CN112188726B - Multilayer board for performing V _ CUT depth detection through electrical test - Google Patents
Multilayer board for performing V _ CUT depth detection through electrical test Download PDFInfo
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- CN112188726B CN112188726B CN202011126105.3A CN202011126105A CN112188726B CN 112188726 B CN112188726 B CN 112188726B CN 202011126105 A CN202011126105 A CN 202011126105A CN 112188726 B CN112188726 B CN 112188726B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a multilayer board for performing V _ CUT depth detection through electrical testing, which comprises test terminals, terminal connecting wires, V _ CUT depth test wires and etching factor test wires, wherein the outer layer wires of an SET delivery UNIT are provided with the test terminals, the terminal connecting wires are arranged between the test terminals, the inner layer wires of the SET delivery UNIT are provided with the V _ CUT depth test wires, and the V _ CUT depth test wires are connected with the network connecting wires of the UNIT. According to the invention, for the multilayer board, accurate V _ CUT depth control can be realized, V _ CUT test can be realized at the same time, and production rework or scrap caused by V _ CUT leakage can be avoided; the trouble of manual detection is reduced, and the production efficiency is improved; the phenomenon that the V _ CUT is too deep or too shallow, so that the plate is broken or cannot be separated is avoided; the method can effectively detect the etching parameters of the etching circuit, and avoids the trouble of detecting the line width distance independently.
Description
Technical Field
The invention relates to production detection of a multilayer circuit board, in particular to a multilayer board for performing V _ CUT depth detection through electrical test.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of electric appliance layout. Along with globalization and miniaturization of production, the circuit board is also developed towards the direction of multilayer high density, meanwhile, very high requirements are provided for reducing power consumption, and along with the continuous increase of the requirements, the detection and quality control of the circuit board also become a key link for reducing scrappage and improving quality; after the circuit board is formed, a manufacturer needs to CUT a dividing line at a specific position of the circuit board in advance by using a turntable cutter according to the drawing requirements of a customer, namely, V-CUT operation, and the purpose is to facilitate board separation (De-panel) after the subsequent SMT circuit board assembly is completed. Therefore, in order to improve the yield of the circuit board, after the V-CUT is finished, the V-CUT needs to be checked, and the condition of V-CUT leakage is discovered and reworked, so that the condition of V-CUT leakage is avoided.
However, at present, the V-CUT condition is usually tested by manual visual inspection. Therefore, on one hand, the probability of missing detection and false detection is high, and on the other hand, the rework rate caused by the missing detection and the false detection is increased, so that the workload of workers is increased to a great extent, the production efficiency of the circuit board is reduced, and the quality of the circuit board cannot be guaranteed; the operation quality of the V _ CUT cannot be accurately judged, the V _ CUT is deep and easy to break, the V _ CUT is shallow and cannot be separated, the cost is increased due to reworking after components are mounted, and meanwhile the rejection rate is greatly improved.
Disclosure of Invention
The invention aims to solve the technical problem of providing an electrical test for a multilayer board, which can realize the detection of the depth and the residual thickness of a V _ CUT and the detection of the minimum line width in the board during the test, realize the quality detection in the production of the board, improve the quality, reduce the labor cost and realize the one-time operation of multiple processes.
In order to solve the technical problems, the invention adopts the following technical scheme: a multilayer board for V _ CUT depth detection through electrical testing comprises SET delivery UNITs combined by at least 2 UNIT UNITs, test terminals, terminal connecting lines, V _ CUT depth test lines and etching factor test lines, wherein the outer layer lines of the SET delivery UNITs are provided with the test terminals, the terminal connecting lines are arranged between the test terminals, the inner layer lines of the SET delivery UNITs are provided with the V _ CUT depth test lines, and the V _ CUT depth test lines are connected to network connecting lines of the UNIT UNITs.
According to the design concept of the invention, the multilayer plate is at least 6 layers.
According to the design concept of the invention, the etching factor test line is divided into three parts, and the line width at the V _ CUT position between the SET delivery units is the value of the multilayer board required to control the line width tolerance plus the compensation value of the corresponding line layer.
According to the design concept of the invention, the laminated structure between the multilayer boards is designed according to the finished board thickness and the V _ CUT depth, and the V _ CUT depth test line comprises an upper V _ CUT depth test line and a lower V _ CUT depth test line; and respectively realizing the detection of the upper limit and the lower limit of the V _ CUT depth.
According to the design concept of the invention, secondary drilling holes are further arranged at the corresponding positions of the V _ CUT depth test line and the etching factor test line, and the hole diameter of each secondary drilling hole is larger than the width of the V _ CUT depth test line or the etching factor test line.
According to the design concept of the invention, the test unit and the terminal connecting wire are arranged on the outer layer circuit.
According to the design concept of the invention, in the electrical performance network connected with the V _ CUT depth test line and the etching factor test line, a metallized hole is communicated with an outer layer line, and the outer layer line is a hole ring of the metallized hole or a bonding pad connected with the metallized hole.
According to the design concept of the invention, the line widths of the V _ CUT depth test line and the etching factor test line are not more than the minimum line width of the corresponding circuit layer of the multilayer board.
In particular, a multi-layer board with small unit size and difficult positioning,
compared with the prior art, the invention has the following beneficial effects: (1) for the multilayer board, the accurate V _ CUT depth control can be realized, the V _ CUT test can be realized at the same time, and the production rework or scrap caused by V _ CUT leakage can be avoided;
2) the trouble of manual detection is reduced, and the production efficiency is improved;
3) the phenomenon that the V _ CUT is too deep or too shallow, so that the plate is broken or cannot be separated is avoided;
4) the etching parameter detection can be effectively carried out on the etched circuit, and the trouble of single line width space detection is avoided;
5) the product quality is improved, and the labor cost is effectively reduced.
Drawings
FIG. 1 is a schematic diagram of the outer layer structure of the electrical test for etching factor detection and V-CUT depth detection of the present invention;
FIG. 2 is a schematic diagram of the inner layer structure of the electrical test for etching factor detection and V-CUT depth detection of the present invention;
FIG. 3 is a schematic view of a laminate structure of the present invention.
Detailed Description
Firstly, it should be noted that the invention realizes the detection of the depth of the V _ CUT and the residual thickness of the V _ CUT by the design of the multilayer board structure, and simultaneously also realizes the detection of the minimum line width in the board, the quality detection in the production of the board, and the problems in the existing production are effectively solved.
Referring to fig. 1 and 2, the multilayer board for etching factor detection and V-CUT depth detection by electrical test of the present invention, especially the multilayer board with small structure and inconvenient positioning, and the PCB board which needs to be produced in large pieces for the convenience of patch production, the V _ CUT between the multilayer boards at least comprises two UNIT cell combinations, or a single UNIT cell adds a process edge for the convenience of production, the process edge and the UNIT are connected and separated by means of V _ CUT, and a V _ CUT line 1 is arranged at the place where the V _ CUT is needed.
The SET delivery UNIT needing the V _ CUT comprises test terminals 2, terminal connecting wires 3, a V _ CUT depth test wire 6 and an etching factor test wire 4, wherein the test terminals 2 are arranged on outer layer wires of the SET delivery UNIT, the terminal connecting wires 3 are arranged between the test terminals 2, and the V _ CUT depth test wire is arranged on an inner layer wire of the SET delivery UNIT and connected with a network connecting wire of the UNIT.
The multilayer board is a four-layer board or a multilayer board with more than 6 layers, and the thickness between the layers is preferably adjusted by the thickness of the core board and the PP sheet in order to accurately confirm the thickness between the layers.
When the core plate and the PP sheet are laminated, a corresponding copper foil strip is added at the process edge, a metal hole and a test bonding pad are arranged at the position corresponding to the copper foil strip, and when the V _ CUT is carried out, the depth measurement control of the V _ CUT is realized by the micro-current test of the V _ CUT machine.
The laminated structure between the multilayer boards is designed according to the finished board thickness and the V _ CUT depth, and the V _ CUT depth test line comprises an upper V _ CUT depth test line and a lower V _ CUT depth test line; and respectively realizing the detection of the upper limit and the lower limit of the V _ CUT depth.
For better quality control, the method also comprises the step of setting an etching factor test line 4, wherein the etching factor test line 4 is divided into three parts, and the line width at the V _ CUT position between the SET delivery units is the value of the multilayer board required to control the line width tolerance plus the compensation value of the corresponding line layer. And secondary drilling holes are further formed in the positions, corresponding to the V _ CUT depth testing line 6 and the etching factor testing line 4, of the secondary drilling holes, and the hole diameter of each secondary drilling hole is larger than the width of the V _ CUT depth testing line 6 or the width of the etching factor testing line 4.
The depth test line and the etching factor test line 4 of inlayer set up on corresponding inlayer circuit layer, are equipped with the metallization hole 5 that has the ring of holes at the both ends of depth test line and etching factor test line 4, metallization hole 5 is in the technology edge of multiply wood, the depth test line runs through V _ CUT line, and is equipped with secondary drilling, etching factor test line 4 passes through or does not pass through V _ CUT line 1, and corresponds the setting or does not set up secondary drilling.
And in the electrical performance network connected with the V _ CUT depth test line 6 and the etching factor test line 4, metallized holes 5 are conducted with outer layer circuits, and the outer layer circuits are provided with hole rings of the metallized holes 5 or bonding pads connected with the metallized holes 5.
The line widths of the V _ CUT depth test line 6 and the etching factor test line 4 are not larger than the minimum line width of the corresponding circuit layer of the multilayer board. And the test sheet and the terminal connecting wire 3 are arranged on the outer layer circuit.
Example one
The thickness of the four-layer multilayer board is required to be 2.0mm, the thickness of the core board is required to be 0.5mm in order to ensure the thickness between layers, the residual thickness of the V _ CUT is controlled to be 0.5-0.7mm according to the requirement of V-CUT board separation, and the fact that the board can be accurately separated and is not easy to break is ensured. Therefore, according to the requirement, the finished plate thickness of 2.0mm is required, and the thickness of the finished plate after pressing is required to be controlled within the range of 1.9mm +/10% mm, so that the practical multilayer core plate or the laminated structure of a plurality of PP sheets is required to be processed.
The test terminal 2 and the terminal connecting wire 3 are added on the outer layer of the multilayer board, so that whether the V _ CUT is leaked or not can be accurately confirmed through electrical test, in the laminated structure, copper foils are placed at the position of a plating clamping edge at 0.6+/-0.1mm and 1.3+/-0.1mm of the laminated layer, a V _ CUT machine and a V _ CUT blade are in metal conduction connection, a micro-current test is installed on the V _ CUT machine, when the V _ CUT blade is contacted with the copper foil, the micro-current test is conducted, the accurate depth position control is realized, when the depth of the upper V _ CUT depth test line is accurately determined, according to the requirement of the design lamination, the depths of the upper and lower V _ CUT blades are symmetrically adjusted to test a lower V _ CUT depth test line, and marking the specific positions of the upper V _ CUT depth test line and the lower V _ CUT depth test line, and adjusting the reserved distance from the V _ CUT to be within the control range of the residual thickness of the V _ CUT.
In order to further reduce the trouble of work among the electric test process, still include the etching factor test, the etching factor test is for passing through the metal via hole, set up the control line of corresponding minimum linewidth on corresponding layer, for example, four-layer board third layer minimum linewidth 5mil, compensate 1.2mil, the minimum 3mil of wire that the requirement was produced, the linewidth that corresponds etching factor test line 4 is 2mil +1.2mil, through the test to the corresponding pad of metal via hole after the etching, can directly confirm whether minimum linewidth satisfies the production demand in the board, or monitor immediately after the inlayer etching comes out, avoided looking for minimum linewidth, make the piece, the trouble of section measurement. The control detection of the etching factor of the outer layer circuit can also be realized.
For the process of adding the V _ CUT test of the copper foil to the electroplating clamping edge, large-plate V _ CUT production is required.
Example two
Referring to fig. 3, for a multilayer board with more than six layers, the number of core boards and the number of PP sheets are large, the adjustment types of the laminated structure are various, taking the requirement of the thickness of an eight-layer board to be 2.0mm as an example, the thickness of the finished board after lamination is 2.0mm according to the requirement, the thickness of the finished board after lamination should be controlled within the range of 1.9mm +/10% mm, and the residual thickness of V _ CUT should be controlled within the range of 0.5-0.7mm according to the requirement of V-CUT separation, so that the accurate separation of the board can be ensured, and the board is not easy to break.
Eight plywood needs three core boards simultaneously, three at least PP pieces, just so provides multiple laminated structure, in order to guarantee the interlaminar thickness, 8 thickness of middle core board are according to copper 0.4mm control, and remaining two core boards are 0.3mm control respectively, can very easily guarantee to set up the copper foil layer in the thickness position of 0.5mm and 1.3 mm.
The test terminal 2 and the terminal connecting wire 3 are added on the outer layer of the multilayer board, whether V _ CUT is leaked or not can be accurately confirmed through electric test, copper is laid on the process side and the electroplating clamping side of the third layer in the laminated structure, micro-current detection is achieved, copper is laid on the process side and the electroplating clamping side of the sixth layer, micro-current detection is conveniently achieved, a V _ CUT space is reserved in a place needing the V-CUT, and copper is not laid in the V _ CUT space.
Meanwhile, the third layer and the sixth layer are used as an upper V _ CUT depth test line control detection layer 9, the fourth layer and the fifth layer are used as a lower V _ CUT depth test line control detection layer 10, and the trouble of adding a copper foil layer is avoided. In the micro-current test or the corresponding conduction test of the V _ CUT machine, the on-off test of an upper V _ CUT depth test line and a lower V _ CUT depth test line is quickly realized, the on-off test is carried out through a universal meter by setting corresponding conducting holes and test bonding pads connected with the conducting holes in the simplest method, and the accurate depth measurement control is realized. And after accurate depth position control is realized, according to the requirement of design lamination, the depths of the upper and lower V _ CUT blades are symmetrically adjusted, the specific positions of the upper V _ CUT depth test line and the lower V _ CUT depth test line are marked, and the reserved distance from the V _ CUT is adjusted to be within the control range of the residual thickness of the V _ CUT.
In order to further reduce the trouble of work among the electric test process, still include the etching factor test, the etching factor test is for passing through the metal via hole, set up the control line of corresponding minimum linewidth on corresponding layer, for example, certain layer minimum linewidth 5mil, compensate 1.2mil, the minimum 3mil of wire that the requirement was produced, the linewidth that corresponds etching factor test line 4 is 2mil +1.2mil, through the test to the corresponding pad of metal via hole after the etching, can directly confirm whether minimum linewidth satisfies the production demand in the board, perhaps monitor immediately after the inlayer etching comes out, avoided looking for minimum linewidth, make the section, slice measuring trouble. The control detection of the etching factor of the outer layer circuit can also be realized.
In order to avoid adding too many V _ CUT depth test lines 6 and inner layer etching factor test lines 7 on the process edge, each delivery unit is provided with only one V _ CUT depth test line 6 and one inner layer etching factor test line 7.
The multi-layer board for detecting the etching parameter and the V _ CUT depth through the electrical test provided by the invention is described in detail above. The principles and embodiments of the present invention have been explained by applying specific examples, and the above descriptions of the embodiments are only used to help understanding the method and the core idea of the present invention. It should be noted that, for a person skilled in the art, several modifications and changes can be made to the present invention without departing from the present invention, and these modifications and changes also fall into the protection scope of the present invention.
Claims (3)
1. A multilayer board for etching factor detection and V _ CUT depth detection through electrical testing, the multilayer board comprises a SET delivery UNIT, test terminals, terminal connecting lines, a V _ CUT depth test line and an etching factor test line which are combined by at least 2 UNIT UNITs, wherein the outer layer lines of the SET delivery UNIT are provided with the test terminals, the terminal connecting lines are arranged between the test terminals, the inner layer lines of the SET delivery UNIT are provided with the V _ CUT depth test line, and the V _ CUT depth test line and the terminal connecting lines are connected on the network connecting lines of the UNIT in a crossing manner;
the laminated structure between the multilayer boards is designed according to the finished board thickness and the V _ CUT depth, and the V _ CUT depth test line comprises an upper V _ CUT depth test line and a lower V _ CUT depth test line; respectively realizing the detection of the upper limit and the lower limit of the V _ CUT depth;
the corresponding positions of the V _ CUT depth test line and the etching factor test line are also provided with secondary drilling holes, and the hole diameter of each secondary drilling hole is larger than the width of the V _ CUT depth test line or the etching factor test line;
in the electrical performance network connected with the V _ CUT depth test line and the etching factor test line, metallized holes are communicated with outer layer circuits, and the outer layer circuits are hole rings of the metallized holes or bonding pads connected with the metallized holes;
the line widths of the V _ CUT depth test line and the etching factor test line are not larger than the minimum line width of the corresponding circuit layer of the multilayer board;
the etching factor test line is divided into three parts, and the line width at the V _ CUT position between the SET delivery units is the value of the tolerance of the required control line width of the multilayer board plus the compensation value of the corresponding line layer;
among the electric test process, still including the etching factor test, the etching factor test is for passing through the metal via hole, sets up the control line of corresponding minimum linewidth on corresponding layer, and through the test to the corresponding pad of metal via hole, whether minimum linewidth satisfies the production demand in the confirmation board after the etching, perhaps monitors immediately after the inlayer is etched out, has avoided looking for minimum linewidth, slices, the trouble of section measurement.
2. The multilayer board for etch factor detection and V _ CUT depth detection by electrical testing of claim 1, wherein the multilayer board is at least a 6-layer board.
3. The multilayer board for etch factor detection and V _ CUT depth detection by electrical testing of claim 1, wherein the test terminals and terminal connection lines are disposed on outer layer traces.
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