CN112210324A - Preparation method of conductive adhesive, conductive material and preparation method of conductive material - Google Patents
Preparation method of conductive adhesive, conductive material and preparation method of conductive material Download PDFInfo
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- CN112210324A CN112210324A CN202010965196.3A CN202010965196A CN112210324A CN 112210324 A CN112210324 A CN 112210324A CN 202010965196 A CN202010965196 A CN 202010965196A CN 112210324 A CN112210324 A CN 112210324A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Abstract
The invention discloses a preparation method of a conductive adhesive, a conductive material and a preparation method of the conductive material. The conductive adhesive comprises an acrylic adhesive and carbon-coated nickel powder, the mass ratio of the acrylic adhesive to the carbon-coated nickel powder is 100 (1.5-6), and the preparation method of the conductive adhesive comprises the following steps: gradually screening the carbon-coated nickel powder, and finishing use within 30min after screening; taking 1/10 total amount of acrylic acid adhesive, diluting the acrylic acid adhesive until the viscosity of the acrylic acid adhesive is 2000CPS, adding screened nickel-in-carbon powder, uniformly mixing to obtain a solution a, and continuously stirring the solution a for later use; and taking the residual acrylic acid adhesive, diluting the residual acrylic acid adhesive until the viscosity of the acrylic acid adhesive is 4000-6000 CPS, uniformly mixing to obtain a solution b, continuously stirring the solution b, pouring the solution a into the solution b, uniformly mixing to obtain a solution c, and adding a curing agent into the solution c to uniformly mix to obtain the conductive adhesive. The preparation method of the conductive material has lower cost, but the prepared conductive material has good conductive performance.
Description
Technical Field
The invention relates to the technical field of conductive materials, in particular to a preparation method of a conductive adhesive, a conductive material and a preparation method of the conductive material.
Background
The conductive adhesive is an adhesive with certain conductive performance after being cured, and is used for bonding which is not easy to weld and/or has requirements on flatness and/or space limitation and has the conductive function requirement, such as bonding of conductive wiring parts in shielding cases of electronic computers, parabolic antennas and liquid crystal displays.
The conductive adhesive mainly comprises acrylic resin, conductive particles and an auxiliary agent.
The acrylic resin adhesive used for adhesion forms vertical conduction up and down after being added with metal conductive particles, and is attached to the attached metal material, so that the conductive connection of the attached metal material is realized.
Besides improving the conductivity of the conductive adhesive, it is the biggest difficulty to ensure that the price is competitive to expand the market application.
At present, in order to achieve better conductivity of the conductive adhesive, silver powder or silver-coated copper with excellent conductivity coefficient is generally selected as conductive particles, but the price of the silver powder is high, so that the cost is increased, and the silver powder cannot be introduced into application in a large quantity. Therefore, re-evaluation and selection of conductive particles with superior price and performance is the focus of research. Based on this, it is necessary to improve the production process to compensate for the inferior quality of the material.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a preparation method of a conductive adhesive, a conductive material and a preparation method of the conductive material, the cost is low, and the prepared conductive material has good conductive performance.
The invention discloses a preparation method of a conductive adhesive, wherein the conductive adhesive comprises an acrylic adhesive and carbon-coated nickel powder, the mass ratio of the acrylic adhesive to the carbon-coated nickel powder is 100 (1.5-6), and the preparation method of the conductive adhesive comprises the following steps:
gradually screening the carbon-coated nickel powder, and finishing use within 100min after screening;
taking 1/10 total amount of the acrylic acid adhesive, adding toluene to dilute the acrylic acid adhesive until the viscosity of the acrylic acid adhesive is 2000-3000 CPS, adding gradually screened nickel powder coated with carbon, uniformly mixing to obtain a solution a, and continuously stirring the solution a for later use; wherein the set viscosity is 2000-3000 CPS, and the nickel powder coated with metal carbon can not be precipitated too fast and can be uniformly dispersed in the adhesive.
Adding toluene to the residual acrylic acid adhesive, diluting until the viscosity of the acrylic acid adhesive is 4000-6000 CPS, uniformly mixing to obtain a solution b, and continuously stirring the solution b for later use;
and continuously stirring the solution b, pouring the solution a into the solution b, uniformly mixing to obtain a solution c, adding a curing agent into the solution c, and uniformly mixing to obtain the conductive adhesive, wherein the adding proportion of the curing agent is 0.4-2% of the total amount of the acrylic adhesive.
Preferably, in the step of 'gradually screening the carbon-coated nickel powder and finishing the use within 100min after the screening', the gradual screening comprises the following steps of: the first screen is suitable for being screened by a screen with 300 meshes, the particle size of the carbon-coated nickel powder after screening is 0.048mm, the suitable coating glue thickness is 0.045-0.05 mm, the second screen is suitable for being screened by a screen with 400 meshes, the particle size of the carbon-coated nickel powder after screening is 0.038mm, the suitable coating glue thickness is 0.035-0.04 mm, the third screen is suitable for being screened by a screen with 500 meshes, the particle size of the carbon-coated nickel powder after screening is 0.025mm, the suitable coating glue thickness is 0.02-0.025 mm, the fourth screen is suitable for being screened by a screen with 800 meshes, the particle size of the carbon-coated nickel powder after screening is 0.018mm, the suitable coating glue thickness is 0.015-0.02 mm, the fifth screen is suitable for being screened by a screen with 1000 meshes, the particle size of the carbon-coated nickel powder after screening is 0.013mm, the suitable for being screened is 0.01-0.015 mm, the carbon-coated nickel powder after screening is subjected to 4 processes, and the carbon-coated nickel powder is suitable for being added into a gradual agglomeration absorption screen for avoiding.
Preferably, the nickel-in-carbon powder is in a flake shape.
Preferably, in the step of taking the total amount of the acrylic acid adhesive 1/10, adding toluene to dilute the acrylic acid adhesive until the viscosity of the acrylic acid adhesive is 2000-3000 CPS, adding gradually screened nickel-in-carbon powder, uniformly mixing to obtain solution a, continuously stirring the solution a for later use, mixing the acrylic acid resin adhesive and the toluene at 430r/min for 2-8 min, adding the nickel-in-carbon powder, mixing at 430r/min for 5-15 min, and keeping the solution a continuously stirred at 430 r/min.
Preferably, in the step "continuously stirring the solution b, pouring the solution a into the solution b, and uniformly mixing to obtain the solution c", slowly pouring the solution a into the solution b, and stirring at 460r/min for 15-25 min to obtain the solution c.
The invention also provides a conductive material, which comprises a release paper layer, a conductive adhesive layer and a metal substrate layer which are sequentially arranged, wherein the conductive adhesive is adopted as the conductive adhesive layer, the thickness range of the conductive adhesive layer is 10-50 mu m, and the thickness range of the metal substrate layer is 10-36 mu m.
Preferably, the conductive adhesive layer contains carbon-coated nickel powder, and the particle size range of the carbon-coated nickel powder in the conductive adhesive layer is 300-1000 meshes.
The invention also provides a preparation method of the conductive material, which comprises the following steps:
the conductive adhesive which is continuously stirred at 430r/min is taken as the optimal setting. The central point of the conductive adhesive presents a micro-concave vortex, so that the stirring force is enough to drive the whole adhesive and avoid the problem of precipitation of the metal carbon coated nickel powder.
Coating the taken-out conductive adhesive on release paper by adopting a coating machine, wherein the speed of the coating machine is 16M/min, and the temperature of an oven is set as follows: the first zone is 60 ℃, the second zone is 80 ℃, the third zone is 90 ℃, the fourth zone is 100 ℃, the fifth zone is 110 ℃ and the sixth zone is 70 ℃;
and coating the conductive adhesive on release paper, curing and maturing the conductive adhesive by an oven, compounding and rolling the conductive adhesive and the metal substrate at the tail of the coating, maturing the conductive adhesive and the metal substrate at the rear section, standing the conductive adhesive at 25 ℃ for 48 hours, and increasing the anchoring rate of the conductive adhesive and the metal substrate to obtain the conductive material.
The invention has the following beneficial effects:
the invention can primarily disperse the agglomeration problem of the carbon-coated nickel powder by gradually screening the carbon-coated nickel powder and can ensure the particle size uniformity of the carbon-coated nickel powder. Due to the accumulated influence of metal attraction among carbon-coated nickel powder particles, if the carbon-coated nickel powder is placed for too long after being screened, the carbon-coated nickel powder is agglomerated again among the carbon-coated nickel powder particles, so that the research result of the invention is that the carbon-coated nickel powder is added and used within 100min after being screened, the agglomeration again among the carbon-coated nickel powder molecules can be prevented, and the carbon-coated nickel powder is ensured to be uniformly dispersed in the adhesive.
According to the invention, acrylic resin adhesive with total amount of 1/10 and toluene are firstly diluted in a higher proportion, and the acrylic resin adhesive and the toluene are used for pre-dispersing the carbon-coated nickel powder. And then mixing the rest of the acrylic resin adhesive with toluene for dilution in a lower proportion. During pre-dispersion, the acrylic resin adhesive is diluted by a high-proportion solvent, the viscosity of the acrylic resin adhesive is about 2000-3000 CPS, and uniform suspension dispersion of the carbon-coated nickel powder in the adhesive can be conveniently realized. Namely, the acrylic resin adhesive in the solution a can separate the carbon-coated nickel powder particles from each other, so that the movement distance required by particle agglomeration is increased, the movement resistance is increased, and the carbon-coated nickel powder can be kept in a uniformly dispersed state in the solution a under a continuous stirring state. Because the carbon-coated nickel powder and a small amount of acrylic resin adhesive are subjected to pre-dispersion, when the solution a and the solution b are mixed, the further dispersion of the carbon-coated nickel powder can be easily realized, and the carbon-coated nickel powder is in a uniform dispersion state in the conductive adhesive.
According to the invention, the diluted acrylic resin adhesive is adopted to pre-disperse the carbon-coated nickel powder to obtain the solution a, and the solution a is continuously stirred for standby application, so that the carbon-coated nickel powder can be further prevented from being precipitated.
According to the invention, the conductive adhesive is continuously stirred at 200r/min until the coating is finished, so that the carbon-coated nickel powder in the conductive adhesive can be prevented from sinking.
According to the invention, the flaky carbon-coated nickel powder is selected, and in the adhesive, the irregular flaky structure can be better connected and conducted, so that the conductivity of the conductive adhesive is improved. The conductive powder carbon-coated nickel combined with the bimetal is adopted, compared with the silver powder particles commonly used in the market, the carbon-coated nickel powder has more advantages in cost, the newly developed preparation process successfully makes up for the selection of inferior materials, and the conductive material not only achieves excellent conductivity, but also has market competitiveness.
In order to make the aforementioned and other objects, features and advantages of the invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The raw material of the carbon-coated nickel powder used in the embodiments and comparative examples 1-3 is nickel powder which is wrapped by carbon as a center and has an outer layer, and the shape of the carbon-coated nickel powder is flaky.
The carbon-coated nickel powder is screened by a progressive screen with 300-1000 meshes, and the vibration frequency of the screen is 180 times/min during each screening. The thickness of the conductive adhesive layer in the embodiment and the comparative examples 1-4 is 20-25 μm, so that the progressive screening of the carbon-coated nickel powder in the embodiment and the comparative examples 1-3 only performs three screening processes. The first screen is suitably screened by a screen with 300 meshes, and the particle size of the carbon-coated nickel powder after screening is 0.048 mm. The second sieve is suitably sieved by a sieve with 400 meshes, and the particle size of the carbon-coated nickel powder after sieving is 0.038 mm. The third screen is screened by a screen with 500 meshes, and the particle size of the carbon-coated nickel powder after screening is 0.025 mm.
Examples
Preparation of conductive adhesive
The components for preparing the conductive adhesive in this example comprise, by weight, 100 parts of an acrylic resin adhesive with a solid content of 60% and a viscosity of 7000-.
Diluting 10 parts of acrylic resin adhesive with 10 parts of toluene, mixing for 5min at the rotating speed of 430r/min, wherein the viscosity of the diluted acrylic resin adhesive is 2000-3000 CPS, adding 2 parts of carbon-coated nickel powder which is sieved for 30min, mixing for 10min at the rotating speed of 430r/min to obtain a solution a, and continuously stirring the solution a at the rotating speed of 430 r/min.
And (3) diluting 90 parts of acrylic resin adhesive with 20 parts of toluene, mixing for 15min at the rotating speed of 430r/min to obtain solution b, wherein the viscosity of the solution b obtained after dilution is 6000 CPS.
Slowly pouring the solution a into the solution b, stirring for 20min at the rotating speed of 460r/min to obtain a solution c, continuously stirring the solution c at the rotating speed of 400r/min, adding 1.2 parts of acrylic acid curing agent under the stirring state, and continuously stirring for 20min to obtain the conductive adhesive. The rotation speed is adjusted to 430r/min, and the conductive adhesive is continuously stirred until the conductive adhesive is used up.
Preparation of conductive Material
The conductive material comprises a release paper layer, a conductive adhesive layer and an aluminum foil layer which are sequentially connected, wherein the thickness of the aluminum foil layer is 26 micrometers, and the thickness of the conductive adhesive layer is 20-25 micrometers. The conductive adhesive prepared in the embodiment is used as the conductive adhesive layer.
Coating the conductive adhesive continuously stirred at the speed of 430r/min on release paper, adopting comma scraper coating equipment and a transfer coating method, and setting the temperature of an oven: the first zone was 60 ℃, the second zone 80 ℃, the third zone 90 ℃, the fourth zone 100 ℃, the fifth zone 110 ℃, the sixth zone 70 ℃ and the coater speed was 16M/min.
After the conductive adhesive is coated on the release paper, curing and ripening are carried out through an oven, the conductive adhesive layer and the aluminum foil at the coating tail are compounded and wound, and finally, the conductive adhesive layer and the aluminum foil are put into a later stage for ripening for 48 hours at 25 ℃, so that the anchoring rate of the conductive adhesive layer and the aluminum foil is increased, and the conductive material is obtained.
Comparative example 1
Preparation of conductive adhesive
The components for preparing the conductive adhesive in this example comprise, by weight, 100 parts of an acrylic resin adhesive with a solid content of 60% and a viscosity of 7000-.
Diluting 100 parts of acrylic resin adhesive with 30 parts of toluene, mixing for 20min at the rotating speed of 430r/min, adjusting the viscosity of the diluted acrylic resin adhesive to be about 6000CPS, adding 2 parts of carbon-coated nickel powder sieved for 30min after dilution, adjusting the rotating speed to be 400r/min after mixing for 30min at the rotating speed of 460r/min, adding 1.2 parts of acrylic acid curing agent, continuously stirring for 20min to obtain the conductive adhesive, and continuously stirring the conductive adhesive until the conductive adhesive is used up by adjusting the rotating speed to be 200 r/min.
Preparation of conductive Material
The conductive material comprises a release paper layer, a conductive adhesive layer and an aluminum foil layer which are sequentially connected, wherein the thickness of the aluminum foil layer is 26 micrometers, and the thickness of the conductive adhesive layer is 20-25 micrometers. The conductive adhesive prepared in the embodiment is used as the conductive adhesive layer.
The preparation scheme of the conductive material was exactly the same as that in example 1.
Comparative example 2
Preparation of conductive adhesive
The components for preparing the conductive adhesive in this example comprise, by weight, 100 parts of 7000-viscosity 9000CPS acrylic resin adhesive, 2 parts of 500-mesh carbon-coated nickel powder, 0 part of toluene diluent, and 1.2 parts of acrylic curing agent.
Taking 100 parts of acrylic resin adhesive, wherein the viscosity is 7000-9000CPS because toluene is not added for dilution, adding 2 parts of carbon-coated nickel powder sieved for 30min, mixing at 460r/min for 30min, adjusting the rotating speed to 400r/min, adding 1.2 parts of acrylic acid curing agent, continuously stirring for 20min to obtain the conductive adhesive, and continuously stirring the conductive adhesive until the conductive adhesive is used up by adjusting the rotating speed to 200 r/min.
Preparation of conductive Material
The conductive material comprises a release paper layer, a conductive adhesive layer and an aluminum foil layer which are sequentially connected, wherein the thickness of the aluminum foil layer is 26 micrometers, and the thickness of the conductive adhesive layer is 20-25 micrometers. The conductive adhesive prepared in the embodiment is used as the conductive adhesive layer.
The preparation scheme of the conductive material was exactly the same as that in example 1.
Comparative example 3
Preparation of conductive adhesive
The components for preparing the conductive adhesive in this example comprise, by weight, 100 parts of an acrylic resin adhesive with a solid content of 60% and a viscosity of 7000-.
Diluting 10 parts of acrylic resin adhesive with 10 parts of toluene, mixing for 5min at the rotating speed of 430r/min, wherein the viscosity of the diluted acrylic resin adhesive is 2000-3000 CPS, adding 2 parts of carbon-coated nickel powder which is sieved for 6 hours, mixing for 10min at the rotating speed of 430r/min to obtain a solution a, and continuously stirring the solution a at the rotating speed of 430 r/min.
And (3) diluting 90 parts of acrylic resin adhesive with 20 parts of toluene, mixing for 15min at the rotating speed of 430r/min to obtain solution b, wherein the viscosity of the solution b obtained after dilution is 6000 CPS.
Slowly pouring the solution a into the solution b, stirring for 20min at the rotating speed of 460r/min to obtain a solution c, continuously stirring the solution c at the rotating speed of 400r/min, adding 1.2 parts of acrylic acid curing agent under the stirring state, and continuously stirring for 20min to obtain the conductive adhesive. The rotation speed is adjusted to 430r/min, and the conductive adhesive is continuously stirred until the conductive adhesive is used up.
Preparation of conductive Material
The conductive material comprises a release paper layer, a conductive adhesive layer and an aluminum foil layer which are sequentially connected, wherein the thickness of the aluminum foil layer is 26 micrometers, and the thickness of the conductive adhesive layer is 20-25 micrometers. The conductive adhesive prepared in the embodiment is used as the conductive adhesive layer.
The preparation scheme of the conductive material was exactly the same as that in example 1.
Comparative example 4
Preparation of conductive adhesive
In this embodiment, the components for preparing the conductive adhesive include, by weight, 100 parts of an acrylic resin adhesive with a solid content of 60% and a viscosity of about 7000-.
Diluting 10 parts of acrylic resin adhesive with 10 parts of toluene, mixing for 5min at the rotating speed of 430r/min, wherein the viscosity of the diluted acrylic resin adhesive is 2000-3000 CPS, adding 2 parts of carbon-coated nickel powder which is sieved for 30min, mixing for 10min at the rotating speed of 430r/min to obtain a solution a, and continuously stirring the solution a at the rotating speed of 430 r/min.
And (3) diluting 90 parts of acrylic resin adhesive with 20 parts of toluene, mixing for 15min at the rotating speed of 430r/min to obtain solution b, wherein the viscosity of the solution b obtained after dilution is 6000 CPS.
Slowly pouring the solution a into the solution b, stirring for 20min at the rotating speed of 460r/min to obtain a solution c, continuously stirring the solution c at the rotating speed of 400r/min, adding 1.2 parts of acrylic acid curing agent under the stirring state, and continuously stirring for 20min to obtain the conductive adhesive. The rotation speed is adjusted to 430r/min, and the conductive adhesive is continuously stirred until the conductive adhesive is used up.
Preparation of conductive Material
The conductive material comprises a release paper layer, a conductive adhesive layer and an aluminum foil layer which are sequentially connected, wherein the thickness of the aluminum foil layer is 26 micrometers, and the thickness of the conductive adhesive layer is 20-25 micrometers. The conductive adhesive prepared in the embodiment is used as the conductive adhesive layer.
The preparation scheme of the conductive material was exactly the same as that in example 1.
The vertical impedance of the conductive materials prepared in example 1 and comparative examples 1 to 3 was measured with a dc resistance tester with a weight of 1kg, and the results are shown in the following table:
according to the test results, the following test results are obtained: compared with the comparative proportion, the electric resistance value is the smallest, in other words, the electric conductivity is the best. Therefore, the scheme in the embodiment is the best scheme of the invention.
The 500-mesh carbon-coated nickel powder adopted in the embodiment of the invention is subjected to progressive screening and is used within 30min after being screened. And then diluting 1/10 acrylic resin adhesive by using a high-proportion solvent, setting the viscosity to be about 2000-3000 CPS, and pre-dispersing the carbon-coated nickel powder by using the diluted acrylic resin adhesive. The remaining 9/10 acrylic resin adhesive was then diluted with a low proportion of solvent to a viscosity of about 6000 CPS. Finally, the two are added and mixed.
The difference between the comparative example 1 and the example is that the carbon-coated nickel powder is not pre-dispersed by the diluted acrylic resin adhesive in the comparative example 1.
Comparative example 2 differs from the examples in that the viscosity of the acrylic adhesive in comparative example 2 was 7000-9000CPS, without additional toluene dilution.
Comparative example 3 is different from the examples in that the nickel-in-carbon powder of comparative example 3 is used after being sieved and left to stand for 6 hours.
Comparative example 4 differs from the examples in that the nickel-in-carbon powder used in comparative example 4 was not progressively sized.
The conductive materials of comparative examples 1-4 have much less conductive properties than the conductive materials of the examples.
From the test results of the examples and the comparative examples 1 to 4, it can be known that the conducting performance of the conducting material can be greatly improved by pre-dispersing the carbon-coated nickel powder and using the carbon-coated nickel powder within 30min after the carbon-coated nickel powder is screened.
Because of the accumulated influence of the air humidity and the attraction of metal among carbon-coated nickel powder particles, if the carbon-coated nickel powder is placed for too long after being sieved, the carbon-coated nickel powder is agglomerated again, so that the carbon-coated nickel powder after being sieved is used up within 100min, and the agglomeration again among the carbon-coated nickel powder molecules is prevented.
The carbon-coated nickel powder is pre-dispersed, so that the uniform suspension and dispersion of the carbon-coated nickel powder in the adhesive can be realized conveniently. Namely, the acrylic resin adhesive in the solution a can separate the carbon-coated nickel powder particles from each other, so that the movement distance required by particle agglomeration is increased, the movement resistance is increased, and the carbon-coated nickel powder can be kept in a uniformly dispersed state in the solution a under a continuous stirring state. Because the carbon-coated nickel powder and a small amount of acrylic resin adhesive are subjected to pre-dispersion, when the solution a and the solution b are mixed, the further dispersion of the carbon-coated nickel powder can be realized, and the carbon-coated nickel powder is in a uniform dispersion state in the conductive adhesive.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. The preparation method of the conductive adhesive is characterized by comprising an acrylic adhesive and carbon-coated nickel powder, wherein the mass ratio of the acrylic adhesive to the carbon-coated nickel powder is 100 (1.5-6), and the preparation method of the conductive adhesive comprises the following steps:
gradually screening the carbon-coated nickel powder, and finishing use within 100min after screening;
1/10 of the total amount of the acrylic acid adhesive is taken, toluene is added to dilute the acrylic acid adhesive until the viscosity of the acrylic acid adhesive is 2000-3000 CPS, then gradually screened nickel powder coated with carbon is added, liquid a is obtained after uniform mixing, and liquid a is continuously stirred for standby;
adding toluene to the residual acrylic acid adhesive, diluting until the viscosity of the acrylic acid adhesive is 4000-6000 CPS, uniformly mixing to obtain a solution b, and continuously stirring the solution b for later use;
and continuously stirring the solution b, pouring the solution a into the solution b, uniformly mixing to obtain a solution c, adding a curing agent into the solution c, and uniformly mixing to obtain the conductive adhesive, wherein the adding proportion of the curing agent is 0.4-2% of the total amount of the acrylic adhesive.
2. The method for preparing the conductive adhesive according to claim 1, wherein the step of gradually screening the nickel-in-carbon powder after 100min is finished comprises the following steps: the first screen is suitably screened by a 300-mesh screen, the second screen is suitably screened by a 400-mesh screen, the third screen is suitably screened by a 500-mesh screen, the fourth screen is suitably screened by a 800-mesh screen, and the fifth screen is suitably screened by a 1000-mesh screen.
3. The method according to claim 1, wherein the nickel-on-carbon powder is in a flake form.
4. The preparation method of the conductive adhesive according to claim 1, wherein in the step of taking 1/10 total amount of the acrylic adhesive, adding toluene to dilute the acrylic adhesive until the viscosity of the acrylic adhesive is 2000-3000 CPS, adding gradually screened nickel-in-carbon powder, uniformly mixing to obtain solution a, continuously stirring the solution a for later use, mixing the acrylic resin adhesive and the toluene at 430r/min for 2-8 min, adding the nickel-in-carbon powder, mixing at 430r/min for 5-15 min, and keeping continuously stirring the solution a at 430 r/min.
5. The method for preparing the conductive adhesive according to claim 1, wherein in the step "continuously stirring the solution b", the solution a is poured into the solution b and uniformly mixed to obtain the solution c ", the solution a is slowly poured into the solution b, and the mixture is stirred at 460r/min for 15-25 min to obtain the solution c.
6. The conductive material comprises a release paper layer, a conductive adhesive layer and a metal substrate layer which are sequentially arranged, and is characterized in that the conductive adhesive layer adopts the conductive adhesive as claimed in any one of claims 1 to 5, the thickness range of the conductive adhesive layer is 10 to 50 μm, and the thickness range of the metal substrate layer is 10 to 36 μm.
7. The conductive material of claim 6, wherein the conductive adhesive layer comprises carbon-coated nickel powder, and the particle size of the carbon-coated nickel powder in the conductive adhesive layer is 300-1000 mesh.
8. A method for preparing the conductive material of claim 6, comprising the steps of:
taking the conductive adhesive which is continuously stirred at 430 r/min;
coating the taken-out conductive adhesive on release paper by adopting a coating machine, wherein the speed of the coating machine is 16M/min, and the temperature of an oven is set as follows: the first zone is 60 ℃, the second zone is 80 ℃, the third zone is 90 ℃, the fourth zone is 100 ℃, the fifth zone is 110 ℃ and the sixth zone is 70 ℃;
and coating the conductive adhesive on release paper, curing and maturing the conductive adhesive by an oven, compounding and rolling the conductive adhesive and the metal substrate at the tail of the coating, maturing the conductive adhesive and the metal substrate at the rear section, and standing the conductive adhesive at 25 ℃ for 48 hours to obtain the conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010965196.3A CN112210324A (en) | 2020-09-15 | 2020-09-15 | Preparation method of conductive adhesive, conductive material and preparation method of conductive material |
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| CN202010965196.3A CN112210324A (en) | 2020-09-15 | 2020-09-15 | Preparation method of conductive adhesive, conductive material and preparation method of conductive material |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008308733A (en) * | 2007-06-14 | 2008-12-25 | Toda Kogyo Corp | Nickel powder coated with carbon and production method therefor |
| CN109355543A (en) * | 2018-11-02 | 2019-02-19 | 安徽工业大学 | A kind of core-shell structure carbon covered metal Nano capsule Al2O3Composite substrate and preparation method |
| CN109796899A (en) * | 2018-12-25 | 2019-05-24 | 太仓金煜电子材料有限公司 | A kind of production method of ultra-thin conductive metal tape |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008308733A (en) * | 2007-06-14 | 2008-12-25 | Toda Kogyo Corp | Nickel powder coated with carbon and production method therefor |
| CN109355543A (en) * | 2018-11-02 | 2019-02-19 | 安徽工业大学 | A kind of core-shell structure carbon covered metal Nano capsule Al2O3Composite substrate and preparation method |
| CN109796899A (en) * | 2018-12-25 | 2019-05-24 | 太仓金煜电子材料有限公司 | A kind of production method of ultra-thin conductive metal tape |
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