CN112216633B - Wafer detection system and method for conveying mechanical arm - Google Patents
Wafer detection system and method for conveying mechanical arm Download PDFInfo
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- CN112216633B CN112216633B CN202011029560.1A CN202011029560A CN112216633B CN 112216633 B CN112216633 B CN 112216633B CN 202011029560 A CN202011029560 A CN 202011029560A CN 112216633 B CN112216633 B CN 112216633B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 title abstract description 11
- 235000012431 wafers Nutrition 0.000 claims abstract description 177
- 230000002159 abnormal effect Effects 0.000 claims abstract description 14
- 238000007689 inspection Methods 0.000 claims description 27
- 230000005611 electricity Effects 0.000 claims description 5
- 230000003068 static effect Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000005856 abnormality Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
- G01L5/009—Force sensors associated with material gripping devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The embodiment of the invention provides a wafer detection system and a method for a transmission manipulator, wherein the system comprises: the device comprises N pressure sensors, N wafer contactors and a controller, wherein N is a positive integer not less than 3; the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors; the controller is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type, a pressure sensor is additionally arranged, the type of the wafer and whether the wafer is abnormal or not can be judged according to the pressure value of the wafer obtained by the pressure sensor, different wafer specifications can be effectively distinguished, and the abnormal condition of the wafer can be found.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a wafer detection system and a wafer detection method for a conveying manipulator.
Background
In the prior art, lamination sometimes occurs when wafers are transferred to a transfer arm, and the wafers have different specifications, which cannot be distinguished in the prior art when wafers of different specifications are transferred to the transfer arm.
Therefore, it is an urgent technical problem to be solved by those skilled in the art how to provide a wafer inspection scheme that can effectively identify different wafer specifications and discover wafer anomalies.
Disclosure of Invention
Embodiments of the present invention provide a wafer inspection system and method for a transfer robot, which can effectively identify different wafer specifications and can detect wafer anomalies.
The embodiment of the invention provides a wafer detection system for a conveying manipulator, which comprises: the system comprises N pressure sensors, N wafer contactors and a controller, wherein N is a positive integer not less than 3;
the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors, wherein the pressure values are the sum of output values of the N pressure sensors;
the controller is connected with the output ends of the N pressure sensors and is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Further, the controller is specifically configured to search a pressure value range corresponding to the pressure value in the preset pressure value table;
if the pressure value table has a pressure value range corresponding to the pressure value, determining the wafer type corresponding to the pressure value range;
and if the pressure value table does not have the pressure value range corresponding to the pressure value, sending an abnormal alarm signal.
Further, the pressure sensor is a piezoelectric ceramic sensor.
Furthermore, the N pressure sensors are arranged at the bottom of the wafer contactor;
n wafer contactors evenly distributed on the supporting part of conveying manipulator.
Further, the controller is also used for sending out a wafer placement error alarm when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value.
Further, the method also comprises the following steps: the camera device is used for shooting a real-time image of the conveying manipulator;
the controller is also used for receiving the real-time image, judging whether the wafer is placed on the wafer contactor according to the real-time image, and starting the pressure sensor when the wafer is placed on the wafer contactor.
Further, still include: an electrostatic generator and a power supply;
the static electricity generating device comprises a positive charge end and an electronic end; the positive charge end and the electronic end are both arranged on the conveying manipulator; the power supply is used for supplying power to the positive charge terminal and the electronic terminal, so that the positive charge terminal generates positive charge, and the electronic terminal generates electrons.
Further, the controller is also used for controlling the electrostatic generator to be electrified so as to increase the friction force between the wafer and the wafer contactor.
An embodiment of the present invention further provides a wafer inspection method for a transfer robot, which is applied to any one of the wafer inspection systems described above, and includes:
when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;
judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Further, the determining the type of the wafer according to the pressure value and a preset pressure value table includes:
searching a pressure value range corresponding to the pressure value in the preset pressure value table;
if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range;
and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal.
According to the wafer detection system and method for the conveying manipulator, provided by the embodiment of the invention, the pressure sensor is additionally arranged, the type and the abnormality of the wafer can be judged according to the pressure value of the wafer obtained by the pressure sensor, different wafer specifications can be effectively distinguished, and the abnormal condition of the wafer can be found.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a block diagram of a wafer inspection system for a transfer robot according to an embodiment of the present invention;
FIG. 2 is a top view of a wafer inspection system for a transfer robot in accordance with an embodiment of the present invention;
FIG. 3 is a front view of a wafer inspection system for a transfer robot in accordance with an embodiment of the present invention;
fig. 4 is a flowchart illustrating a wafer inspection method for a transfer robot according to an embodiment of the present disclosure;
fig. 5 is a flowchart illustrating a method for inspecting a wafer by a transfer robot according to an embodiment of the present disclosure.
Reference numerals are as follows:
1: a base; 11: a support portion; 12: a connecting portion; 13: a wiring duct;
21: a positive charge terminal; 22: an electronic terminal;
3: a wafer contactor; 4: a pressure sensor; 5: a first conductive line; 6: a second conductive line; 7: a wire distributor; 8: and a controller.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
A wafer inspection system for a transfer robot according to an embodiment of the present invention will be described with reference to fig. 1 to 3.
FIG. 1 is a schematic diagram of a wafer inspection system for a transfer robot according to an embodiment of the present invention; FIG. 2 is a top view of a wafer inspection system for a transfer robot in accordance with an embodiment of the present invention; figure 3 is a front view of a wafer inspection system for a transfer robot in accordance with an embodiment of the present invention.
The embodiment of the invention provides a wafer detection system for a conveying manipulator, which comprises: the system comprises N pressure sensors 4, N wafer contactors 3 and a controller 8, wherein N is a positive integer not less than 3; the N pressure sensors 4 are respectively connected with the N wafer contactors 3 and are used for acquiring the pressure value of the wafer after the wafer is placed on the wafer contactor 3, wherein the pressure value is the sum of the output values of the N pressure sensors; the controller 8 is connected with the output ends of the N pressure sensors 4 and is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Specifically, as shown in fig. 1, there are a 1 st wafer contactor 301 and a 2 nd wafer contactor 302 … … nth wafer contactor 30N, and since the wafer contactors are solid members for contacting and supporting the wafers, at least 3 wafers are required to be able to fix the sheet-like wafers, and therefore, N is an integer not less than 3, that is, a natural number such as 3 or 4 … …. Correspondingly, N pressure sensors, namely the 1 st pressure sensor 401 and the 2 nd pressure sensor 402 … … nth pressure sensor 40N, can be arranged at the bottom of the wafer contactor in a one-to-one correspondence manner, so that when a wafer is placed on the wafer contactor, the wafer can generate pressure on the pressure sensors, and the pressure sensors acquire pressure values caused by the wafer. The pressure value is the sum of the output values of the N pressure sensors, that is, the pressure value measured by each pressure sensor needs to be summed, if the position of the wafer is correctly placed and is at the midpoint, the pressure value measured by each pressure sensor is the same, but if the position of the wafer is not at the midpoint, the pressure value measured by each pressure sensor may not be the same, but even if the pressure value is not the same, the sum of the output values of the sensors is the total pressure value generated by the corresponding wafer.
Specifically, when the controller performs the determination by using the pressure generated by the pressure sensor 4, the controller may be specifically configured to search a pressure value range corresponding to the pressure value in the preset pressure value table; if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range; and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal. For example, the pressure value is 5, and there are: the range of the first pressure value is 1-2, the range of the second pressure value is 2-3, and the range of the third pressure value is 3-4; if only the three pressure ranges exist, the current wafer is an abnormal wafer, and an abnormal alarm signal should be sent out. If the fourth pressure value range 4-5 exists in the preset pressure value table, the current wafer belongs to the fourth pressure value range, and therefore the type of the current wafer can be judged. Of course, the preset pressure value table also contains the wafer types corresponding to the pressure value ranges such as the first pressure value range, the second pressure value range … …, and the like. In particular, the wafer type may be a process type or may be a different customer type from the wafer.
Further, as for the Pressure sensor, the Pressure sensor 4(Pressure Transducer) is a device or means that can sense a Pressure signal and can convert the Pressure signal into a usable output electric signal according to a certain rule. May be provided in particular as a piezoceramic sensor. The main working principle of the piezoelectric ceramic sensor is the direct piezoelectric effect, and due to the action of external force, the generated charges can be stored only when a loop has infinite input impedance. Of course, other pressure sensors 4 may be used, such as sapphire pressure sensor 4, piezoelectric pressure sensor 4, diffused silicon pressure sensor 4, piezoresistive pressure sensor 4, etc., which are not described in detail herein.
It should be noted that, in order to determine whether the wafer is placed on the transfer robot, a camera device may be further disposed in the wafer detection system, and the camera device is configured to capture a real-time image of the transfer robot; the controller is further used for receiving the real-time image, judging whether the wafer is placed on the wafer contactor 3 according to the real-time image, and starting the pressure sensor 4 when the wafer is placed on the wafer contactor 3. That is, the wafer is determined whether it is in place by image recognition. Of course, a neural network needs to be set up in the controller and trained with image samples identifying the number wafer in place.
Specifically, for the combination manner of the pressure sensors 4 and the wafer contactor 3, N pressure sensors 4 may be specifically arranged at the bottom of the wafer contactor 3; the N wafer contactors 3 are uniformly distributed on the supporting part 11 of the conveying manipulator. The conveying manipulator is provided with a base body 1, a supporting part 11 used for supporting a wafer is arranged on the base body 1, the supporting part 11 is provided with a wafer contactor 3, the wafer contactor 3 protrudes out of the surface of the supporting part 11, and the bottom of the wafer contactor 3 is provided with a pressure sensor 4. The wafer contactor 3 is evenly distributed on the supporting part 11, and the bottom of each wafer contactor is provided with the pressure sensor 4. The wafer contactors 3 and the positive charge terminals 21 are alternately arranged, and/or the wafer contactors 3 and the negative charge terminals are alternately arranged. A wiring groove 13 is formed in the base body 1, and a first wire 5 for connecting the power supply and the positive charge end 21 and a second wire 6 for connecting the power supply and the positive charge end 21 are arranged in the wiring groove 13. When the supporting portion 11 is provided with the wafer contactor 3, the bottom of the wafer contactor 3 is provided with the pressure sensor 4, and the pressure sensor 4 is arranged in the wiring groove 13. The base body 1 is connected with a wiring distributor 7, and the wiring distributor 7 is arranged at one end, close to the power supply, of the wiring groove 13. The connection portion 12 of the base body 1 is connected to the wire distributor 7.
Furthermore, the wafer detection system is also provided with an electrostatic generating device and a power supply; the static electricity generating device comprises a positive charge end 21 and an electronic end 22; the positive charge end 21 and the electron end 22 are both arranged on the conveying manipulator; the power supply is configured to supply power to the positive charge terminal 21 and the electron terminal 22, so that the positive charge terminal 21 generates positive charges and the electron terminal 22 generates electrons. The controller is also used for controlling the static electricity generating device to be electrified so as to increase the friction force between the wafer and the wafer contactor 3. Wherein the power supply provides direct current, and the power supply can be a direct current power supply generator.
On the basis of the above embodiment, in this embodiment, in order to know whether there is a deviation in the wafer placement position, the controller is further configured to issue a wafer placement error alarm when the deviation between any one of the N pressure values corresponding to the N pressure sensors 4 and the other pressure value exceeds a threshold value. That is, if the wafer is placed at the correct position, the pressure values of the N pressure sensors 4 should be the same, but if one of the pressure sensors is abnormal, it indicates that the abnormal pressure sensor 4 is subjected to too much or too little pressure, and the wafer is placed at an incorrect position.
The following describes a wafer inspection method for a transfer robot according to an embodiment of the present invention, and the wafer inspection system for a transfer robot described below and the wafer inspection system for a transfer robot described above may be referred to in correspondence.
Referring to fig. 4 and 5, fig. 4 is a flowchart illustrating a wafer inspection method for a transfer robot according to an embodiment of the present disclosure; fig. 5 is a flowchart illustrating a wafer inspection method for a transfer robot according to an embodiment of the present disclosure.
An embodiment of the present invention further provides a wafer inspection method for a transfer robot, which is applied to the wafer inspection system in any of the above embodiments, and includes:
step S41: when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;
step S42: judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type.
Further, the determining the type of the wafer according to the pressure value and a preset pressure value table to obtain a determination result specifically includes the following steps:
step S51: searching a pressure value range corresponding to the pressure value in the preset pressure value table;
step S52: if the corresponding pressure value range exists in the pressure value table, determining the type of the wafer corresponding to the pressure value range;
step S53: and if the corresponding pressure value range does not exist in the pressure value table, sending an abnormal alarm signal.
According to the wafer detection system and method for the conveying manipulator, provided by the embodiment of the invention, the pressure sensor is additionally arranged, the type and the abnormality of the wafer can be judged according to the pressure value of the wafer acquired by the pressure sensor, different wafer specifications can be effectively distinguished, and the abnormal condition of the wafer can be found.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A wafer inspection system for a transfer robot, comprising: the system comprises N pressure sensors, N wafer contactors and a controller, wherein N is a positive integer not less than 3;
the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors, wherein the pressure values are the sum of output values of the N pressure sensors;
the controller is connected with the output ends of the N pressure sensors and is used for judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type;
the controller is specifically configured to search a pressure value range corresponding to the pressure value in the preset pressure value table;
if the pressure value table has a pressure value range corresponding to the pressure value, determining the wafer type corresponding to the pressure value range;
if the pressure value table does not have a pressure value range corresponding to the pressure value, an abnormal alarm signal is sent out;
the controller is further used for sending out a wafer placement error warning signal when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value.
2. The wafer inspection system of claim 1, wherein the pressure sensor is a piezo ceramic sensor.
3. The wafer inspection system of claim 2, wherein N pressure sensors are disposed at the bottom of the wafer contactor;
n wafer contactors evenly distributed in the supporting part of conveying manipulator.
4. The wafer inspection system of claim 1, further comprising: the camera device is used for shooting a real-time image of the conveying manipulator;
the controller is also used for receiving the real-time image, judging whether the wafer is placed on the wafer contactor according to the real-time image, and starting the pressure sensor when the wafer is placed on the wafer contactor.
5. The wafer inspection system of any of claims 1 to 4, further comprising: a static electricity generating device and a power supply;
the static electricity generating device comprises a positive charge end and an electronic end; the positive charge end and the electronic end are both arranged on the conveying manipulator; the power supply is used for supplying power to the positive charge end head and the electronic end head, so that the positive charge end head generates positive charge, and the electronic end head generates electrons.
6. The wafer inspection system of claim 5, wherein the controller is further configured to control the electrostatic generator to be energized to increase a friction between the wafer and the wafer contactor.
7. A wafer inspection method for a transfer robot, applied to the wafer inspection system according to any one of claims 1 to 6, comprising:
when the wafer is placed on the wafer contactor, acquiring a pressure value of the wafer;
judging the type of the wafer according to the pressure value and a preset pressure value table to obtain a judgment result; the preset pressure value table is provided with a pressure value range and a corresponding wafer type;
searching a pressure value range corresponding to the pressure value in the preset pressure value table;
if the corresponding pressure value range exists in the pressure value table, determining the wafer type corresponding to the pressure value range;
if the corresponding pressure value range does not exist in the pressure value table, an abnormal alarm signal is sent out;
the controller is further used for sending out a wafer placement error warning signal when the deviation of any one of the N pressure values corresponding to the N pressure sensors and other pressure values exceeds a threshold value.
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| CN202011029560.1A CN112216633B (en) | 2020-09-27 | 2020-09-27 | Wafer detection system and method for conveying mechanical arm |
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| CN202011029560.1A CN112216633B (en) | 2020-09-27 | 2020-09-27 | Wafer detection system and method for conveying mechanical arm |
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| CN113899446B (en) * | 2021-12-09 | 2022-03-22 | 北京京仪自动化装备技术股份有限公司 | Wafer transmission system detection method and wafer transmission system |
| CN117723850B (en) * | 2024-02-07 | 2024-04-26 | 泓浒(苏州)半导体科技有限公司 | Electrostatic detection system and method for wafer transfer mechanical arm in ultra-vacuum environment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0536815A (en) * | 1991-07-25 | 1993-02-12 | Canon Inc | Wafer carrier |
| CN105374727B (en) * | 2014-08-25 | 2018-07-06 | 北京北方华创微电子装备有限公司 | The fixing means of electrostatic chuck apparatus and chip or pallet |
| CN105762089B (en) * | 2014-12-18 | 2019-02-19 | 北京北方华创微电子装备有限公司 | The detection of wafer position deviation and method of adjustment and semiconductor processing equipment |
| CN207320081U (en) * | 2017-09-13 | 2018-05-04 | 上海陛通半导体能源科技股份有限公司 | A kind of wafer end actuator with pressure sensor |
| CN208753281U (en) * | 2018-06-15 | 2019-04-16 | 德淮半导体有限公司 | FOUP device |
| US10692754B2 (en) * | 2018-07-15 | 2020-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Device and method for contact state inspection |
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Address after: 100176 block a, 14 / F, courtyard 8, Liangshuihe 2nd Street, Daxing Economic and Technological Development Zone, Beijing Applicant after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 block a, 14 / F, courtyard 8, Liangshuihe 2nd Street, Daxing Economic and Technological Development Zone, Beijing Applicant before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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