CN112151351A - Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment - Google Patents
Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment Download PDFInfo
- Publication number
- CN112151351A CN112151351A CN202011332509.8A CN202011332509A CN112151351A CN 112151351 A CN112151351 A CN 112151351A CN 202011332509 A CN202011332509 A CN 202011332509A CN 112151351 A CN112151351 A CN 112151351A
- Authority
- CN
- China
- Prior art keywords
- power supply
- radio frequency
- electromagnetic interference
- frequency power
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a structure for inhibiting electromagnetic interference and leakage waves, a radio frequency power supply and plasma etching equipment.
Description
Technical Field
The invention relates to the technical field of radio frequency microwave/semiconductor equipment, in particular to a structure for inhibiting electromagnetic interference and wave leakage, a radio frequency power supply and plasma etching equipment.
Background
A typical application of rf power is as a front end for plasma etching. The place where the plasma etching occurs is called a plasma chamber, and when the plasma is not ignited, it corresponds to a vacuum chamber. When high-power energy is added, plasma is ignited, the impedance is rapidly reduced from the original high impedance, and then the plasma bombards the target material which is placed in advance, so that the target material is positively charged and reacts with the material, and the etching process is completed.
Because the impedance of the plasma changes with the state of the gas at any moment when the radio frequency power supply works, if the impedance is mismatched, the gas in the cavity cannot obtain enough energy to excite the plasma, and the working state is abnormal. An automatic impedance matching box is often deployed between the rf power supply and the reaction chamber to obtain adaptive impedance changes. However, when the working power of the rf power supply changes, the impedance adjustment speed of the automatic impedance matching box often requires a certain response time. The radio frequency power supply and the reaction chamber are in an impedance mismatch state in response time, and the problem brought by the impedance mismatch is that the impact of overlarge reflected power on a system module causes poor system heat dissipation, component damage, overhigh various harmonic waves and overlarge EMI (electro magnetic interference), and even leaks electromagnetic waves to cause damage to a human body.
However, studies on the problem of electromagnetic wave leakage indicate that when a human body is in close proximity to a radiation source, excessive radiation energy may be applied to the human body to cause dizziness, sleep disorder, hypomnesis, bradycardia, and blood pressure decrease. The study finds that when the human eyes are close to the leakage position of the microwave oven by about 30cm and the microwave leakage energy reaches 1mW/cm2, the human eyes can suddenly feel dim, and the eyeground inspection shows that the upper part of the macula part of the retina is somewhat bled; the most vulnerable part of the human body to leaky waves is the eye's lens. If the eye is subjected to microwave radiation for an extended period of time beyond safety regulations, vision may be degraded and even cataracts may result. In order to ensure the health of users, the international electrotechnical commission and relevant departments in China stipulate that the leakage of microwaves is measured to be not more than 5mW/cm2 at a position 5 cm away from the door of the microwave oven. And other high-power devices, the daily maximum allowable amount is 400 uW h/cm 2.
In order to generate plasma, the output power of the rf power supply (the rf power supply is a power supply capable of generating a sine wave voltage with a fixed frequency, the frequency is in the rf range (about 3KHz to 300 GHz) and has a certain power) usually needs to be in kW level, and the typical output power is 5 kW. The general radio frequency power supply is assembled by adopting a metal shell, so that the structural strength and the shielding capability can be improved, but the isolation of more than 80dB is needed from the shielding of possible leakage wave power of kilowatt level to 5mW/cm2, and the metal shell is often difficult to meet; and the assembly process is limited (such as gaps and holes on corners), and the natural electromagnetic wave conduction path is adopted, so that the risks of electromagnetic interference and wave leakage are greatly increased.
Therefore, the prior art still needs to be improved and developed.
Disclosure of Invention
The invention aims to provide a structure for inhibiting electromagnetic interference and leaky waves, a radio frequency power supply and plasma etching equipment, and aims to solve the problem that the existing radio frequency power supply shell cannot meet the shielding requirements of electromagnetic interference and leaky waves.
The technical scheme of the invention is as follows: the structure comprises a radio frequency power supply shell and a plurality of concave cavities with certain depths, wherein the concave cavities are arranged on the inner wall of the radio frequency power supply shell, and the electromagnetic interference of a radio frequency power supply enters the concave cavities and is attenuated through multiple reflection and scattering of the concave cavities.
The structure for suppressing electromagnetic interference and wave leakage is characterized in that the plurality of concave cavities are distributed in an array arrangement.
The structure for suppressing electromagnetic interference and wave leakage is characterized in that the distance between the left and right adjacent cavities is positively correlated with the working frequency of the radio frequency power supply, and the distance between the upper and lower adjacent cavities is positively correlated with the working frequency of the radio frequency power supply.
The structure for inhibiting electromagnetic interference and wave leakage is characterized in that the cross section of the concave cavity, which is parallel to the inner wall of the radio frequency power supply shell, is elliptical, circular or polygonal.
When the cross section of the concave cavity parallel to the inner wall of the radio frequency power supply shell is polygonal, the relationship between the distance between the left and right adjacent concave cavities and the working frequency of the radio frequency power supply, the relationship between the distance between the upper and lower adjacent concave cavities and the working frequency of the radio frequency power supply, and the relationship between the depth of the concave cavity and the working frequency of the radio frequency power supply are as follows:
wherein, the Gap1 is the distance between the upper and the lower adjacent concave cavities, the Gap2 is the distance between the upper and the lower adjacent concave cavities,
c is the speed of light, freq is the operating frequency of the radio frequency power supply, and L is the side length of the polygon.
The structure for inhibiting electromagnetic interference and wave leakage is characterized in that when the cross section of the concave cavity, which is parallel to the inner wall of the radio frequency power supply shell, is polygonal, the internal angle of the polygon is larger than 90 degrees.
The structure for suppressing electromagnetic interference and leaky waves is characterized in that when the cross section of the concave cavity, which is parallel to the inner wall of the radio frequency power supply shell, is polygonal, the side length of the concave cavity is related to the working frequency of the radio frequency power supply; the depth of the cavity is related to the operating frequency of the rf power supply.
The structure for inhibiting electromagnetic interference and leaky waves is characterized in that the cross section of the concave cavity, which is parallel to the inner wall of the radio frequency power supply shell, is in a regular hexagon shape.
A radio frequency power supply, comprising the structure for suppressing electromagnetic interference and leakage wave as described above.
A plasma etching apparatus, comprising the structure for suppressing electromagnetic interference and leaky waves as described in any of the above.
The invention has the beneficial effects that: the invention provides a structure for inhibiting electromagnetic interference and leakage wave, a radio frequency power supply and plasma etching equipment, wherein a metallized honeycomb network concave cavity array is adopted on all inner walls of a radio frequency power supply shell, when an interference signal enters the honeycomb concave cavity structure, the interference signal power is attenuated, and multiple reflection and scattering are generated, so that the electromagnetic interference disturbance and leakage wave damage of the radio frequency power supply to the outside are inhibited, and the requirements of the radio frequency power supply shell on electromagnetic interference and leakage wave shielding are met.
Drawings
Fig. 1 is a schematic structural diagram of a structure for suppressing electromagnetic interference and leakage waves in the present invention.
Fig. 2 is a schematic view of the configuration of the cavity of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
As shown in fig. 1 to 2, a structure for suppressing electromagnetic interference and leakage wave for suppressing EMC (electromagnetic interference) and leakage wave of a radio frequency power supply includes a radio frequency power supply housing 1 and a plurality of cavities 2 with a depth H (the depth of the cavity 2 is related to the operating frequency of the radio frequency power supply) disposed on the inner wall of the radio frequency power supply housing 1, and the electromagnetic interference of the radio frequency power supply is incident into the cavity 2 and is subject to multiple reflection and scattering by the cavity 2, thereby suppressing the disturbance and leakage wave damage of the radio frequency power supply to the external electromagnetic interference.
In order to suppress as much as possible the electromagnetic interference and leakage waves of the rf power source (leakage waves refer to insufficient electromagnetic shielding capability due to design defects of the housing and manufacturing process problems, so that internally generated electromagnetic energy is radiated from gaps, holes, etc. of the machine, which is one type of EMI (electromagnetic interference)), in some embodiments, the plurality of cavities 2 are arranged in an array.
In order to suppress electromagnetic interference and leakage waves of the rf power source with different operating frequencies, in some embodiments, the Gap1 between the two adjacent cavities 2 is positively correlated with the operating frequency of the rf power source, and the Gap2 between the two adjacent cavities 2 is positively correlated with the operating frequency of the rf power source.
In some embodiments, the shape of the cross section of the cavity 2 parallel to the inner wall of the rf power supply housing 1 may be set according to practical requirements, such as an ellipse, a circle, a polygon, and the like.
As a preferred embodiment, in order to make the electromagnetic interference and the leakage wave of the rf power supply perform multiple reflection and scattering (without leakage) on the rf power supply housing 1 as much as possible, the shape of the cross section of the concave cavity 2 parallel to the inner wall of the rf power supply housing 1 is polygonal.
When the cross section of the cavity 2 parallel to the inner wall of the rf power supply housing 1 is polygonal, the relationship between the Gap1, the Gap2, the depth H and the operating frequency of the rf power supply is as follows:
wherein the content of the first and second substances,
c is the speed of light, freq is the operating frequency of the radio frequency power supply, and L is the side length of the polygon.
In order to avoid electromagnetic ignition in the cavity 2, when the shape of the cross section of the cavity 2 and the inner wall of the radio frequency power supply shell 1 in parallel is a polygon, the internal angle of the polygon is larger than 90 °.
When the cross section of the cavity 2 parallel to the inner wall of the radio frequency power supply housing 1 is polygonal, the polygon may have different numbers of sides, such as quadrangle, hexagon, octagon, etc., according to the requirement.
When the cross section of the concave cavity 2 parallel to the inner wall of the radio frequency power supply shell 1 is polygonal, the side length L of the concave cavity 2 is related to the working frequency of the radio frequency power supply. If the working frequency of the radio frequency power supply is Freq and the corresponding wavelength is Length, the side Length L of the concave cavity 2 is one fourth of the corresponding wavelength; the characteristic is based on the transmission line terminal short circuit impedance transformation principle, the incident electromagnetic energy forms a short circuit in the cavity 2, and the energy is attenuated and reflected without leaking out of the radio frequency power supply shell 1.
When the cross section of the concave cavity 2 parallel to the inner wall of the radio frequency power supply shell 1 is polygonal, the depth H of the concave cavity 2 is related to the working frequency. If the operating frequency of the rf power supply is Freq, corresponding to a wavelength of Length, the depth H of the cavity 2 is one sixteenth of the corresponding wavelength of Length, at which the electromagnetic energy is repeatedly reflected in the metal walls of the cavity 2.
In a preferred embodiment, the polygon is in the shape of a regular hexagon, and a plurality of cavities 2 of the regular hexagon are arranged on the inner wall of the radio frequency power supply shell 1 to form a metallized honeycomb network array.
The technical scheme also protects a radio frequency power supply which comprises the structure for inhibiting electromagnetic interference and wave leakage.
The technical scheme also protects the plasma etching equipment which comprises the structure for inhibiting electromagnetic interference and wave leakage.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A structure for suppressing electromagnetic interference and leakage waves is characterized by comprising a radio frequency power supply shell and a plurality of concave cavities with certain depths, wherein the concave cavities are arranged on the inner wall of the radio frequency power supply shell, and the electromagnetic interference of a radio frequency power supply enters the concave cavities and is attenuated through multiple reflection and scattering of the concave cavities.
2. The structure of claim 1, wherein the plurality of cavities are distributed in an array.
3. The structure for suppressing electromagnetic interference and leakage waves of claim 1, wherein the distance between two adjacent cavities on the left and right sides is positively correlated with the operating frequency of the radio frequency power supply, and the distance between two adjacent cavities on the upper and lower sides is positively correlated with the operating frequency of the radio frequency power supply.
4. The structure for suppressing electromagnetic interference and leakage waves of claim 1, wherein the cross section of the cavity parallel to the inner wall of the housing of the radio frequency power supply has an elliptical, circular or polygonal shape.
5. The structure for suppressing electromagnetic interference and leakage waves according to claim 3, wherein when the cross-section of the cavity parallel to the inner wall of the housing of the rf power supply has a polygonal shape, the relationship between the distance between two adjacent cavities on the left and right sides and the operating frequency of the rf power supply, the relationship between the distance between two adjacent cavities on the upper and lower sides and the operating frequency of the rf power supply, and the relationship between the cavity and the operating frequency of the rf power supply are as follows:
wherein, the Gap1 is the distance between two adjacent cavities at the left and the right, the Gap2 is the distance between two adjacent cavities at the upper and the lower,
c is the speed of light, freq is the operating frequency of the radio frequency power supply, and L is the side length of the polygon.
6. The structure for suppressing electromagnetic interference and leakage waves of claim 1, wherein when a cross-section of the cavity parallel to an inner wall of the housing of the rf power supply is polygonal, an inner angle of the polygon is greater than 90 °.
7. The structure for suppressing electromagnetic interference and leaky waves as claimed in claim 1, wherein when a cross section of the cavity parallel to an inner wall of the housing of the rf power supply has a polygonal shape, a side length of the cavity is related to an operating frequency of the rf power supply; the depth of the cavity is related to the operating frequency of the rf power supply.
8. The structure for suppressing electromagnetic interference and leakage waves of claim 1, wherein the cross-section of the cavity parallel to the inner wall of the housing of the rf power supply is regular hexagon.
9. A radio frequency power supply comprising the structure for suppressing electromagnetic interference and leakage waves of any one of claims 1 to 8.
10. A plasma etching apparatus comprising the structure for suppressing electromagnetic interference and leakage waves as claimed in any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011332509.8A CN112151351A (en) | 2020-11-24 | 2020-11-24 | Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment |
| PCT/CN2021/078431 WO2022110565A1 (en) | 2020-11-24 | 2021-03-01 | Structure for suppressing electromagnetic interference and leaky waves, and radio frequency power supply and plasma etching apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011332509.8A CN112151351A (en) | 2020-11-24 | 2020-11-24 | Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112151351A true CN112151351A (en) | 2020-12-29 |
Family
ID=73887275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011332509.8A Pending CN112151351A (en) | 2020-11-24 | 2020-11-24 | Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112151351A (en) |
| WO (1) | WO2022110565A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110565A1 (en) * | 2020-11-24 | 2022-06-02 | 季华实验室 | Structure for suppressing electromagnetic interference and leaky waves, and radio frequency power supply and plasma etching apparatus |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06132691A (en) * | 1992-10-21 | 1994-05-13 | Tomoegawa Paper Co Ltd | Radio wave absorber |
| US5539150A (en) * | 1995-01-18 | 1996-07-23 | American Etching & Manufacturing | Kit and method of making radiation shields |
| JP2000013084A (en) * | 1998-06-24 | 2000-01-14 | Yokohama Rubber Co Ltd:The | Manufacture of electromagnetic wave absorber |
| JP2002180568A (en) * | 2000-12-12 | 2002-06-26 | Yokohama Rubber Co Ltd:The | Electromagnetic wave absorptive object and its execution method |
| CN101325620A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Ray-proof mobile phone casing |
| CN101415318A (en) * | 2007-10-19 | 2009-04-22 | 鸿富锦精密工业（深圳）有限公司 | Wireless communication apparatus and electromagnetic shielding device thereof |
| CN201947596U (en) * | 2010-11-11 | 2011-08-24 | 谢忠 | Novel wave shielding plate |
| CN103002723A (en) * | 2011-09-08 | 2013-03-27 | 青钢金属建材股份有限公司 | Electromagnetic wave filter resistance plate structure |
| CN202978850U (en) * | 2012-12-19 | 2013-06-05 | 中微半导体设备(上海)有限公司 | Plasma treatment chamber and radiofrequency matching circuit thereof |
| CN103781297A (en) * | 2012-10-23 | 2014-05-07 | 姜堰市科苑电子仪器有限公司 | Electrical apparatus case electromagnetic shielding structure |
| CN106777627A (en) * | 2016-12-02 | 2017-05-31 | 上海无线电设备研究所 | A kind of honeycomb inhales the contracting of ripple plate than simulation material building method |
| CN207399753U (en) * | 2017-11-09 | 2018-05-22 | 四川农业大学 | A kind of absorbing material structure with metal shielding board |
| CN109023290A (en) * | 2018-06-21 | 2018-12-18 | 成都溢杰科技有限公司 | Two-dimensional Carbon preparation method of nano material and device based on solid carbon source |
| CN109167181A (en) * | 2018-07-24 | 2019-01-08 | 电子科技大学 | A kind of graphical cellular unit broadband periodic absorbent structure |
| CN209658588U (en) * | 2018-04-08 | 2019-11-19 | 东莞理工学院 | One kind is every magnetic heat dissipation laser |
| CN110574142A (en) * | 2017-04-24 | 2019-12-13 | 周星工程股份有限公司 | Substrate processing apparatus |
| CN209845637U (en) * | 2019-03-26 | 2019-12-24 | 福建星宏新材料科技有限公司 | Wave-absorbing structure |
| CN111029789A (en) * | 2019-12-24 | 2020-04-17 | 中国航空工业集团公司沈阳飞机设计研究所 | Wave-absorbing material with positive honeycomb structure of 10 degrees |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6738265B1 (en) * | 2000-04-19 | 2004-05-18 | Nokia Mobile Phones Ltd. | EMI shielding for portable electronic devices |
| KR20080025628A (en) * | 2006-09-18 | 2008-03-21 | 엘지전자 주식회사 | Display filter and method of manufacturing the same |
| JP2011222640A (en) * | 2010-04-07 | 2011-11-04 | Bridgestone Corp | Electromagnetic shielding material for optical filter and optical filter using the same |
| CN101917829A (en) * | 2010-08-24 | 2010-12-15 | 哈尔滨工业大学 | Electronic equipment housing with electromagnetic-shielding efficient heat radiating hole based on frequency selecting surface technique |
| CN204314346U (en) * | 2014-09-03 | 2015-05-06 | 公安部第三研究所 | Electromagnetic screen in radio frequency testing |
| CN112151351A (en) * | 2020-11-24 | 2020-12-29 | 季华实验室 | Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment |
-
2020
- 2020-11-24 CN CN202011332509.8A patent/CN112151351A/en active Pending
-
2021
- 2021-03-01 WO PCT/CN2021/078431 patent/WO2022110565A1/en active Application Filing
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06132691A (en) * | 1992-10-21 | 1994-05-13 | Tomoegawa Paper Co Ltd | Radio wave absorber |
| US5539150A (en) * | 1995-01-18 | 1996-07-23 | American Etching & Manufacturing | Kit and method of making radiation shields |
| JP2000013084A (en) * | 1998-06-24 | 2000-01-14 | Yokohama Rubber Co Ltd:The | Manufacture of electromagnetic wave absorber |
| JP4148562B2 (en) * | 1998-06-24 | 2008-09-10 | 横浜ゴム株式会社 | Manufacturing method of radio wave absorber |
| JP2002180568A (en) * | 2000-12-12 | 2002-06-26 | Yokohama Rubber Co Ltd:The | Electromagnetic wave absorptive object and its execution method |
| CN101325620A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Ray-proof mobile phone casing |
| CN101415318A (en) * | 2007-10-19 | 2009-04-22 | 鸿富锦精密工业（深圳）有限公司 | Wireless communication apparatus and electromagnetic shielding device thereof |
| CN201947596U (en) * | 2010-11-11 | 2011-08-24 | 谢忠 | Novel wave shielding plate |
| CN103002723A (en) * | 2011-09-08 | 2013-03-27 | 青钢金属建材股份有限公司 | Electromagnetic wave filter resistance plate structure |
| CN103781297A (en) * | 2012-10-23 | 2014-05-07 | 姜堰市科苑电子仪器有限公司 | Electrical apparatus case electromagnetic shielding structure |
| CN202978850U (en) * | 2012-12-19 | 2013-06-05 | 中微半导体设备(上海)有限公司 | Plasma treatment chamber and radiofrequency matching circuit thereof |
| CN106777627A (en) * | 2016-12-02 | 2017-05-31 | 上海无线电设备研究所 | A kind of honeycomb inhales the contracting of ripple plate than simulation material building method |
| CN110574142A (en) * | 2017-04-24 | 2019-12-13 | 周星工程股份有限公司 | Substrate processing apparatus |
| CN207399753U (en) * | 2017-11-09 | 2018-05-22 | 四川农业大学 | A kind of absorbing material structure with metal shielding board |
| CN209658588U (en) * | 2018-04-08 | 2019-11-19 | 东莞理工学院 | One kind is every magnetic heat dissipation laser |
| CN109023290A (en) * | 2018-06-21 | 2018-12-18 | 成都溢杰科技有限公司 | Two-dimensional Carbon preparation method of nano material and device based on solid carbon source |
| CN109167181A (en) * | 2018-07-24 | 2019-01-08 | 电子科技大学 | A kind of graphical cellular unit broadband periodic absorbent structure |
| CN209845637U (en) * | 2019-03-26 | 2019-12-24 | 福建星宏新材料科技有限公司 | Wave-absorbing structure |
| CN111029789A (en) * | 2019-12-24 | 2020-04-17 | 中国航空工业集团公司沈阳飞机设计研究所 | Wave-absorbing material with positive honeycomb structure of 10 degrees |
Non-Patent Citations (2)
| Title |
|---|
| DONG I1 KIM等: "Electromagnetic Wave Absorber with Wide-Band Frequency Characteristics Using Exponentially Tapered Ferrite", 《IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILLTY》 * |
| 唐霞辉: "《大功率射频板条CO2激光器》", 30 April 2016, 华中科技大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110565A1 (en) * | 2020-11-24 | 2022-06-02 | 季华实验室 | Structure for suppressing electromagnetic interference and leaky waves, and radio frequency power supply and plasma etching apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022110565A1 (en) | 2022-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102057154B1 (en) | Waveguide coupling, high-frequency module, filling level radar, and use | |
| TW480594B (en) | Plasma processing apparatus | |
| US20210249746A1 (en) | Dielectric filter and communications device | |
| US9039301B2 (en) | Optical transceiver having enhanced EMI tolerance | |
| US10756426B2 (en) | Millimeter-wave band communication device | |
| CN112151351A (en) | Structure for inhibiting electromagnetic interference and wave leakage, radio frequency power supply and plasma etching equipment | |
| JP6048513B2 (en) | Wireless communication device and electronic device | |
| WO2020054754A1 (en) | Microwave heating device | |
| KR101949566B1 (en) | A magnetron having second harmonic frequency suppressing choke and a microwave using the same | |
| JP4464550B2 (en) | Plasma processing equipment | |
| KR101427720B1 (en) | Plasma waveguide using step part and block part | |
| US9419319B1 (en) | Photonic waveguide choke joint with absorptive loading | |
| CN102843799B (en) | Device and method for suppressing electromagnetic leakage of microwave oven | |
| JP2019192420A (en) | Microwave processing equipment | |
| EP3911121B1 (en) | Oven having multiple chokes | |
| CN214545335U (en) | Microwave shielding test cover for high-low temperature test of phased array antenna | |
| KR930000384B1 (en) | Outlet structure of magnetron | |
| RU2129420C1 (en) | Reflexotherapy apparatus "kovert-moksa" | |
| RU2295197C1 (en) | Method for electromagnetic protection of premises | |
| RU2085057C1 (en) | Superhigh-frequency oven | |
| KR100186493B1 (en) | Microwave leakage shielding apparatus for microwave oven | |
| CN117042428A (en) | Device for weakening point discharge electromagnetic wave of power equipment | |
| TWM635205U (en) | A vacuum sealing equipment | |
| KR200373470Y1 (en) | Microwave oven | |
| JP2015133580A (en) | plane transmission line waveguide converter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201229 |