CN112208013B - Dressing method - Google Patents

Dressing method Download PDF

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Publication number
CN112208013B
CN112208013B CN202010644248.7A CN202010644248A CN112208013B CN 112208013 B CN112208013 B CN 112208013B CN 202010644248 A CN202010644248 A CN 202010644248A CN 112208013 B CN112208013 B CN 112208013B
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China
Prior art keywords
plate
cutting
trimming
dressing
cutting tool
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Application number
CN202010644248.7A
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Chinese (zh)
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CN112208013A (en
Inventor
蔡卓萧
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Disco Corp
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Disco Corp
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Provided is a trimming method capable of suppressing the time required for planarization trimming. The trimming method has the following steps: a position detection step (ST 4) for shooting the trimming plate held on the holding table by a shooting unit and detecting the position of the outer periphery of the trimming plate; a positioning step (ST 6) of positioning the direction from one end of the trimming plate toward the other end in parallel with the axis of the spindle, and positioning the lower end of the cutting tool outside one end of the trimming plate at the cutting depth of the cutting into the trimming plate according to the position of the outer peripheral edge of the trimming plate detected by the position detection step (ST 4); and a dressing step (ST 7) in which, after the positioning step (ST 6) is performed, the cutting tool is moved relative to the dressing plate so as to cut from one end of the dressing plate to the other end, thereby flattening the tip of the cutting tool.

Description

Dressing method
Technical Field
The present invention relates to a method of planarizing and trimming a cutting tool.
Background
The cutting device cuts various plate-shaped workpieces such as semiconductor substrates, resin package substrates, and ceramic substrates, which are made of silicon, gallium arsenide, siC (silicon carbide), sapphire, and the like, with a cutting tool, and when the cutting device cuts a workpiece, the tip of the cutting edge of the cutting tool may be deformed into a circular arc shape in cross section.
Some cutting devices perform flattening and trimming regularly, and planarize the tip of the cutting edge of the cutting tool along the axial center of the spindle (see, for example, patent document 1). In the dressing method disclosed in patent document 1, a cutting tool is moved in the axial direction of a spindle from one end to the other end of a dressing plate attached to a frame by being attached to a belt, and the dressing plate is cut by the cutting tool, thereby performing flattening dressing. Therefore, the cutting device stores the size of the dressing plate in advance, and sets the moving distance of the cutting tool according to the size of the dressing plate.
Patent document 1: japanese patent application laid-open No. 2010-588
The trimming method disclosed in patent document 1 holds the frame by a conveying unit and conveys the frame so that the center of the frame overlaps the center of the holding table. Therefore, in the dressing method, the chuck center and the dressing plate center do not necessarily coincide with each other due to an error in the bonding position of the dressing plate to the frame and a conveyance error, and therefore the cutting tool is moved between positions outside the outer peripheral edge of the dressing plate by the margin width. However, in the dressing method disclosed in patent document 1, since the movement distance of the cutting tool increases according to the margin width, the time required for dressing increases, and it is desired to shorten the time required for dressing. In particular, compared to a case where a workpiece is cut by relatively moving a cutting tool in the X-axis direction as in a normal cutting, the planarization dressing applies a load to the cutting tool, and thus the relative movement speed is set to be low. Therefore, regarding planarization finishing, it is highly desirable to set the margin width as short as possible.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and an object thereof is to provide a trimming method capable of suppressing the time required for planarization trimming.
In order to achieve the above object, the present invention provides a method for flattening a cutting tool fixed to a front end of a spindle, comprising the steps of: a position detection step of photographing the trimming plate held on the holding table by using a photographing member, and detecting the position of the outer peripheral edge of the trimming plate; a positioning step of positioning a direction from one end of the dressing plate toward the other end thereof in parallel with an axis of the spindle, and positioning a lower end of the cutting tool at a predetermined height position cut into the dressing plate outside the one end of the dressing plate in accordance with a position of an outer peripheral edge of the dressing plate detected by the position detecting step; and a dressing step of relatively moving the cutting tool with respect to the dressing plate after the positioning step is performed, and cutting the one end of the dressing plate to the other end thereof, thereby flattening the tip of the cutting tool.
The trimming method may include the steps of: a cutting completion region storing step of storing information on a cutting completion region of the finishing plate cut by the finishing step; a processing step of removing the dressing plate from the holding table after the dressing step is performed, holding the workpiece by the holding table, and cutting the workpiece on the holding table by the cutting tool; a2 nd positioning step of, after the machining step is performed, carrying out the workpiece from the holding table, holding the dressing plate by the holding table, and positioning the lower end of the cutting tool at a predetermined height position cut into the dressing plate outside one end of the dressing plate based on the position of the outer peripheral edge of the dressing plate detected by the position detecting step and the information on the cutting completion region of the dressing plate stored by the cutting completion region storing step; and a2 nd dressing step of relatively moving the cutting tool with respect to the dressing plate to cut from the one end to the other end of the dressing plate after the 2 nd positioning step is performed.
The trimming method of the present application has an effect of being able to suppress the time required for planarization trimming.
Drawings
Fig. 1 is a perspective view showing a configuration example of a cutting device for performing the dressing method according to embodiment 1.
Fig. 2 is a perspective view showing an example of a dressing plate for flattening and dressing a cutting tool of the cutting device shown in fig. 1.
Fig. 3 is an example of a cross-sectional view of the tip of the cutting edge of the cutting tool before flattening and trimming in the trimming method of embodiment 1.
Fig. 4 is an example of a cross-sectional view of the tip of the cutting edge of the cutting tool after the flattening and trimming of the cutting tool shown in fig. 3.
Fig. 5 is a plan view of the dressing plate, showing a dressing start position, a dressing end position, and the like of the dressing method of embodiment 1.
Fig. 6 is a side sectional view of the dressing plate, showing the cutting depth and the like of the dressing method of embodiment 1.
Fig. 7 is a flowchart showing the flow of the trimming method according to embodiment 1.
Fig. 8 is a side view in partial cross-section illustrating a processing step of the trimming method illustrated in fig. 7.
Fig. 9 is a plan view of the workpiece at the position detection step of the dressing method shown in fig. 7.
Fig. 10 is a side view of the cutting unit and the dressing plate showing in partial cross-section the positioning step of the dressing method shown in fig. 7.
Fig. 11 is a top view of the cutting unit and the finishing plate shown in fig. 10.
Fig. 12 is a side view of the cutting unit and the dressing plate showing the dressing step of the dressing method shown in fig. 7 in partial cross-section.
Fig. 13 is a top view of the cutting unit and the finishing plate shown in fig. 12.
Fig. 14 is a top view of the finishing plate after the finishing step of the finishing method shown in fig. 7.
Fig. 15 is a top view of the cutting unit and the finishing plate of the 2 nd positioning step of the finishing method shown in fig. 7.
Fig. 16 is a top view of the cutting unit and the finishing plate of the finishing step 2 of the finishing method shown in fig. 7.
Description of the reference numerals
1: A cutting device; 10: a holding table; 21: a cutting tool; 22: a main shaft; 30: a photographing unit (photographing means); 90: trimming the plate; 91: one end; 92: the other end; 200: a workpiece; 304: depth of cut (predetermined height position); 601: a cutting completion region; ST2: a processing step; ST4: a position detection step; ST6: positioning; ST7: a trimming step; ST8: a cutting completion region storing step; ST10: a2 nd positioning step; ST11: and 2, finishing step.
Detailed Description
The mode (embodiment) for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiments. The constituent elements described below include those that can be easily understood by those skilled in the art and those that are substantially the same. The structures described below may be appropriately combined. Various omissions, substitutions and changes in the structure may be made without departing from the spirit of the invention.
Embodiment 1
A trimming method according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a cutting device for performing the dressing method according to embodiment 1. Fig. 2 is a perspective view showing an example of a dressing plate for flattening and dressing a cutting tool of the cutting device shown in fig. 1. Fig. 3 is an example of a cross-sectional view of the tip of the cutting edge of the cutting tool before flattening and trimming in the trimming method of embodiment 1. Fig. 4 is an example of a cross-sectional view of the tip of the cutting edge of the cutting tool after the flattening and trimming of the cutting tool shown in fig. 3. Fig. 5 is a plan view of the dressing plate, showing a dressing start position, a dressing end position, and the like of the dressing method of embodiment 1. Fig. 6 is a side sectional view of the dressing plate, showing the cutting depth and the like of the dressing method of embodiment 1.
The dressing method of embodiment 1 is implemented by the cutting device 1 shown in fig. 1. The cutting device 1 shown in fig. 1 is a device for cutting (machining) a workpiece 200 that is a plate-like object. In embodiment 1, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium, or the like as a base material. The workpiece 200 has devices 203 formed on a front surface 201 in regions divided in a lattice shape by a plurality of lines 202 to be divided formed in a lattice shape. The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which a central portion is thinned and a thick portion is formed on an outer peripheral portion, or may be a rectangular package substrate, a ceramic plate, a glass plate, or the like having a plurality of resin-sealed devices, in addition to the wafer. A circular plate-shaped adhesive tape 206 is attached to the back surface 204 of the workpiece 200, and an annular ring frame 205 having an inner diameter larger than the outer diameter of the workpiece 200 is attached to the outer periphery of the adhesive tape 206, so that the workpiece 200 is supported by the opening inside the ring frame 205.
The cutting device 1 shown in fig. 1 is a device for holding a workpiece 200 having a line 202 to be divided by a holding table 10 and cutting the workpiece along the line 202 to be divided by a cutting tool 21. As shown in fig. 1, the cutting device 1 includes: a holding table 10 for sucking and holding the workpiece 200 by the holding surface 11; a cutting unit 20 for cutting the workpiece 200 held by the holding table 10 by a cutting tool 21 attached to a spindle 22; an imaging unit 30 as an imaging means for imaging the workpiece 200 held by the holding table 10; and a control unit 100 as a control means.
As shown in fig. 1, the cutting device 1 includes at least: an X-axis moving unit 41 that performs machining feed of the holding table 10 in an X-axis direction parallel to the horizontal direction and the width direction of the apparatus main body 2; a Y-axis moving unit 42 that performs indexing feed of the cutting unit 20 in a Y-axis direction parallel to the horizontal direction and the longitudinal direction of the apparatus main body 2 and perpendicular to the X-axis direction; a Z-axis moving unit 43 that performs cutting and feeding of the cutting unit 20 in a Z-axis direction parallel to a vertical direction perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 44 that rotates the holding table 10 around an axis parallel to the Z-axis direction, and performs machining feed in the X-axis direction together with the holding table 10 by the X-axis moving unit 41.
The holding table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramics or the like. The holding table 10 is provided to be movable by the X-axis moving means and rotatable by a rotation driving source. The holding table 10 is connected to a vacuum suction source, not shown, and sucks and holds the workpiece 200 by the vacuum suction source. Further, a plurality of clamping portions 12 for clamping the ring frame 211 are provided around the holding table 10.
The cutting unit 20 has a spindle 22 to which a cutting tool 21 for cutting the workpiece 200 held by the holding table 10 is attached. The cutting unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 42 and so as to be movable in the Z-axis direction by the Z-axis moving unit 43 with respect to the workpiece 200 held by the holding table 10.
As shown in fig. 1, the cutting unit 20 is provided on a support frame 3 erected from the apparatus main body 2 by a Y-axis moving unit 42, a Z-axis moving unit 43, and the like. The cutting unit 20 can position the cutting tool 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.
The cutting unit 20 includes, in addition to the cutting tool 21 and the spindle 22 having the cutting tool 21 attached to the tip thereof: a spindle case 23 that accommodates the spindle 22 rotatably about an axis by being moved in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 42 and the Z-axis moving unit 43; and a spindle motor, not shown, which is housed in the spindle case 23 and rotates the spindle 22 around the axis.
The cutting tool 21 is an extremely thin cutting grinder having a substantially annular shape. The spindle 22 rotates the cutting tool 21 to cut the workpiece 200. The spindle 22 is accommodated in a spindle housing 23, and the spindle housing 23 is supported by a Z-axis moving unit 43. The spindle 22 of the cutting unit 20 and the axial center of the cutting tool 21 are set parallel to the Y-axis direction.
The X-axis moving unit 41 moves the holding table 10 in the X-axis direction as the machining feed direction, and thereby relatively performs machining feed of the holding table 10 and the cutting unit 20 along the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction as the indexing direction, thereby indexing the holding table 10 and the cutting unit 20 relatively in the Y-axis direction. The Z-axis moving unit 43 moves the cutting unit 20 in the Z-axis direction, which is the plunge feed direction, and thereby plunges the holding table 10 and the cutting unit 20 relatively in the Z-axis direction.
The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 have: a known ball screw provided rotatably around an axis; a known pulse motor that rotates a ball screw around an axis; and a well-known guide rail for supporting the holding table 10 or the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.
The cutting device 1 further includes: an X-axis direction position detecting means, not shown, for detecting the position of the holding table 10 in the X-axis direction; a Y-axis direction position detecting unit, not shown, for detecting the Y-axis direction position of the cutting unit 20; and a Z-axis direction position detecting unit for detecting a Z-axis direction position of the cutting unit 20. The X-axis direction position detecting unit and the Y-axis direction position detecting unit may be constituted by a linear scale and a readhead parallel to the X-axis direction or the Y-axis direction. The Z-axis direction position detection unit detects the Z-axis direction position of the cutting unit 20 by the pulse of the pulse motor. The X-axis direction position detecting means, the Y-axis direction position detecting means, and the Z-axis direction position detecting means output the position of the holding table 10 in the X-axis direction, the Y-axis direction, or the Z-axis direction of the cutting means 20 to the control means 100. In embodiment 1, each position is predetermined by the distances from the reference position in the X-axis direction, the Y-axis direction, and the Z-axis direction.
The cutting device 1 further includes: a cassette lifter 50 that mounts a cassette 51 that accommodates the workpiece 200 before and after cutting, and moves the cassette 51 in the Z-axis direction; a cleaning unit 60 for cleaning the workpiece 200 after cutting; and a conveying unit, not shown, that conveys the workpiece 200 while bringing the workpiece 200 into and out of the cassette 51.
The cassettes 51 house a plurality of workpieces 200 supported by the annular frame 205 at intervals in the Z-axis direction. In addition, the cassette 51 houses a trimming plate 90 shown in fig. 2. The dressing plate 90 shown in fig. 2 is used for flattening and dressing the cutting tool 21 having a circular-arc-shaped cross section at the tip end of the cutting edge 24, as shown in fig. 3, for example, by repeating cutting of the workpiece 200. The flattening trimming is to cut the cutting tool 21 shown in fig. 3 into the trimming plate 90 while moving in the Y-axis direction parallel to the axis of the spindle, so that the tip of the cutting edge 24 is formed flat in the Y-axis direction as shown in fig. 4.
In embodiment 1, the trimming plate 90 is formed in a rectangular flat plate shape. The dressing plate 90 is formed by mixing abrasive grains such as WA (white corundum, alumina system) and GC (green silicon carbide, silicon carbide system) into a resin or ceramic bonding material. The trimming plate 90 is attached with a disc-shaped adhesive tape 206 on one surface, and an annular frame 205 is attached to the outer periphery of the adhesive tape 206, similarly to the workpiece 200, and is supported by an opening inside the annular frame 205. The trimming plate 90 is disposed at the center of the ring frame 205, but the relative position to the ring frame 205 may be set at a predetermined position, but may deviate from the predetermined position.
The dressing plate 90 is supported by the ring frame 205, is stored in a predetermined position in the Z-axis direction of the cassette 51, and when flattening dressing is performed, the dressing plate 90 is carried out of the cassette 51, and thereafter, is sucked and held by the holding table 10, and the ring frame 205 is clamped by the clamping portion 12. In the planarization and trimming, the cutting edge 24 of the cutting tool 21 of the cutting unit 20 moving in the Y-axis direction is cut in while the trimming plate 90 is held on the holding table 10, and a cutting groove 95 (shown by a broken line in fig. 5) recessed from the upper surface is formed in the trimming plate 90, thereby performing the planarization and trimming on the cutting tool 21.
In the flattening trimming, the cutting tool 21 is relatively moved in the Y-axis direction with respect to the trimming plate 90 from one end 91 toward the other end 92 in the Y-axis direction of the trimming plate 90 held by the holding table 10, or from the other end 92 toward the one end 91, thereby forming the cutting groove 95. In the flattening trimming, after the cutting groove 95 is formed, the cutting tool 21 is moved in the X-axis direction, and is moved relatively in the Y-axis direction with respect to the trimming plate 90 from the other end 92 toward one end 91 or from one end 91 toward the other end 92 of the trimming plate 90 held by the holding table 10, thereby forming the cutting groove 95.
In embodiment 1, in the planarization finishing, the cutting tool 21 sequentially forms the cutting grooves 95 parallel to the Y-axis direction from one end 93 toward the other end 94 in the X-axis direction. Further, compared to the usual dressing in which the cutting tool 21 is relatively moved in the X-axis direction with respect to the dressing plate 90, the planarization dressing moves the cutting tool 21 in the Y-axis direction, and thus the relative movement speed of the cutting tool 21 with respect to the dressing plate 90 is slower.
The photographing unit 30 is fixed to move integrally with the cutting unit 20. The imaging unit 30 includes an imaging element that images a region to be divided of the workpiece 200 held by the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS, complementary metal oxide semiconductor) imaging element. The imaging unit 30 images the workpiece 200 held by the holding table 10 to obtain an image for performing alignment (i.e., aligning the workpiece 200 with the cutting tool 21), and outputs the obtained image to the control unit 100.
When flattening trimming is performed, the imaging unit 30 images the outer peripheral edge of the trimming plate 90 held by the holding table 10, and outputs the imaged image to the control unit 100. In embodiment 1, the imaging unit 30 images the center in the longitudinal direction of all the outer peripheral edges of the trimming plate 90. The relative position of the imaging unit 30 with respect to the holding table 10 when the imaging unit 30 images the outer peripheral edge of the trimming plate 90 is set in advance, and the field of view of the imaging unit 30 is set to a range in which the outer peripheral edge can be imaged even if the trimming plate 90 is displaced from the annular frame 205.
The control unit 100 controls the above-described components of the cutting device 1, respectively, so that the cutting device 1 performs the processing operation and the planarization finishing on the workpiece 200. In addition, the control unit 100 is a computer, and the control unit 100 has: an arithmetic processing device having a microprocessor such as a CPU (central processing unit ); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory; and an input/output interface device.
The control unit 100 is connected to a display unit, not shown, which is configured by a liquid crystal display device or the like that displays a state of a machining operation, an image, or the like, an input unit used by an operator to register machining content information, or the like, and a notification unit 110. The input unit is configured by at least one of a touch panel provided in the display unit and an external input device such as a keyboard. The notification unit 110 is controlled by the control unit 100 to emit at least one of light and sound, and notifies the operator of the emitted light and sound.
The memory device of the control unit 100 registers processing conditions from the input unit. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with the machining conditions and the computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to the above-described components of the cutting device 1 via the input/output interface device. In embodiment 1, the machining conditions include an X-axis direction margin width 301, a Y-axis direction margin width 302, an X-axis direction feed width 303, the number of times the cutting tool 21 is moved relative to the dressing plate 90, and a cutting depth 304 shown in fig. 6, which are shown in fig. 5. These X-axis direction margin width 301, Y-axis direction margin width 302, X-axis direction feed width 303, and the number of movements of the cutting tool 21 relative to the dressing plate 90 and the cutting depth 304 are processing conditions when the cutting device 1 performs planarization dressing.
The X-axis direction margin width 301 is a distance in the X-axis direction from one end 93 of the trimming plate 90 in the X-axis direction, on which the planarization trimming has not been performed, to the trimming start position 401 or the trimming end position 402 at the time of the initial planarization trimming. In addition, the dressing start position 401 is a position of the lower end of the cutting edge 24 of the cutting tool 21 when the outer side of the dressing plate 90 held by the holding table 10 and the cutting unit 20 starts to move in the Y-axis direction with respect to the dressing plate 90 when flattening dressing is performed. The dressing end position 402 is a position of the lower end of the cutting edge 24 of the cutting tool 21 when the outer side of the dressing plate 90 held by the holding table 10 and the movement of the cutting unit 20 in the Y-axis direction with respect to the dressing plate 90 is ended at the time of performing the planarization dressing.
The Y-axis direction margin width 302 is a distance in the Y-axis direction from an end of the trimming plate 90 in the Y-axis direction to the trimming start position 401 or the trimming end position 402. In order to make the relative movement speed of the flattened and dressed cutting tool 21 with respect to the dressing plate 90 slower than the relative movement speed of the normal and dressed cutting tool 21 with respect to the dressing plate 90, the Y-axis direction margin width 302 is preferably an extremely short distance.
The X-axis direction feed width 303 is a distance in the X-axis direction between the dressing start position 401 and the dressing end position 402, that is, a distance when the cutting tool 21 is moved in the Y-axis direction with respect to the dressing plate 90 after being moved in the X-axis direction with respect to the dressing plate 90 at the time of planarization dressing.
The number of movements of the cutting tool 21 relative to the dressing plate 90 indicates the number and orientation of movements of the cutting tool 21 relative to the dressing plate 90 in the Y-axis direction in one planarization dressing. In embodiment 1, the number of movements of the cutting tool 21 relative to the dressing plate 90 indicates the number and orientation of movements of the cutting tool 21 relative to the dressing plate 90 in the Y-axis direction from one end 91 toward the other end 92 of the Y-axis direction of the dressing plate 90 held by the holding table 10, and then from the other end 92 toward the one end 91.
The cutting depth 304 is a predetermined height position at which the cutting tool 21 cuts into the dressing plate 90, and indicates a distance from the upper surface of the dressing plate 90 to the lower end of the cutting edge 24 of the cutting tool 21 cut into the dressing plate 90 during planarization and dressing. In addition, the control unit 100 stores information related to the outer diameter of the cutting edge 24 of the cutting tool 21. Information on the outer diameter of the cutting edge 24 of the cutting tool 21 is registered from an input unit or in a storage device by a reference position setting means, not shown, of the cutting device 1.
As shown in fig. 1, the control unit 100 includes a cutting completion region storage unit 101, a trimming range setting unit 102, and a control unit 103. The cutting completion region storage unit 101 stores information on a cutting completion region 601 (shown in fig. 14) of the finishing plate 90 formed by cutting the cutting edge 24 of the cutting tool 21 during the planarization finishing. In embodiment 1, as information on the cutting completion region 601, the cumulative number of times of movement of the cutting tool 21 in the Y-axis direction with respect to the dressing plate 90 at the time of planarization dressing is stored.
When the number of movements of the cutting completion region storage unit 101, which is information on the cutting completion region 601, is stored as zero, the trimming range setting unit 102 calculates the position of the outer peripheral edge of the trimming plate 90 from the image obtained by photographing the outer peripheral edge of the trimming plate 90, which is not subjected to the flattening trimming, by the photographing unit 30, and sets the trimming start position 401 and the trimming end position 402 at the time of the flattening trimming, based on the margin widths 301 and 302, the X-axis direction feed width 303, the number of movements of the cutting tool 21 relative to the trimming plate 90 at the time of the flattening trimming, and the cutting depth 304.
When the number of movements of the cutting completion region storage unit 101, which is information on the cutting completion region 601, is stored as one or more times, the trimming range setting unit 102 sets the trimming start position 401 and the trimming end position 402 at the time of the planarization trimming, based on the cumulative number of movements of the cutting tool 21 at the time of the planarization trimming, which are stored in the cutting completion region storage unit 101, with respect to the trimming plate 90 in the Y-axis direction, the margin widths 301 and 302, the X-axis direction feed width 303, and the number of movements of the cutting tool 21 at the time of the planarization trimming with respect to the trimming plate 90, and the cutting depth 304.
The control unit 103 controls the constituent elements of the cutting device 1 to cause the cutting device 1 to perform the processing operation and the planarization and the trimming of the workpiece 200.
The cutting completion region storage unit 101 functions as a storage device. The functions of the trimming range setting unit 102 and the control unit 103 are realized by the arithmetic processing device executing a computer program stored in the storage device.
Next, the present description will explain a dressing method according to embodiment 1, which is a machining operation of the cutting device 1. Fig. 7 is a flowchart showing the flow of the trimming method according to embodiment 1. The dressing method, which is the machining operation of the cutting apparatus 1 of embodiment 1, is a flattening dressing method for the cutting tool 21 that divides the workpiece 200 into the individual devices 203 and is fixed to the tip of the spindle 22.
The cutting device 1 configured as described above registers the machining conditions in the control unit 100 by the operator, and sets the cassette 51 accommodating the workpiece 200 and the dressing plate 90 before the cutting machining in the cassette lifter 50. Then, when the cutting device 1 receives a start instruction of a machining operation from an operator via the input means, the machining operation, that is, the dressing method of embodiment 1 is started. When the cutting device 1 starts the machining operation, the control unit 103 of the control unit 100 drives the spindle motor to rotate the spindle 22 around the axis according to the rotation speed set in the machining condition, and determines whether or not the flattening trimming timing is present (step ST 1).
The flattening trimming timing refers to timing of flattening trimming of the cutting tool 21 of the cutting unit 20. In embodiment 1, the flattening trimming timing is registered in the control unit 100 as a part of the machining conditions, for example, every time a predetermined number of workpieces 200 are cut. The flattening timing of the present invention is not limited to every time a predetermined number of workpieces 200 are cut. When the control unit 103 of the control unit 100 of the cutting device 1 determines that the flattening trimming timing is not the flattening trimming timing (step ST1: no), the processing proceeds to a processing step ST2.
(Processing step)
Fig. 8 is a side view in partial cross-section illustrating a processing step of the trimming method illustrated in fig. 7. The processing step ST2 is a step of holding the workpiece 200 by the holding table 10 and cutting the workpiece 200 on the holding table 10 by the cutting tool 21.
In the processing step ST2, the control unit 103 of the control unit 100 controls the conveying unit to take out the workpiece 200 before the cutting processing from the cassette 51, and places the rear surface 204 side on the holding surface 11 of the holding table 10 via the adhesive tape 206. The control unit 103 of the control unit 100 controls the vacuum suction source and the like, sucks and holds the rear surface 204 side of the workpiece 200 on the holding surface 11 of the holding table 10 via the adhesive tape 206, and clamps the ring frame 205 by the clamp 12. The control unit 103 of the control unit 100 controls the X-axis moving unit 41 to move the holding table 10 downward of the cutting unit 20, controls the imaging unit 30 to image the workpiece 200, and performs alignment based on the image obtained by the imaging unit 30.
In the processing step ST2, the control unit 103 of the control unit 100 controls the cutting unit 20 and the respective moving units 41, 42, 43, 44 to relatively move the workpiece 200 and the cutting unit 20 along the lines 202 to be divided, and as shown in fig. 8, cuts the cutting tool 21 into the respective lines 202 to be divided into the respective devices 203. In the processing step ST2, the control unit 103 of the control unit 100 controls the conveying unit to convey the processed object 200 divided into the devices 203 to the cleaning unit 60, controls the cleaning unit 60 to clean the processed object 200, and then controls the conveying unit to store the processed object 200 in the cassette 51, and the flow proceeds to step ST13.
When the control unit 103 of the control unit 100 determines that the flattening trimming timing is the flattening trimming timing (yes in step ST 1), it is determined whether or not the information on the cutting completion area 601 is stored in the cutting completion area storage unit 101, that is, whether or not the number of movements, which is the information on the cutting completion area 601 stored in the cutting completion area storage unit 101, is stored as zero times (step ST 3).
When the control unit 103 of the control unit 100 determines that the cutting completion region storage unit 101 does not store the information on the cutting completion region 601, that is, determines that the number of movements as the information on the cutting completion region 601 stored in the cutting completion region storage unit 101 is zero (step ST3: no), the process proceeds to the position detection step ST4.
(Position detection step)
Fig. 9 is a plan view of the workpiece at the position detection step of the dressing method shown in fig. 7. The position detection step ST4 is a step of detecting the position of the outer peripheral edge of the finishing plate 90 by photographing the finishing plate 90 held on the holding table 10 with the photographing unit 30.
In the position detection step ST4, the control unit 103 of the control unit 100 controls the conveyance unit to take out the finishing plate 90 from the cassette 51, and place the finishing plate 90 on the holding surface 11 of the holding table 10 via the adhesive tape 206. The control unit 103 of the control unit 100 controls the vacuum suction source and the like, suctions and holds the finishing plate 90 on the holding surface 11 of the holding table 10 via the adhesive tape 206, and clamps the ring frame 205 by the clamp 12. The control unit 103 of the control unit 100 controls the X-axis moving unit 41 to move the holding table 10 downward of the cutting unit 20, and controls the imaging unit 30 to image the outer periphery of the finishing plate 90.
In embodiment 1, in the position detection step ST4, the imaging unit 30 images the center portion of each outer peripheral edge in the imaging range 501 shown by the broken line in fig. 9, obtains an image of the center portion of each outer peripheral edge in the imaging range 501, and outputs the obtained image to the control unit 100. In the position detection step ST4, the control unit 103 of the control unit 100 calculates the position of the outer peripheral edge of the trimming plate 90 held by the holding table 10 from the image in the imaging range 501, the detection result of each position detection unit, and the like, and stores the calculated position in the storage device, and the control unit proceeds to the trimming range setting step ST5.
(Trimming Range setting step)
The trimming range setting step ST5 is a step of setting the trimming start position 401 and the trimming end position 402 of the flattening trimming. In the trimming range setting step ST5, the trimming range setting unit 102 of the control unit 100 calculates the trimming start position 401 and the trimming end position 402 with reference to the position of the outer peripheral edge of the trimming plate 90, the margin widths 301 and 302 of the machining conditions, the X-axis direction feed width 303, the number of movements of the cutting tool 21 relative to the trimming plate 90 at the time of flattening trimming, and the cut depth 304 stored in the storage device.
In embodiment 1, in the trimming range setting step ST5, the trimming range setting unit 102 calculates, as the initial trimming start position 401, a position from the one end 93 of the trimming plate 90 in the X-axis direction toward the other end 94 in accordance with the X-axis direction margin width 301 and a position from the one end 91 of the trimming plate 90 in the Y-axis direction toward the outside of the trimming plate 90 in accordance with the Y-axis direction margin width 302. In embodiment 1, in the trimming range setting step ST5, the trimming range setting unit 102 calculates, as the initial trimming end position 402, a position from the one end 93 of the trimming plate 90 in the X-axis direction toward the other end 94 in accordance with the X-axis direction margin width 301 and a position from the other end 92 of the trimming plate 90 in the Y-axis direction toward the outside of the trimming plate 90 in accordance with the Y-axis direction margin width 302. When the trimming range setting step ST5 calculates the trimming start position 401 and the trimming end position 402, it proceeds to the positioning step ST6.
(Positioning step)
Fig. 10 is a side view of the cutting unit and the dressing plate showing in partial cross-section the positioning step of the dressing method shown in fig. 7. Fig. 11 is a top view of the cutting unit and the finishing plate shown in fig. 10.
The positioning step ST6 is a step of: the direction from one end 91 toward the other end 92 of the dressing plate 90 is positioned parallel to the Y-axis direction, which is the axial center of the spindle 22, according to the position of the outer peripheral edge of the dressing plate 90 stored in the storage device, and the lower end of the cutting edge 24 of the cutting tool 21 is positioned outside the one end 91 of the dressing plate 90 to the cutting depth 304 cut into the dressing plate 90 according to the position of the outer peripheral edge of the dressing plate 90 detected by the position detection step ST 4.
In the positioning step ST6, the control unit 103 of the control unit 100 controls the rotation movement unit 44 to adjust the orientation of the holding table 10 about the axis so that the direction from the one end 91 toward the other end 92 of the dressing plate 90 is parallel to the Y-axis direction. In the positioning step ST6, the control unit 103 of the control unit 100 controls the respective moving units 41, 42, 43 to position the lower end of the cutting edge 24 of the cutting tool 21 of the cutting unit 20 at the initial trimming start position 401 calculated in the trimming range setting step ST5, and the process proceeds to the trimming step ST7.
(Finishing step)
Fig. 12 is a side view of the cutting unit and the dressing plate showing the dressing step of the dressing method shown in fig. 7 in partial cross-section. Fig. 13 is a top view of the cutting unit and the finishing plate shown in fig. 12. Fig. 14 is a top view of the finishing plate after the finishing step of the finishing method shown in fig. 7.
The dressing step ST7 is a step of flattening the tip of the cutting edge 24 of the cutting tool 21 by relatively moving the cutting tool 21 with respect to the dressing plate 90 and cutting the dressing plate 90 from one end 91 to the other end 92 after the positioning step ST6 is performed. In the dressing step ST7, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from the one end 91 toward the other end 92 of the dressing plate 90, and cuts the cutting edge 24 of the cutting tool 21 into the dressing plate 90 to form the cutting groove 95, as shown in fig. 12 and 13. In the dressing step ST7, the control unit 103 of the control unit 100 controls the X-axis moving unit 41 and the Y-axis moving unit 42 to stop the movement of the cutting tool 21 in the Y-axis direction at the dressing end position 402, and then moves the cutting tool 21 to the other end 94 side in the X-axis direction by the X-axis direction feed width 303 to be positioned at the next dressing start position 401.
In the dressing step ST7, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from the other end 92 of the dressing plate 90 toward the one end 91, and cuts the cutting edge 24 of the cutting tool 21 into the dressing plate 90 to form the cutting groove 95. In embodiment 1, in the dressing step ST7, the control unit 103 of the control unit 100 moves the cutting tool 21 in the Y-axis direction in accordance with the number of movements of the cutting tool 21 relative to the dressing plate 90 at the time of flattening dressing of the machining conditions, and flattens the tip of the cutting edge 24 of the cutting tool 21. In embodiment 1, when two cutting grooves 95 are formed in the dressing step ST7 as shown in fig. 14, the process proceeds to a cutting completion area storage step ST8.
(Cutting completion region storing step)
The cutting completion region storing step ST8 is a step in which the cutting completion region storing unit 101 stores information on the cutting completion region 601 of the finishing plate 90 cut by the flattening finishing in the finishing step ST 7. In embodiment 1, in the cutting completion region storing step ST8, the cutting completion region storing section 101 stores, as information on the cutting completion region 601, the cumulative number of times, which is obtained by adding the number of times of movement of the cutting tool 21 in the Y-axis direction with respect to the dressing plate 90 in the dressing step ST7 to the number of times of completion that has been stored. When the cutting completion region storage section 101 stores the cumulative number of times of movement of the cutting tool 21 in the Y-axis direction with respect to the dressing plate 90 at the time of the planarization dressing as the information related to the cutting completion region 601 in the cutting completion region storage step ST8, the flow proceeds to step ST13.
When the control unit 103 of the control unit 100 determines that the cutting completion region storage unit 101 stores information about the cutting completion region 601, that is, that the number of movements is stored at least once as information about the cutting completion region 601 stored in the cutting completion region storage unit 101 (yes in step ST 3), the flow proceeds to a 2 nd trimming range setting step ST9.
(2 Nd trimming Range setting step)
The 2 nd trimming range setting step ST9 is a step of setting the trimming start position 401 and the trimming end position 402 of the flattening trimming in the case where the cutting groove 95, which is the cutting completion region 601, is formed in the trimming plate 90.
In the 2 nd trimming range setting step ST9, the trimming range setting section 102 of the control unit 100 calculates the trimming start position 401 and the trimming end position 402 with reference to the cumulative number of times of movement of the cutting tool 21 in the flattening trimming with respect to the trimming plate 90, the position of the outer peripheral edge of the trimming plate 90 stored in the storage device, the allowance widths 301, 302 of the processing conditions, the X-axis direction feeding width 303, the number of times of movement of the cutting tool 21 in the flattening trimming with respect to the trimming plate 90, and the cutting depth 304, which are stored in the cutting completion region storage section 101.
In embodiment 1, in the 2 nd trimming range setting step ST9, the trimming range setting unit 102 calculates the position of the width direction center of the cutting groove 95 formed most recently in the trimming step ST7 or the 2 nd trimming step ST11, calculates the position of the feeding width 303 in the X-axis direction toward the other end 94 from the calculated position of the width direction center of the cutting groove 95 formed most recently and the position of the feeding width 302 in the Y-axis direction toward the outside of the trimming plate 90 from the one end 91 in the Y-axis direction of the trimming plate 90 as the initial trimming start position 401. In embodiment 1, in the 2 nd trimming range setting step ST9, the trimming range setting unit 102 calculates, as the initial trimming end position 402, a position closer to the other end 94 in the X-axis direction from the calculated position of the width direction center of the most recently formed cutting groove 95 and a position closer to the outside of the trimming plate 90 in the Y-axis direction from the other end 92 of the trimming plate 90 in the Y-axis direction margin width 302. When the trimming range setting step ST9 at 2 nd calculates the trimming start position 401 and the trimming end position 402, the process proceeds to the positioning step ST10 at 2 nd.
(Positioning step 2)
Fig. 15 is a top view of the cutting unit and the finishing plate of the 2 nd positioning step of the finishing method shown in fig. 7. The 2 nd positioning step ST10 is the following step: the dressing plate 90 is held by the holding table 10, and the lower end of the cutting edge 24 of the cutting tool 21 is positioned outside the one end 91 of the dressing plate 90 at the cutting depth 304 which is a predetermined height position to be cut into the dressing plate 90, based on the position of the outer peripheral edge of the dressing plate 90 detected in the position detection step ST4 and the information on the cutting completion region of the dressing plate 90 stored in the cutting completion region storage step ST 8.
In embodiment 1, in the 2 nd positioning step ST10, the control unit 103 of the control unit 100 controls the conveying unit to take out the finishing plate 90 from the cassette 51, and place the finishing plate 90 on the holding surface 11 of the holding table 10 via the adhesive tape 206. The control unit 103 of the control unit 100 controls the vacuum suction source and the like, suctions and holds the finishing plate 90 on the holding surface 11 of the holding table 10 via the adhesive tape 206, and clamps the ring frame 205 by the clamp 12.
In the 2 nd positioning step ST10, the control unit 103 of the control unit 100 controls the rotation and transfer unit 44 according to the position of the outer peripheral edge of the finishing plate 90 stored in the storage device, and adjusts the orientation of the holding table 10 around the axis so that the direction from the one end 91 toward the other end 92 of the finishing plate 90 is parallel to the Y-axis direction. In the 2 nd positioning step ST10, the control unit 103 of the control unit 100 controls the respective moving units 41, 42, 43 to position the lower end of the cutting edge 24 of the cutting tool 21 of the cutting unit 20 at the first trimming start position 401 calculated in the 2 nd trimming range setting step ST9, and proceeds to the 2 nd trimming step ST11.
(2 Nd finishing step)
Fig. 16 is a top view of the cutting unit and the finishing plate of the finishing step 2 of the finishing method shown in fig. 7. The 2 nd trimming step ST11 is a step of relatively moving the cutting tool 21 with respect to the trimming plate 90 after the 2 nd positioning step ST10 is performed, and cutting the trimming plate 90 from one end 91 to the other end 92, thereby flattening the tip of the cutting edge 24 of the cutting tool 21.
In the 2 nd dressing step ST11, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 so that the cutting unit 20 moves in the Y-axis direction from the one end 91 toward the other end 92 of the dressing plate 90, and as shown in fig. 16, a cutting groove 95 is formed in the dressing plate 90. In the 2 nd dressing step ST11, the control unit 103 of the control unit 100 controls the X-axis moving unit 41 and the Y-axis moving unit 42 to stop the movement of the cutting tool 21 in the Y-axis direction at the dressing end position 402. Then, the cutting tool 21 is moved to the other end 94 side in the X-axis direction by the X-axis direction feed width 303, and positioned at the next trimming start position 401.
In the 2 nd dressing step ST11, the control unit 103 of the control unit 100 controls the Y-axis moving unit 42 to move the cutting unit 20 in the Y-axis direction from the other end 92 of the dressing plate 90 toward the one end 91, and cuts the cutting tool 21 into the dressing plate 90 to form the cutting groove 95. In embodiment 1, in the 2 nd dressing step ST11, the control unit 103 of the control unit 100 moves the cutting tool 21 in the Y-axis direction in accordance with the number of movements of the cutting tool 21 relative to the dressing plate 90 at the time of flattening dressing of the machining conditions, and flattens the tip of the cutting edge 24 of the cutting tool 21. In embodiment 1, when two cutting grooves 95 are formed in the 2 nd trimming step ST11, the process proceeds to the 2 nd cutting completion area storage step ST12.
(2 Nd cutting completion region storing step)
The 2 nd cutting completion region storing step ST12 is a step in which the cutting completion region storing unit 101 stores information on the cutting completion region 601 of the finishing plate 90 cut by the flattening finishing in the 2 nd finishing step ST 11. In embodiment 1, in the cutting completion region storing step ST8, the cutting completion region storing section 101 stores, as information on the cutting completion region 601, the cumulative number of times, which is obtained by adding the number of times of movement of the cutting tool 21 in the Y-axis direction with respect to the dressing plate 90 in the 2 nd dressing step ST11 to the number of times of completion that has been stored. When the cutting completion region storage unit 101 stores the information on the cutting completion region 601 in the cutting completion region storage step ST8, the process proceeds to step ST13.
In step ST13, the control unit 103 of the control unit 100 determines whether or not the flattening trimming of the cutting tool 21 can be performed using the trimming plate 90 held by the holding table 10. In embodiment 1, the control unit 103 of the control unit 100 calculates the position of the width direction center of the cutting groove 95 formed most recently in the 2 nd trimming step ST11, and calculates the position of the other end 94 toward the X-axis direction feeding width 303 from the calculated position of the width direction center of the cutting groove 95 formed most recently. When the distance from the position closer to the other end 94 than the feeding width 303 in the X-axis direction to the other end 94 is smaller than the margin width 301 in the X-axis direction, the control unit 103 of the control unit 100 determines that the flattening trimming of the cutting tool 21 cannot be performed using the trimming plate 90 held by the holding table 10 (step ST13: no), and causes the notification unit 110 to operate and notify the operator (step ST 14).
When the distance from the position closer to the other end 94 than the position closer to the other end than the position is equal to or greater than the X-axis direction allowance width 301, returning to step ST1. Therefore, in the dressing method according to embodiment 1, in the second and subsequent processing steps ST2, at least one of the dressing steps ST7 and ST11 is performed, and then the dressing plate 90 is carried out from the holding table 10, and the dressing plate 90 is accommodated in the cassette 51. In the dressing method according to embodiment 1, in the 2 nd positioning step ST10, after the processing step ST2 is performed, the workpiece 200 is carried out from the holding table 10 and stored in the cassette 51, and the dressing plate 90 is held by the holding table 10.
As described above, the trimming method according to embodiment 1 includes: a position detecting step ST4, a positioning step ST6, a trimming step ST7, a cutting completion region storing step ST8, a processing step ST2, a2 nd positioning step ST10, and a2 nd trimming step ST11.
As described above, in the dressing method and the cutting device 1 according to embodiment 1, since the position detection step ST4 for detecting the position of the outer peripheral edge of the dressing plate 90 is performed, it is not necessary to excessively set the Y-axis direction margin width 302, and the Y-axis direction margin width 302 itself can be suppressed. As a result, the dressing method and the cutting device 1 have an effect of being able to suppress the time required for planarization dressing.
In addition, in the dressing method and the cutting device 1 according to embodiment 1, after the dressing steps ST7 and ST11, information on the cutting completion region 601 of the dressing plate 90 is stored in the cutting completion region storage unit 101. As a result, the dressing method and the cutting device 1 can perform the planarization dressing while avoiding the cutting completion region 601.
In addition, the dressing method and the cutting device 1 of embodiment 1 store the cumulative number of times of movement of the cutting tool 21 in the Y-axis direction with respect to the dressing plate 90 at the time of the planarization dressing in the cutting completion region storage section 101 as information on the cutting completion region 601 of the dressing plate 90. As a result, the dressing method and the cutting device 1 can reliably avoid the cutting completion region 601 and perform the planarization dressing.
The present invention is not limited to the above embodiment. That is, various modifications may be made and implemented within a range not departing from the gist of the present invention.

Claims (2)

1. A dressing method for flattening a cutting tool fixed to the front end of a spindle, wherein,
The trimming method has the following steps:
A position detection step of capturing, with a capturing means, a trimming plate held on a holding table with an adhesive tape interposed therebetween, and detecting the position of the outer peripheral edge of the trimming plate;
A positioning step of positioning a direction from one end of the dressing plate toward the other end thereof in parallel with an axis of the spindle, and positioning a lower end of the cutting tool outside one end of the dressing plate at a predetermined height position cut into the dressing plate and a distance from the dressing plate that is a margin width included in a machining condition, based on a position of an outer peripheral edge of the dressing plate detected by the position detecting step; and
And a dressing step of, after the positioning step is performed, relatively moving the cutting tool with respect to the dressing plate, moving the cutting tool from the one end of the dressing plate to the other end of the dressing plate to a position having a distance from the dressing plate that is the margin width included in the machining condition, and performing cutting, thereby flattening the tip of the cutting tool.
2. The trimming method according to claim 1, wherein,
The trimming method has the following steps:
a cutting completion region storing step of storing information on a cutting completion region of the finishing plate cut by the finishing step;
A processing step of removing the dressing plate from the holding table after the dressing step is performed, holding the workpiece by the holding table, and cutting the workpiece on the holding table by the cutting tool;
A2 nd positioning step of, after the machining step is performed, carrying out the workpiece from the holding table, holding the finishing plate by the holding table, and positioning the lower end of the cutting tool outside one end of the finishing plate at a predetermined height position cut into the finishing plate and a distance from the finishing plate that is a position of the margin width included in the machining condition, based on the position of the outer peripheral edge of the finishing plate detected by the position detection step and the information on the finishing region of the finishing plate stored by the finishing region storage step; and
And a2 nd trimming step of moving the cutting tool relative to the trimming plate from the one end to the other end of the trimming plate to a position at a distance from the trimming plate that is the margin width included in the machining condition, and cutting the trimming plate after the 2 nd positioning step is performed.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036233A (en) * 2000-07-25 2002-02-05 Takabayashi Denki:Kk Dicing device and recording medium
JP2006218571A (en) * 2005-02-10 2006-08-24 Disco Abrasive Syst Ltd Dressing board and dressing method
JP2018144206A (en) * 2017-03-08 2018-09-20 株式会社ディスコ Dressing method for cutting blade

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254679B2 (en) 2008-06-23 2013-08-07 株式会社ディスコ Cutting blade dressing method
JP6246566B2 (en) * 2013-11-11 2017-12-13 株式会社ディスコ Dressing method
JP6700101B2 (en) * 2016-05-16 2020-05-27 株式会社ディスコ Cutting equipment
JP6873712B2 (en) * 2017-01-17 2021-05-19 株式会社ディスコ Dressing board, cutting blade dressing method and cutting equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036233A (en) * 2000-07-25 2002-02-05 Takabayashi Denki:Kk Dicing device and recording medium
JP2006218571A (en) * 2005-02-10 2006-08-24 Disco Abrasive Syst Ltd Dressing board and dressing method
JP2018144206A (en) * 2017-03-08 2018-09-20 株式会社ディスコ Dressing method for cutting blade

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