CN112163659A - Miniature electronic tag and preparation method thereof - Google Patents
Miniature electronic tag and preparation method thereof Download PDFInfo
- Publication number
- CN112163659A CN112163659A CN202010942699.9A CN202010942699A CN112163659A CN 112163659 A CN112163659 A CN 112163659A CN 202010942699 A CN202010942699 A CN 202010942699A CN 112163659 A CN112163659 A CN 112163659A
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- printed circuit
- circuit board
- layer
- printed
- adjacent
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses a miniature electronic tag and a preparation method of the miniature electronic tag. From this, through setting up multilayer printed circuit board stromatolite, compare with prior art, can realize the high density of printed antenna and pile up in limited space, can increase substantially the wiring length of antenna, also can improve miniature electronic tags's performance and quality to can improve the accommodation space of antenna, and then can guarantee the reading and writing distance between miniature electronic tags and the ware.
Description
Technical Field
The invention relates to the field of electronic tags, in particular to a miniature electronic tag and a preparation method of the miniature electronic tag.
Background
The rfid technology, also called rfid, is a communication technology that can identify a specific target by radio signals and read/write related data without establishing mechanical or optical contact between an identification system and the specific target. The electronic tags are composed of coupling elements and chips, each electronic tag has a unique electronic code, and the high-capacity electronic tags have user writable storage spaces and are attached to objects to mark target objects. The reader is used for reading the equipment of the electronic label information, and can be designed to be handheld or fixed. The antenna is used for transmitting radio frequency signals between the electronic tag and the reader.
The electronic tag and the reader realize the spatial coupling of radio frequency signals through the coupling element, and the energy transfer and the data exchange are realized in the coupling channel according to the time sequence relation. The performance of the antenna, which is an important component of the rfid system, will greatly affect the efficiency and quality of the entire rfid system. The main factors affecting the performance of the antenna include the size, the operating frequency band, the impedance, the gain, and the like of the antenna. In some industrial fields, a smaller electronic tag size is required, new requirements are provided for electronic tag design and development, and the size of an antenna and the size of a tag bring great influence on the application space of a product. For example, the electronic metering seal product adopts the radio frequency identification technology, mainly install on equipment such as intelligent ammeter, batch meter (cabinet), acquisition terminal, mutual-inductor secondary terminal box, be used for measuring equipment in the process of dispatching from the factory, examine and determine, links such as on-the-spot installation maintenance, prevent that unauthorized person from illegally opening electric energy metering device and relevant equipment, be the special mark object that has legal effect, the space that this product can be used for the wiring is the ring shape, internal diameter 8mm, external diameter 10mm, can the wiring space extremely limited, lead to lacking effectual wiring space when the antenna wiring.
In the related art, the antenna arrangement scheme of the existing electronic tag adopts a flexible board or a printed circuit board to realize the antenna function through a printed antenna. The diameter of the miniature electronic tag in the plane is limited, for example: the inner diameter of the wiring space for the annular space is 4mm, and the outer diameter is 6 mm. The overall length of wiring in the plane direction is limited after the wiring distance is considered, so that the antenna performance adjusting space is limited, and the read-write distance between the electronic tag and the reader cannot meet the ideal requirement.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a micro electronic tag, which can realize high-density stacking of printed antennas in a limited space, and can greatly increase the wiring length of the antennas, and also can improve the performance and quality of the micro electronic tag, so that the adjustment space of the antennas can be increased, and the read-write distance between the micro electronic tag and a reader can be ensured.
The invention further provides a preparation method of the miniature electronic tag.
The miniature electronic tag comprises a multilayer printed circuit board, wherein the multilayer printed circuit board adopts a laminated design so that printed antennas arranged on each layer of printed circuit board are stacked, and the adjacent printed circuit boards in the multilayer printed circuit board are connected by adopting solder balls so that the printed antennas on the adjacent printed circuit boards are connected in series through the solder balls.
According to the micro electronic tag, the multilayer printed circuit boards are arranged in a laminated mode, compared with the prior art, the high-density stacking of the printed antennas can be achieved in a limited space, the wiring length of the antennas can be greatly increased, the performance and the quality of the micro electronic tag can be improved, the adjusting space of the antennas can be increased, and the reading and writing distance between the micro electronic tag and a reader can be further guaranteed.
In some examples of the present invention, the multilayer printed circuit board includes two layers, a pad contact and a first connection pad are disposed on a first layer printed circuit board adjacent to a second layer printed circuit board, the pad contact is adapted for flip chip mounting and is connected to a printed antenna disposed on the first layer printed circuit board, the first connection pad is adapted for placing the solder ball and is connected to the printed antenna disposed on the first layer printed circuit board, and a second connection pad is disposed on the second layer printed circuit board adjacent to the first layer printed circuit board and is connected to the printed antenna disposed on the second layer printed circuit board and is used for connecting the solder ball.
In some examples of the invention, the chip is provided with bumps, and the chip and the first printed circuit board are connected by using conductive adhesive.
In some examples of the invention, the thickness of the chip is 120 μm to 150 μm, and the bump height is 15 μm to 22 μm.
In some examples of the invention, the first layer printed circuit board and the second layer printed circuit board are both FR4 copper clad laminates.
In some examples of the invention, the first layer of printed circuit board has a thickness of 0.13mm to 0.15mm and the second layer of printed circuit board has a thickness of 0.20 mm.
In some examples of the present invention, the first printed circuit board is a single-sided board, the second printed circuit board is a double-sided board, the upper surface of the second printed circuit board is etched to form a printed antenna and covered with an insulating layer, and the lower surface of the second printed circuit board is reserved with the second connection pad by electroplating.
In some examples of the present invention, the adjacent printed circuit boards are reinforced by filling an underfill material therebetween.
The preparation method of the miniature electronic tag comprises the following steps: s1, implanting solder balls between the adjacent printed circuit boards; s2, inversely installing the chip at the preset position between the adjacent printed circuit boards, and coating glue for reinforcement; s3, printing solder at the welding position between the adjacent printed circuit boards to form a connecting pad; s4, aligning the printed antenna on each layer of printed circuit board, and performing reflow soldering after aligning; and S5, filling lower filling materials between the adjacent printed circuit boards for reinforcement.
According to the preparation method of the miniature electronic tag, the multiple layers of printed circuit boards can be laminated together, the high-density stacking of the printed antennas can be realized in a limited space, the wiring length of the antennas can be greatly improved, and the performance and the quality of the miniature electronic tag can also be improved, so that the adjusting space of the antennas can be improved, and the reading-writing distance between the miniature electronic tag and a reader can be further ensured.
In some examples of the invention, injection molding is also performed after step S5.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a cross-sectional view of a miniature electronic tag according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a micro electronic tag according to an embodiment of the present invention.
Reference numerals:
a miniature electronic tag 10;
a printed circuit board 1; a first layer of printed circuit board 11; a second layer printed circuit board 12;
a printed antenna 2; a solder ball 3; a pad contact 4; a first connection pad 5; a chip 6; and a second connection pad 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
A miniature electronic tag 10 according to an embodiment of the present invention is described below with reference to fig. 1 and 2.
As shown in fig. 1 and fig. 2, according to the miniature electronic tag 10 of the embodiment of the present invention, the miniature electronic tag 10 includes a multi-layer printed circuit board 1, printed antennas 2 are disposed on the multi-layer printed circuit board 1, the multi-layer printed circuit board 1 adopts a stacked design, such that the printed antennas 2 disposed on each layer of printed circuit board are stacked together, and two adjacent printed circuit boards 1 in the multi-layer printed circuit board 1 are connected by solder balls 3, such that the printed antennas 2 on the adjacent printed circuit boards 1 are connected in series by the solder balls 3, which can also be understood as that the printed antennas 2 on the two adjacent printed circuit boards 1 can be connected in series.
Among them, the wiring length of the printed antenna 2 of the miniature electronic tag 10 has a significant influence on both the frequency and the inductance. Through overlapping multilayer printed circuit board 1 together, when the plane space of wiring is regularly, can realize the high density of printed antenna 2 and pile up in finite space, can increase substantially printed antenna 2's wiring length, make miniature electronic tags 10's frequency, inductance all obtain promoting to can improve miniature electronic tags 10's performance and quality, and then can improve printed antenna 2's regulation space, also can guarantee the reading and writing distance between miniature electronic tags 10 and the ware.
Therefore, through the laminated arrangement of the multilayer printed circuit board 1, compared with the prior art, the high-density stacking of the printed antenna 2 can be realized in a limited space, the wiring length of the antenna can be greatly improved, and the performance and the quality of the micro electronic tag 10 can also be improved, so that the adjusting space of the antenna can be improved, and the reading and writing distance between the micro electronic tag 10 and a reader can be further ensured.
In some examples of the present invention, as shown in fig. 1, the multi-layer printed circuit board 1 may include two layers, the two layers of the printed circuit board 1 are a first layer printed circuit board 11 and a second layer printed circuit board 12, respectively, a pad contact 4 and a first connection pad 5 may be disposed on the first layer printed circuit board 11 adjacent to the second layer printed circuit board 12, the micro electronic tag 10 may include a chip 6, the pad contact 4 is adapted for flip-mounting the chip 6, it is also understood that the chip 6 is flip-mounted on the pad contact 4, and the pad contact 4 is connected to the printed antenna 2 disposed on the first layer printed circuit board 11, the pad contact 4 is connected to the first connection pad 5, thereby achieving conduction between the chip 6 and the printed antenna 2 on the first layer printed circuit board 11, and, by flip-mounting the chip 6 on the pad contact 4, the chip 6 can be disposed between the first layer printed circuit board 11 and the second layer printed circuit board 12, the volume of the micro electronic tag 10 can be reduced, and the height of the micro electronic tag 10 can be reduced at a certain time in the plane space.
Meanwhile, the first connection pad 5 is suitable for placing the solder ball 3, that is, the first connection pad 5 is connected with the solder ball 3, the first connection pad 5 is connected with the printed antenna 2 arranged on the first layer printed circuit board 11, the second connection pad 7 can be arranged on the second layer printed circuit board 12 adjacent to the first layer printed circuit board 11, the second connection pad 7 can be connected with the printed antenna 2 arranged on the second layer printed circuit board 12, and the second connection pad 7 is used for connecting the solder ball 3, that is, the second connection pad 7 is connected with the solder ball 3, so that the printed antenna 2 on the first layer printed circuit board 11 and the printed antenna 2 on the second layer printed circuit board 12 can be connected in series, and the conduction between the first layer printed circuit board 11 and the second layer printed circuit board 12 can be realized.
In some examples of the present invention, as shown in fig. 1, the chip 6 may be provided with bumps, and the chip 6 and the first printed circuit board 11 are connected together by using a conductive adhesive, and optionally, the chip 6 and the pad contacts 4 on the first printed circuit board 11 may be connected by using an anisotropic conductive adhesive, so that the chip 6 can be stably mounted on the first printed circuit board 11, the chip 6 can be prevented from being separated from the first printed circuit board 11, and the operational reliability of the micro electronic tag 10 can be ensured.
In some examples of the present invention, after the bumping of the chip 6, the thickness of the chip 6 may be set to 120 μm to 150 μm, and the bump height may be set to 15 μm to 22 μm, so that the overall height of the chip 6 may be 130 μm to 170 μm.
In some examples of the present invention, both the first printed circuit board 11 and the second printed circuit board 12 may be FR4 copper clad laminates (i.e. glass fiber epoxy resin copper clad laminates), and the FR4 copper clad laminates are cheap, so that the manufacturing cost of the first printed circuit board 11 and the second printed circuit board 12 can be reduced, the production cost of the micro electronic tag 10 can be reduced, and the market competitiveness of the micro electronic tag 10 can be improved.
In some examples of the present invention, the thickness of the first layer printed circuit board 11 may be set to 0.13mm to 0.15mm, and the thickness of the second layer printed circuit board 12 may be set to 0.20mm, so that the thicknesses of the first layer printed circuit board 11 and the second layer printed circuit board 12 are suitable, and the height of the micro electronic tag 10 may be controlled to be between 0.45mm to 0.50mm, so that the size of the micro electronic tag 10 may be reduced.
In some examples of the present invention, the first printed circuit board 11 may be a single-sided board, that is, the components are disposed on one surface of the first printed circuit board 11, the first printed circuit board 11 is subjected to the wiring of the printed antenna 2 by an etching process, and the surface of the first printed circuit board 11 on which the components are disposed is subjected to a plating process. The second printed circuit board 12 may be a double-sided board, i.e., components are disposed on both surfaces of the first printed circuit board 11, the upper surface of the second printed circuit board 12 is etched with the printed antenna 2, and the upper surface of the second layer of printed circuit board 12 is covered with an insulating layer, the lower surface of the second layer of printed circuit board 12 is provided with the printed antenna 2 and is reserved with a second connecting pad 7 through electroplating, the upper surface and the lower surface of the second layer of printed circuit board 12 are conducted through a via hole, the printed antenna 2 on the upper surface of the second printed circuit board 12 and the printed antenna 2 on the lower surface of the second printed circuit board 12 may be connected together by a reflow soldering process using a printed solder, and the solder joint height after reflow is about 180um, or the printed antenna 2 on the upper surface of the second printed circuit board 12 and the printed antenna 2 on the lower surface of the second printed circuit board 12 may be connected by manual soldering.
In some examples of the present invention, the adjacent printed circuit boards 1 are filled with a filler for reinforcement, so as to improve the connection strength between the adjacent printed circuit boards 1 and protect the chip 6, thereby making the micro electronic tag 10 meet the processing requirements of the injection molding process.
After the micro electronic tag 10 is mounted, an independent electronic tag module is formed by mechanical separation, and the high-strength micro electronic tag 10 is formed by an injection molding process, wherein the injection molding material may be ABS plastic (Acrylonitrile Butadiene Styrene plastic), PVC (Polyvinyl chloride-Polyvinyl chloride material), or the like. Compared with the prior art, the size of the miniature electronic tag 10 is greatly reduced, the miniature electronic tag 10 is processed through an injection molding process, the miniature electronic tag 10 has the characteristics of water resistance, high temperature resistance and the like, the printed circuit board 1 and the chip 6 can be protected, the miniature electronic tag 10 can be pasted on different terminal products, and the miniature electronic tag 10 can be widely applied.
As shown in fig. 2, according to the method for manufacturing the micro electronic tag 10 of the embodiment of the present invention, the micro electronic tag 10 is the micro electronic tag 10 of the embodiment, and the method includes the following steps:
s1, solder balls 3 are implanted between adjacent printed circuit boards 1, so that the printed antennas 2 on the adjacent printed circuit boards 1 are connected in series through the solder balls 3, thereby achieving conduction between the adjacent printed circuit boards 1.
And S2, inversely installing the chip 6 at a preset position between the adjacent printed circuit boards 1, and coating glue for reinforcement, wherein one of the two adjacent printed circuit boards 1 is provided with a pad contact 4, the chip 6 is inversely installed at the pad contact 4, and the chip 6 is connected with the first layer printed circuit board 11 by adopting conductive glue. The arrangement can stably install the chip 6 on the first layer printed circuit board 11, and can avoid the separation of the chip 6 from the first layer printed circuit board 11, thereby ensuring the working reliability of the micro electronic tag 10
S3, solder is printed at the soldering position between the adjacent printed circuit boards 1 to form connection pads, and the solder balls 3 are connected to the connection pads on the adjacent two printed circuit boards 1.
And S4, aligning the printed antenna 2 on each layer of the printed circuit board 1, and performing reflow soldering after aligning.
And S5, filling the filler between the adjacent printed circuit boards 1 for reinforcement, so that the connection strength between the adjacent printed circuit boards 1 can be improved, and the chip 6 can be protected.
When the preparation method is adopted to produce the miniature electronic tag 10, the multilayer printed circuit board 1 can be arranged in a laminated mode, compared with the prior art, the high-density stacking of the printed antenna 2 can be achieved in a limited space, the wiring length of the antenna can be greatly improved, the performance and the quality of the miniature electronic tag 10 can also be improved, the adjusting space of the antenna can be improved, and the reading-writing distance between the miniature electronic tag 10 and a reader can be further guaranteed.
Further, after step S5, injection molding is performed, and the injection molding material may be selected from ABS plastic, PVC, etc. The micro electronic tag 10 is processed by an injection molding process, so that the micro electronic tag 10 has the characteristics of water resistance, high temperature resistance and the like, can protect the printed circuit board 1 and the chip 6, and can be adhered to different terminal products, thereby realizing the wide application of the micro electronic tag 10.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A miniature electronic tag is characterized by comprising a plurality of layers of printed circuit boards, wherein the plurality of layers of printed circuit boards are in a laminated design so that printed antennas arranged on each layer of printed circuit board are stacked, and the adjacent printed circuit boards in the plurality of layers of printed circuit boards are connected through welding balls so that the printed antennas on the adjacent printed circuit boards are connected in series through the welding balls.
2. The microelectronic tag of claim 1, wherein said multilayer printed circuit board comprises two layers, a first layer of printed circuit board adjacent to a second layer of printed circuit board having a pad contact and a first connection pad, said pad contact adapted for flip chip mounting and being connected to a printed antenna disposed on said first layer of printed circuit board, said first connection pad adapted for placement of said solder ball and being connected to a printed antenna disposed on said first layer of printed circuit board, a second layer of printed circuit board adjacent to said first layer of printed circuit board having a second connection pad disposed thereon, said second connection pad being connected to a printed antenna disposed on said second layer of printed circuit board and being adapted for connection to said solder ball.
3. The microelectronic tag according to claim 2, wherein said chip is provided with bumps, and said chip is connected to said first printed circuit board by using a conductive adhesive.
4. The microelectronic tag according to claim 3, wherein the thickness of said chip is 120 μm-150 μm, and the height of the bump is 15 μm-22 μm.
5. The miniature electronic tag according to claim 2, wherein said first printed circuit board and said second printed circuit board are both FR4 copper clad laminates.
6. The microelectronic tag of claim 5, wherein said first layer of printed circuit board has a thickness of 0.13mm to 0.15mm and said second layer of printed circuit board has a thickness of 0.20 mm.
7. The microelectronic tag according to claim 2, wherein said first printed circuit board is a single-sided board, said second printed circuit board is a double-sided board, said upper surface of said second printed circuit board is etched with a printed antenna and covered with an insulating layer, and said second connection pads are reserved on the lower surface of said second printed circuit board by electroplating.
8. The microelectronic tag according to any of claims 1 to 7, wherein an underfill material is filled between adjacent printed circuit boards for reinforcement.
9. A method for preparing a miniature electronic label according to any one of claims 1 to 8, comprising the steps of:
s1, implanting solder balls between the adjacent printed circuit boards;
s2, inversely installing the chip at the preset position between the adjacent printed circuit boards, and coating glue for reinforcement;
s3, printing solder at the welding position between the adjacent printed circuit boards to form a connecting pad;
s4, aligning the printed antenna on each layer of printed circuit board, and performing reflow soldering after aligning;
and S5, filling lower filling materials between the adjacent printed circuit boards for reinforcement.
10. The method for preparing a microelectronic tag according to claim 9, wherein injection molding is further performed after step S5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010942699.9A CN112163659A (en) | 2020-09-09 | 2020-09-09 | Miniature electronic tag and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010942699.9A CN112163659A (en) | 2020-09-09 | 2020-09-09 | Miniature electronic tag and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112163659A true CN112163659A (en) | 2021-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010942699.9A Pending CN112163659A (en) | 2020-09-09 | 2020-09-09 | Miniature electronic tag and preparation method thereof |
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| CN (1) | CN112163659A (en) |
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|---|---|---|---|---|
| WO2000016279A1 (en) * | 1998-09-11 | 2000-03-23 | Motorola Inc. | Radio frequency identification tag circuit chip having printed interconnection pads |
| JP2007066989A (en) * | 2005-08-29 | 2007-03-15 | Hitachi Ltd | Printed circuit board with rfid tag |
| US20090145971A1 (en) * | 2007-12-07 | 2009-06-11 | Wen Cheng Yin | Printed wireless rf identification label structure |
| CN102014573A (en) * | 2009-09-04 | 2011-04-13 | 上海中京电子标签集成技术有限公司 | Printed circuit board with radio frequency identification and production method thereof |
| CN202395152U (en) * | 2011-12-29 | 2012-08-22 | 北京握奇数据***有限公司 | Antenna, electronic tag and electronic tag reader |
| US20160275391A1 (en) * | 2014-12-10 | 2016-09-22 | Texas Instruments Deutschland Gmbh | Miniature rfid tag with coil on ic package |
| CN107112285A (en) * | 2014-12-17 | 2017-08-29 | 微软技术许可有限责任公司 | The heat management of electronic building brick |
| CN107548232A (en) * | 2017-09-29 | 2018-01-05 | 北京微度芯创科技有限责任公司 | The integration packaging part of millimetre-wave radar chip and antenna |
| CN107872923A (en) * | 2016-09-24 | 2018-04-03 | 苹果公司 | Stacked printed circuit boards encapsulate |
| CN213934947U (en) * | 2020-09-09 | 2021-08-10 | 北京智芯微电子科技有限公司 | Miniature electronic label |
-
2020
- 2020-09-09 CN CN202010942699.9A patent/CN112163659A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000016279A1 (en) * | 1998-09-11 | 2000-03-23 | Motorola Inc. | Radio frequency identification tag circuit chip having printed interconnection pads |
| JP2007066989A (en) * | 2005-08-29 | 2007-03-15 | Hitachi Ltd | Printed circuit board with rfid tag |
| US20090145971A1 (en) * | 2007-12-07 | 2009-06-11 | Wen Cheng Yin | Printed wireless rf identification label structure |
| CN102014573A (en) * | 2009-09-04 | 2011-04-13 | 上海中京电子标签集成技术有限公司 | Printed circuit board with radio frequency identification and production method thereof |
| CN202395152U (en) * | 2011-12-29 | 2012-08-22 | 北京握奇数据***有限公司 | Antenna, electronic tag and electronic tag reader |
| US20160275391A1 (en) * | 2014-12-10 | 2016-09-22 | Texas Instruments Deutschland Gmbh | Miniature rfid tag with coil on ic package |
| CN107112285A (en) * | 2014-12-17 | 2017-08-29 | 微软技术许可有限责任公司 | The heat management of electronic building brick |
| CN107872923A (en) * | 2016-09-24 | 2018-04-03 | 苹果公司 | Stacked printed circuit boards encapsulate |
| CN107548232A (en) * | 2017-09-29 | 2018-01-05 | 北京微度芯创科技有限责任公司 | The integration packaging part of millimetre-wave radar chip and antenna |
| CN213934947U (en) * | 2020-09-09 | 2021-08-10 | 北京智芯微电子科技有限公司 | Miniature electronic label |
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