction for the camera module, for example, 3D face recognition can be carried out through a mobile phone camera. In order to ensure the accuracy of 3D imaging, it is particularly important to calibrate the 3D structured light module.
The traditional 3D structure optical module bracket calibration method mainly adjusts the relative position relationship between an infrared receiving module and a transmitter. The infrared structured light projected onto the mark map by the emitter is collected by the industrial camera, and the infrared light source lamp is arranged beside the industrial camera to provide a light source for the infrared receiving module to collect images. Black patches are arranged at four corners of the transparent mark map, the industrial camera and the infrared receiving module can acquire the four black patches on the mark map, and the center of the mark map can be located through the four patches. And respectively calculating the deviation value of the optical center of the infrared structure and the center of the mark map and the deviation value of the optical center of the infrared receiving module and the center of the mark map by taking the mark map as reference, and adjusting the relative position of the module according to the deviation value to realize the calibration of the 3D structure optical module bracket. The traditional 3D structure optical module bracket calibration method has the defects of low calibration efficiency and high cost because the calculation of the angular offset of the emitter must be carried out by depending on an industrial camera.
Disclosure of Invention
Therefore, it is necessary to provide a method, an apparatus and a device for calibrating a 3D structured light module bracket, which can improve calibration efficiency and reduce cost, for solving the problems of low calibration efficiency and high cost of the conventional 3D structured light module bracket calibration method.
A3D structure optical module support calibration method comprises the following steps: the control transmitter projects infrared light to the calibration board and receives an infrared image, and the infrared image is obtained by shooting the calibration board projected with the infrared light through the infrared receiving module; acquiring the position of a preset mark point in the infrared image, and calculating the offset between the position of the preset mark point and the set position of the preset mark point; and adjusting the positions of the infrared receiving module and the transmitter according to the offset.
According to the calibration method of the 3D structure optical module support, the emitter is controlled to project infrared light to the calibration plate, and an infrared image obtained by shooting the calibration plate projected with the infrared light by the infrared receiving module is received. And then the calibration machine platform calculates the offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module and the transmitter according to the obtained offset. The infrared image of the infrared ray projected to the calibration plate by the emitter shot by the infrared receiving module is analyzed to obtain the offset, and the position of the infrared receiving module and the emitter is adjusted, so that the position corresponding relation does not need to be calculated by using an industrial camera, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
In one embodiment, an XYZ three-axis coordinate system is established, the infrared receiving module and the emitter are both positioned in an XY plane of the XYZ three-axis coordinate system, and the calibration plate is parallel to the XY plane; the said according to the said offset carries on the position adjustment to said infrared receiving module and said launcher, including: and adjusting the relative position of the infrared receiving module and the emitter on the X, Y axis according to the offset between the position of the preset mark point and the set position of the preset mark point. And adjusting the relative position of the infrared receiving module and the transmitter on the XOY plane by combining the coordinate axis according to the offset between the position of the preset mark point and the set position of the preset mark point, and the operation is simple, convenient and accurate.
In one embodiment, the adjusting the positions of the infrared receiving module and the transmitter according to the offset further includes: receiving the distances measured by the distance measuring device in the Z-axis direction from the infrared receiving module and the transmitter respectively; calculating the offset of the infrared receiving module and the transmitter in the Z-axis direction according to the distances between the distance meter and the infrared receiving module and the distance between the distance meter and the transmitter in the Z-axis direction; and adjusting the relative positions of the infrared receiving module and the transmitter on the Z axis according to the offset of the infrared receiving module and the transmitter on the Z axis direction. When carrying out position adjustment to infrared receiving module and transmitter, still combine the range finder survey with infrared receiving module and the skew of transmitter in the Z axle direction of distance determination infrared receiving module and transmitter, according to the relative position of infrared receiving module and transmitter in the Z axle direction of skew adjustment infrared receiving module and transmitter in the Z axle direction, realize the space relative position adjustment to infrared receiving module and transmitter, improved accuracy and the comprehensive nature of demarcating to 3D structure optical module support.
A 3D structured light module support calibration apparatus, comprising: the image acquisition module is used for controlling the emitter to project infrared light to the calibration board and receiving an infrared image, and the infrared image is obtained by shooting the calibration board projected with the infrared light through the infrared receiving module; the offset calculation module is used for acquiring the position of a preset mark point in the infrared image and calculating the offset between the position of the preset mark point and the set position of the preset mark point; and the position adjusting module is used for adjusting the positions of the infrared receiving module and the transmitter according to the offset.
The 3D structure light module support calibration device controls the emitter to project infrared light to the calibration plate, and receives an infrared image obtained by shooting the calibration plate after the infrared light is projected by the infrared receiving module. And then the calibration machine platform calculates the offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module and the transmitter according to the obtained offset. The infrared image of the infrared ray projected to the calibration plate by the emitter shot by the infrared receiving module is analyzed to obtain the offset, and the position of the infrared receiving module and the emitter is adjusted, so that the position corresponding relation does not need to be calculated by using an industrial camera, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
A3D structure light module support calibration device comprises a calibration machine table, a calibration plate and a fixing frame, wherein the calibration machine table is used for placing an infrared receiving module and an emitter of a 3D structure light module, the fixing frame is arranged on the calibration machine table, the calibration plate is fixedly arranged on the fixing frame, the calibration machine table is also used for controlling the emitter to project infrared light to the calibration plate and receive an infrared image, and the infrared light is obtained by shooting the calibration plate after the infrared light is projected through the infrared receiving module; and acquiring the position of a preset mark point in the infrared image, calculating the offset between the position of the preset mark point and the set position of the preset mark point, and adjusting the positions of the infrared receiving module and the transmitter according to the offset.
According to the 3D structure light module support calibration device, the calibration machine is used for controlling the emitter to project infrared light to the calibration plate, and the infrared receiving module is used for receiving an infrared image obtained by shooting the calibration plate after the infrared light is projected. And then the calibration machine platform calculates the offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module and the transmitter according to the obtained offset. The infrared image of the infrared ray projected to the calibration plate by the emitter shot by the infrared receiving module is analyzed to obtain the offset, and the position of the infrared receiving module and the emitter is adjusted, so that the position corresponding relation does not need to be calculated by using an industrial camera, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
In one embodiment, the calibration board is a blank rectangular calibration board, and the emitter projects infrared light to the calibration board to form the preset mark points in four corner areas of the calibration board. The blank rectangular calibration plate is adopted for image projection, and the preset mark points are formed in the four corner areas of the calibration plate, so that the influence on the subsequent 3D structure extraction is avoided, and the module calibration accuracy is improved.
In one embodiment, the calibration plate is arranged along a projection direction perpendicular to the emitter. The calibration plate is arranged along the projection direction perpendicular to the emitter, so that the image projected by the emitter is displayed on the calibration plate clearly and completely, and the accuracy of module calibration is improved.
In one embodiment, the calibration machine comprises a machine body, a moving mechanism, a connecting device and a controller, wherein the moving mechanism is arranged on the machine body and used for placing the infrared receiving module and the emitter and driving the infrared receiving module and the emitter; the connecting device is arranged on the moving mechanism, and the controller is electrically connected with the infrared receiving module through the connecting device and is electrically connected with the emitter through the connecting device. The controller receives the infrared image acquired by the infrared receiving module through the connecting device, analyzes the infrared image to obtain the offset, controls the moving mechanism to adjust the relative position of the infrared receiving module and the emitter according to the offset, and is simple, convenient and reliable to operate.
In one embodiment, the calibration machine further includes an interaction device connected to the controller, and the interaction device is disposed on an outer surface of the machine body. Utilize interactive device to carry out information interaction, operation such as test personnel accessible interactive device is markd operation control and data and is looked over has improved the convenience of module calibration operation.
In one embodiment, the interactive device includes a keyboard and a display screen coupled to the controller. The tester utilizes the keyboard to input information, can realize the control to the calibration operation to and input instruction control controller draws required data and sends to the display screen and shows.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
As shown in fig. 1, the structure diagram of a conventional 3D structured light module bracket calibration (AA) apparatus includes an AA machine, a transparent char, a diffusion film, an Infrared light source, an industrial camera, an IR (Infrared) module, and a projector module. The center position coordinates of the char are calculated through the centers of the four patches on the transparent char (marking plate) and are used as position references of an IR module (I) and a projector module (II), the offset shift1 between the optical center of the IR module and the center of the transparent char (II) is obtained through an image collected by the IR module (I), and the offset shift2 between the optical center of the projector module and the center of the transparent char (II) is obtained through an image collected by an industrial camera (II). The AA machine calculates the relative position relationship between the IR module and the projector module through shift1 and shift2, and the relative position relationship is used as the basis for adjusting the position of the module. As shown in fig. 2, the black patches on the four corners of the transparent char are circular patches, and the shapes of the patches may be other shapes (square, triangle, etc.). The conventional 3D structured light module bracket calibration device must rely on the industrial camera for calculating the angular offset of the Project module, and has low calculation efficiency and economic benefit.
Based on this, a 3D structured light module bracket calibration device is provided, as shown in fig. 3, including a calibration machine 110, a calibration plate 120, and a fixing frame 130, where the calibration machine 110 is used to place an infrared receiving module 210 and an emitter 220 of a 3D structured light module, the fixing frame 130 is disposed on the calibration machine 110, the calibration plate 120 is fixedly disposed on the fixing frame 130, the calibration machine 110 is further used to control the emitter 220 to project infrared light to the calibration plate 120, and receive an infrared image, and the infrared image is obtained by shooting the calibration plate 120 projected with infrared light through the infrared receiving module 210; and the calibration machine 110 further obtains the position of the preset mark point in the infrared image, calculates the offset between the position of the preset mark point and the set position of the preset mark point, and adjusts the positions of the infrared receiving module 210 and the transmitter 220 according to the obtained offset.
The calibration board 120 is used as a 3D structured light module for projection and image acquisition, the specific structure of the calibration board 120 is not unique, and no special mark is required, and only a blank board is required for image projection. When the 3D structured light module is calibrated, the calibration machine 110 controls the transmitter 220 to output the infrared light carrying the preset mark points and projects the infrared light onto the calibration plate 120, so that the infrared receiving module 210 performs image acquisition to obtain the infrared image carrying the mark points. In one embodiment, as shown in FIG. 4, the calibration plate 120 is a blank rectangular calibration plate. Specifically, after the emitter 220 projects infrared light onto the calibration board 120, preset mark points are formed in four corner regions of the calibration board 120. The blank rectangular calibration plate is adopted for image projection, and the preset mark points are formed in the four corner areas of the calibration plate 120, so that the influence on the subsequent 3D structure extraction is avoided, and the module calibration accuracy is improved.
The relationship between the calibration plate 120 and the 3D structured light module is not exclusive, and in one embodiment, the calibration plate 120 is disposed along a direction perpendicular to the projection direction of the emitter 220. Specifically, the infrared receiving module 210 and the emitter 220 may be placed on a horizontally designed testing platform of the calibration machine 110, the projection surface of the calibration board 120 is also set along the horizontal direction, and the emitter 220 projects infrared light to the projection surface of the calibration board 120 from the vertical upward direction. The calibration board 120 is arranged along the projection direction perpendicular to the emitter 220, so that the image projected by the emitter 220 is displayed clearly and completely on the calibration board 120, and the calibration accuracy of the module is improved.
After receiving the infrared image captured by the infrared receiving module 210, the calibration machine 110 performs image recognition processing on the infrared image, and extracts the position of the preset mark point in the image. Then, the calibration machine 110 calculates an offset according to the position of the preset mark point and the set position of the preset mark point, and adjusts the position between the infrared receiving module 210 and the transmitter 220 according to the offset. When the 3D structured light module leaves the factory, a mask (mark) is disposed on the lens of the emitter 220, and when the mark is emitted by infrared light, the position coordinates of the four corners of the calibration board 120 are determined, and the calibration board 110 may pre-store the set position of the preset mark point. In the actual testing process, the position of the preset mark point has a certain offset when the infrared light is projected onto the calibration board 120, and after the actual position of the preset mark point in the infrared image is obtained, the relative position of the infrared receiving module 210 and the emitter 220 is adjusted according to the offset between the previously determined set position coordinate and the collected actual position of the preset mark point. Similarly, taking the calibration board 120 as a blank rectangular calibration board, and the preset mark points are formed in four corner regions of the calibration board 120 as an example, four mark points in the image projected by the control transmitter 220 can be respectively arranged at four corners of the calibration board 120. An XYZ three-axis coordinate system is established, and the infrared receiving module 210 and the transmitter 220 are both located in the XY plane of the XYZ three-axis coordinate system. The calibration machine 110 may obtain the offset of the mark point according to the position of the preset mark point in the infrared image and the set position of the preset mark point, and further obtain the offset of the infrared receiving module 210 and the transmitter 220 in the X and Y directions, which is used as a reference for adjusting the positions of the infrared receiving module 210 and the transmitter 220. In addition, the calibration stage 110 may further adjust the position of the infrared receiving module 210 and the transmitter 220 in the Z-axis direction in combination with the offset of the infrared receiving module 210 and the transmitter 220 in the Z-axis direction.
The calibration device for the 3D structured light module bracket utilizes the calibration machine 110 to control the emitter 220 to project infrared light to the calibration board 120, and receives an infrared image obtained by shooting the calibration board 120 projected with the infrared light by the infrared receiving module 210. Then, the calibration machine 110 calculates an offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module 210 and the transmitter 220 according to the obtained offset. The infrared image of the infrared receiving module 210 shot by the emitter 220 after the infrared light is projected to the calibration board 120 is analyzed to obtain the offset, the position of the infrared receiving module 210 and the position of the emitter 220 are adjusted, an industrial camera is not needed to calculate the corresponding relation of the positions, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
The specific structure of the calibration stage 110 is not exclusive, and in one embodiment, as shown in fig. 5, the calibration stage 110 includes a body 112, a moving mechanism 114, a connecting device and a controller (not shown in the figure), wherein the moving mechanism 114 is disposed on the body 112 and is used for placing the infrared receiving module 210 and the emitter 220 and driving the infrared receiving module 210 and the emitter 220 to move; the connecting device is disposed on the moving mechanism 114, and the controller is electrically connected to the infrared receiving module 210 through the connecting device and is electrically connected to the transmitter 220 through the connecting device. The type of the controller is not exclusive, and in this embodiment, the controller is an MCU (Micro Control Unit). And the MCU is utilized to carry out module calibration control, so that the reliability is high.
The controller can be disposed inside the body 112, the connecting device includes a first connecting end 116 and a second connecting end 118, and the controller is electrically connected to the transmitter 220 through the first connecting end 116 and electrically connected to the infrared receiving module 210 through the second connecting end 118. Specifically, the controller controls the transmitter 220 to project infrared light onto the calibration board 120, and then receives an infrared image captured by the infrared receiving module 210. After calculating the offset of the preset mark point according to the infrared image, the controller controls the moving mechanism 114 to move the emitter 220 according to the offset, thereby adjusting the positions of the emitter 220 and the infrared receiving module 210.
In this embodiment, the controller receives the infrared image acquired by the infrared receiving module 210 through the connecting device, analyzes the infrared image to obtain the offset, and controls the moving mechanism 114 to adjust the relative positions of the infrared receiving module 210 and the transmitter 220 according to the offset, so that the operation is simple, convenient and reliable.
Further, in an embodiment, the calibration platform 110 further includes an interaction device connected to the controller, and the interaction device is disposed on an outer surface of the body 112. The tester can input instructions through the interaction device to control the module calibration operation, or the controller extracts relevant information and displays the information through the interaction device so that the tester can check the information. Utilize interactive device to carry out information interaction, operation such as test personnel accessible interactive device is markd operation control and data and is looked over has improved the convenience of module calibration operation.
The specific configuration of the interactive apparatus is not exclusive and in one embodiment the interactive apparatus comprises a keyboard and a display screen connected to the controller. The Display screen may be an LCD (Liquid Crystal Display) Display screen or a digital Display tube. The tester utilizes the keyboard to carry out information input, can realize the control to module calibration operation to and input instruction control controller draws required data and sends to the display screen and shows.
In another embodiment, the interactive device is a touch display screen. The tester can realize information interaction by performing touch operation on the touch display screen, and performs information interaction and calibration control on the touch display screen, so that the convenience of module calibration operation can be further improved.
In one embodiment, an XYZ coordinate system is established such that the infrared receiving module 210 and the transmitter 220 are both located in the XY plane of the XYZ coordinate system, and the calibration board 120 is parallel to the XY plane. The calibration machine 110 adjusts the relative position of the infrared receiving module 210 and the transmitter 220 on the X, Y axis according to the offset between the position of the preset mark point and the set position of the preset mark point. Wherein the X-axis is perpendicular to the Y-axis, and the Z-axis is perpendicular to the XY-plane. And adjusting the relative position of the infrared receiving module 210 and the transmitter 220 on the XOY plane by combining the coordinate axes according to the offset between the position of the preset mark point and the set position of the preset mark point, so that the operation is simple, convenient and accurate.
In one embodiment, the 3D structured light module holder calibration apparatus further includes a distance meter connected to the calibration stage 110, and the distance meter may be specifically disposed above the calibration stage 110 to detect the distance between the infrared receiving module 210 and the emitter 220 in the Z-axis direction. The calibration machine 110 is further configured to receive distances measured by the distance measuring device in the Z-axis direction from the infrared receiving module 210 and the transmitter 220, respectively; calculating the offset of the infrared receiving module 210 and the emitter 220 in the Z-axis direction according to the distances between the distance meter and the infrared receiving module 210 and the emitter 220 in the Z-axis direction respectively; according to the offset of the infrared receiving module 210 and the emitter 220 in the Z-axis direction, the relative position of the infrared receiving module 210 and the emitter 220 in the Z-axis direction is adjusted.
Specifically, the distance measuring device may be a laser distance measuring device, which is fixed above the calibration stage 110, and the distance Z1 from the distance measuring device to the lens center of the infrared receiving module 210 and the distance Z2 from the distance measuring device to the lens center of the transmitter 220 are obtained, so as to obtain the Z-direction offset Δ Z2-Z1, and finally, the module position is adjusted according to the Z-direction offset.
When the positions of the infrared receiving module 210 and the transmitter 220 are adjusted, the distance between the infrared receiving module 210 and the transmitter 220, which is measured by the distance measuring device, is combined to determine the offset of the infrared receiving module 210 and the transmitter 220 in the Z-axis direction, and the relative positions of the infrared receiving module 210 and the transmitter 220 in the Z-axis direction are adjusted according to the offset of the infrared receiving module 210 and the transmitter 220 in the Z-axis direction, so that the spatial relative position adjustment of the infrared receiving module 210 and the transmitter 220 is realized, and the calibration accuracy and the calibration comprehensiveness of the 3D structure light module bracket are improved.
In order to better understand the above 3D structured light module holder calibration apparatus, the following detailed description is made with reference to specific embodiments.
As shown in fig. 3, the calibration board 120 does not need to be specially marked, but only needs a piece of white paper with high flatness, the infrared receiving module 210 shoots the white icon calibration board above the module, the emitter 220 projects the white icon calibration board into the infrared image, the calibration board 110 searches for the special mark points marked in the infrared image through an algorithm, calculates the offset in the X and Y directions according to the actual positions of the found mark points in the infrared image, calculates the offset in the Z direction according to the relative positions of the infrared receiving module 210 and the emitter 220, and finally adjusts the module position according to the offset position.
The improved calibration process does not need to use an industrial camera to calculate the position corresponding relation, eliminates the system bottleneck of the industrial camera in the calibration process, enables the calculation of the relative position of the infrared receiving module 210 and the emitter 220 to be directly realized through a software algorithm, can greatly improve the production efficiency, can save economic resources, can greatly improve the unit time productivity in the same equipment environment, and has good social and economic effects. In addition, since only the four corners of the calibration board 120 need to be projected to generate special marks, such as small squares, and the mark points are located at the four corners of the calibration board 120, the extraction of the 3D structure in practice is required to ensure the accuracy and is not analyzed by using boundary values, so that the extraction of the 3D structure is not affected.
In one embodiment, as shown in fig. 6, there is also provided a 3D structured light module holder calibration method, including the steps of:
step S110: the control transmitter projects infrared light to the calibration board and receives the infrared image. The infrared image is obtained by shooting the calibration board after the infrared light is projected through the infrared receiving module.
Step S120: and acquiring the position of a preset mark point in the infrared image, and calculating the offset between the position of the preset mark point and the set position of the preset mark point.
Step S130: and adjusting the positions of the infrared receiving module and the transmitter according to the offset.
Specifically, the calibration machine can control the emitter to project infrared light and receive an infrared image obtained by shooting of the infrared receiving module, the infrared image is subjected to image analysis processing, and the offset is calculated to adjust the positions of the infrared receiving module and the emitter. The calibration plate is used as a 3D structured light module for projection and image acquisition, the specific structure of the calibration plate is not unique, and in one embodiment, the calibration plate is a blank rectangular calibration plate. After the emitter projects infrared light to the calibration board, preset mark points are formed in four corner areas of the calibration board. The relationship between the calibration plate and the 3D structured light module is not exclusive, and in one embodiment, the calibration plate is disposed along a direction perpendicular to the projection direction of the emitter. And after receiving the infrared image shot by the infrared receiving module, the calibration machine station carries out image recognition processing on the infrared image and extracts the position of a preset mark point in the image. And then the calibration machine platform calculates to obtain the offset according to the position of the preset mark point and the preset position stored in advance, and further adjusts the position between the infrared receiving module and the emitter.
The specific process of the 3D structured light module bracket calibration method is explained in detail in the above 3D structured light module bracket calibration device, and is not described herein again.
According to the calibration method of the 3D structure optical module support, the emitter is controlled to project infrared light to the calibration plate, and an infrared image obtained by shooting the calibration plate projected with the infrared light by the infrared receiving module is received. And then the calibration machine platform calculates the offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module and the transmitter according to the obtained offset. The infrared image of the infrared ray projected to the calibration plate by the emitter shot by the infrared receiving module is analyzed to obtain the offset, and the position of the infrared receiving module and the emitter is adjusted, so that the position corresponding relation does not need to be calculated by using an industrial camera, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
In one embodiment, an XYZ coordinate system is established such that the infrared receiving module 210 and the transmitter 220 are both located in the XY plane of the XYZ coordinate system, and the calibration board 120 is parallel to the XY plane. As shown in fig. 7, step S130 includes step S132: and adjusting the relative positions of the infrared receiving module and the emitter on the X, Y axis according to the offset between the position of the preset mark point and the set position of the preset mark point. And adjusting the relative position of the infrared receiving module and the transmitter on the XOY plane by combining the coordinate axis according to the offset between the position of the preset mark point and the set position of the preset mark point, and the operation is simple, convenient and accurate.
In one embodiment, with continued reference to fig. 7, step S130 further includes steps S134-S138.
Step S134: and the distances measured by the receiving distance meter and the infrared receiving module and the distance measured by the receiving distance meter in the Z-axis direction are respectively from the transmitter.
Step S136: and calculating the offset of the infrared receiving module and the emitter in the Z-axis direction according to the distances between the distance meter and the infrared receiving module and between the distance meter and the emitter in the Z-axis direction.
Step S138: and adjusting the relative positions of the infrared receiving module and the transmitter on the Z axis according to the offset of the infrared receiving module and the transmitter on the Z axis direction.
It can be understood that step S132 is to adjust the relative position of the infrared receiving module and the transmitter in the X axis and the Y axis, and steps S134 to S138 are to adjust the relative position of the infrared receiving module and the transmitter in the Z axis, which may be performed simultaneously, or may be performed by adjusting X, Y the relative position in the axis first and then adjusting the relative position in the Z axis; or the relative position on the Z axis can be adjusted first, and then the relative position on the X, Y axis can be adjusted.
When carrying out position adjustment to infrared receiving module and transmitter, still combine the range finder survey with infrared receiving module and the skew of transmitter in the Z axle direction of distance determination infrared receiving module and transmitter, according to the relative position of infrared receiving module and transmitter in the Z axle direction of skew adjustment infrared receiving module and transmitter in the Z axle direction, realize the space relative position adjustment to infrared receiving module and transmitter, improved accuracy and the comprehensive nature of demarcating to 3D structure optical module support.
In one embodiment, as shown in fig. 8, there is also provided a 3D structured light module support calibration apparatus, which includes an image acquisition module 310, an offset calculation module 320, and a position adjustment module 330.
The image acquisition module 310 is used for the transmitter to project infrared light to the calibration board and receive the infrared image. The infrared image is obtained by shooting the calibration board after the infrared light is projected through the infrared receiving module.
The offset calculating module 320 is configured to obtain a position of a preset mark point in the infrared image, and calculate an offset between the position of the preset mark point and a set position of the preset mark point.
The position adjusting module 330 is used for adjusting the positions of the infrared receiving module and the transmitter according to the offset.
For specific limitations of the 3D structured light module holder calibration apparatus, reference may be made to the description of the 3D structured light module holder calibration device, which is not described herein again. The modules in the 3D structured light module support calibration apparatus may be implemented in whole or in part by software, hardware, and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
The 3D structure light module support calibration device controls the emitter to project infrared light to the calibration plate, and receives an infrared image obtained by shooting the calibration plate after the infrared light is projected by the infrared receiving module. And then the calibration machine platform calculates the offset between the position of the preset mark point and the set position of the preset mark point according to the infrared image, and adjusts the positions of the infrared receiving module and the transmitter according to the obtained offset. The infrared image of the infrared ray projected to the calibration plate by the emitter shot by the infrared receiving module is analyzed to obtain the offset, and the position of the infrared receiving module and the emitter is adjusted, so that the position corresponding relation does not need to be calculated by using an industrial camera, the unit time productivity in the same equipment environment is improved, and the method has good social and economic effects. Compared with the traditional 3D structure optical module bracket calibration method, the calibration efficiency is improved, and the cost is low.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.