CN112165762A - Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof - Google Patents
Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof Download PDFInfo
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- CN112165762A CN112165762A CN202011029451.XA CN202011029451A CN112165762A CN 112165762 A CN112165762 A CN 112165762A CN 202011029451 A CN202011029451 A CN 202011029451A CN 112165762 A CN112165762 A CN 112165762A
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- Prior art keywords
- copper
- manufacturing
- boss
- thermoelectric separation
- etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a copper-based PCB circuit board containing a thermoelectric separation copper boss and a manufacturing method thereof, wherein the manufacturing method of the copper-based PCB circuit board containing the thermoelectric separation copper boss comprises a copper boss manufacturing step, a copper substrate manufacturing step and a bonding sheet manufacturing step; the bonding sheet manufacturing method comprises the following steps: p1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into the size required by the work; p2, drilling to obtain a required bonding sheet; the invention discloses a copper-based PCB circuit board containing a thermoelectric separation copper boss and a manufacturing method thereof.
Description
Technical Field
The invention belongs to the technical field of circuit board production, and particularly relates to a method for manufacturing a copper-based PCB (printed circuit board) containing a thermoelectric separation copper boss.
Background
In recent years, copper-based PCB has been widely used, and compared with common FR-4 material, the heat dissipation of copper-based PCB has been widely accepted. The heat conductivity coefficient of the copper base is high and reaches 400W/m.K, but the heat conductivity coefficient of the insulating layer can only reach 2-4W/m.K, so that the heat conductivity of the insulating layer determines that the overall heat conductivity of the copper base PCB is low, the high heat conductivity of the copper base cannot be fully utilized, the heat of heating components cannot be conducted out in time, and the service life, the performance and the like of the product are greatly reduced.
Disclosure of Invention
Aiming at the condition of the prior art, the invention overcomes the defects and provides a method for manufacturing a copper-based PCB containing a thermoelectric separation copper boss.
In order to achieve the above object, the present invention is achieved by the following technical means.
A method for manufacturing a copper-based PCB (printed circuit board) containing a thermoelectric separation copper boss comprises a copper boss manufacturing step, a substrate manufacturing step and a bonding sheet manufacturing step; wherein:
the manufacturing method of the copper boss comprises the following steps:
s1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into a required size;
s2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
s3, carrying out ultraviolet irradiation alignment exposure;
s4, DES processing;
s5, soaking, cleaning and drying;
s6, carrying out browning treatment by adopting a browning liquid to obtain a required copper boss;
the substrate manufacturing method comprises the following steps:
t1, cutting and cutting the board;
t2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
t3, carrying out ultraviolet irradiation alignment exposure;
t4, DES processing;
t5, soaking, cleaning and drying;
t6, milling grooves;
t7, performing browning treatment by using a browning liquid to obtain a required substrate;
the bonding sheet manufacturing method comprises the following steps:
p1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into the size required by the work;
p2, drilling to obtain a required bonding sheet;
the manufacturing method of the copper-based PCB board containing the thermoelectric separation copper boss further comprises the following steps:
q1. pressing the copper boss obtained in S6, the substrate obtained in T7 and the bonding sheet obtained in P2;
q2, grinding the plate;
q3. electroplating a copper layer on the surface by zinc immersion and copper electroplating;
electroplating the outer layer circuit;
q5. drilling a hole;
q6, resistance welding;
q6, character printing;
q7, surface treatment;
q8. solder the components to the substrate.
According to the above technical means, as a more preferable technical means of the above technical means, the method for manufacturing a copper-based PCB including a copper boss for thermoelectric separation further includes the steps of:
q9. testing the whole PCB circuit board;
and Q10, bill making and shipment.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step S4 is specifically implemented as the following steps:
s4.1, decomposing the ink which is not irradiated by light by using a developing solution;
s4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and S4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
According to the above technical solution, as a further preferable technical solution of the above technical solution, the step T4 is specifically implemented as the following steps:
t4.1, decomposing the ink which is not irradiated by light by using a developing solution;
t4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and T4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
According to the above technical means, as a more preferable technical means of the above technical means, in step S6 and step T7, the browning liquid is hydrogen peroxide.
According to the above aspect, as a more preferable aspect of the above aspect, the material of the adhesive sheet is an epoxy resin.
According to the above technical means, as a further preferable technical means of the above technical means, in the step Q1, the copper boss is press-fitted into the groove of the substrate.
According to the above aspect, as a more preferable aspect of the above aspect, in the step Q3, the thickness of the copper plating layer is not less than 5 μm.
According to the above aspect, as a more preferable aspect of the above aspect, in the step Q8, the heat generating component among the components is soldered to a copper land.
According to the above technical means, as a more preferable technical means of the above technical means, a copper-based PCB including a copper boss for thermoelectric separation is manufactured by the method for manufacturing a copper-based PCB including a copper boss for thermoelectric separation disclosed in any one of the above technical means.
The invention discloses a copper-based PCB circuit board containing a thermoelectric separation copper boss and a manufacturing method thereof, and the copper-based PCB circuit board has the beneficial effects that: the invention makes copper bosses on the corresponding positions of the heating elements pasted on the substrate, the heating elements conduct electricity by the pasting method by utilizing the high heat-conducting property of copper, and the heat generated by the heating elements can be quickly conducted to the substrate through the copper bosses, thereby achieving the thermoelectric separation effect, improving the heat-radiating property of the whole copper substrate, reducing the surface temperature of the heating elements, and further achieving the purposes of improving the product performance and prolonging the product service life.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
fig. 2 is a flow chart of the fabrication of the preferred embodiment of the present invention.
The reference numerals include: copper boss 10, copper substrate 20, groove 21, bonding sheet 30, and heat-generating component 40.
Detailed Description
The invention discloses a copper-based PCB circuit board containing a thermoelectric separation copper boss and a manufacturing method thereof, and the specific implementation mode of the invention is further described in combination with the preferred embodiment.
Referring to fig. 1 to 2 of the drawings, fig. 1 is a schematic structural view of a preferred embodiment of the present invention; fig. 2 is a flow chart of the fabrication of the preferred embodiment of the present invention.
Preferred embodiments.
A method for manufacturing a copper-based PCB (printed Circuit Board) containing a thermoelectric separation copper boss comprises a copper boss 10 manufacturing step, a substrate 20 manufacturing step and a bonding sheet 30 manufacturing step; wherein:
the manufacturing of the copper boss 10 comprises the following steps:
s1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into a required size;
s2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
s3, carrying out ultraviolet irradiation alignment exposure;
s4, DES processing;
s5, soaking, cleaning and drying;
s6, performing browning treatment by using a browning liquid to obtain a needed copper boss 10;
the substrate 20 fabrication includes the following steps:
t1, cutting and cutting the board;
t2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
t3, carrying out ultraviolet irradiation alignment exposure;
t4, DES processing;
t5, soaking, cleaning and drying;
t6, milling grooves;
t7, performing browning treatment by using a browning liquid to obtain a needed substrate 20;
the bonding sheet 30 fabrication includes the following steps:
p1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into the size required by the work;
p2, drilling to obtain a required bonding sheet 30;
the manufacturing method of the copper-based PCB board containing the thermoelectric separation copper boss further comprises the following steps:
q1. pressing the copper boss 10 obtained in S6, the substrate 20 obtained in T7 and the bonding sheet 30 obtained in P2;
q2, grinding the plate;
q3. electroplating a copper layer on the surface by zinc immersion and copper electroplating;
electroplating the outer layer circuit;
q5. drilling a hole;
q6, resistance welding;
q6, character printing;
q7, surface treatment;
q8. solder the component to the substrate 20.
Preferably, the method for manufacturing the copper-based PCB board including the copper boss 10 for thermoelectric separation further includes the steps of:
q9. testing the whole PCB circuit board;
and Q10, bill making and shipment.
Preferably, the step S4 is specifically implemented as the following steps:
s4.1, decomposing the ink which is not irradiated by light by using a developing solution;
s4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and S4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
Preferably, the step T4 is implemented as the following steps:
t4.1, decomposing the ink which is not irradiated by light by using a developing solution;
t4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and T4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
Preferably, in step S6 and step T7, the browning liquid is hydrogen peroxide.
Preferably, the material of the bonding sheet 30 is epoxy resin.
Preferably, in the step Q1, the copper boss 10 is pressed into the groove 21 of the substrate 20.
Preferably, in the step Q3, the thickness of the copper plating layer is not less than 5 μm.
Preferably, in the step Q8, the heating element 40 among the elements is soldered on the copper boss.
The embodiment also discloses a copper-based PCB containing the thermoelectric separation copper boss, which is manufactured by the manufacturing method of the copper-based PCB containing the thermoelectric separation copper boss 10 disclosed by any one of the technical schemes.
According to the preferred embodiment, different from the conventional process, the invention provides a method for manufacturing a copper-based PCB (printed circuit board) with a copper boss for thermoelectric separation, the copper boss 10 is manufactured at the corresponding position of a heating element 40 (a resistor, an electric heating wire and the like) which is pasted on a substrate 10, the heating element is conductive by a pasting method by utilizing the high heat conductivity of copper, the heat generated by the heating element 40 can be quickly conducted to the substrate 20 through the copper boss 10, the thermoelectric separation effect is achieved, the heat dissipation performance of the whole copper substrate is improved, the surface temperature of the heating element 40 is reduced, and therefore the purposes of improving the product performance and prolonging the product service life are achieved.
A second embodiment.
A method for manufacturing a copper-based PCB (printed Circuit Board) containing a thermoelectric separation copper boss comprises a copper boss 10 manufacturing step, a substrate 20 manufacturing step and a bonding sheet 30 manufacturing step; wherein:
the manufacturing of the copper boss 10 comprises the following steps:
s1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into a required size;
s2, pressing a film;
s3, carrying out ultraviolet irradiation alignment exposure;
s4, developing, etching and removing a film;
s5, soaking, cleaning and drying;
s6, performing browning treatment by using a browning liquid to obtain a needed copper boss 10;
the substrate 20 fabrication includes the following steps:
t1, cutting and cutting the board;
t2, pressing the film;
t3, carrying out ultraviolet irradiation alignment exposure;
t4, developing, etching and removing a film;
t5, soaking, cleaning and drying;
t6, milling grooves;
t7, performing browning treatment by using a browning liquid to obtain a needed substrate 20;
the bonding sheet 30 fabrication includes the following steps:
p1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into the size required by the work;
p2, drilling to obtain a required bonding sheet 30;
the manufacturing method of the copper-based PCB board containing the thermoelectric separation copper boss further comprises the following steps:
q1. pressing the copper boss 10 obtained in S6, the substrate 20 obtained in T7 and the bonding sheet 30 obtained in P2;
q2, grinding the plate;
q3. electroplating a copper layer on the surface by zinc immersion and copper electroplating;
electroplating the outer layer circuit;
q5. drilling a hole;
q6, resistance welding;
q6, character printing;
q7, surface treatment;
q8. solder the components to the substrate.
Preferably, the method for manufacturing the copper-based PCB board with the copper bosses for thermoelectric separation further comprises the following steps:
q9. testing the whole PCB circuit board;
and Q10, bill making and shipment.
Preferably, in step S6 and step T7, the browning liquid is hydrogen peroxide.
Preferably, the material of the bonding sheet is epoxy resin.
Preferably, in the step Q1, the copper boss 10 is pressed into the groove 21 of the substrate.
Preferably, in the step Q3, the thickness of the copper plating layer is not less than 5 μm.
Preferably, in the step Q8, the heating element 40 among the elements is soldered on the copper boss 10.
The embodiment also discloses a copper-based PCB containing the thermoelectric separation copper boss, which is manufactured by the manufacturing method of the copper-based PCB containing the thermoelectric separation copper boss disclosed by any one of the technical schemes.
It should be noted that the technical features related to the circuit board process and the like in the patent application of the present invention should be regarded as the prior art, and the specific structure, the operation principle, the control mode and the spatial arrangement mode of the technical features may be selected conventionally in the field, and should not be regarded as the invention point of the patent of the present invention, and the patent of the present invention is not further specifically described in detail.
It will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.
Claims (10)
1. A manufacturing method of a copper-based PCB containing a thermoelectric separation copper boss is characterized in that: the method comprises a copper boss manufacturing step, a substrate manufacturing step and a bonding sheet manufacturing step; wherein:
the manufacturing method of the copper boss comprises the following steps:
s1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into a required size;
s2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
s3, carrying out ultraviolet irradiation alignment exposure;
s4, DES processing;
s5, soaking, cleaning and drying;
s6, carrying out browning treatment by adopting a browning liquid to obtain a required copper boss;
the substrate manufacturing method comprises the following steps:
t1, cutting and cutting the board;
t2, forming the anti-etching ink through a circuit board process, and performing film pressing treatment;
t3, carrying out ultraviolet irradiation alignment exposure;
t4, DES processing;
t5, soaking, cleaning and drying;
t6, milling grooves;
t7, performing browning treatment by using a browning liquid to obtain a required substrate;
the bonding sheet manufacturing method comprises the following steps:
p1, designing the shape of a PCB circuit according to the manufacture, and manufacturing the PCB circuit into the size required by the work;
p2, drilling to obtain a required bonding sheet;
the manufacturing method of the copper-based PCB board containing the thermoelectric separation copper boss further comprises the following steps:
q1. pressing the copper boss obtained in S6, the substrate obtained in T7 and the bonding sheet obtained in P2;
q2, grinding the plate;
q3. electroplating a copper layer on the surface by zinc immersion and copper electroplating;
electroplating the outer layer circuit;
q5. drilling a hole;
q6, resistance welding;
q6, character printing;
q7, surface treatment;
q8. solder the components to the substrate.
2. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: the manufacturing method of the copper-based PCB board containing the thermoelectric separation copper boss further comprises the following steps:
q9. testing the whole PCB circuit board;
and Q10, bill making and shipment.
3. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: the step S4 is specifically implemented as the following steps:
s4.1, decomposing the ink which is not irradiated by light by using a developing solution;
s4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and S4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
4. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: the step T4 is specifically implemented as the following steps:
t4.1, decomposing the ink which is not irradiated by light by using a developing solution;
t4.2, etching the exposed surface copper by using an etching solution to form a wiring circuit pattern;
and T4.3, adopting a stripping solution to bite the etching-resistant ink, so that the circuit is completely exposed.
5. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: in step S6 and step T7, the browning liquid is hydrogen peroxide.
6. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: the bonding sheet is made of epoxy resin.
7. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: in the step Q1, the copper boss is pressed into the groove of the substrate.
8. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: in the step Q3, the thickness of the copper plating layer is not less than 5 μm.
9. The method for manufacturing a copper-based PCB board with thermoelectric separation copper bosses as recited in claim 1, wherein: in the step Q8, the heating element of the elements is soldered on the copper boss.
10. A copper base PCB board that contains thermoelectric separation copper boss, its characterized in that: made according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011029451.XA CN112165762A (en) | 2020-09-27 | 2020-09-27 | Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011029451.XA CN112165762A (en) | 2020-09-27 | 2020-09-27 | Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof |
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| CN112165762A true CN112165762A (en) | 2021-01-01 |
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| CN202011029451.XA Pending CN112165762A (en) | 2020-09-27 | 2020-09-27 | Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459639A (en) * | 1993-09-17 | 1995-10-17 | Fujitsu Limited | Printed circuit board assembly having high heat radiation property |
| US20110163348A1 (en) * | 2008-03-25 | 2011-07-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump |
| CN102202459A (en) * | 2011-05-27 | 2011-09-28 | 乐健线路板（珠海）有限公司 | PCB (printed circuit board) with metal micro radiator |
| US20130020606A1 (en) * | 2011-07-19 | 2013-01-24 | Han Chang | Circuit board with thermo-conductive pillar |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
-
2020
- 2020-09-27 CN CN202011029451.XA patent/CN112165762A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459639A (en) * | 1993-09-17 | 1995-10-17 | Fujitsu Limited | Printed circuit board assembly having high heat radiation property |
| US20110163348A1 (en) * | 2008-03-25 | 2011-07-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump |
| CN102202459A (en) * | 2011-05-27 | 2011-09-28 | 乐健线路板（珠海）有限公司 | PCB (printed circuit board) with metal micro radiator |
| US20130020606A1 (en) * | 2011-07-19 | 2013-01-24 | Han Chang | Circuit board with thermo-conductive pillar |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN108322993A (en) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | A kind of the pcb board part and its processing method of thermoelectricity separation |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 田文超: "《电子封装结构设计》", 30 April 2017, 西安：西安电子科技大学出版社 * |
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Application publication date: 20210101 |
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