CN112170613A - Lower die of punching die of circuit board - Google Patents
Lower die of punching die of circuit board Download PDFInfo
- Publication number
- CN112170613A CN112170613A CN201910605860.0A CN201910605860A CN112170613A CN 112170613 A CN112170613 A CN 112170613A CN 201910605860 A CN201910605860 A CN 201910605860A CN 112170613 A CN112170613 A CN 112170613A
- Authority
- CN
- China
- Prior art keywords
- die
- lower die
- circuit board
- punching
- connecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 title claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to the technical field of circuit board dies, in particular to a lower die of a die-cutting die for a circuit board, which is a tool for die-cutting a metal substrate circuit board and comprises a die base, wherein a connecting column is convexly extended on the die base, a lower die bottom plate arranged on the connecting column, a connecting plate arranged between the die base and the lower die bottom plate, and a push rod arranged on the die base and the connecting plate; the connecting plate is provided with a thimble, and a second through hole is formed in the lower die bottom plate corresponding to the position of the punching die cavity. The lower die of the punching die of the circuit board drives the connecting plate to move upwards on the connecting column through the pushing rod, so that the ejector pin penetrates through the second through hole to jack up the punched workpiece, and the bottom end surface of the punched workpiece is higher than the top end surface of the lower die bottom plate; the lower die of the punching die of the circuit board can be used on automatic production equipment, the production efficiency of the punching circuit board is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of circuit board dies, in particular to a lower die of a punching die of a circuit board.
Background
The circuit board is also called a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The metal circuit board is a unique metal-based copper-clad plate, and has good heat conductivity, electrical insulation performance and machining performance. At present, after a die for punching a circuit board punches a product, the punched product needs to be manually taken out of a die cavity of the punching die, and then the next product to be punched is placed on the die cavity of the die for punching again; the punching die is easy to hurt people, and the processed product is taken out manually, so that the labor is high, and the punching die cannot be used on automatic production equipment.
Therefore, it is desirable to provide a lower die of a circuit board punching die to overcome the disadvantages of the prior art.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a lower die of a punching die of a circuit board.
The technical scheme of the invention is as follows:
a lower die of a punching die of a circuit board, a tool for punching a metal substrate circuit board, comprising:
the mould base is provided with a connecting column in a protruding mode;
the lower die bottom plate is arranged on the connecting column, a punching die cavity is formed in the lower die bottom plate, and the punching die cavity is used for placing punched workpieces;
the connecting plate is arranged between the die base and the lower die bottom plate, and is movably sleeved on the connecting column;
wherein, a push rod is arranged on the mould base and the connecting plate; the connecting plate is provided with a thimble, and a second through hole is formed on the lower die bottom plate corresponding to the position of the punching die cavity; the pushing rod is pushed by external force, the connecting plate is pushed by the pushing rod to move upwards on the connecting column, and therefore the ejector pin penetrates through the second through hole to jack up the punched workpiece, so that the bottom end face of the punched workpiece is higher than the top end face of the lower die base plate.
Preferably, the length of the ejector pin is greater than the thickness of the lower die base plate.
Preferably, the die base is in an E shape, a first through hole is formed in the die base, a first blind hole which is concentric with the first through hole is formed in the connecting plate correspondingly, and the push rod penetrates through the first through hole and is inserted into the first blind hole to be respectively arranged on the die base and the connecting plate.
Furthermore, at least four first through holes are formed in the mold base, and at least four first blind holes are formed in the mold base corresponding to the connecting plate.
Preferably, the pushing rod is in transmission connection with an executing element, the executing element is an air cylinder, and an expansion rod of the air cylinder is arranged in the first through hole and the first blind hole.
Preferably, the connecting columns are protruded at four corners of the mold base.
Preferably, the connecting plate is provided with at least four ejector pins, and at least four second through holes are formed in the lower die base plate correspondingly.
Preferably, a supporting plate is installed between the mold base and the connecting plate, and the supporting plate is used for supporting the connecting plate.
Preferably, the workpiece is a circuit board of a metal substrate.
The invention has the beneficial effects that: compared with the prior art, the lower die of the circuit board punching die drives the connecting plate to move upwards on the connecting column through the pushing rod, so that the ejector pin penetrates through the second through hole to jack up the punched workpiece, and the bottom end surface of the punched workpiece is higher than the top end surface of the lower die bottom plate; the lower die of the punching die of the circuit board can be used on automatic production equipment, the production efficiency of the punching circuit board is improved, and the production cost is reduced.
Description of the drawings:
fig. 1 is a schematic structural view of a lower die of the circuit board punching die of the invention.
Fig. 2 is another angle structure diagram of the lower die of the circuit board punching die of the invention.
Fig. 3 is a cross-sectional view of a lower die of the circuit board punching die of the present invention.
Fig. 4 is a schematic structural diagram of a lower die of a punching die for applying the circuit board to a conventional punching device.
Detailed Description
In order to make the object, technical solution and technical effect of the present invention more apparent, the present invention will be further described with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 3, the lower die of the circuit board punching die of the present invention is mainly used for a tool for punching a metal substrate circuit board. The lower die of the punching die of the circuit board comprises a die base 10, a lower die bottom plate 20 and a connecting plate 30 arranged between the die base 10 and the lower die bottom plate 20; the upper convex of the die base 10 extends to form a connecting column 11, and the lower die base plate 20 and the connecting plate 30 are both sleeved on the connecting column 11. The four corners of the mold base 10 are provided with the connecting columns 11 in a protruding manner; the lower die bottom plate 20 is provided with a punching die cavity 21. In this embodiment, a support plate 40 is installed between the mold base 10 and the connecting plate 30, and the support plate 40 is used for supporting the connecting plate 30 to prevent the connecting plate 30 from being deformed without support or a central portion of the connecting plate 30 from being depressed; the supporting plate 40 is fixedly mounted on the mold base 10 by screws or bolts.
The die base 10 is in an E shape, a first through hole 12 is formed in the die base 10, a first blind hole 31 concentric with the first through hole 12 is formed in the connecting plate 30 correspondingly, and a push rod 50 penetrates through the first through hole 12 and is inserted into the first blind hole 31 to be respectively arranged on the die base 10 and the connecting plate 30. At least four first through holes 12 are formed in the mold base 10, and at least four first blind holes 31 are formed in the mold base corresponding to the connecting plate 30; the push rod 50 is in driving connection with an actuator. In the present embodiment, four push rods 50 surround a rectangular area, and the outer dimension of the support plate 40 is smaller than the rectangular area. The actuator is preferably a pneumatic cylinder, and in other embodiments, the actuator may be a push-type electric or pneumatic element.
The connecting plate 30 is provided with at least four ejector pins 32, and a second through hole 22 is formed in the lower die base plate 20, and the second through hole 22 is formed in the position of the punching die cavity 21. In this embodiment, four thimbles 32 are respectively disposed at four corners of the connecting plate 30.
When the punched workpiece is placed in the punching die cavity 21, the actuator of the lower die of the punching die of the circuit board drives the pushing rod 50 to push upwards to drive the connecting plate 30 to slide upwards along the connecting column 11, so as to drive the ejector pin 32 to pass through the second through hole 22 to abut against the bottom end face of the punched workpiece and jack the punched workpiece upwards.
Referring to fig. 4, the lower die 1 of the circuit board punching die is applied to the existing punching device 2, after the punching device punches a workpiece to be punched, the upper die 3 on the punching device is separated from the lower die 1, and an ejector pin of the lower die 1 of the circuit board punching die jacks up the punched workpiece, so that the punched workpiece is convenient to move out; when the punched workpiece is moved out of the die cavity of the lower die, the telescopic pushing piece 4 can be used for pushing the punched workpiece out of the die cavity of the lower die, and a manipulator can be used for grabbing the punched workpiece and moving the punched workpiece out of the die cavity of the lower die, so that the punching equipment is prevented from accidentally injuring operators. Therefore, the punching die of the lower die of the punching die applying the circuit board can be used on automatic production equipment, and the production efficiency of punching the circuit board is improved.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the present invention pertains, the architecture form can be flexible and varied without departing from the concept of the present invention, and a series of products can be derived. But rather a number of simple derivations or substitutions are made which are to be considered as falling within the scope of the invention as defined by the appended claims.
Claims (9)
1. A lower die of a punching die of a circuit board, a tool for punching a metal substrate circuit board, comprising:
the mould base is provided with a connecting column in a protruding mode;
the lower die bottom plate is arranged on the connecting column, a punching die cavity is formed in the lower die bottom plate, and the punching die cavity is used for placing punched workpieces;
the connecting plate is arranged between the die base and the lower die bottom plate, and is movably sleeved on the connecting column;
wherein, a push rod is arranged on the mould base and the connecting plate; the connecting plate is provided with a thimble, and a second through hole is formed on the lower die bottom plate corresponding to the position of the punching die cavity; the pushing rod is pushed by external force, the connecting plate is pushed by the pushing rod to move upwards on the connecting column, and therefore the ejector pin penetrates through the second through hole to jack up the punched workpiece, so that the bottom end face of the punched workpiece is higher than the top end face of the lower die base plate.
2. The lower die of a circuit board punching die of claim 1, wherein the die base is in an "E" shape, the die base is provided with a first through hole, a first blind hole having a same center axis as the first through hole is correspondingly formed on the connecting plate, and the pushing rod is inserted into the first blind hole through the first through hole and is respectively disposed on the die base and the connecting plate.
3. The lower die of the circuit board punching die of claim 2, wherein the die base is provided with at least four first through holes, and at least four first blind holes are correspondingly formed in the connecting plate.
4. The lower die of a circuit board punching die according to claim 1, wherein the length of the ejector pin is greater than the thickness of the lower die base plate.
5. The lower die of the punching die for the circuit board as claimed in claim 2, wherein the pushing rod is in transmission connection with an actuating element, the actuating element is a cylinder, and the telescopic rod of the cylinder is the pushing rod.
6. The lower die of the circuit board punching die according to any one of claims 1 to 5, wherein the connecting posts protrude from four corners of the die base.
7. The lower die of a circuit board punching die according to any one of claims 1 to 5, wherein at least four ejector pins are provided on the connecting plate, and at least four second through holes are provided on the corresponding lower die base plate.
8. The lower die of the punching die for the circuit board according to any one of claims 1 to 5, wherein a support plate is installed between the die base and the connecting plate, and the support plate is used for supporting the connecting plate.
9. A lower die of a punching die for a wiring board according to any one of claims 1 to 5, wherein the work is a wiring board of a metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605860.0A CN112170613A (en) | 2019-07-05 | 2019-07-05 | Lower die of punching die of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605860.0A CN112170613A (en) | 2019-07-05 | 2019-07-05 | Lower die of punching die of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112170613A true CN112170613A (en) | 2021-01-05 |
Family
ID=73918720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910605860.0A Pending CN112170613A (en) | 2019-07-05 | 2019-07-05 | Lower die of punching die of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112170613A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204566563U (en) * | 2015-04-14 | 2015-08-19 | 新乡市正元科技电源材料有限公司 | A kind of buckle ring mould |
| CN205571172U (en) * | 2016-04-19 | 2016-09-14 | 湖南财经工业职业技术学院 | Car wedge support forming die |
| CN206445072U (en) * | 2017-01-20 | 2017-08-29 | 嘉兴美可泰科技有限公司 | Automatic locking interlock plate die cutting die |
| CN207657111U (en) * | 2017-12-25 | 2018-07-27 | 欧唐科技（深圳）有限公司 | The Double-ejection demoulding mechanism of mold |
| CN207915976U (en) * | 2017-12-25 | 2018-09-28 | 欧唐科技（深圳）有限公司 | Double-ejection demoulding mechanism |
| CN109226508A (en) * | 2018-10-26 | 2019-01-18 | 江门市锐丰金属制品有限公司 | A kind of drawing die |
| CN209007305U (en) * | 2018-09-30 | 2019-06-21 | 江门市锐丰金属制品有限公司 | A kind of bead cutter |
-
2019
- 2019-07-05 CN CN201910605860.0A patent/CN112170613A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204566563U (en) * | 2015-04-14 | 2015-08-19 | 新乡市正元科技电源材料有限公司 | A kind of buckle ring mould |
| CN205571172U (en) * | 2016-04-19 | 2016-09-14 | 湖南财经工业职业技术学院 | Car wedge support forming die |
| CN206445072U (en) * | 2017-01-20 | 2017-08-29 | 嘉兴美可泰科技有限公司 | Automatic locking interlock plate die cutting die |
| CN207657111U (en) * | 2017-12-25 | 2018-07-27 | 欧唐科技（深圳）有限公司 | The Double-ejection demoulding mechanism of mold |
| CN207915976U (en) * | 2017-12-25 | 2018-09-28 | 欧唐科技（深圳）有限公司 | Double-ejection demoulding mechanism |
| CN209007305U (en) * | 2018-09-30 | 2019-06-21 | 江门市锐丰金属制品有限公司 | A kind of bead cutter |
| CN109226508A (en) * | 2018-10-26 | 2019-01-18 | 江门市锐丰金属制品有限公司 | A kind of drawing die |
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