CN112143176A - Mobile phone back shell with built-in three-dimensional composite heat dissipation structure and manufacturing method thereof - Google Patents

Mobile phone back shell with built-in three-dimensional composite heat dissipation structure and manufacturing method thereof Download PDF

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CN112143176A
CN112143176A CN202011054966.5A CN202011054966A CN112143176A CN 112143176 A CN112143176 A CN 112143176A CN 202011054966 A CN202011054966 A CN 202011054966A CN 112143176 A CN112143176 A CN 112143176A
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parts
mobile phone
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mixed
heat
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周兵
张敬敏
周润生
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Zhuixin Digital Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Abstract

The invention discloses a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure and a manufacturing method thereof, wherein the mobile phone back shell is composed of a hard matrix part and a flexible inner surface attachment part, wherein the hard matrix part takes epoxy resin as a matrix, and three functional fillers, namely 0.8-1 wt% of carbon fiber tubes, 43-45 wt% of alumina powder and 14-15 wt% of mixed silicon carbide particles, which are composed of silicon carbide with different particle sizes and account for the total mass of the mobile phone back shell, are solidified in the hard matrix part; the flexible inner surface attachment part is insulating heat-conducting silicone, and the insulating heat-conducting silicone is a composite material prepared by taking hydroxyl-terminated polydimethylsiloxane as a matrix, copper powder as a functional filler and calcium carbonate as a reinforcing filler. The invention has the advantages of high heat conductivity, three-dimensional heat dissipation, corrosion resistance and aging resistance.

Description

Mobile phone back shell with built-in three-dimensional composite heat dissipation structure and manufacturing method thereof
Technical Field
The invention relates to the technical field of heat dissipation of electrical equipment, in particular to a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure and a manufacturing method thereof.
Background
The heat dissipation material for the electrical equipment is widely applied to integrated blocks, power tubes or parts needing insulation and heat conduction in the industries of aerospace, national defense and military, automobiles, electronic and electrical appliances and the like. The heat conductive insulating filler that can be used to make the heat conductive silicone rubber includes carbides, nitrides, metal oxides, and the like. Among them, carbides and nitrides have good insulation and high thermal conductivity, but are expensive, which limits large-scale industrial application; metal oxides such as aluminum oxide, zinc oxide, magnesium oxide, etc., which are inexpensive and readily available and have high thermal conductivity, have become the first choice for large-scale industrial applications, and a great deal of research has been conducted on them. However, the heat-conducting fillers such as aluminum oxide and zinc oxide have excessively stable chemical properties and poor binding force with a matrix, which leads to the decrease of toughness and difficult forming of the whole material body, and thus the application of the heat-conducting fillers in the fields with high requirements for light weight such as new energy batteries is greatly limited. In addition, at present, electronic products are becoming more miniaturized and lighter, besides effective heat dissipation by using heat conducting materials, higher requirements on flame retardant performance are required, and a common method for improving the flame retardant performance of silicone sealant is to add a large amount of flame retardant fillers such as magnesium hydroxide and aluminum hydroxide, and make the silicone sealant achieve the flame retardant effect by virtue of the flame retardant and self-extinguishing effects of the fillers. But the method further reduces the heat-conducting property, the physical and mechanical properties, the adhesion and the like of the heat-conducting silicone sealant; if expensive platinum-group flame retardant is added into the sealant to improve the flame retardant performance, the economy of the silica gel is greatly reduced.
Therefore, a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure, which has high heat conductivity, three-dimensional heat dissipation, corrosion resistance and aging resistance, is urgently needed in the market.
Disclosure of Invention
The invention aims to provide a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure, which has high heat conduction, three-dimensional heat dissipation, corrosion resistance and ageing resistance.
In order to achieve the purpose, the invention adopts the following technical scheme: a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure is composed of a hard matrix part and a flexible inner surface attachment part, wherein the hard matrix part takes epoxy resin as a matrix, and three functional fillers, namely 0.8-1 wt% of carbon fiber tubes, 43-45 wt% of alumina powder and 14-15 wt% of mixed silicon carbide particles, which are composed of silicon carbide with different particle sizes and account for the total mass of the mobile phone back shell, are solidified in the hard matrix part; the flexible inner surface attachment part is heat-conducting silicone, and the heat-conducting silicone is a composite material prepared by taking hydroxyl-terminated polydimethylsiloxane as a matrix, copper powder as a functional filler and calcium carbonate as a reinforcing filler;
the manufacturing method of the mobile phone back shell comprises the following steps:
s1: raw material preparation
Preparing 20-22 parts of hydroxyl-terminated polydimethylsiloxane, 50-52 parts of copper powder with the particle size of 0.1-0.12 mu m, 1-1.2 parts of methyltrimethoxysilane, 6-8 parts of calcium carbonate particles with the particle size of 0.1-0.12 mu m, 3-5 parts of titanium complex, 1-1.2 parts of gamma-aminopropyltrimethoxysilane, 1-1.2 parts of gamma-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, 450-550 parts of epoxy resin master batch, 8-10 parts of carbon fiber tube, 430-450 parts of alumina powder with the particle size of 0.1-0.12 mu m, 86-90 parts of silicon carbide particles with the particle size of 2-2.5 mu m, 42-45 parts of silicon carbide particles with the particle size of 0.6-0.8 mu m, 12-15 parts of silicon carbide particles with the particle size of 0.1-0.12 mu m, 25-30 parts of methylhexahydrophthalic anhydride, 4-6 parts of rubidium acetylacetonate, 8-10 parts of gamma-aminopropyltriethoxysilane, 8-10 parts of 3, 5-diaminobenzoic acid, 8-10 parts of triphenyl phosphite, 8-10 parts of pyridine, sufficient lithium chloride methanol solution, sufficient NMP, sufficient DMF, sufficient xylene and sufficient acetone;
s2: preparation of thermally conductive silicones
Adding the hydroxy-terminated polydimethylsiloxane prepared in the step of S1, copper powder and calcium carbonate particles into a planetary machine with a heating device, uniformly dispersing at a mechanical stirring speed of 600-800 rpm, and then further vacuum degree of 1 × 10-2Pa-1×10-3Stirring and vacuum dehydrating at 125-130 ℃ for 2-2.5 h under Pa vacuum environment, and then furnace cooling to room temperature under vacuum environment to obtain base rubber for later use;
② in the base rubber to be used obtained in the step I, under the vacuum degree of 1X 10-2Pa-1×10-3Sequentially adding methyl trimethoxy silane, gamma-aminopropyl trimethoxy silane, gamma-beta- (aminoethyl) -gamma-aminopropyl trimethoxy silane, titanium complex and other auxiliaries prepared in the step S1 under a Pa vacuum environment, and stirring at a mechanical stirring speed of 600-800 rpm for 25-30 min to obtain the required heat-conducting silicone;
s3: hard matrix part preparation
Uniformly mixing a carbon fiber tube, alumina powder and three silicon carbide particles with different particle sizes prepared in the step S1, cleaning and drying, then modifying the mixed particles at 125-130 ℃ by using dimethylbenzene prepared in the step S1 as a solvent and gamma-aminopropyltriethoxysilane as a modifier for 5-6 h, and taking out the mixed particles to obtain primary modified mixed particles;
secondly, dispersing the primarily modified mixed particles obtained in the step I in NMP prepared in the step S1 in a sufficient amount stage by ultrasonic vibration until the particles are uniformly dispersed, then adding 3, 5-diaminobenzoic acid, triphenyl phosphite and pyridine prepared in the step S1 in NMP dispersion liquid, filling nitrogen for protection, then heating to 105-110 ℃, reacting for 2-2.5 hours, after the reaction liquid is cooled to room temperature under the protection of nitrogen, dripping lithium chloride methanol solution prepared in the step S1 in the reaction liquid until precipitate is not generated any more, filtering out precipitate and other solid content, and repeatedly cleaning the precipitate and the solid content by adopting DMF and acetone prepared in the step S1 until the weight of the mixed powder consisting of the precipitate and the solid content is not changed any more, thus obtaining modified mixed powder;
thirdly, uniformly mixing the epoxy resin master batch prepared in the step S1 with rubidium acetylacetonate, and heating the mixture to 85-90 ℃ until the rubidium acetylacetonate is completely dissolved in the epoxy resin to obtain epoxy resin mixed solution;
adding 1000-1200 parts by weight of acetone into the epoxy resin mixed solution obtained in the third step of putting all the modified mixed powder obtained in the second step, performing composite ultrasonic dispersion treatment at a mechanical stirring speed of 2000-2500 rpm for 40-50 min until the mixed solution is completely and uniformly mixed, heating to 50-55 ℃ while keeping stirring to partially evaporate the acetone in the mixed solution, and heating for 40-50 min to obtain a prefabricated mixed solution;
fifthly, the methylhexahydrophthalic anhydride prepared in the step S1 is put into the prefabricated mixed liquid obtained in the step IV to obtain the final mixed liquid, and then the final mixed liquid is placed in the vacuum degree of 1 multiplied by 10 while the stirring is still kept-2Pa-1×10-3Degassing for 35-40 min under a Pa vacuum environment, then injecting the final mixed solution into a mobile phone shell mold required by design, heating the mold to 115-120 ℃, precuring for 2.5-3 h, and heating to 150-155 ℃ for secondary curing for 15-18 h to obtain a hard matrix part;
s4: assembled for use
Filling the heat-conducting silicone obtained in the step S2 between the hard matrix part obtained in the step S3 and the mobile phone battery, and then connecting and curing the mobile phone battery, the heat-conducting silicone and the hard matrix part through a buckle structure of the hard matrix part until the heat-conducting silicone is completely cured to obtain the mobile phone back shell with the built-in three-dimensional composite heat dissipation structure.
Compared with the prior art, the invention has the following advantages: (1) the flexible gluing part, namely the adhesion layer (the main technical purpose is to attach the hard shell and the mobile phone battery in a self-adaptive and complete manner to enlarge the contact area) of the invention takes copper powder as a main heat-conducting filler and calcium carbonate as a reinforced thixotropic filler to prepare the environmentally-friendly dealcoholized heat-conducting silicone sealant with lower density, so that the effective reduction of the density of the silicone sealant and the reliable flame retardant property are realized on the premise of obtaining higher heat conductivity (the heat conductivity of the part is 4.2W/m.K-4.8W/m.K), and the physical and mechanical properties are better guaranteed. (2) Unlike the prior art, which generally uses organic polymer materials which are mostly poor thermal conductors (the thermal conductivity coefficient is generally 0.1W/mK-0.5W/mK), the invention obtains good technical effects by constructing a three-dimensional, all-dimensional and all-angle heat transfer structure. According to related researches, the thermal conductivity coefficient of the composite material has a great relationship with the structures of different phase regions in the composite material, and due to the existence of a micro-phase structure in a common composite material in the prior art, the direct conduction thermal resistance at a phase interface is increased. Therefore, the thermal conductivity of the composite material has a larger relation with the thickness of a sample, and the construction of the efficient heat-conducting network chain has a great positive effect on improving the thermal conductivity of the composite material. In an epoxy resin system, according to data model derivation, practice verification and continuous optimization and improvement, five heat-conducting particles with different proportions, different properties and different shapes and sizes are selected, and finally a perfect full-face heat-conducting network chain structure is constructed, so that the method is a brand-new attempt for improving the heat conductivity coefficient of the material. The experimental result shows that the 'all-sided' heat conduction network chain can effectively improve the heat conductivity coefficient of the composite material. The shell thermal conductivity coefficient of the prepared composite material with the shell of 32W/(m.K) -35W/(m.K) is far higher than that of the existing composite epoxy resin material by adopting a multi-component filling particle structure formed by filling five fillers with different particle sizes and different shapes and compounding the fillers with the epoxy resin of a matrix. Therefore, the invention has the characteristics of high heat conduction, three-dimensional heat dissipation, corrosion resistance and aging resistance.
Detailed Description
Example 1:
a mobile phone back shell with a built-in three-dimensional composite heat dissipation structure is composed of a hard matrix part and a flexible inner surface attachment part, wherein the hard matrix part takes epoxy resin as a matrix, and three functional fillers, namely 0.8-1 wt% of carbon fiber tubes, 43-45 wt% of alumina powder and 14-15 wt% of mixed silicon carbide particles, which are composed of silicon carbide with different particle sizes and account for the total mass of the mobile phone back shell, are solidified in the hard matrix part; the flexible inner surface attachment part is heat-conducting silicone, and the heat-conducting silicone is a composite material prepared by taking hydroxyl-terminated polydimethylsiloxane as a matrix, copper powder as a functional filler and calcium carbonate as a reinforcing filler;
the manufacturing method of the mobile phone back shell comprises the following steps:
s1: raw material preparation
Firstly, 2.1g of hydroxyl-terminated polydimethylsiloxane, 5.1g of copper powder having a particle size of 0.1 to 0.12. mu.m, 0.11g of methyltrimethoxysilane, 0.7g of calcium carbonate particles having a particle size of 0.1 to 0.12. mu.m, 0.4g of titanium complex, 0.11g of gamma-aminopropyltrimethoxysilane, 0.11g of gamma-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, 52g of epoxy resin master batch, 0.9g of carbon fiber tube, 44.2g of alumina powder having a particle size of 0.1 to 0.12. mu.m, 8.7g of silicon carbide particles having a particle size of 2 to 2.5. mu.m, 4.4g of silicon carbide particles having a particle size of 0.6 to 0.8. mu.m, 1.3g of silicon carbide particles having a particle size of 0.1 to 0.12. mu.m, 2.7g of methylhexahydrophthalic anhydride, 0.5g of rubidium acetylacetonate, 0.9g of gamma-aminopropyltriethoxysilane, 3.9 g of triethoxy silane, 0.9g of 5-diaminobenzoic acid, 0.9g of triphenyl phosphite, 0.9g of pyridine, enough lithium chloride methanol solution, enough NMP, enough DMF, enough xylene and enough acetone;
s2: preparation of thermally conductive silicones
Adding the hydroxy-terminated polydimethylsiloxane prepared in the step of S1, copper powder and calcium carbonate particles into a planetary machine with a heating device, uniformly dispersing at a mechanical stirring speed of 600-800 rpm, and then further vacuum degree of 1 × 10-2Pa-1×10-3Stirring and vacuum dehydrating at 125-130 ℃ for 2-2.5 h under Pa vacuum environment, and then furnace cooling to room temperature under vacuum environment to obtain base rubber for later use;
② in the base rubber to be used obtained in the step I, under the vacuum degree of 1X 10-2Pa-1×10-3Adding methyl trimethoxy silane, gamma-aminopropyl trimethoxy silane, gamma-beta- (aminoethyl) -gamma-aminopropyl trimethoxy silane, titanium complex and other assistant successively from the step S1 in Pa vacuum environmentStirring the mixture for 25 to 30 minutes according to a mechanical stirring speed of 600 to 800rpm to prepare the required heat-conducting silicone;
s3: hard matrix part preparation
Uniformly mixing a carbon fiber tube, alumina powder and three silicon carbide particles with different particle sizes prepared in the step S1, cleaning and drying, then modifying the mixed particles at 125-130 ℃ by using dimethylbenzene prepared in the step S1 as a solvent and gamma-aminopropyltriethoxysilane as a modifier for 5-6 h, and taking out the mixed particles to obtain primary modified mixed particles;
secondly, dispersing the primarily modified mixed particles obtained in the step I in NMP prepared in the step S1 in a sufficient amount stage by ultrasonic vibration until the particles are uniformly dispersed, then adding 3, 5-diaminobenzoic acid, triphenyl phosphite and pyridine prepared in the step S1 in NMP dispersion liquid, filling nitrogen for protection, then heating to 105-110 ℃, reacting for 2-2.5 hours, after the reaction liquid is cooled to room temperature under the protection of nitrogen, dripping lithium chloride methanol solution prepared in the step S1 in the reaction liquid until precipitate is not generated any more, filtering out precipitate and other solid content, and repeatedly cleaning the precipitate and the solid content by adopting DMF and acetone prepared in the step S1 until the weight of the mixed powder consisting of the precipitate and the solid content is not changed any more, thus obtaining modified mixed powder;
thirdly, uniformly mixing the epoxy resin master batch prepared in the step S1 with rubidium acetylacetonate, and heating the mixture to 85-90 ℃ until the rubidium acetylacetonate is completely dissolved in the epoxy resin to obtain epoxy resin mixed solution;
adding 1000-1200 parts by weight of acetone into the epoxy resin mixed solution obtained in the third step of putting all the modified mixed powder obtained in the second step, performing composite ultrasonic dispersion treatment at a mechanical stirring speed of 2000-2500 rpm for 40-50 min until the mixed solution is completely and uniformly mixed, heating to 50-55 ℃ while keeping stirring to partially evaporate the acetone in the mixed solution, and heating for 40-50 min to obtain a prefabricated mixed solution;
fifthly, the methyl hexahydrophthalic anhydride prepared in the step S1 is put into the prefabricated mixed liquid obtained in the step (iv) to obtainThe final mix was then placed under a vacuum of 1X 10 while still stirring-2Pa-1×10-3Degassing for 35-40 min under a Pa vacuum environment, then injecting the final mixed solution into a mobile phone shell mold required by design, heating the mold to 115-120 ℃, precuring for 2.5-3 h, and heating to 150-155 ℃ for secondary curing for 15-18 h to obtain a hard matrix part;
s4: assembled for use
Filling the heat-conducting silicone obtained in the step S2 between the hard matrix part obtained in the step S3 and the mobile phone battery, and then connecting and curing the mobile phone battery, the heat-conducting silicone and the hard matrix part through a buckle structure of the hard matrix part until the heat-conducting silicone is completely cured to obtain the mobile phone back shell with the built-in three-dimensional composite heat dissipation structure.
The mobile phone back shell produced according to the embodiment has the advantages that the thermal conductivity of the flexible gluing part is 4.2W/mK-4.8W/mK, the flexible and elastic properties of adaptive deformation are realized, and the thermal conductivity of the hard matrix part is 32W/(mK) -35W/(mK), so the comprehensive heat transfer efficiency of the embodiment is far higher than that of the existing composite epoxy resin material, and the following is the same.
Example 2
The whole is in accordance with example 1, with the difference that:
preparing 2g of hydroxyl-terminated polydimethylsiloxane, 5.2g of copper powder with the particle size of 0.1-0.12 μm, 0.12g of methyltrimethoxysilane, 0.8g of calcium carbonate particles with the particle size of 0.1-0.12 μm, 0.5g of titanium complex, 0.12g of gamma-aminopropyltrimethoxysilane, 0.12g of gamma-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, 45g of epoxy resin master batch, 1g of carbon fiber tube, 43g of alumina powder with the particle size of 0.1-0.12 μm, 9g of silicon carbide particles with the particle size of 2-2.5 μm, 4.5g of silicon carbide particles with the particle size of 0.6-0.8 μm, 1.5g of silicon carbide particles with the particle size of 0.1-0.12 μm, 3g of methylhexahydrophthalic anhydride, 0.6g of rubidium acetylacetonate, 1g of gamma-aminopropyltriethoxysilane and 3g of rubidium by weight, 1g of 5-diaminobenzoic acid, 1g of triphenyl phosphite, 1g of pyridine, enough lithium chloride methanol solution, enough NMP, enough DMF, enough xylene and enough acetone;
example 3
The whole is in accordance with example 1, with the difference that:
firstly, 2.2g of hydroxyl-terminated polydimethylsiloxane, 5g of copper powder with a particle size of 0.1 to 0.12 μm, 0.1g of methyltrimethoxysilane, 0.6g of calcium carbonate particles with a particle size of 0.1 to 0.12 μm, 0.3g of titanium complex, 0.1g of gamma-aminopropyltrimethoxysilane, 0.1g of gamma-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, 55g of epoxy resin master batch, 0.8g of carbon fiber tube, 45g of alumina powder with a particle size of 0.1 to 0.12 μm, 8.6g of silicon carbide particles with a particle size of 2 to 2.5 μm, 4.2g of silicon carbide particles with a particle size of 0.6 to 0.8 μm, 1.2g of silicon carbide particles with a particle size of 0.1 to 0.12 μm, 2.5g of methylhexahydrophthalic anhydride, 0.4g of rubidium acetylacetonate, 0.8g of gamma-aminopropyltriethoxysilane, 3.8 g of 3 μm, 0.8g of 5-diaminobenzoic acid, 0.8g of triphenyl phosphite, 0.8g of pyridine, enough lithium chloride methanol solution, enough NMP, enough DMF, enough xylene and enough acetone;
the previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (1)

1. The utility model provides a cell-phone dorsal scale of built-in three-dimensional compound heat radiation structure which characterized in that: the mobile phone back shell is divided into a hard matrix part and a flexible inner surface attachment part, wherein the hard matrix part takes epoxy resin as a matrix, and three functional fillers, namely 0.8-1 wt% of carbon fiber tubes, 43-45 wt% of alumina powder and 14-15 wt% of mixed silicon carbide particles, which are composed of silicon carbide with different particle sizes and account for the total mass of the mobile phone back shell, are solidified in the matrix; the flexible inner surface attachment part is heat-conducting silicone, and the heat-conducting silicone is a composite material prepared by taking hydroxyl-terminated polydimethylsiloxane as a matrix, copper powder as a functional filler and calcium carbonate as a reinforcing filler;
the manufacturing method of the mobile phone back shell comprises the following steps:
s1: raw material preparation
Preparing 20-22 parts of hydroxyl-terminated polydimethylsiloxane, 50-52 parts of copper powder with the particle size of 0.1-0.12 mu m, 1-1.2 parts of methyltrimethoxysilane, 6-8 parts of calcium carbonate particles with the particle size of 0.1-0.12 mu m, 3-5 parts of titanium complex, 1-1.2 parts of gamma-aminopropyltrimethoxysilane, 1-1.2 parts of gamma-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, 450-550 parts of epoxy resin master batch, 8-10 parts of carbon fiber tube, 430-450 parts of alumina powder with the particle size of 0.1-0.12 mu m, 86-90 parts of silicon carbide particles with the particle size of 2-2.5 mu m, 42-45 parts of silicon carbide particles with the particle size of 0.6-0.8 mu m, 12-15 parts of silicon carbide particles with the particle size of 0.1-0.12 mu m, 25-30 parts of methylhexahydrophthalic anhydride, 4-6 parts of rubidium acetylacetonate, 8-10 parts of gamma-aminopropyltriethoxysilane, 8-10 parts of 3, 5-diaminobenzoic acid, 8-10 parts of triphenyl phosphite, 8-10 parts of pyridine, sufficient lithium chloride methanol solution, sufficient NMP, sufficient DMF, sufficient xylene and sufficient acetone;
s2: preparation of thermally conductive silicones
Adding the hydroxy-terminated polydimethylsiloxane prepared in the step of S1, copper powder and calcium carbonate particles into a planetary machine with a heating device, uniformly dispersing at a mechanical stirring speed of 600-800 rpm, and then further vacuum degree of 1 × 10- 2Pa-1×10-3Stirring and vacuum dehydrating at 125-130 ℃ for 2-2.5 h under Pa vacuum environment, and then furnace cooling to room temperature under vacuum environment to obtain base rubber for later use;
② in the base rubber to be used obtained in the step I, under the vacuum degree of 1X 10-2Pa-1×10-3Sequentially adding methyl trimethoxy silane, gamma-aminopropyl trimethoxy silane, gamma-beta- (aminoethyl) -gamma-aminopropyl trimethoxy silane, titanium complex and other auxiliaries prepared in the step S1 under a Pa vacuum environment, and stirring at a mechanical stirring speed of 600-800 rpm for 25-30 min to obtain the required heat-conducting silicone;
s3: hard matrix part preparation
Uniformly mixing a carbon fiber tube, alumina powder and three silicon carbide particles with different particle sizes prepared in the step S1, cleaning and drying, then modifying the mixed particles at 125-130 ℃ by using dimethylbenzene prepared in the step S1 as a solvent and gamma-aminopropyltriethoxysilane as a modifier for 5-6 h, and taking out the mixed particles to obtain primary modified mixed particles;
secondly, dispersing the primarily modified mixed particles obtained in the step I in NMP prepared in the step S1 in a sufficient amount stage by ultrasonic vibration until the particles are uniformly dispersed, then adding 3, 5-diaminobenzoic acid, triphenyl phosphite and pyridine prepared in the step S1 in NMP dispersion liquid, filling nitrogen for protection, then heating to 105-110 ℃, reacting for 2-2.5 hours, after the reaction liquid is cooled to room temperature under the protection of nitrogen, dripping lithium chloride methanol solution prepared in the step S1 in the reaction liquid until precipitate is not generated any more, filtering out precipitate and other solid content, and repeatedly cleaning the precipitate and the solid content by adopting DMF and acetone prepared in the step S1 until the weight of the mixed powder consisting of the precipitate and the solid content is not changed any more, thus obtaining modified mixed powder;
thirdly, uniformly mixing the epoxy resin master batch prepared in the step S1 with rubidium acetylacetonate, and heating the mixture to 85-90 ℃ until the rubidium acetylacetonate is completely dissolved in the epoxy resin to obtain epoxy resin mixed solution;
adding 1000-1200 parts by weight of acetone into the epoxy resin mixed solution obtained in the third step of putting all the modified mixed powder obtained in the second step, performing composite ultrasonic dispersion treatment at a mechanical stirring speed of 2000-2500 rpm for 40-50 min until the mixed solution is completely and uniformly mixed, heating to 50-55 ℃ while keeping stirring to partially evaporate the acetone in the mixed solution, and heating for 40-50 min to obtain a prefabricated mixed solution;
fifthly, the methylhexahydrophthalic anhydride prepared in the step S1 is put into the prefabricated mixed liquid obtained in the step IV to obtain the final mixed liquid, and then the final mixed liquid is placed in the vacuum degree of 1 multiplied by 10 while the stirring is still kept-2Pa-1×10-3PaDegassing for 35-40 min in a vacuum environment, then injecting the final mixed solution into a mobile phone shell mold required by design, heating the mold to 115-120 ℃, precuring for 2.5-3 h, and heating to 150-155 ℃, and performing secondary curing for 15-18 h to obtain a hard matrix part;
s4: assembled for use
Filling the heat-conducting silicone obtained in the step S2 between the hard matrix part obtained in the step S3 and the mobile phone battery, and then connecting and curing the mobile phone battery, the heat-conducting silicone and the hard matrix part through a buckle structure of the hard matrix part until the heat-conducting silicone is completely cured to obtain the mobile phone back shell with the built-in three-dimensional composite heat dissipation structure.
CN202011054966.5A 2020-09-30 2020-09-30 Mobile phone back shell with built-in three-dimensional composite heat dissipation structure and manufacturing method thereof Withdrawn CN112143176A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023102694A1 (en) * 2021-12-06 2023-06-15 华为数字能源技术有限公司 Thermally conductive insulating housing and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023102694A1 (en) * 2021-12-06 2023-06-15 华为数字能源技术有限公司 Thermally conductive insulating housing and electronic device

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