CN112176287A - PDMS-based elastic base material, manufacturing method thereof and electronic device - Google Patents

PDMS-based elastic base material, manufacturing method thereof and electronic device Download PDF

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Publication number
CN112176287A
CN112176287A CN202011044168.4A CN202011044168A CN112176287A CN 112176287 A CN112176287 A CN 112176287A CN 202011044168 A CN202011044168 A CN 202011044168A CN 112176287 A CN112176287 A CN 112176287A
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China
Prior art keywords
pdms
substrate
transition layer
metal film
adhesion layer
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Chinese (zh)
Inventor
周成刚
魏珊珊
魏钰
何逸昭
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University of Science and Technology of China USTC
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University of Science and Technology of China USTC
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering

Abstract

The invention provides a PDMS-based elastic base material, a manufacturing method thereof and an electronic device, and provides a technical scheme that a transition layer is introduced between a PDMS substrate and a metal film, and the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film, so that the problem of larger stress caused by larger difference of the thermal expansion coefficients between the PDMS substrate and the metal film can be solved, the problems of wrinkling or cracking and the like when the metal film is manufactured on the side of the transition layer, which is far away from the PDMS substrate, are solved, and the excellent quality of the metal film in the PDMS-based elastic base material is ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.

Description

PDMS-based elastic base material, manufacturing method thereof and electronic device
Technical Field
The invention relates to the technical field of electronic devices, in particular to a PDMS (polydimethylsiloxane) -based elastic base material, a manufacturing method thereof and an electronic device.
Background
PDMS (polydimethylsiloxane) is a material of a high molecular organic silicon compound, is a non-toxic and hydrophobic viscoelastic transparent body, has simple and quick process and higher biocompatibility, and is widely used in the field of microfluidics. The use of PDMS-based substrates in flexible electronic or wearable devices is also increasing by the preparation or transfer of metal electrodes on PDMS substrates. However, when the metal film is prepared on the PDMS substrate in the prior art, the prepared metal film has the problems of wrinkling or cracking and the like.
Disclosure of Invention
In view of this, the invention provides a PDMS-based elastic substrate, a method for manufacturing the same, and an electronic device, which effectively solve the technical problems in the prior art and ensure the excellent quality of a metal film in the PDMS-based elastic substrate.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a manufacturing method based on PDMS elastic base material comprises the following steps:
preparing a PDMS substrate;
forming a transition layer on one side of the PDMS substrate;
forming an adhesion layer on one side of the transition layer, which is far away from the PDMS substrate;
and forming a metal film on the side of the adhesion layer, which is far away from the transition layer, wherein the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film.
Optionally, preparing a PDMS substrate includes:
providing substrate materials of PDMS precursor and curing agent in preset proportion;
stirring the substrate material and then placing the substrate material in a vacuum oven to remove bubbles;
and pouring the substrate material into a mold, and baking and curing to obtain the PDMS substrate.
Optionally, forming a transition layer on one side of the PDMS substrate includes:
and forming an AZO transition layer on one side of the PDMS substrate.
Optionally, forming an adhesion layer on a side of the transition layer facing away from the PDMS substrate, includes:
and forming a metal adhesion layer on the side of the transition layer, which faces away from the PDMS substrate, wherein the metal adhesion layer comprises a Ti adhesion layer or a Cr adhesion layer.
Correspondingly, the invention also provides a PDMS-based elastic substrate, which comprises:
a PDMS substrate;
the transition layer is positioned on one side of the PDMS substrate;
the adhesion layer is positioned on one side of the transition layer, which is far away from the PDMS substrate;
and the metal film is positioned on one side of the adhesion layer, which is far away from the transition layer, and the thermal expansion coefficient of the transition layer is positioned between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film.
Optionally, the transition layer includes an AZO transition layer.
Optionally, the transition layer has a thickness in a range of 70nm to 80nm, inclusive.
Optionally, the adhesion layer comprises a metal adhesion layer comprising a Ti adhesion layer or a Cr adhesion layer.
Optionally, the metal thin film comprises an Au or Pt metal thin film.
Correspondingly, the invention also provides an electronic device, which comprises the PDMS-based elastic substrate.
Compared with the prior art, the technical scheme provided by the invention at least has the following advantages:
the invention provides a PDMS-based elastic substrate, a manufacturing method thereof and an electronic device, wherein the manufacturing method comprises the following steps: preparing a PDMS substrate; forming a transition layer on one side of the PDMS substrate; forming an adhesion layer on one side of the transition layer, which is far away from the PDMS substrate; and forming a metal film on the side of the adhesion layer, which is far away from the transition layer, wherein the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film.
From the above, the transition layer is introduced between the PDMS substrate and the metal film according to the technical scheme provided by the present invention, and the thermal expansion coefficient of the transition layer is between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film, so that the problem of larger stress caused by a larger difference between the thermal expansion coefficients of the PDMS substrate and the metal film can be solved, the problems of wrinkling or cracking and the like when the metal film is manufactured on the side of the transition layer away from the PDMS substrate can be solved, and the excellent quality of the metal film in the PDMS-based elastic base material can be ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a PDMS-based elastic substrate according to an embodiment of the present invention;
FIGS. 2-5 are schematic views of the respective steps in FIG. 1;
FIG. 6 is a flow chart of a method for preparing a PDMS substrate according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a PDMS-based elastic substrate according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background art, PDMS (polydimethylsiloxane) is a material of a high molecular organic silicon compound, is a non-toxic, hydrophobic, viscoelastic, transparent body, has a simple and rapid process, has high biocompatibility, and is widely used in the field of microfluidics. The use of PDMS-based substrates in flexible electronic or wearable devices is also increasing by the preparation or transfer of metal electrodes on PDMS substrates. However, when the metal film is prepared on the PDMS substrate in the prior art, the prepared metal film has the problems of wrinkling or cracking and the like.
Based on the above, the embodiment of the invention provides a PDMS-based elastic base material, a manufacturing method thereof and an electronic device, which effectively solve the technical problems in the prior art and ensure the excellent quality of a metal film in the PDMS-based elastic base material. To achieve the above object, the technical solutions provided by the embodiments of the present invention are described in detail below, specifically with reference to fig. 1 to 7.
Referring to fig. 1, a flow chart of a method for manufacturing a PDMS-based elastic substrate according to an embodiment of the present invention is shown, wherein the method includes:
s1, preparing the PDMS substrate.
And S2, forming a transition layer on one side of the PDMS substrate.
And S3, forming an adhesion layer on the side of the transition layer, which faces away from the PDMS substrate.
And S4, forming a metal film on the side of the adhesion layer, which faces away from the transition layer, wherein the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film.
As can be seen from the above, the transition layer is introduced between the PDMS substrate and the metal film according to the technical solution provided in the embodiments of the present invention, and the thermal expansion coefficient of the transition layer is located between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film, so that the problem of larger stress caused by a larger difference between the thermal expansion coefficients of the PDMS substrate and the metal film can be solved, the problem of wrinkling or cracking when the metal film is fabricated on the side of the transition layer away from the PDMS substrate can be solved, and the excellent quality of the metal film in the PDMS-based elastic base material can be ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.
The manufacturing method shown in fig. 1 according to the embodiment of the present invention is described in more detail with reference to fig. 2 to 5, wherein fig. 2 to 5 are schematic structural diagrams corresponding to steps in fig. 1.
As shown in fig. 2, corresponding to step S1, a PDMS substrate 100 is prepared.
The invention can be prepared by adopting PDMS precursor and curing agent according to a certain proportion. Referring specifically to fig. 6, there is provided a flowchart of a method for preparing a PDMS substrate according to an embodiment of the present invention, where the preparing the PDMS substrate includes:
s11, providing substrate materials of the PDMS precursor and the curing agent in preset proportion.
And S12, stirring the substrate material, and then placing the substrate material in a vacuum oven to remove bubbles.
And S13, pouring the substrate material into a mold, and baking and curing to obtain the PDMS substrate.
In an embodiment of the present invention, a substrate material with a preset ratio of PDMS prepolymer to curing agent of 10:1 may be provided in an embodiment of the present invention. The substrate material is then thoroughly stirred after it is obtained and placed in a vacuum oven to remove excess air bubbles from the substrate material. And finally, pouring the substrate material subjected to air bubble removal into a preset mold for baking and curing, specifically baking for 150min at the baking temperature of 70-90 ℃ (inclusive) to cure, and then obtaining the PDMS substrate.
It should be noted that, in the embodiment of the present invention, specific values of the parameters such as the preset ratio, the baking temperature, the baking time, and the like provided above are not limited, and specific values need to be analyzed and calculated according to various influencing factors in practical application.
As shown in fig. 3, corresponding to step S2, a transition layer 200 is formed on one side of the PDMS substrate 100.
In an embodiment of the present invention, the forming of the transition layer on one side of the PDMS substrate provided in the present invention includes:
and forming an AZO transition layer on one side of the PDMS substrate.
It can be understood that the transition layer provided in the embodiment of the present invention may be an AZO (aluminum-doped zinc oxide) transition layer, and may also be a transition layer made of other materials.
In an embodiment of the present invention, the transition layer may be formed on the PDMS substrate by a magnetron sputtering process. When the transition layer provided by the embodiment of the invention is the AZO transition layer, the numerical range of the corresponding power parameter of the magnetron sputtering process can be 100-150W (including end values), and the numerical range of the air pressure parameter can be 1-2 mtorr.
The thickness range of the transition layer provided by the embodiment of the invention can be 70-80nm (including end points), the invention does not limit the specific value of the thickness of the transition layer, and specific analysis and calculation are required according to practical application.
Optionally, in the embodiment of the present invention, before the transition layer is formed on one side of the PDMS substrate, the PDMS substrate may be pre-cleaned by using a magnetron sputtering process. After curing the substrate material to obtain the PDMS substrate, pre-cleaning the PDMS substrate, wherein the range of the power parameter related to the pre-cleaning of the corresponding magnetron sputtering process may be 30-60W (inclusive), and the range of the cleaning time may be 2-3min (inclusive).
As shown in fig. 4, corresponding to step S3, an adhesion layer 300 is formed on the side of the transition layer 200 facing away from the PDMS substrate 100.
In an embodiment of the present invention, the forming of the adhesion layer on the side of the transition layer away from the PDMS substrate provided in the present invention includes:
and forming a metal adhesion layer on the side of the transition layer, which faces away from the PDMS substrate, wherein the metal adhesion layer comprises a Ti adhesion layer or a Cr adhesion layer.
According to the embodiment of the invention, the adhesion layer can be prepared and formed on the transition layer by adopting a magnetron sputtering process. If the adhesion layer provided by the embodiment of the invention is a Ti adhesion layer, the numerical range of the power parameter related to the magnetron sputtering process in the process of manufacturing the Ti adhesion layer can be 150-250W (including end values), and the numerical range of the air pressure parameter can be 3-5 mtorr.
It can be understood that the technical solution provided by the embodiment of the present invention can form an adhesion layer on the transition layer, and further can improve the adhesion capability of the metal film through the adhesion layer. In addition, the adhesion layer provided by the embodiment of the invention can be set as a metal adhesion layer, and the metal adhesion layer can improve the adhesion capability of the metal film, and meanwhile, the metal film is in contact with the metal adhesion layer, so that the impedance of the metal film can be further reduced.
In other embodiments of the present invention, the adhesion layer provided by the present invention may also be an adhesion layer made of other materials, and the present invention is not limited in particular.
As shown in fig. 5, corresponding to step S4, a metal film 400 is formed on the side of the adhesion layer 300 facing away from the transition layer 200, and the thermal expansion coefficient of the transition layer 200 is between that of the PDMS substrate 100 and that of the metal film 400.
In an embodiment of the present invention, the metal thin film provided by the present invention may be an Au or Pt metal thin film, and the present invention is not limited thereto. In the embodiment of the invention, the metal film can be prepared on the adhesion layer by adopting a magnetron sputtering process. If the metal film provided by the embodiment of the invention is the Au metal film, the numerical range of the power parameter related to the magnetron sputtering process when the Au metal film is manufactured can be 100-150W (including an end value), and the numerical range of the air pressure parameter can be 3-5 mtorr.
As can be seen from the above, the transition layer is introduced between the PDMS substrate and the metal film according to the technical solution provided in the embodiments of the present invention, and the thermal expansion coefficient of the transition layer is located between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film, so that the problem of larger stress caused by a larger difference between the thermal expansion coefficients of the PDMS substrate and the metal film can be solved, the problem of wrinkling or cracking when the metal film is fabricated on the side of the transition layer away from the PDMS substrate can be solved, and the excellent quality of the metal film in the PDMS-based elastic base material can be ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.
It should be noted that, the magnetron sputtering processes according to the above embodiments provided in the present invention may all be performed in a pure Ar gas environment.
Correspondingly, the embodiment of the invention also provides a PDMS-based elastic base material which is manufactured by adopting the manufacturing method provided by any one of the embodiments. Referring to fig. 7, a schematic structural diagram of a PDMS-based elastic substrate according to an embodiment of the present invention is shown, where the PDMS-based elastic substrate includes:
a PDMS substrate 10.
A transition layer 20 on one side of the PDMS substrate 10.
An adhesion layer 30 on the side of the transition layer 20 facing away from the PDMS substrate 10.
A metal film 40 located on the side of the adhesion layer 30 facing away from the transition layer 20, wherein the thermal expansion coefficient of the transition layer 20 is between the thermal expansion coefficient of the PDMS substrate 10 and the thermal expansion coefficient of the metal film 40.
As can be seen from the above, the transition layer is introduced between the PDMS substrate and the metal film according to the technical solution provided in the embodiments of the present invention, and the thermal expansion coefficient of the transition layer is located between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film, so that the problem of larger stress caused by a larger difference between the thermal expansion coefficients of the PDMS substrate and the metal film can be solved, the problem of wrinkling or cracking when the metal film is fabricated on the side of the transition layer away from the PDMS substrate can be solved, and the excellent quality of the metal film in the PDMS-based elastic base material can be ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.
In an embodiment of the present invention, the PDMS substrate provided in the present invention may be prepared by using a PDMS prepolymer and a curing agent according to a certain ratio.
Specifically, the embodiment of the invention can provide a substrate material with a preset ratio of the PDMS prepolymer to the curing agent of 10: 1. The substrate material is then thoroughly stirred after it is obtained and placed in a vacuum oven to remove excess air bubbles from the substrate material. And finally, pouring the substrate material subjected to air bubble removal into a preset mold for baking and curing, specifically baking for 150min at the baking temperature of 70-90 ℃ (inclusive) to cure, and then obtaining the PDMS substrate. The embodiment of the invention does not limit the specific values of the parameters such as the preset proportion, the baking temperature, the baking time and the like, and the specific values are analyzed and calculated according to various influence factors in practical application.
In an embodiment of the invention, the transition layer provided by the invention includes an AZO transition layer, and the invention is not particularly limited.
It can be understood that the transition layer provided in the embodiment of the present invention may be an AZO (aluminum-doped zinc oxide) transition layer, and may also be a transition layer made of other materials.
Optionally, the invention may adopt a magnetron sputtering process to form a transition layer on the PDMS substrate. When the transition layer provided by the embodiment of the invention is the AZO transition layer, the numerical range of the corresponding power parameter of the magnetron sputtering process can be 100-150W (including end values), and the numerical range of the air pressure parameter can be 1-2 mtorr. The thickness range of the transition layer provided by the embodiment of the invention can be 70-80nm (including end points), the invention does not limit the specific value of the thickness of the transition layer, and specific analysis and calculation are required according to practical application.
In an embodiment of the invention, the adhesion layer provided by the invention comprises a metal adhesion layer, and the metal adhesion layer comprises a Ti adhesion layer or a Cr adhesion layer.
Specifically, the embodiment of the invention can adopt a magnetron sputtering process to prepare and form the adhesion layer on the transition layer. If the adhesion layer provided by the embodiment of the invention is a Ti adhesion layer, the numerical range of the power parameter related to the magnetron sputtering process in the process of manufacturing the Ti adhesion layer can be 150-250W (including end values), and the numerical range of the air pressure parameter can be 3-5 mtorr.
It can be understood that the technical solution provided by the embodiment of the present invention can form an adhesion layer on the transition layer, and further can improve the adhesion capability of the metal film through the adhesion layer. In addition, the adhesion layer provided by the embodiment of the invention can be set as a metal adhesion layer, and the metal adhesion layer can improve the adhesion capability of the metal film, and meanwhile, the metal film is in contact with the metal adhesion layer, so that the impedance of the metal film can be further reduced.
In other embodiments of the present invention, the adhesion layer provided by the present invention may also be an adhesion layer made of other materials, for example, the adhesion layer provided by the embodiments of the present invention may also be a non-metal adhesion layer, and the present invention is not limited in particular.
In an embodiment of the present invention, the metal thin film provided by the present invention includes an Au or Pt metal thin film, and the present invention is not limited in particular.
Optionally, in the embodiment of the present invention, a magnetron sputtering process may be adopted to prepare the metal film on the adhesion layer. If the metal film provided by the embodiment of the invention is the Au metal film, the numerical range of the power parameter related to the magnetron sputtering process when the Au metal film is manufactured can be 100-150W (including an end value), and the numerical range of the air pressure parameter can be 3-5 mtorr.
Correspondingly, the embodiment of the invention also provides an electronic device, and the electronic device comprises the PDMS-based elastic substrate provided by any one of the embodiments.
Optionally, the electronic device provided in the embodiment of the present invention may specifically be a microfluidic device, and the present invention is not particularly limited thereto.
The embodiment of the invention provides a PDMS-based elastic substrate, a manufacturing method thereof and an electronic device, wherein the manufacturing method comprises the following steps: preparing a PDMS substrate; forming a transition layer on one side of the PDMS substrate; forming an adhesion layer on one side of the transition layer, which is far away from the PDMS substrate; and forming a metal film on the side of the adhesion layer, which is far away from the transition layer, wherein the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film.
As can be seen from the above, the transition layer is introduced between the PDMS substrate and the metal film according to the technical solution provided in the embodiments of the present invention, and the thermal expansion coefficient of the transition layer is located between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film, so that the problem of larger stress caused by a larger difference between the thermal expansion coefficients of the PDMS substrate and the metal film can be solved, the problem of wrinkling or cracking when the metal film is fabricated on the side of the transition layer away from the PDMS substrate can be solved, and the excellent quality of the metal film in the PDMS-based elastic base material can be ensured. Meanwhile, an adhesion layer is formed before the metal film is manufactured, so that the adhesion of the metal film can be further improved, and the performance of the metal film based on the PDMS elastic substrate is improved.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A manufacturing method based on PDMS elastic base material is characterized by comprising the following steps:
preparing a PDMS substrate;
forming a transition layer on one side of the PDMS substrate;
forming an adhesion layer on one side of the transition layer, which is far away from the PDMS substrate;
and forming a metal film on the side of the adhesion layer, which is far away from the transition layer, wherein the thermal expansion coefficient of the transition layer is between that of the PDMS substrate and that of the metal film.
2. The method of claim 1, wherein the preparing the PDMS substrate comprises:
providing substrate materials of PDMS precursor and curing agent in preset proportion;
stirring the substrate material and then placing the substrate material in a vacuum oven to remove bubbles;
and pouring the substrate material into a mold, and baking and curing to obtain the PDMS substrate.
3. The method of claim 1, wherein forming the transition layer on one side of the PDMS substrate comprises:
and forming an AZO transition layer on one side of the PDMS substrate.
4. The method of claim 1, wherein forming an adhesion layer on a side of the transition layer facing away from the PDMS substrate comprises:
and forming a metal adhesion layer on the side of the transition layer, which faces away from the PDMS substrate, wherein the metal adhesion layer comprises a Ti adhesion layer or a Cr adhesion layer.
5. A PDMS-based elastomeric substrate, comprising:
a PDMS substrate;
the transition layer is positioned on one side of the PDMS substrate;
the adhesion layer is positioned on one side of the transition layer, which is far away from the PDMS substrate;
and the metal film is positioned on one side of the adhesion layer, which is far away from the transition layer, and the thermal expansion coefficient of the transition layer is positioned between the thermal expansion coefficient of the PDMS substrate and the thermal expansion coefficient of the metal film.
6. The PDMS based elastic substrate according to claim 5, wherein the transition layer comprises an AZO transition layer.
7. The PDMS based elastic substrate according to claim 5, wherein the transition layer has a thickness in a range of 70nm to 80nm, inclusive.
8. The PDMS based elastic substrate according to claim 5, wherein the adhesion layer comprises a metal adhesion layer comprising a Ti adhesion layer or a Cr adhesion layer.
9. The PDMS based elastic substrate according to claim 5, wherein the metal thin film comprises Au or Pt metal thin film.
10. An electronic device comprising a PDMS based elastomeric substrate according to any one of claims 5-9.
CN202011044168.4A 2020-09-28 2020-09-28 PDMS-based elastic base material, manufacturing method thereof and electronic device Pending CN112176287A (en)

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CN105463376A (en) * 2015-12-08 2016-04-06 云南云天化股份有限公司 Polyimide metal-coated thin film with transition combination layer and preparing method of thin film
CN105997058A (en) * 2016-05-28 2016-10-12 惠州市力道电子材料有限公司 Polymer flexible interdigital electrode and processing method thereof
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US20120205656A1 (en) * 2008-05-20 2012-08-16 Palo Alto Research Center Incorporated Thin-Film Electronic Devices Including Pre-Deformed Compliant Substrate
CN103456802A (en) * 2013-09-04 2013-12-18 南开大学 Back electrode used for Cu-In-Ga-Se film solar cell with polyimide substrate
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Application publication date: 20210105