CN112218430A - Manufacturing method of copper block-embedded circuit board of new energy automobile - Google Patents
Manufacturing method of copper block-embedded circuit board of new energy automobile Download PDFInfo
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- CN112218430A CN112218430A CN202011010786.7A CN202011010786A CN112218430A CN 112218430 A CN112218430 A CN 112218430A CN 202011010786 A CN202011010786 A CN 202011010786A CN 112218430 A CN112218430 A CN 112218430A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to the technical field of circuit board processing, and provides a method for manufacturing a copper block embedded circuit board of a new energy automobile, which comprises the following steps: prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process. The embedded copper block circuit board comprises a copper block penetrating type and a copper block semi-embedded type. The copper block-embedded printed circuit board is manufactured by the method. Dip-soldering for 10 seconds in a lead-tin solder tank with the temperature control range of 288 +/-5 ℃, and testing to be qualified because of no delamination, bubbling, interlayer separation and the like in the third time of thermal stress, and the copper block is relatively flat and has the height difference of 12 microns in the flatness condition of the copper block embedded in the finished product copper-embedded board and the printed circuit board, and the test is qualified because of no delamination, bubbling, interlayer separation and the like in the third time of using lead-free reflow soldering parameters; the manufacturing method of the invention can realize the mass production of the copper-embedded plate.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a manufacturing method of a copper block embedded circuit board of a new energy automobile.
Background
The copper-embedded board is a printed circuit board with a copper block embedded in a local position on the printed circuit board, the heating element is directly attached to the copper block, and heat is transmitted out through the copper block.
The conventional heat dissipation method generally adopts two types of metal substrates to manufacture a circuit board and welds the metal substrates on the circuit board, however, the two types of processes have the defects of large metal material consumption, complex manufacturing process, high cost and heavy volume, and for some occasions with relatively low heat dissipation power requirements, the higher processing cost and the complex process for welding the metal plates cannot meet the market requirements.
Disclosure of Invention
In view of this, the invention provides a method for manufacturing a copper block embedded circuit board of a new energy automobile.
The technical scheme of the invention is as follows:
a manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
Further, the prepreg process comprises: cutting, laminating → hole milling → inspection → auxiliary material matching.
Further, the aluminum sheet process comprises: cutting → matching with auxiliary materials.
Further, the inner core board process comprises the following steps: cutting → internal light imaging → internal layer etching inspection → internal layer punching → hole milling → 4 hole positioning by CCD punching → matching center → blackening.
Further, the copper block process comprises the following steps: cutting → blackening.
Further, the CS-SS process comprises the following steps: laminating → grinding plate → copper deposition → removing glue → plating the whole plate → drilling → back drilling → drilling blind holes on the copper block by a drilling machine with depth control function → milling blind grooves, milling the blind grooves on the copper block by using a special molding machine → copper deposition → external light imaging → pattern plating → outer layer etching → solder resist → next process.
Furthermore, in the CS-SS process, the CS surface faces downwards during lamination and typesetting, a 35-micron copper foil is padded below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is placed above the SS surface of the plate, and lamination is carried out normally.
Furthermore, a prepreg of 1080 model is selected for the lamination, the filling is full through the cooperation of a plurality of prepregs, a material of high Tg model is selected, and the copper block is blackened or browned.
Furthermore, the thickness of the copper block is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper block is required to be +/-0.025 mm, and copper foil and aluminum sheet are placed on one side for buffering during lamination.
Furthermore, the single side of the milling groove of the inner layer chip is 0.1mm (4mil) larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm (8mil) larger than that of the copper block, the dimensional tolerance requirement of the copper block is +/-0.05 mm, and the milling groove tolerance of the inner layer core plate and the milling groove of the prepreg is +/-0.1 mm controlled through rough milling and finish milling.
Furthermore, the design of the blind hole on the copper block is more than or equal to 1.0mm, the aperture depth ratio of the blind hole is more than 1, and the milling groove uses a special forming center, so that the precision of the milling groove and the smoothness of the groove are ensured.
Furthermore, the copper block embedded circuit board comprises a copper block penetrating type and a copper block semi-embedded type.
Furthermore, the copper block penetrating type embedded copper block circuit board is characterized in that the thickness of the embedded copper block is equal to that of the total board, the copper block penetrates through the top layer and the bottom layer, and steps are arranged in the vertical direction of the copper block and the vertical direction of the copper block.
Furthermore, the thickness of the embedded copper block is smaller than the total plate thickness, the copper block only penetrates through the bottom layer, the other surface of the copper block is flush with a certain layer of the inner layer, and the copper block semi-embedded type embedded copper block circuit board comprises a copper block which is not grooved and a copper block which is grooved.
Further, the copper billet thickness that buries the copper billet circuit board of copper billet run-through type is 2.3mm, the copper billet thickness that buries the copper billet circuit board of copper billet semi-buried type is 1.5mm, and the copper billet fillet is handled, and fillet R =1 mm.
The invention solves the following technical problems:
1. the binding force between the copper block and the printed circuit board is improved;
2. the flatness difference between the copper block and the printed circuit board is within the range of +/-50 microns;
3. the matching degree of the copper block, the inner-layer chip and the prepreg milling groove is improved;
4. and (4) processing accuracy of blind hole drilling and groove milling on the copper block after the copper block is buried.
The main innovation points of the invention are as follows: the embedded copper block circuit board is designed according to different types, and specifically comprises the following steps:
1. copper block through type: the thickness of the embedded copper block is equal to that of the total plate, the copper block penetrates through the top layer and the bottom layer, the type design can be divided into two types, and the copper block is straight in the vertical direction and has steps in the vertical direction;
2. semi-buried type of copper block: the thickness of the embedded copper block is smaller than the total plate thickness, the copper block only penetrates through the bottom layer, the other surface of the copper block is flush with a certain layer of the inner layer, the type of design can be divided into two types, and no groove is formed in the copper block and a groove is formed in the copper block;
3. milling grooves of a core plate and prepregs corresponding to the copper-embedded positions, wherein the size of a slotted hole of the core plate is 4mil larger than that of a single side of a copper block, the size of slotted holes of all prepregs is 8mil larger than that of the single side of the copper block, four corners of the slotted holes are fillets, and R =1 mm;
4. the slotted holes of the core plate and the prepreg are manufactured by adopting a mode of rough milling and finish milling, wherein the finish milling cutter is 1.0mm, and the size precision of the slotted hole is required to be +/-0.1 mm;
5. the thickness of the penetrating copper block is 2.3mm, the thickness of the semi-buried copper block is 1.5mm, the fillet of the copper block is processed, and the fillet R =1 mm;
6. the special copper block browning fixture is used for production, the fixture is made of a 3.0mm epoxy resin plate, blind grooves of 3 sizes are milled on the fixture, the copper block browning fixture is suitable for copper blocks of various sizes, and through holes of 2.0mm are drilled in the blind grooves, so that the liquid medicine is facilitated to be communicated.
The invention has the beneficial effects that:
the copper block-embedded printed circuit board is manufactured by the method. Dip-soldering for 10 seconds in a lead-tin solder tank with the temperature control range of 288 +/-5 ℃, and testing to be qualified because of no delamination, bubbling, interlayer separation and the like in the third time of thermal stress, and the copper block is relatively flat and has the height difference of 12 microns in the flatness condition of the copper block embedded in the finished product copper-embedded board and the printed circuit board, and the test is qualified because of no delamination, bubbling, interlayer separation and the like in the third time of using lead-free reflow soldering parameters; the manufacturing method of the invention can realize the mass production of the copper-embedded plate.
Drawings
FIG. 1 is a schematic view of a copper block through type of partial structure produced according to an embodiment of the present invention;
FIG. 2 is a schematic view of a copper block through type of partial structure produced according to an embodiment of the present invention;
FIG. 3 is a schematic view of a semi-buried copper block structure according to an embodiment of the present invention;
FIG. 4 is a schematic view of a semi-buried copper block structure according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a copper-clad block laminate produced according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
Further, the prepreg process comprises: cutting, laminating → hole milling → inspection → auxiliary material matching.
Further, the aluminum sheet process comprises: cutting → matching with auxiliary materials.
Further, the inner core board process comprises the following steps: cutting → internal light imaging → internal layer etching inspection → internal layer punching → hole milling → 4 hole positioning by CCD punching → matching center → blackening.
Further, the copper block process comprises the following steps: cutting → blackening.
Further, the CS-SS process comprises the following steps: laminating → grinding plate → copper deposition → removing glue → plating the whole plate → drilling → back drilling → drilling blind holes on the copper block by a drilling machine with depth control function → milling blind grooves, milling the blind grooves on the copper block by using a special molding machine → copper deposition → external light imaging → pattern plating → outer layer etching → solder resist → next process.
Furthermore, in the CS-SS process, the CS surface faces downwards during lamination and typesetting, a 35-micron copper foil is padded below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is placed above the SS surface of the plate, and lamination is carried out normally.
Furthermore, a prepreg of 1080 model is selected for the lamination, the filling is full through the cooperation of a plurality of prepregs, a material of high Tg model is selected, and the copper block is blackened or browned.
Furthermore, the thickness of the copper block is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper block is required to be +/-0.025 mm, and copper foil and aluminum sheet are placed on one side for buffering during lamination.
Furthermore, the single side of the milling groove of the inner layer chip is 0.1mm (4mil) larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm (8mil) larger than that of the copper block, the dimensional tolerance requirement of the copper block is +/-0.05 mm, and the milling groove tolerance of the inner layer core plate and the milling groove of the prepreg is +/-0.1 mm controlled through rough milling and finish milling.
Furthermore, the design of the blind hole on the copper block is more than or equal to 1.0mm, the aperture depth ratio of the blind hole is more than 1, and the milling groove uses a special forming center, so that the precision of the milling groove and the smoothness of the groove are ensured.
Furthermore, the buried copper block circuit board is a copper block through type.
Furthermore, the thickness of the embedded copper block is equal to that of the total board, the copper block penetrates through the top layer and the bottom layer, and the vertical direction of the copper block is straight.
Furthermore, the thickness of the copper block penetrating type embedded copper block circuit board is 2.3mm, the fillet of the copper block is processed, and the fillet R =1 mm.
Example 2
A manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
Further, the prepreg process comprises: cutting, laminating → hole milling → inspection → auxiliary material matching.
Further, the aluminum sheet process comprises: cutting → matching with auxiliary materials.
Further, the inner core board process comprises the following steps: cutting → internal light imaging → internal layer etching inspection → internal layer punching → hole milling → 4 hole positioning by CCD punching → matching center → blackening.
Further, the copper block process comprises the following steps: cutting → blackening.
Further, the CS-SS process comprises the following steps: laminating → grinding plate → copper deposition → removing glue → plating the whole plate → drilling → back drilling → drilling blind holes on the copper block by a drilling machine with depth control function → milling blind grooves, milling the blind grooves on the copper block by using a special molding machine → copper deposition → external light imaging → pattern plating → outer layer etching → solder resist → next process.
Furthermore, in the CS-SS process, the CS surface faces downwards during lamination and typesetting, a 35-micron copper foil is padded below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is placed above the SS surface of the plate, and lamination is carried out normally.
Furthermore, a prepreg of 1080 model is selected for the lamination, the filling is full through the cooperation of a plurality of prepregs, a material of high Tg model is selected, and the copper block is blackened or browned.
Furthermore, the thickness of the copper block is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper block is required to be +/-0.025 mm, and copper foil and aluminum sheet are placed on one side for buffering during lamination.
Furthermore, the single side of the milling groove of the inner layer chip is 0.1mm (4mil) larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm (8mil) larger than that of the copper block, the dimensional tolerance requirement of the copper block is +/-0.05 mm, and the milling groove tolerance of the inner layer core plate and the milling groove of the prepreg is +/-0.1 mm controlled through rough milling and finish milling.
Furthermore, the design of the blind hole on the copper block is more than or equal to 1.0mm, the aperture depth ratio of the blind hole is more than 1, and the milling groove uses a special forming center, so that the precision of the milling groove and the smoothness of the groove are ensured.
Furthermore, the buried copper block circuit board is a copper block through type.
Furthermore, the copper block penetrating type embedded copper block circuit board is characterized in that the thickness of the embedded copper block is equal to that of the total board, the copper block penetrates through the top layer and the bottom layer, and steps are arranged in the vertical direction of the copper block.
Furthermore, the thickness of the copper block penetrating type embedded copper block circuit board is 2.3mm, the fillet of the copper block is processed, and the fillet R =1 mm.
Example 3
A manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
Further, the prepreg process comprises: cutting, laminating → hole milling → inspection → auxiliary material matching.
Further, the aluminum sheet process comprises: cutting → matching with auxiliary materials.
Further, the inner core board process comprises the following steps: cutting → internal light imaging → internal layer etching inspection → internal layer punching → hole milling → 4 hole positioning by CCD punching → matching center → blackening.
Further, the copper block process comprises the following steps: cutting → blackening.
Further, the CS-SS process comprises the following steps: laminating → grinding plate → copper deposition → removing glue → plating the whole plate → drilling → back drilling → drilling blind holes on the copper block by a drilling machine with depth control function → milling blind grooves, milling the blind grooves on the copper block by using a special molding machine → copper deposition → external light imaging → pattern plating → outer layer etching → solder resist → next process.
Furthermore, in the CS-SS process, the CS surface faces downwards during lamination and typesetting, a 35-micron copper foil is padded below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is placed above the SS surface of the plate, and lamination is carried out normally.
Furthermore, a prepreg of 1080 model is selected for the lamination, the filling is full through the cooperation of a plurality of prepregs, a material of high Tg model is selected, and the copper block is blackened or browned.
Furthermore, the thickness of the copper block is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper block is required to be +/-0.025 mm, and copper foil and aluminum sheet are placed on one side for buffering during lamination.
Furthermore, the single side of the milling groove of the inner layer chip is 0.1mm (4mil) larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm (8mil) larger than that of the copper block, the dimensional tolerance requirement of the copper block is +/-0.05 mm, and the milling groove tolerance of the inner layer core plate and the milling groove of the prepreg is +/-0.1 mm controlled through rough milling and finish milling.
Furthermore, the design of the blind hole on the copper block is more than or equal to 1.0mm, the aperture depth ratio of the blind hole is more than 1, and the milling groove uses a special forming center, so that the precision of the milling groove and the smoothness of the groove are ensured.
Furthermore, the copper block embedded circuit board is of a copper block semi-embedded type.
Furthermore, the thickness of the embedded copper block is smaller than the total plate thickness, the copper block only penetrates through the bottom layer, the other surface of the copper block is flush with a certain layer of the inner layer, and no groove is formed in the copper block.
Furthermore, the thickness of the copper block semi-buried type copper block-buried circuit board is 1.5mm, the fillet of the copper block is processed, and the fillet R =1 mm.
Example 4
A manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
Further, the prepreg process comprises: cutting, laminating → hole milling → inspection → auxiliary material matching.
Further, the aluminum sheet process comprises: cutting → matching with auxiliary materials.
Further, the inner core board process comprises the following steps: cutting → internal light imaging → internal layer etching inspection → internal layer punching → hole milling → 4 hole positioning by CCD punching → matching center → blackening.
Further, the copper block process comprises the following steps: cutting → blackening.
Further, the CS-SS process comprises the following steps: laminating → grinding plate → copper deposition → removing glue → plating the whole plate → drilling → back drilling → drilling blind holes on the copper block by a drilling machine with depth control function → milling blind grooves, milling the blind grooves on the copper block by using a special molding machine → copper deposition → external light imaging → pattern plating → outer layer etching → solder resist → next process.
Furthermore, in the CS-SS process, the CS surface faces downwards during lamination and typesetting, a 35-micron copper foil is padded below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is placed above the SS surface of the plate, and lamination is carried out normally.
Furthermore, a prepreg of 1080 model is selected for the lamination, the filling is full through the cooperation of a plurality of prepregs, a material of high Tg model is selected, and the copper block is blackened or browned.
Furthermore, the thickness of the copper block is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper block is required to be +/-0.025 mm, and copper foil and aluminum sheet are placed on one side for buffering during lamination.
Furthermore, the single side of the milling groove of the inner layer chip is 0.1mm (4mil) larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm (8mil) larger than that of the copper block, the dimensional tolerance requirement of the copper block is +/-0.05 mm, and the milling groove tolerance of the inner layer core plate and the milling groove of the prepreg is +/-0.1 mm controlled through rough milling and finish milling.
Furthermore, the design of the blind hole on the copper block is more than or equal to 1.0mm, the aperture depth ratio of the blind hole is more than 1, and the milling groove uses a special forming center, so that the precision of the milling groove and the smoothness of the groove are ensured.
Furthermore, the copper block embedded circuit board is of a copper block semi-embedded type.
Furthermore, the thickness of the embedded copper block is smaller than the total plate thickness, the copper block only penetrates through the bottom layer, the other surface of the copper block is flush with a certain layer of the inner layer, and the copper block is provided with a groove.
Furthermore, the thickness of the copper block semi-buried type copper block-buried circuit board is 1.5mm, the fillet of the copper block is processed, and the fillet R =1 mm.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A manufacturing method of a new energy automobile copper block embedded circuit board is characterized by comprising the following steps:
prepreg process → aluminum sheet process → inner core board process → copper block process → CS-SS process.
2. The method for manufacturing the copper-embedded block circuit board of the new energy automobile according to claim 1, wherein the CS-SS process comprises: laminating → grinding plate → copper deposition → whole plate electroplating → drilling → back drilling → milling blind groove → copper deposition → external light imaging → pattern electroplating → outer layer etching → solder mask → lower process.
3. The method for manufacturing the circuit board with the embedded copper blocks of the new energy automobile according to claim 2, wherein in the CS-SS process, the CS surface faces downwards, a 35-micron copper foil is arranged below the CS surface, the smooth surface of the copper foil faces upwards, an aluminum sheet is arranged above the SS surface of the circuit board, and lamination is performed normally.
4. The manufacturing method of the copper block embedded circuit board of the new energy automobile according to claim 2, wherein in the CS-SS process, a 1080 model prepreg is selected for lamination, a plurality of prepregs are matched to ensure full filling, a high Tg model material is selected, and a copper block is blackened or browned.
5. The method for manufacturing the circuit board with the embedded copper blocks of the new energy automobile according to claim 2, wherein in the CS-SS process, the thickness of the copper blocks is designed to be consistent with the theoretical thickness of the corresponding laminated thickness, the thickness tolerance of the copper blocks is required to be +/-0.025 mm, and copper foil is placed on one surface and aluminum sheet is placed on the other surface for buffering during lamination.
6. The method for manufacturing the copper-block-embedded circuit board of the new energy automobile according to claim 2, wherein in the CS-SS process, the single side of the milling groove of the inner layer chip is 0.1mm larger than that of the copper block, the single side of the milling groove of the prepreg is 0.2mm larger than that of the copper block, the dimensional tolerance of the copper block is required to be +/-0.05 mm, and the milling grooves of the inner layer core plate and the prepreg are subjected to rough milling and finish milling to control the tolerance of the milling groove to be +/-0.1 mm.
7. The method for manufacturing the copper block embedded circuit board of the new energy automobile according to any one of claims 1 to 6, wherein the copper block embedded circuit board comprises a copper block through type and a copper block semi-embedded type.
8. The method for manufacturing the embedded copper block circuit board of the new energy automobile according to claim 7, wherein the copper block penetrating type embedded copper block circuit board is embedded in a thickness equal to the total board thickness, and the copper block penetrates through the top layer and the bottom layer and comprises a straight copper block vertical direction and a step in the copper block vertical direction.
9. The method for manufacturing the copper-embedded block circuit board of the new energy automobile according to claim 7, wherein the copper-embedded block circuit board is a copper-embedded block circuit board, the thickness of the embedded copper block is smaller than the total board thickness, the copper block only penetrates through the bottom layer, and the other surface of the copper block is flush with one of the inner layers, and the copper block is not provided with a groove and the copper block is provided with a groove.
10. The method for manufacturing the copper block embedded circuit board of the new energy automobile according to claim 7, wherein the thickness of the copper block through type copper block embedded circuit board is 2.3mm, the thickness of the copper block semi-embedded type copper block embedded circuit board is 1.5mm, the copper block is processed in a round angle mode, and the round angle R =1 mm.
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| CN202011010786.7A CN112218430A (en) | 2020-09-23 | 2020-09-23 | Manufacturing method of copper block-embedded circuit board of new energy automobile |
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| CN114040564A (en) * | 2021-11-10 | 2022-02-11 | 珠海方正科技多层电路板有限公司 | Preparation method of circuit board and circuit board |
| CN114040564B (en) * | 2021-11-10 | 2023-10-27 | 珠海方正科技多层电路板有限公司 | Circuit board preparation method and circuit board |
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114190011B (en) * | 2021-11-11 | 2024-02-23 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN115841959A (en) * | 2023-02-23 | 2023-03-24 | 广州美维电子有限公司 | Packaging structure and method of high-power chip |
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