CN112153864A - Heat radiator for computer network equipment uses - Google Patents

Heat radiator for computer network equipment uses Download PDF

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Publication number
CN112153864A
CN112153864A CN202010984670.7A CN202010984670A CN112153864A CN 112153864 A CN112153864 A CN 112153864A CN 202010984670 A CN202010984670 A CN 202010984670A CN 112153864 A CN112153864 A CN 112153864A
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CN
China
Prior art keywords
heat
heat conducting
fixing
heat dissipation
network equipment
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Pending
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CN202010984670.7A
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Chinese (zh)
Inventor
陆易
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Individual
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Individual
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Priority to CN202010984670.7A priority Critical patent/CN112153864A/en
Priority to PCT/CN2020/127291 priority patent/WO2022057058A1/en
Publication of CN112153864A publication Critical patent/CN112153864A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat dissipation device for computer network equipment, which is mounted on a main frame together with an exchanger and used for dissipating heat generated by the exchanger, wherein the heat dissipation device for the computer network equipment comprises a heat conduction mechanism and a heat dissipation mechanism; the heat conducting mechanism comprises a heat conducting block and a fixing plate, the fixing plate is installed on the heat conducting block, the heat conducting block is hollow and arranged towards openings on two sides, the heat conducting block is fixedly connected with the fixing plate, and the heat conducting block is installed on the main frame through the fixing plate, is attached to the switch and is used for guiding heat generated by the switch to the fixing plate; the heat dissipation mechanism is installed at an opening at one side of the heat conduction block and used for dissipating heat guided to the fixing plate from an opening at the other side of the heat conduction block. Generally speaking, this heat abstractor for computer network equipment can realize when the switch dispels the heat, reduces the condition of switch deposition.

Description

Heat radiator for computer network equipment uses
Technical Field
The invention relates to the field of network equipment, in particular to a heat dissipation device for computer network equipment.
Background
The switch is a network device for forwarding electrical (optical) signals, which can provide an exclusive electrical signal path for any two network nodes accessing the switch, the most common switch is an ethernet switch, and other common switches are a telephone voice switch, an optical fiber switch, etc., most enterprises will purchase a large number of switches to form an intranet to ensure data security at present, the switches will be divided into a plurality of groups to be placed in a cabinet, because the switches will generate large heat during operation, the existing cabinet generally adopts to increase the placement distance between the switches and the switch, so that the heat can be better dispersed into the air, but this makes the number of the cabinets accommodating the switches smaller, and for this reason, a plurality of cabinets are also required to be added to place other switches, so that the space utilization efficiency of the machine room is low, and because there is certain space between the switch and the switchboard, this easily causes the dust phenomenon.
Disclosure of Invention
Technical problem to be solved
In order to solve the above problems, the present invention provides a heat dissipation device for computer network equipment.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a heat dissipating double-fuselage for computer network equipment, install on main frame with the exchanger, and is used for dispelling the heat that the exchanger produces, the heat dissipating double-fuselage for computer network equipment includes heat conducting mechanism and heat-dissipating organization; the heat conducting mechanism comprises a heat conducting block and a fixing plate, the fixing plate is installed on the heat conducting block, the heat conducting block is hollow and arranged towards openings on two sides, the heat conducting block is fixedly connected with the fixing plate, and the heat conducting block is installed on the main frame through the fixing plate, is attached to the switch and is used for guiding heat generated by the switch to the fixing plate; the heat dissipation mechanism is installed at an opening at one side of the heat conduction block and used for dissipating heat guided to the fixing plate from an opening at the other side of the heat conduction block.
Preferably, the heat conduction piece includes last heat-conducting plate and lower heat-conducting plate, goes up the heat-conducting plate and can dismantle the connection each other with lower heat-conducting plate, goes up the heat-conducting plate and all is equipped with a plurality of fin with lower heat-conducting plate one side in opposite directions, and the fixed plate is equipped with two to fix respectively on the both sides of last heat-conducting plate and lower heat-conducting plate.
Preferably, the upper heat-conducting plate and the lower heat-conducting plate are both provided with heat dissipation holes.
Preferably, heat dissipation mechanism includes the main casing body, fixed subassembly and a plurality of heat dissipation fans, and the main casing body is inside to be equipped with one side open-ended cavity, and fixed subassembly installs on the main casing body for fix the opening part at heat conduction block with main casing body open-ended one side, and a plurality of heat dissipation fans are installed respectively in the main casing body, and the opening part towards the main casing body of blowing of heat dissipation fan, and the position that the main casing body corresponds a plurality of heat dissipation fans is equipped with a plurality of induced air holes.
Preferably, the fixing assembly comprises an auxiliary shell with an inner cavity, and a fixing rod and an elastic piece which are both installed in the auxiliary shell, a fixing hole is formed in the fixing plate, a through hole communicated with the inner part is formed in one side of the auxiliary shell, the fixing rod is installed in the auxiliary shell in a sliding mode, the first end of the fixing rod extends out of the through hole and is clamped with the fixing hole, one end of the elastic piece is connected with the inner wall of the auxiliary shell, and the other end of the elastic piece is connected.
Preferably, the auxiliary housing is further provided with a guide hole, and the second end of the fixing rod is provided with a push-pull member extending from the guide hole.
Preferably, the heat dissipation mechanism further comprises a shock absorber, and the shock absorber is arranged on the edge of the opening of the main shell and does not close the opening of the main shell.
(III) advantageous effects
The invention provides a heat dissipation device for computer network equipment, which is mounted on a main frame together with an exchanger and used for dissipating heat generated by the exchanger, wherein the heat dissipation device for the computer network equipment comprises a heat conduction mechanism and a heat dissipation mechanism; the heat conducting mechanism comprises a heat conducting block and a fixing plate, the fixing plate is installed on the heat conducting block, the heat conducting block is hollow and arranged towards openings on two sides, the heat conducting block is fixedly connected with the fixing plate, and the heat conducting block is installed on the main frame through the fixing plate, is attached to the switch and is used for guiding heat generated by the switch to the fixing plate; the heat dissipation mechanism is installed at an opening at one side of the heat conduction block and used for dissipating heat guided to the fixing plate from an opening at the other side of the heat conduction block. Generally speaking, this heat abstractor for computer network equipment can realize when the switch dispels the heat, reduces the condition of switch deposition.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:
FIG. 1 shows a first schematic structural diagram of an embodiment of the present invention;
FIG. 2 shows a second schematic structural diagram of an embodiment of the present invention;
FIG. 3 is a schematic diagram showing the manner in which the switch and heat sink of FIG. 1 are stacked;
FIG. 4 shows an exploded view of the first heat conducting mechanism of FIG. 3;
FIG. 5 shows an exploded view of the second thermal conduction mechanism of FIG. 3;
FIG. 6 shows a first schematic structural diagram of the heat-dissipating mechanism in FIG. 3;
FIG. 7 shows a second schematic structural view of the heat removal mechanism of FIG. 3;
FIG. 8 shows an exploded view of the heat removal mechanism of FIG. 7;
fig. 9 shows a partially enlarged view of a portion a in fig. 8.
In the figure: 1 exchanger, 2 main frames, 3 heat conduction mechanisms, 31 heat conduction blocks, 311 upper heat conduction plates, 312 lower heat conduction plates, 313 heat dissipation fins, 314 heat dissipation holes, 32 fixing plates, 321 fixing holes, 4 heat dissipation mechanisms, 41 main shells, 411 air guide holes, 42 fixing components, 421 auxiliary shells, 421a through holes, 421b guide holes, 422 fixing rods, 422a push-pull parts, 423 elastic parts, 43 heat dissipation fans and 44 shock absorbing parts.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 9, a heat sink for computer network equipment, which is installed on a main frame 2 together with an exchange 1 and is used for dissipating heat generated by the exchange 1, includes a heat conducting mechanism 3 and a heat dissipating mechanism 4; the heat conducting mechanism 3 comprises a heat conducting block 31 and a fixing plate 32, the fixing plate 32 is installed on the heat conducting block 31, the heat conducting block 31 is hollow and is arranged towards openings on two sides, the heat conducting block 31 is fixedly connected with the fixing plate 32, the heat conducting block 31 is installed on the main frame 2 through the fixing plate 32 and is attached to the switch 1, and the heat conducting block is used for guiding heat generated by the switch 1 to the fixing plate 32; the heat dissipating mechanism 4 is installed at an opening of one side of the heat conducting block 31, and serves to dissipate heat guided to the fixing plate 32 from an opening of the other side of the heat conducting block 31.
Specifically, main frame 2 is specifically the frame of placing the inside rack of switch 1, and on main frame 2, a plurality of switches 1 and a plurality of this heat abstractor are fixed to main frame 2 in proper order according to the mode of piling up. As shown in fig. 1, the upper surface and the lower surface of each switch 1 are attached to the heat conducting block 31 of the heat dissipating device, wherein the heat conducting block 31 can be made of copper, aluminum or copper-aluminum matched material, because the enterprise-level switch 1 has a large volume, the heat conducting block 31 needs to contact with the upper surface and the lower surface of the switch 1 to the maximum extent to have a better heat conducting effect, the corresponding volume of the heat conducting block 31 needs to be close to that of the switch 1, and the heat dissipating device needs to be assembled on a cabinet by operation and maintenance personnel, so the weight cannot be too large, so from the aspects of material cost and density quality, the aluminum material is more economical and practical than the copper material, while the heat conducting block 31 adopting copper-aluminum matched can mutually utilize the advantages of the two materials, but it needs to spend time cost on the manufacturing difficulty and design of the processing technology, the heat conduction block 31 in this embodiment is made of pure aluminum. Most of heat generated by the switch 1 in the operation process is guided out by the two heat-conducting blocks 31 contacting the upper surface and the lower surface of the switch 1, the shape of the heat-conducting blocks 31 is similar to a hollow square column, so that the contact surface area of the heat-conducting blocks 31 and air is increased, the heat-radiating efficiency is improved, meanwhile, the heat-radiating mechanism 4 is arranged at an opening at one side of the heat-conducting blocks 31, the heat-radiating mechanism 4 can continuously discharge the heat guided by the heat-conducting blocks 31 from an opening at the other side of the heat-conducting blocks 31, the side of the switch 1 provided with a net opening is the same side as the opening of the heat-conducting blocks 31 provided with the heat-radiating mechanism 4, as a plurality of net wires need to be inserted at one side of the switch 1 provided with the net openings, if the net wires are concentrated at the position where the heat is discharged, the net wires are easy to be damaged and accumulated, thereby causing the use failure, affecting the, the accommodating capacity of the cabinet for the switch 1 is increased by the stacking mode of the switch 1 and the heat dissipation devices, wherein the switch 1 is clamped between the two heat dissipation devices, so that dust is not easy to fall onto the switch 1, and the dust accumulation is avoided.
Based on the scheme, the specific implementation steps are as follows:
pass through right angle connector and screw fixation with switch 1 on main frame 2, pass through fixed plate 32 and screw fixation with heat conduction piece 31 on main frame 2 again, when fixed, guarantee that heat conduction piece 31 and switch 1 laminate each other, on the basis of above-mentioned installation, the installation of all the other a plurality of switches 1 and a plurality of heat conduction piece 31 is the same, wherein need notice, every switch 1 all need have two heat conduction pieces 31 to laminate on two upper and lower surfaces, switch 1 is after heat conduction piece 31 installation is accomplished, install the opening part of corresponding heat conduction piece 31 respectively with a plurality of heat dissipation mechanisms 4 again, the heat of producing when switch 1 operates can be absorbed by two upper and lower heat conduction pieces 31 drainage, and under the heat dissipation of heat dissipation mechanism 4, the heat that will be detained in heat conduction piece 31 is discharged from the opening part of heat conduction piece 31.
Further, the heat conducting block 31 includes an upper heat conducting plate 311 and a lower heat conducting plate 312, the upper heat conducting plate 311 and the lower heat conducting plate 312 are detachably connected to each other, a plurality of heat dissipating fins 313 are disposed on opposite sides of the upper heat conducting plate 311 and the lower heat conducting plate 312, two fixing plates 32 are disposed and fixed on both sides of the upper heat conducting plate 311 and the lower heat conducting plate 312, and heat dissipating holes 314 are disposed on the upper heat conducting plate 311 and the lower heat conducting plate 312.
Referring to fig. 4 and 5, fasteners capable of being nested and connected with each other are disposed on both sides of the upper heat-conducting plate 311 and the lower heat-conducting plate 312, and both fasteners are formed by bending through a sheet metal process, and in order to increase the surface area of contact with air, the heat-dissipating fins 313 on the upper heat-conducting plate 311 and the lower heat-conducting plate 312 are staggered with each other when the upper heat-conducting plate 311 and the lower heat-conducting plate 312 are nested and connected with each other, so that heat conducted between the heat-dissipating fins 313 cannot interfere with each other to affect heat-dissipating efficiency, and the staggering of the heat-dissipating fins 313 facilitates heat exchange when the heat-dissipating fins are in contact with air.
Further, the heat dissipation mechanism 4 includes a main housing 41, a fixing component 42 and a plurality of heat dissipation fans 43, a cavity with an opening on one side is provided inside the main housing 41, the fixing component 42 is installed on the main housing 41 and is used for fixing the opening of the main housing 41 at the opening of the heat conduction block 31, the plurality of heat dissipation fans 43 are respectively installed inside the main housing 41, and the air blowing direction of the heat dissipation fans 43 is towards the opening of the main housing 41, and a plurality of air guiding holes 411 are provided at positions of the main housing 41 corresponding to the plurality of heat dissipation fans 43.
Referring to fig. 8, a plurality of mounting slots for mounting a heat dissipating fan 43 are provided in a main housing 41, the structure of the mounting slots is similar to that of a heat dissipating fan mounted on a server in the market, and details are not repeated here, the main housing 41 is fixed at an opening of a heat conducting block 31 through a fixing component 42, wherein when the main housing 41 is fixed, it is necessary to ensure that one side of the opening of the main housing 41 is attached and fixed to the opening of the heat conducting block 31, so as to ensure that the heat dissipating fan 43 effectively guides wind into the heat conducting block 31, and heat guided to a heat dissipating fin 313 is replaced into air and discharged from an opening at the other side of the heat conducting block 31, when the switch 1 and the heat conducting block 31 are attached and mounted, it is difficult for them to reach a completely attached state, and both form a gap that is not raised, which affects heat conduction of the switch 1, unless a CPU is tightly attached to, however, a large amount of materials similar to silicone grease are needed, the cost is high, and the silicone grease needs to be cleaned when the heat dissipation device is disassembled for ash removal subsequently, and the silicone grease needs to be replenished again when the heat dissipation device is installed back, which is time-consuming, labor-consuming and capital-consuming, so that the upper heat conduction plate 311 and the lower heat conduction plate 312 on the heat dissipation device are both provided with a plurality of heat dissipation holes 314, the heat-dissipating wind driven by the heat-dissipating fan 43 can enter the heat conduction block 31, and the heat-dissipating wind, except for performing heat replacement with the heat conduction block 31 and the heat dissipation fins 313, also goes out from the heat dissipation holes 314 to contact with the upper surface and the lower surface of the switch 1, and performs heat replacement, so as to improve the heat dissipation effect of the heat dissipation device for the computer network equipment.
Further, the fixing assembly 42 includes a sub-housing 421 having an inner cavity, and a fixing rod 422 and an elastic member 423 both installed in the sub-housing 421, the fixing plate 32 is provided with a fixing hole 321, one side of the sub-housing 421 is provided with a through hole 421a communicating with the inside, the fixing rod 422 is installed in the sub-housing 421 slidably, a first end of the fixing rod 422 extends out of the through hole 421a and is clamped with the fixing hole 321, one end of the elastic member 423 is connected with an inner wall of the sub-housing 421, and the other end is connected with the fixing rod 422.
The sub-housing 421 further has a guiding hole 421b, the second end of the fixing rod 422 is provided with a push-pull member 422a, and the push-pull member 422a extends from the guiding hole 421 b.
Specifically, two sets of fixing assemblies 42 are provided, and are respectively and symmetrically installed on two sides of the main housing 41, when the heat driving mechanism 4 is installed on the heat conducting mechanism 3, the first end of the fixing rod 422 is located at the position extending out of the through hole 421a and is placed outside under the action of the elastic member 423, when a user fixes the heat driving mechanism 4 on the heat conducting mechanism 3, the user needs to drive the push-pull member 422a to move along the length direction of the guide hole 421b through an external force, so that the first end of the fixing rod 422 retracts into the sub-housing 421 from the through hole 421a, when the opening of the main housing 41 is attached to the opening of the heat conducting block 31, the position of the through hole 421a is flush with the position of the fixing hole 321, at this time, the push-pull member 422a can be released, the first end of the fixing rod 422 can extend out of the through hole 422a again under the action of the elastic member 423 and is clamped with the fixing hole 321 on the fixing plate 32, so as, when the user needs to disassemble the heat dissipation mechanism 4 and the heat conduction mechanism 3, the operation process can be adopted.
Further, the heat-dissipating mechanism 4 further includes a shock absorbing member 44, and the shock absorbing member 44 is disposed on the edge of the opening of the main casing 41 and does not close the opening of the main casing 41.
Specifically, because driving hot fan 43 when the operation, can take place the vibrations of certain frequency, and the great noise just can be brought in the simultaneous operation of the driving hot fan 43 of a large amount, and vibrations in this even probably bring the damage on the hardware for switch 1, consequently at the opening part hand bradyseism piece 44 of main casing 41, specifically be the EVA material, it has antistatic, inhales sound and bradyseism effect, can effectually slow down vibrations and the noise that driving hot fan 43 brought.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, means, and/or combinations thereof, unless the context clearly indicates otherwise.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a heat abstractor that computer network equipment used, all installs on main frame (2) with switch (1) for dispel the heat that switch (1) produced, its characterized in that includes: a heat conducting mechanism (3) and a heat driving mechanism (4);
the heat conducting mechanism (3) comprises a heat conducting block (31) and a fixing plate (32), the fixing plate (32) is installed on the heat conducting block (31), the heat conducting block (31) is hollow and is arranged towards openings on two sides, the heat conducting block (31) is fixedly connected with the fixing plate (32), and the heat conducting block (31) is installed on the main frame (2) through the fixing plate (32), is attached to the switch (1) and is used for guiding heat generated by the switch (1) to the fixing plate (32);
the heat dissipation mechanism (4) is arranged at an opening at one side of the heat conduction block (31) and is used for dissipating heat guided to the fixing plate (32) from an opening at the other side of the heat conduction block (31).
2. The heat dissipating device for computer network equipment according to claim 1, wherein the heat conducting block (31) comprises an upper heat conducting plate (311) and a lower heat conducting plate (312), the upper heat conducting plate (311) and the lower heat conducting plate (312) are detachably connected to each other, a plurality of heat dissipating fins (313) are provided on each of the opposite sides of the upper heat conducting plate (311) and the lower heat conducting plate (312), and two fixing plates (32) are provided and fixed on both sides of the upper heat conducting plate (311) and the lower heat conducting plate (312), respectively.
3. The heat dissipating device for computer network equipment according to claim 1, wherein the upper heat conducting plate (311) and the lower heat conducting plate (312) are provided with heat dissipating holes (314).
4. The heat dissipation device for computer network equipment according to claim 1, wherein the heat dissipation mechanism (4) comprises a main housing (41), a fixing component (42) and a plurality of heat dissipation fans (43), a cavity with an opening at one side is formed inside the main housing (41), the fixing component (42) is installed on the main housing (41) and is used for fixing the open side of the main housing (41) at the opening of the heat conduction block (31), the plurality of heat dissipation fans (43) are installed in the main housing (41) respectively, the blowing direction of the heat dissipation fans (43) faces the opening of the main housing (41), and a plurality of air guiding holes (411) are formed in the position of the main housing (41) corresponding to the plurality of heat dissipation fans (43).
5. The heat dissipation device for computer network equipment as claimed in claim 4, wherein the fixing assembly (42) includes a sub-housing (421) having an internal cavity, and a fixing rod (422) and an elastic member (423) both installed in the sub-housing (421), the fixing plate (32) is provided with a fixing hole (321), one side of the sub-housing (421) is provided with a through hole (421a) communicated with the inside, the fixing rod (422) is slidably installed in the sub-housing (421), a first end of the fixing rod (422) extends out of the through hole (421a) and is connected with the fixing hole (321) in a clamping manner, one end of the elastic member (423) is connected with the inner wall of the sub-housing (421), and the other end of the elastic member is connected with the fixing rod (422).
6. The heat dissipation device for computer network equipment as claimed in claim 5, wherein the sub-housing (421) further has a guiding hole (421b), the second end of the fixing rod (422) has a push-pull member (422a), and the push-pull member (422a) protrudes from the guiding hole (421 b).
7. The heat dissipation device for computer network equipment according to claim 4, wherein the heat dissipation mechanism (4) further comprises a shock absorber (44), and the shock absorber (44) is disposed on the edge of the opening of the main housing (41) and does not close the opening of the main housing (41).
CN202010984670.7A 2020-09-18 2020-09-18 Heat radiator for computer network equipment uses Pending CN112153864A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010984670.7A CN112153864A (en) 2020-09-18 2020-09-18 Heat radiator for computer network equipment uses
PCT/CN2020/127291 WO2022057058A1 (en) 2020-09-18 2020-11-06 Heat dissipation apparatus for computer network device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010984670.7A CN112153864A (en) 2020-09-18 2020-09-18 Heat radiator for computer network equipment uses

Publications (1)

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CN112153864A true CN112153864A (en) 2020-12-29

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CN (1) CN112153864A (en)
WO (1) WO2022057058A1 (en)

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