CN112151430A - Transmission chamber and annealing equipment in semiconductor equipment - Google Patents

Transmission chamber and annealing equipment in semiconductor equipment Download PDF

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Publication number
CN112151430A
CN112151430A CN202010954506.1A CN202010954506A CN112151430A CN 112151430 A CN112151430 A CN 112151430A CN 202010954506 A CN202010954506 A CN 202010954506A CN 112151430 A CN112151430 A CN 112151430A
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chamber
sub
movable
hole
holes
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CN202010954506.1A
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CN112151430B (en
Inventor
王磊
赵磊
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a transmission chamber and annealing equipment in semiconductor equipment, wherein the transmission chamber comprises: the device comprises at least one chamber body, a plurality of vacuum chambers and a plurality of vacuum pipes, wherein each chamber body comprises at least two sub-chambers which are isolated from each other, and each sub-chamber is provided with a vent hole communicated with the outside of the chamber body; the mounting block is arranged on the outer wall of the cavity body, and the mounting block is provided with air exhaust channels which correspond to the vent holes one by one; and the switching component can selectively block or communicate any air suction channel. The invention has the advantages that the structure of the transmission chamber and the vacuumizing pipeline is compact, the maintenance space of the equipment is improved, and on the other hand, each sub-chamber can be independently vacuumized, so that the problem of cross contamination among the sub-chambers can be avoided.

Description

Transmission chamber and annealing equipment in semiconductor equipment
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a transfer chamber and annealing equipment in the semiconductor equipment.
Background
With the development of the semiconductor silicon wafer industry, the demand of semiconductor equipment is increasing, and the transmission platform as an important component of the semiconductor equipment has a great influence on the transmission efficiency, the equipment space and the like of the semiconductor. The structure of the transmission platform is divided into two parts: the vacuum transmission chamber is connected with the process chamber, so that the silicon wafer is transmitted in vacuum, and the content of oxygen, nitrogen, water vapor and other gas impurities on the surface of the silicon wafer can be reduced; the atmospheric transmission chamber respectively realizes the gas pressure balance with the vacuum side and the atmospheric side by continuously changing the air pressure in the chamber, and realizes the mutual transmission of the silicon wafers at the atmospheric side and the vacuum side.
The silicon wafer is transmitted in the annealing equipment in a duplex silicon wafer transmission mode, the atmospheric transmission chamber comprises a left transmission chamber and a right transmission chamber, and each transmission chamber is divided into an upper layer and a lower layer. Each layer of transmission chamber is connected with a vacuum-pumping system, and the total number of the vacuum-pumping systems is four. The design mode makes the pipeline design of the annealing equipment complex and the maintenance space small. In the improved design scheme, two lower-layer cavities of the left transmission cavity and the right transmission cavity are connected with one set of air pumping system, and two upper-layer cavities of the left transmission cavity and the right transmission cavity are connected with one set of air pumping system, so that the improved mode saves space, but the two cavities connected with one set of air pumping system are simultaneously vacuumized, and can not be vacuumized independently, and if one cavity is polluted by particles, oil stains and gas, the other cavity can be polluted.
Therefore, how to simplify the platform structure, increase the maintenance space, and avoid cross contamination between chambers becomes an important link of the atmospheric transmission chamber mechanism.
Disclosure of Invention
The invention aims to provide a transmission chamber and annealing equipment in semiconductor equipment, which solve the problems of complex design of pipelines of an air pumping system, small maintenance space and cross contamination among sub-chambers.
To achieve the above object, the present invention provides a transfer chamber in a semiconductor apparatus, comprising:
the chamber comprises at least one chamber body, each chamber body comprises at least two sub-chambers which are isolated from each other, and each sub-chamber is provided with a vent hole communicated with the outside of the chamber body;
the mounting block is arranged on the outer wall of the cavity body, and the mounting block is provided with air exhaust channels which correspond to the vent holes one by one;
a switch member capable of selectively blocking or communicating any of the pumping channels.
Optionally, the mounting block is provided with mounting holes and air exhaust holes corresponding to the air vents one to one, the air exhaust holes are located on inner walls of the corresponding mounting holes, the air exhaust channel is formed between each air vent and the corresponding air exhaust hole, the switch component includes a plurality of movable sealing members installed in each mounting hole, the movable sealing members block the air exhaust channel by contacting end faces of the air exhaust holes or the air vents, and the movable sealing members communicate with the air exhaust channel by being far away from the end faces of the air exhaust holes or the air vents.
Optionally, the mounting hole and the vent hole are coaxial, and the movable sealing member moves in the axial direction of the mounting hole to contact or be away from the end face of the vent hole.
Optionally, one end of the mounting hole close to the vent hole is provided with a sealing surface perpendicular to the axial direction of the mounting hole; the movable seal includes:
a movable member;
the elastic component is sleeved on the periphery of the movable component;
the sealing ring is arranged at the end part of the elastic component and sleeved on the periphery of the movable component;
the sealing ring can be in sealing contact with or separated from the sealing surface under the driving of the movable component; the passage is blocked when the seal ring is in sealing contact with the sealing face and the passage communicates when the seal ring is separated from the sealing face.
Optionally, the movable part includes a cylinder and a movable rod, wherein the elastic part is sleeved on the periphery of the movable rod, and the cylinder is connected to one end of the movable rod away from the sealing ring and used for driving the movable rod to move.
Optionally, each sub-chamber further has a cavity thereon:
atmosphere switch and atmosphere switch connecting hole, the atmosphere switch passes through the atmosphere switch connecting hole with the subchamber intercommunication, the atmosphere switch is used for right the subchamber carries out overvoltage crowbar.
Optionally, each sub-chamber further has a cavity thereon:
the vacuum gauge is used for detecting the vacuum degree of the sub-chamber.
Optionally, the vent holes of at least two of the sub-chambers of the chamber body are provided on the same side wall of the chamber body.
Optionally, the mounting block is a unitary body; or, the mounting block comprises a plurality of mutually independent sub-mounting blocks, wherein each sub-mounting block is provided with at least one vent hole.
The invention also provides annealing equipment comprising the conveying chamber.
The invention has the beneficial effects that:
according to the invention, the side wall of the chamber body is provided with the mounting block, the mounting block is provided with the air exhaust channels which correspond to the vent holes one by one, and the switch component is used for controlling the vacuumizing of one sub-chamber. The platform structure is simplified on the one hand to this kind of mode of setting, makes transmission chamber and evacuation pipeline compact structure, improves the maintenance space of equipment, and on the other hand can carry out the evacuation to each subchamber alone, can avoid having cross contamination's problem between the subchamber.
The apparatus of the present invention has other features and advantages which will be apparent from or are set forth in detail in the accompanying drawings and the following detailed description, which are incorporated herein, and which together serve to explain certain principles of the invention.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings, in which like reference numerals generally represent like parts.
Fig. 1 is a schematic structural view illustrating a transfer chamber in a semiconductor apparatus according to an embodiment of the present invention.
FIG. 2 illustrates a schematic structural view of a chamber body according to an embodiment of the present invention.
Fig. 3 shows a schematic structural diagram of a mounting block according to an embodiment of the present invention.
FIG. 4 illustrates a schematic structural view of a moveable seal according to an embodiment of the present invention.
Description of reference numerals:
1-a first atmosphere switch; 2-a first vacuum gauge; 3-a second vacuum gauge; 4-a second atmosphere switch; 5, mounting a block; 6-vacuum pipeline; 7-a second movable seal; 8-a first movable seal; 10-upper cover; 21-a first atmosphere switch connection hole; 22-first vacuum gauge attachment hole; 23-a first sub-chamber; 24-a second sub-chamber; 25-a first vent; 26-a second vent; 31-a first movable bar; 32-a first sealing ring; 33-a first spring; 34-a first cylinder; 41A-first sealing surface; 41B-a second sealing surface; 42A-a first extraction hole; 42B-a second extraction hole; 43-first mounting hole; 44-a second mounting hole; 51-left chamber body; 52-right chamber body.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
An embodiment of the present invention provides a transfer chamber in a semiconductor device, and fig. 1 illustrates a schematic structural diagram of a transfer chamber of a semiconductor device. Fig. 2 to 4 show a schematic structural view of the different components of the transfer chamber. Referring to fig. 1 to 4, the transfer chamber includes:
the device comprises at least one chamber body, a plurality of vacuum chambers and a plurality of vacuum pipes, wherein each chamber body comprises at least two sub-chambers which are isolated from each other, and each sub-chamber is provided with a vent hole communicated with the outside of the chamber body;
the mounting block is arranged on the outer wall of the cavity body, and the mounting block is provided with air exhaust channels which correspond to the vent holes one by one;
and the switching component can selectively block or communicate any air suction channel.
Specifically, referring to fig. 1, the present embodiment includes two chamber bodies, the two chamber bodies are disposed on the left and right, the left chamber body 51 is disposed on the left side, and the right chamber body 52 is disposed on the right side. Referring to fig. 2, fig. 2 is a schematic diagram of an internal structure of one of the chamber bodies, the chamber body includes two sub-chambers arranged up and down, an upper layer is a first sub-chamber 23, and a lower layer is a second sub-chamber 24. An upper cover 10 is arranged above the first sub-chamber 23. In other embodiments, the first sub-chamber 23 and the second sub-chamber 24 may be disposed left and right. The first sub-chamber 23 and the second sub-chamber 24 may be identical or different in structure. The side wall of the first sub-chamber 23 is provided with a first vent hole 25, the side wall of the second sub-chamber 24 is provided with a second vent hole 26, and the first vent hole 25 and the second vent hole 26 are both referred to as vent holes. The first and second ventilation holes 25 and 26 serve as air circulation holes for evacuating or inflating the first and second sub-chambers 23 and 24, respectively. In this embodiment, the first ventilation hole 25 and the second ventilation hole 26 are both located on the sidewall of the chamber body, and both are located on the same sidewall. In other embodiments, the first venting hole 25 and the second venting hole 26 may be located on different sidewalls, or the first venting hole 25 may be located on the top surface of the chamber body and the second venting hole 26 may be located on the bottom surface of the chamber body. It should be understood that the first ventilation hole 25 and the second ventilation hole 26 may be air ventilation holes, and the position, size, and shape thereof are not limited in the present invention.
Fig. 3 is a schematic structural diagram of the mounting block 5 in this embodiment. The mounting block 5 is disposed on an outer wall of the chamber body. The mounting block 5 is provided with a first air extraction hole 42A and a second air extraction hole 42B, and the first air extraction hole and the second air extraction hole are both called air extraction holes. In this embodiment, the number of the pumping holes is the same as that of the vent holes, and the pumping channels are formed between the pumping holes and the vent holes. That is, an air exhaust passage is formed between the first air exhaust hole 42A and the first ventilation hole 25, and an air exhaust passage is formed between the second air exhaust hole 42B and the second ventilation hole 26. In other embodiments, one pumping hole may correspond to a plurality of vent holes, and a respective pumping channel is formed between the pumping hole and each vent hole. The other end of the extraction hole is connected with a vacuum pipeline 6, the tail end of the vacuum pipeline 6 is connected with a dry pump, and the dry pump carries out vacuum pumping operation on the sub-cavity through an air pumping channel. The switch component can selectively block or communicate with any one of the air pumping channels so as to selectively and independently vacuumize one of the sub-chambers. If the pipeline between the first suction hole 42A and the first ventilation hole 25 is communicated and the pipeline between the second suction hole 42B and the second ventilation hole 26 is blocked, the dry pump performs the vacuum pumping operation on the first sub-chamber 23. The arrangement mode can avoid the problem of cross contamination among the sub-chambers caused by simultaneously vacuumizing the plurality of sub-chambers. In addition, the side wall of the chamber body is provided with the mounting block, and the sub-chamber is vacuumized through the air suction hole in the mounting block, so that the platform structure can be simplified, the mounting space can be reduced, the number of parts can be reduced, and the maintenance space can be increased. In this embodiment, the ends of the plurality of pumping holes are connected to one vacuum device, so that the platform structure can be further simplified, and the maintenance space can be increased.
In one embodiment, the mounting block is provided with mounting holes and air exhaust holes which correspond to the air vents in a one-to-one manner, the air exhaust holes are located on the inner walls of the corresponding mounting holes, air exhaust channels are formed between the air vents and the corresponding air exhaust holes, the switch part comprises a plurality of movable sealing pieces which are mounted on each mounting hole, the movable sealing pieces are used for blocking the air exhaust channels by contacting the end faces of the air exhaust holes or the air vents, and the movable sealing pieces are communicated with the air exhaust channels by the end faces far away from the air exhaust holes or the air. In an alternative example, the mounting hole and the vent hole are coaxial, and the movable seal member moves in the axial direction of the mounting hole to contact or move away from the end face of the vent hole.
In an alternative embodiment, the mounting block is a unitary body; or the mounting block comprises a plurality of mutually independent sub-mounting blocks, wherein each sub-mounting block is provided with at least one vent hole. For example, a mounting block is arranged on the side wall of each chamber body, and the number of the pumping holes on the mounting block corresponds to the number of the sub-chambers of the chamber body. When two cavity bodies are close, two cavity bodies can share one installation block, and the installation block is provided with air suction holes corresponding to each sub-cavity one to one, or each sub-cavity corresponds to one installation block.
Specifically, in the present embodiment, the mounting block 5 is plate-shaped and is mounted on the side wall of the chamber body where the first ventilation hole 25 and the second ventilation hole 26 are located. A first mounting hole 43 and a second mounting hole 44 are provided, the first mounting hole 43 being used for mounting the first movable seal member 8, and the second mounting hole 44 being used for mounting the second movable seal member 7. The first movable seal 8 and the second movable seal 7 are both referred to as movable seals. The first mounting hole 43 is disposed opposite to and in communication with the first ventilation hole 25, and the second mounting hole 44 is disposed opposite to and in communication with the second ventilation hole 26. The first suction hole 42A is located on an inner wall of the first mounting hole 43, and the second suction hole 42B is located on an inner wall of the second mounting hole 44. Referring to fig. 3, one end of the first mounting hole 43 near the first ventilation hole 25 is provided with a first sealing surface 41A perpendicular to the axial direction of the first mounting hole 43; one end of the second mounting hole 44 near the second vent hole 26 is provided with a second sealing surface 41B perpendicular to the axial direction of the second mounting hole 44. When the first movable seal member 8 is brought into contact with the first sealing surface 41A, the suction passage between the first ventilation hole 25 and the first suction hole 42A is blocked. When the first movable seal member 8 is away from the first sealing surface 41A, the air-bleeding passage between the first air-bleeding hole 25 and the first air-bleeding hole 42A is communicated.
In one embodiment, the first movable seal and the second movable seal are identical in structure, including: a movable member; an elastic component sleeved on the periphery of the movable component; a seal ring arranged at the end of the elastic component and sleeved on the periphery of the movable component; the sealing ring can be in sealing contact with or separated from the sealing surface under the driving of the movable component; when the sealing ring is in sealing contact with the sealing surface, the channel is blocked, and when the sealing ring is separated from the sealing surface, the channel is communicated. In the alternative, the movable part comprises a cylinder and a movable rod, wherein the elastic part is sleeved on the periphery of the movable rod, and the cylinder is connected to one end, away from the sealing ring, of the movable rod and used for driving the movable rod to move.
Referring to fig. 4, the structure of the movable seal will be described by taking the first movable seal as an example. The first movable seal 8 includes: a first movable bar 31; the first spring 33 is sleeved on the periphery of the first movable rod 31, the first sealing ring 32 is arranged at the end part of the first spring 33 and sleeved on the periphery of the first movable rod 31, the first sealing ring 32 is fixed on the first movable rod 31, and the first sealing ring 32 moves along with the first movable rod; the first seal ring 32 can be brought into sealing contact with or separated from the first seal surface 41A by the movement of the first movable rod 31; when the first seal ring 32 is in sealing contact with the first seal surface 41A, the first vent hole 25 is isolated from the first suction hole 25, the first chamber 23 is sealed, and when the first seal ring 32 is separated from the first seal surface 41A, the first vent hole 25 communicates with the first suction hole 42A. In this embodiment, the power source for driving the first movable rod 31 is a first cylinder 34, and the first cylinder 34 is connected to one end of the first movable rod 31 away from the first sealing ring 32.
Taking the first movable seal member 8 as an example, how to communicate or isolate the first ventilation hole 25 and the first suction hole 42A by the first movable seal member 8 will be described. The initial position of the first seal ring 32 is located at the first sealing surface 41A, that is, the initial position, the first chamber 23 is in a sealed state, and the first suction hole 42A and the first ventilation hole 25 are isolated from each other. The first spring 33 is under compression to bring the first seal ring 32 into close contact with the first sealing surface 41A for a better seal. When the first chamber 23 needs to be evacuated, the first cylinder 34 is activated, the first movable rod 31 drives the first sealing ring 32 to move in a direction away from the first vent hole 25, the first compression spring 33 is further compressed, the first sealing ring 32 is separated from the first sealing surface 41A, and the first sealing ring 32 moves to a side of the first suction hole 42A away from the first vent hole 25, so that the first vent hole 25 is communicated with the first suction hole 42A. At this time, the dry pump is started to vacuumize the first chamber. The first compression spring 33 is always in a compression state, and always provides a continuous and stable force for the first sealing ring 32, so that the first movable rod 31 is prevented from shaking due to uneven stress.
The movable sealing element of the embodiment has simple structure, compact matching with the mounting block and simple operation.
In this embodiment, still be equipped with on the cavity body: the first atmosphere switch connecting hole 21 is communicated with the first cavity 23, the first atmosphere switch connecting hole 21 is connected with the first atmosphere switch 1, and the first atmosphere switch 1 is used for performing overpressure protection on the first cavity 23. In this embodiment, the first atmosphere switch connection hole 21 is located on the top surface of the first chamber 23. And a second atmosphere switch connecting hole (located on the bottom surface of the second chamber and not shown in the figure) is further formed in the chamber body and communicated with the second chamber, a second atmosphere switch 4 is connected to the second atmosphere switch connecting hole, and the second atmosphere switch 4 is used for carrying out overvoltage protection on the second chamber 24. In other embodiments, the first or second atmosphere switch connection hole may also be provided on the side wall of the corresponding chamber.
In this embodiment, still be equipped with on the cavity body: the first vacuum gauge connecting hole 22 is communicated with the first cavity 23, the first vacuum gauge connecting hole 22 is connected with a first vacuum gauge 2, and the first vacuum gauge 2 is used for detecting the vacuum degree of the first cavity 23. In this embodiment, the first vacuum gauge attachment hole 21 is located on the top surface of the first chamber 23. The cavity body shanghai is provided with a second vacuum gauge connecting hole (located on the bottom surface of the second cavity and not shown in the figure) communicated with the second cavity, the second vacuum gauge connecting hole is connected with a second vacuum gauge 3, and the second vacuum gauge 3 is used for detecting the vacuum degree of the second cavity 24. In other embodiments, the first or second vacuum gauge connection hole may also be disposed on the sidewall of the corresponding chamber.
The transmission chamber of this embodiment includes two chamber bodies, and every chamber body all is equipped with two sub-chambers, can realize the transmission of double silicon chips, realizes the transmission of silicon chip in atmosphere side and vacuum side.
Another embodiment of the present invention further provides an annealing apparatus, which includes the above-mentioned transfer chamber, wherein the transfer chamber includes a plurality of chamber bodies, and the plurality of chamber bodies share the same set of vacuum pipeline.
Having described embodiments of the present invention, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims (10)

1. A transfer chamber in a semiconductor device, comprising:
the chamber comprises at least one chamber body, each chamber body comprises at least two sub-chambers which are isolated from each other, and each sub-chamber is provided with a vent hole communicated with the outside of the chamber body;
the mounting block is arranged on the outer wall of the cavity body, and the mounting block is provided with air exhaust channels which correspond to the vent holes one by one;
a switch member capable of selectively blocking or communicating any of the pumping channels.
2. The transfer chamber of claim 1, wherein the mounting block has mounting holes and pumping holes corresponding to the air holes, the pumping holes are located on inner walls of the corresponding mounting holes, the air holes and the corresponding pumping holes form the pumping channel therebetween, the switch unit includes a plurality of movable sealing members mounted on each of the mounting holes, the movable sealing members block the pumping channel by contacting end surfaces of the pumping holes or the air holes, and the movable sealing members communicate with the pumping channel by end surfaces far from the pumping holes or the air holes.
3. The transfer chamber of claim 2, wherein the mounting hole and the vent hole are coaxial, and the movable seal member moves in an axial direction of the mounting hole to contact or be away from an end surface of the vent hole.
4. The transfer chamber in a semiconductor apparatus according to claim 3, wherein an end of the mounting hole near the vent hole is provided with a sealing surface perpendicular to an axial direction of the mounting hole; the movable seal includes:
a movable member;
the elastic component is sleeved on the periphery of the movable component;
the sealing ring is arranged at the end part of the elastic component and sleeved on the periphery of the movable component;
the sealing ring can be in sealing contact with or separated from the sealing surface under the driving of the movable component; the passage is blocked when the seal ring is in sealing contact with the sealing face and the passage communicates when the seal ring is separated from the sealing face.
5. The transfer chamber of claim 4, wherein the movable member comprises a cylinder and a movable rod, wherein the elastic member is sleeved on the outer circumference of the movable rod, and the cylinder is connected to one end of the movable rod away from the sealing ring for driving the movable rod to move.
6. The transfer chamber of claim 1, wherein each sub-chamber further comprises:
atmosphere switch and atmosphere switch connecting hole, the atmosphere switch passes through the atmosphere switch connecting hole with the subchamber intercommunication, the atmosphere switch is used for right the subchamber carries out overvoltage crowbar.
7. The transfer chamber of claim 1, wherein each sub-chamber further comprises:
the vacuum gauge is used for detecting the vacuum degree of the sub-chamber.
8. The transfer chamber of claim 1, wherein the vent holes of at least two of the sub-chambers of the chamber body are disposed on a sidewall of the chamber body on the same side.
9. The transfer chamber of claim 1, wherein the mounting block is a unitary body; or, the mounting block comprises a plurality of mutually independent sub-mounting blocks, wherein each sub-mounting block is provided with at least one vent hole.
10. An annealing apparatus comprising the transfer chamber of any one of claims 1-9.
CN202010954506.1A 2020-09-11 2020-09-11 Transmission cavity and annealing equipment in semiconductor equipment Active CN112151430B (en)

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Application Number Priority Date Filing Date Title
CN202010954506.1A CN112151430B (en) 2020-09-11 2020-09-11 Transmission cavity and annealing equipment in semiconductor equipment

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Application Number Priority Date Filing Date Title
CN202010954506.1A CN112151430B (en) 2020-09-11 2020-09-11 Transmission cavity and annealing equipment in semiconductor equipment

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CN112151430A true CN112151430A (en) 2020-12-29
CN112151430B CN112151430B (en) 2024-06-21

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101614283A (en) * 2008-06-26 2009-12-30 喜开理株式会社 Vacuum valve
US20100054905A1 (en) * 2008-08-27 2010-03-04 Mehran Behdjat Load lock chamber for large area substrate processing system
KR20100089312A (en) * 2009-02-03 2010-08-12 세메스 주식회사 Loadlock chamber in a semi-conductor manufacturing system
KR20140038184A (en) * 2012-09-20 2014-03-28 주식회사 마이크로텍 Heating type angle valve
KR20170019256A (en) * 2015-08-11 2017-02-21 주식회사 영우디에스피 Purge module and burk chamber with purge module
CN109819663A (en) * 2017-09-18 2019-05-28 应用材料公司 Vacuum flush system and method for being vacuum-treated one or more substrates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101614283A (en) * 2008-06-26 2009-12-30 喜开理株式会社 Vacuum valve
US20100054905A1 (en) * 2008-08-27 2010-03-04 Mehran Behdjat Load lock chamber for large area substrate processing system
KR20100089312A (en) * 2009-02-03 2010-08-12 세메스 주식회사 Loadlock chamber in a semi-conductor manufacturing system
KR20140038184A (en) * 2012-09-20 2014-03-28 주식회사 마이크로텍 Heating type angle valve
KR20170019256A (en) * 2015-08-11 2017-02-21 주식회사 영우디에스피 Purge module and burk chamber with purge module
CN109819663A (en) * 2017-09-18 2019-05-28 应用材料公司 Vacuum flush system and method for being vacuum-treated one or more substrates

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