CN112198713A - Light source assembly, preparation method thereof, backlight module and display device - Google Patents
Light source assembly, preparation method thereof, backlight module and display device Download PDFInfo
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- CN112198713A CN112198713A CN202011131470.3A CN202011131470A CN112198713A CN 112198713 A CN112198713 A CN 112198713A CN 202011131470 A CN202011131470 A CN 202011131470A CN 112198713 A CN112198713 A CN 112198713A
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- light source
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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Abstract
The embodiment of the invention provides a light source component, a preparation method thereof, a backlight module and a display device. The light source assembly comprises a driving substrate with a first surface, a plurality of conductive pads, a plurality of microstructures, a plurality of light-emitting elements and a reflecting layer. The conductive pads and the microstructures are patterned from the same conductive layer and are located on the first surface. The periphery of each conductive pad is correspondingly provided with a plurality of microstructures. Each light emitting element is located on at least one conductive pad and electrically connected to the driving substrate through at least one conductive pad. The reflecting layer covers the surface of the microstructure, which is not in contact with the driving substrate, and covers the area, on the first surface, where the conductive pad and the microstructure are not arranged. The position of the reflecting layer covering the microstructure is convex in the direction of the light emitting element relative to the position of the reflecting layer covering the first surface.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light source component, a preparation method of the light source component, a backlight module using the light source component and a display device.
Background
Currently, a light source assembly applied to a direct type backlight module in a liquid crystal display device can improve brightness by coating highly reflective ink with a smooth surface on a driving substrate. However, since the surface of the highly reflective ink is flat, part of the light emitted from the light source is reflected by the highly reflective ink and then is shifted to the outside of the optical film set, which cannot be utilized by the liquid crystal display device.
Therefore, the light source assembly in the existing direct type backlight module has the problem of low light source utilization rate.
Disclosure of Invention
In one aspect, the present invention provides a light source assembly comprising:
a driving substrate having a first surface;
the conductive pads and the microstructures are patterned from the same conductive layer and are located on the first surface, wherein a plurality of microstructures are correspondingly arranged around each conductive pad;
a plurality of light emitting elements, each of which is located on at least one of the conductive pads and electrically connected to the driving substrate through at least one of the conductive pads; and
the reflecting layer coats the surface of the microstructure, which is not contacted with the driving substrate, and covers the region, on the first surface, on which the conducting pad and the microstructure are not arranged;
wherein a position of the reflective layer covering the microstructure is convex in a direction of the light emitting element with respect to a position of the reflective layer covering the first surface.
In the light source module according to the embodiment of the invention, the position of the covering microstructure of the reflective layer is protruded towards the direction of the light emitting element relative to the position of the first surface of the reflective layer covering the driving substrate, that is, the reflective layer has an uneven rough surface. Therefore, the light emitted by the light-emitting elements is changed into diffuse reflection after being irradiated onto the reflecting layer, and when the light source assembly is applied to the direct type backlight module, the efficiency of the light-emitting elements being upwards incident to the optical film group is improved, and the utilization rate of the light source is further improved.
In another aspect, the present invention provides a method for preparing a light source module, which includes the following steps:
forming a conductive layer on a first surface of a driving substrate;
patterning the conductive layer to form a plurality of conductive pads and a plurality of microstructures, wherein the periphery of each conductive pad is provided with a plurality of microstructures correspondingly;
forming a reflecting layer, wherein the reflecting layer covers the surface of the microstructure, which is not in contact with the driving substrate, and the region, which is not provided with the conductive pad and the microstructure, on the first surface, and the position of the reflecting layer, which covers the microstructure, is convex towards the direction of the light-emitting element relative to the position of the reflecting layer, which covers the first surface; and
and electrically connecting a plurality of light-emitting elements to the driving substrate, wherein each light-emitting element is located on at least one conductive pad and electrically connected to the driving substrate through at least one conductive pad.
In the preparation method of the light source assembly, the reflecting layer of the obtained light source assembly has the rough surface with the unevenness. Therefore, the light emitted by the light-emitting elements is changed into diffuse reflection after being irradiated onto the reflecting layer, and when the light source assembly is applied to the direct type backlight module, the efficiency of the light-emitting elements being upwards incident to the optical film group is improved, and the utilization rate of the light source is further improved.
In another aspect, the present invention provides a backlight module, which includes a light source assembly and an optical film set located at one side of the light source assembly, wherein the light source assembly is the above-mentioned light source assembly.
Because the backlight module comprises the light source component, the backlight module also has high light source utilization rate.
The invention further provides a display device, which includes a backlight module and a display panel, wherein the backlight module is stacked.
Because the display device comprises the backlight module, the display device also has high light source utilization rate.
Drawings
Fig. 1 is an exploded view of a display device according to an embodiment of the invention.
Fig. 2 is a cross-sectional view of the light source module of fig. 1.
Fig. 3 is a schematic distribution diagram of light-emitting elements and microstructures around the light-emitting elements in a light source assembly according to an embodiment of the invention.
FIG. 4 is a schematic view illustrating distribution of light-emitting elements and microstructures around the light-emitting elements in a light source module according to another embodiment of the present invention.
FIG. 5 is a schematic view illustrating distribution of light-emitting elements and microstructures around the light-emitting elements in a light source assembly according to still another embodiment of the present invention.
FIG. 6 is a schematic view illustrating a distribution of light-emitting elements and microstructures around the light-emitting elements in a light source module according to another embodiment of the present invention.
Fig. 7 is a flowchart illustrating a method for manufacturing a light source module according to an embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view illustrating a conductive layer formed on the driving substrate in step S1 of fig. 7.
Fig. 9 is a schematic plan view of the conductive pad and the microstructure formed by patterning the conductive layer in step S2 of fig. 7.
Fig. 10 is a schematic cross-sectional view of the reflective layer formed in step S3 of fig. 7.
Fig. 11 is a schematic plan view illustrating the light emitting device formed on the conductive pad in step S4 of fig. 7.
Description of the main elements
Upper brightness enhancement sheet 12
Lower brightness enhancement sheet 13
Light guiding layer 15
First conductive pad 2211
Second conductive pad 2212
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Fig. 1 is an exploded view of a display device 100 according to an embodiment of the invention. As shown in fig. 1, the display device 100 includes a backlight module 102 and a display panel 101 stacked together. The backlight module 102 includes a light source assembly 20 and an optical film assembly 10 disposed on one side of the light source assembly 20. The optical film set 10 is positioned between the display panel 101 and the light source assembly 20. The optical film group 10 includes an upper diffusion sheet 11, an upper brightness enhancement sheet 12, a lower brightness enhancement sheet 13, a lower diffusion sheet 14, and a light guide layer 15, which are stacked in sequence along a direction in which the display panel 101 points to the light source assembly 20.
In one embodiment, the upper diffusion plate 11 and the lower diffusion plate 14 mainly correct the diffusion angle, so as to increase the light radiation area. The upper diffusion sheet 11 and the lower diffusion sheet 14 include, for example, a transparent substrate (not shown) and optical light scattering particles (not shown) coated on both surfaces of the transparent substrate.
In one embodiment, since the light passing through the upper diffusion sheet 11 and the lower diffusion sheet 14 reduces the light intensity per unit area, in order to meet the brightness requirement of the display panel 101, films for increasing brightness, i.e., the upper brightness enhancement sheet 12 and the lower brightness enhancement sheet 13, are required to be disposed. The upper and lower brightness enhancement sheets 12 and 13 may be, for example, prism films including a transparent film (not shown) and a uniform and ordered prism structure (not shown) distributed on the film to uniformly converge light emitted from the lower diffusion sheet 14 to various divergent angles in an axial direction to improve axial brightness without increasing the total light flux emitted.
In other embodiments, the optical film assembly 10 may also include other types of optical films, such as a filter film. Also, the number of optical sheets in the optical sheet group 10 may be one or more.
In one embodiment, the display panel 101 is a liquid crystal display panel, and the backlight module 102 is a direct-type backlight. The display panel 101 includes a color filter substrate (not shown), a thin film transistor array substrate (not shown) disposed opposite to the color filter substrate, and a liquid crystal layer (not shown) interposed between the color filter substrate and the thin film transistor array substrate. The light emitted from the light source assembly 20 passes through each optical film and then is used as a backlight for the display panel 101 to display images.
In an embodiment, the display device 100 is a product with a display function, such as a mobile phone, a tablet computer, and the like.
Fig. 2 is a cross-sectional view of light source module 20 of fig. 1. As shown in fig. 2, the light source assembly 20 includes a driving substrate 21, a plurality of conductive pads 221 and microstructures 222, a plurality of light emitting elements 23, and a reflective layer 24. The driving substrate 21 has a first surface 211. A plurality of conductive pads 221 and a plurality of microstructures 222 are disposed on the first surface 211. Each of the light emitting elements 23 is disposed on at least one of the conductive pads 221 and electrically connected to the driving substrate 21 through at least one of the conductive pads 221. Each of the light emitting elements 23 has a plurality of the microstructures 222 around the light emitting element. The reflective layer 24 covers the surface of the microstructure 222 that is not in contact with the driving substrate 21. The position of the reflective layer 24 covering the microstructure 222 is convex in the direction of the light emitting element 23 relative to the position of the reflective layer 24 covering the first surface 211.
Because the reflection layer 24 has an uneven rough surface, light emitted by the light emitting elements 23 is changed into diffuse reflection after being irradiated onto the reflection layer 24, and when the light source assembly 20 is applied to a direct type backlight source, the efficiency of the light emitting elements 23 being upwards incident to the optical film group 10 is improved, and further the utilization rate of the light source is improved.
In one embodiment, the conductive pads 221 and the microstructures 222 are patterned from the same conductive layer 22. That is, the plurality of microstructures 222 can be formed simultaneously when the conductive pad 221 is formed. Thus, the manufacturing process is simplified. The conductive layer 22 is, for example, a metal layer, a metal alloy layer, or the like.
In one embodiment, the conductive layer 22 is a copper layer, and the conductive pads 221 and the microstructures 222 are formed by etching. The cross section of each of the microstructures 222 along the thickness direction of the light source assembly 20 is trapezoidal. In consideration of the etching process, the included angle between the bottom angle of the trapezoid and the first surface 211 is approximately 30 to 45 degrees.
In one embodiment, the height of each of the microstructures 222 is greater than or equal to 9 μm. That is, in fig. 2, the height of the trapezoid is 9 μm or more. Specifically, the height of the microstructure 222 can be adjusted according to the material cost and the light extraction rate.
In one embodiment, the driving substrate 21 is a flexible printed circuit board or a printed circuit board. The Light Emitting element 23 is a Mini Light Emitting Diode (Mini LED), that is, a submillimeter-sized Light Emitting Diode, and the size of the Mini LED is approximately one hundred to several hundred micrometers. In other embodiments, the light emitting device 23 may be a light emitting diode with other sizes. The light emitting diode has an N-pole and a P-pole located on the same side, and the N-pole and the P-pole can be electrically connected to the driving substrate 21 through an electrically conductive pad 221, respectively, so as to emit light under the driving of the driving substrate 21.
In one embodiment, the reflective layer 24 is made of white highly reflective ink. On one hand, the white highly reflective ink has a high reflectivity (more than 85%) for the light emitted from the light emitting element 23, and the reflective layer 24 partially covers the microstructure 222 and partially covers the first surface 211 of the driving substrate 21, so that the reflective layer 24 has a rugged surface, and the light emitted from the light emitting element 23 enters the surface of the reflective layer 24 and becomes diffused light, which is emitted substantially perpendicular to the light source assembly 20, thereby improving the efficiency of the light source irradiating the optical film assembly 10 upwards. On the other hand, the white highly reflective ink also has a solder resist function, so that the white highly reflective ink can protect the driving substrate 21 and the microstructure 222 located therebelow.
Fig. 3 is a schematic distribution diagram of the light-emitting elements 23 and the microstructures 222 around the light-emitting elements in the light source assembly 20 according to an embodiment of the invention. Only a portion of microstructures 222 is schematically depicted in fig. 3, and not all of microstructures 222 are depicted. As shown in fig. 3, the plurality of microstructures 222 corresponding to the periphery of each light emitting element 23 are arranged at intervals in a plurality of rings. In fig. 3, a plurality of microstructures 222 are arranged along a path of a generally rectangular ring. Each microstructure 222 is of equal size, and the adjacent rectangular rings and the adjacent microstructures 222 are arranged at equal intervals. That is, the number of microstructures 222 on each rectangular ring increases gradually as the rectangular ring becomes larger from the center outward of the light emitting element 23. That is, among the plurality of rectangular rings centered on the light emitting element 23, the larger the number of microstructures 222 arranged on the rectangular ring farther from the light emitting element 23. In fig. 3, the projection of the microstructure 222 on the first surface 211 of the driving substrate 21 is a circle, and the diameter (defined as a) of the circle is greater than or equal to 0.1 mm. I.e., microstructures 222 are small-top and large-bottom cylinders. The distance between two adjacent microstructures 222 is L. Wherein, L is more than or equal to A +0.075 mm. That is, in fig. 2, the distance between the boundaries of two adjacent microstructures 222 is not less than 0.075 mm. In other embodiments, L may have other values depending on the etching accuracy of the conductive layer 22.
In other embodiments, the projection of the microstructure 222 on the first surface 211 of the driving substrate 21 may be a polygon or an irregular shape. The polygon is, for example, a triangle, a hexagon, or the like. The size of the microstructures 222 can be adjusted according to the requirement, and the microstructures 222 with different sizes and different shapes can be mixed and arranged in the light source module 20. With continued reference to fig. 3, an opening 241 is defined around the light emitting device 23. In fig. 3, the opening section 241 is substantially rectangular. The distance of the open area 241 from its nearest rectangular ring is defined as D. Wherein D is more than or equal to 0.5A +0.1 mm. In one embodiment, the reflective layer 24 is white highly reflective ink, and the opening 241 is a boundary of the white highly reflective ink. That is, the light emitting element 23 is located in the opening area 241, and no white highly reflective ink is formed in the opening area 241. That is, the white highly reflective ink is formed around the periphery of the light emitting device 23 with a slight gap (greater than or equal to 0.1mm) from the light emitting device 23, which is not shown in fig. 2 for clarity.
Fig. 4 is a schematic distribution diagram of light-emitting elements 23 and microstructures 222 around the light-emitting elements in a light source assembly 20 according to another embodiment of the present invention. As shown in fig. 4, the arrangement of the microstructures 222 is different from that of the microstructures 222 in fig. 3 in that, in fig. 4, a plurality of microstructures 222 are arranged along a path of a substantially circular ring. In addition, in FIG. 4, the distance between adjacent microstructures 222 is also L ≧ A +0.075mm, the distance from each corner to its nearest ring in the four corners of the opening 241 is defined as D, D ≧ 0.5A +0.1 mm.
Fig. 5 is a schematic distribution diagram of light-emitting elements 23 and microstructures 222 around the light-emitting elements in light source module 20 according to still another embodiment of the present invention. As shown in fig. 5, the difference between the arrangement of the microstructures 222 in fig. 3 is that, in fig. 5, the microstructures 222 arranged along each rectangular ring are equally large, and the projection area of the microstructures 222 on the driving substrate 21 increases as the distance from the light emitting element 23 increases. The diameters of the projections of the respective microstructures 222 on the driving substrate 21 are defined as a1, a2, A3, a4 … An (n is An integer of 2 or more) in this order from the near side to the far side from the light emitting element 23, and the distances between the adjacent microstructures 222 are defined as L1, L2, and L3 … Ln (n is An integer of 1 or more) in this order. Wherein A1 is more than or equal to 0.1mm, A1 is more than A2 and more than A3 is more than A4 and more than … and less than An. L1 is more than or equal to A1+0.075mm, L2 is more than or equal to A2+0.075mm, L3 is more than or equal to A4+0.075mm, …, Ln-1 is more than or equal to An +0.075 mm. That is, the distance between the boundaries of adjacent microstructures 222 is 0.075mm or more. In fig. 5, among the microstructures 222 disposed corresponding to each light emitting device 23, the microstructure farther from the light emitting device 23 has a larger projection area, so that the microstructure farther from the light emitting device 23 has a stronger light gathering capability, thereby further improving the utilization rate of the light source.
Fig. 6 is a schematic distribution diagram of light-emitting elements 23 and microstructures 222 around the light-emitting elements in a light source assembly 20 according to another embodiment of the present invention. As shown in fig. 6, the arrangement of the microstructures 222 is different from that of the microstructures 222 in fig. 5 in that, in fig. 6, a plurality of microstructures 222 are arranged along a path of a substantially circular ring. In fig. 6, the microstructures 222 arranged along each circle are equally large, and the projection area of the microstructures 222 on the driving substrate 21 increases as the distance from the light emitting element 23 increases. The diameters of the projections of the respective microstructures 222 on the driving substrate 21 are defined as a1, a2, A3, a4 … An (n is An integer of 2 or more) in this order from the near side to the far side from the light emitting element 23, and the distances between the adjacent microstructures 222 are defined as L1, L2, and L3 … Ln (n is An integer of 1 or more) in this order. Wherein A1 is more than or equal to 0.1mm, A1 is more than A2 and more than A3 is more than A4 and more than … and less than An. L1 is more than or equal to A1+0.075mm, L2 is more than or equal to A2+0.075mm, L3 is more than or equal to A4+0.075mm, …, Ln-1 is more than or equal to An +0.075 mm. That is, the distance between the boundaries of adjacent microstructures 222 is 0.075mm or more. The distance from each corner to the nearest circle among the four corners of the opening area 241 is defined as D, D is 0.5A +0.1 mm.
In other embodiments, the arrangement path of the microstructures 222 is not limited to a circular ring or a rectangular ring.
Fig. 7 is a flowchart illustrating a method for manufacturing a light source assembly 20 according to an embodiment of the present invention. As shown in fig. 7, the preparation method includes the following steps.
Step S1: a conductive layer 22 is formed on a driving substrate 21.
As shown in fig. 8, the conductive layer 22 is formed on the first surface 211 of the driving substrate 21. In one embodiment, the conductive layer 22 may be formed by electroplating or other methods.
Step S2: the conductive layer 22 is patterned.
As shown in fig. 9, the conductive layer 22 is patterned to form a plurality of conductive pads 221 spaced apart from each other and a plurality of microstructures 222 spaced apart from each other. The conductive pads 221 are substantially rectangular and are arranged in pairs. In fig. 9, each pair of conductive pads 221 includes a first conductive pad 2211 and a second conductive pad 2212 for electrically connecting to the N-pole and P-pole of the light emitting element 23 (when the light emitting element 23 is an LED), respectively. The first and second conductive pads 2211 and 2212 are respectively connected to a circuit (not shown) of the driving substrate 21. Each pair of conductive pads 221 surrounds a plurality of microstructures 222.
In one embodiment, the patterning step is etching, and the patterned conductive pad 221 and the microstructure 222 have substantially the same height.
Step S3: a reflective layer 24 is formed.
As shown in fig. 10, the reflective layer 24 covers the surface of the microstructure 222 that is not in contact with the driving substrate 21 and covers the first surface 211 where the conductive pad 221 and the microstructure 222 are not disposed. Wherein the position of the reflective layer 24 covering the microstructure 222 is convex in the direction of the light emitting element 23 relative to the position of the reflective layer 24 covering the first surface 211.
In one embodiment, the reflective layer 24 is a white highly reflective ink formed by screen printing.
Step S4: the plurality of light emitting elements 23 are electrically connected to the driving substrate 21.
As shown in fig. 11, each of the light emitting elements 23 is located on two of the conductive pads 221 and electrically connected to the driving substrate 21 through the two conductive pads 221. In the method for manufacturing the light source assembly 20, the plurality of microstructures 222 are simultaneously formed by using the patterning process of the conductive pad 221, and then the reflective layer 24 is formed on the microstructures 222 and the first surface 211 of the driving substrate 21, so that the light utilization rate can be improved and the cost can be saved without additionally increasing the process.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (10)
1. A light source assembly, comprising:
a driving substrate having a first surface;
the conductive pads and the microstructures are patterned from the same conductive layer and are located on the first surface, wherein a plurality of microstructures are correspondingly arranged around each conductive pad;
a plurality of light emitting elements, each of which is located on at least one of the conductive pads and electrically connected to the driving substrate through at least one of the conductive pads; and
the reflecting layer coats the surface of the microstructure, which is not contacted with the driving substrate, and covers the region, on the first surface, on which the conducting pad and the microstructure are not arranged;
wherein a position of the reflective layer covering the microstructure is convex in a direction of the light emitting element with respect to a position of the reflective layer covering the first surface.
2. The light source module as recited in claim 1, wherein the plurality of microstructures corresponding to the periphery of each of the light emitting elements are arranged at intervals in a plurality of rings.
3. The light source module as recited in claim 2, wherein among the plurality of microstructures corresponding to the periphery of each of the light emitting elements, the microstructures farther from the light emitting element have larger projected areas on the driving substrate.
4. The light source module as recited in claim 2, wherein the more the number of the microstructures arranged on a ring farther from the light emitting element among the plurality of rings.
5. The light source module according to claim 1, wherein each of the microstructures has a trapezoidal cross-section along a thickness direction of the light source module.
6. The light source module as recited in claim 1, wherein each of the microstructures has a height of 9 microns or greater.
7. The light source module according to claim 1, wherein the distance between two adjacent microstructures is 0.075mm or more.
8. A method of producing a light source module, comprising the steps of:
forming a conductive layer on a first surface of a driving substrate;
patterning the conductive layer to form a plurality of conductive pads and a plurality of microstructures, wherein the periphery of each conductive pad is provided with a plurality of microstructures correspondingly;
forming a reflecting layer, wherein the reflecting layer covers the surface of the microstructure, which is not in contact with the driving substrate, and the region, which is not provided with the conductive pad and the microstructure, on the first surface, and the position of the reflecting layer, which covers the microstructure, is convex towards the direction of the light-emitting element relative to the position of the reflecting layer, which covers the first surface; and
and electrically connecting a plurality of light-emitting elements to the driving substrate, wherein each light-emitting element is located on at least one conductive pad and electrically connected to the driving substrate through at least one conductive pad.
9. A backlight module comprising a light source module and an optical film set disposed at one side of the light source module, wherein the light source module is the light source module as claimed in any one of claims 1 to 7.
10. A display device comprising a backlight module and a display panel, wherein the backlight module is the backlight module according to claim 9.
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| CN202011131470.3A CN112198713A (en) | 2020-10-21 | 2020-10-21 | Light source assembly, preparation method thereof, backlight module and display device |
| TW109137159A TWI754431B (en) | 2020-10-21 | 2020-10-26 | Light source assembly, method for making same, backlight module, and a display device |
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| CN202011131470.3A CN112198713A (en) | 2020-10-21 | 2020-10-21 | Light source assembly, preparation method thereof, backlight module and display device |
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| TW202217412A (en) | 2022-05-01 |
| TWI754431B (en) | 2022-02-01 |
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