CN112143175A - Epoxy resin composite material for superconducting magnet and preparation method thereof - Google Patents
Epoxy resin composite material for superconducting magnet and preparation method thereof Download PDFInfo
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- CN112143175A CN112143175A CN202011050000.4A CN202011050000A CN112143175A CN 112143175 A CN112143175 A CN 112143175A CN 202011050000 A CN202011050000 A CN 202011050000A CN 112143175 A CN112143175 A CN 112143175A
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- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 239000012745 toughening agent Substances 0.000 claims abstract description 17
- 239000011256 inorganic filler Substances 0.000 claims abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- INAPMGSXUVUWAF-GCVPSNMTSA-N [(2r,3s,5r,6r)-2,3,4,5,6-pentahydroxycyclohexyl] dihydrogen phosphate Chemical compound OC1[C@H](O)[C@@H](O)C(OP(O)(O)=O)[C@H](O)[C@@H]1O INAPMGSXUVUWAF-GCVPSNMTSA-N 0.000 claims description 2
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- DIAIBWNEUYXDNL-UHFFFAOYSA-N n,n-dihexylhexan-1-amine Chemical compound CCCCCCN(CCCCCC)CCCCCC DIAIBWNEUYXDNL-UHFFFAOYSA-N 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 abstract description 11
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 description 10
- 239000004014 plasticizer Substances 0.000 description 7
- 239000002887 superconductor Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910001275 Niobium-titanium Inorganic materials 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HFYPIIWISGZGRF-UHFFFAOYSA-N [Nb].[Sn].[Sn].[Sn] Chemical compound [Nb].[Sn].[Sn].[Sn] HFYPIIWISGZGRF-UHFFFAOYSA-N 0.000 description 1
- OSOKRZIXBNTTJX-UHFFFAOYSA-N [O].[Ca].[Cu].[Sr].[Bi] Chemical compound [O].[Ca].[Cu].[Sr].[Bi] OSOKRZIXBNTTJX-UHFFFAOYSA-N 0.000 description 1
- BTGZYWWSOPEHMM-UHFFFAOYSA-N [O].[Cu].[Y].[Ba] Chemical compound [O].[Cu].[Y].[Ba] BTGZYWWSOPEHMM-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 229910003471 inorganic composite material Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- RJSRQTFBFAJJIL-UHFFFAOYSA-N niobium titanium Chemical compound [Ti].[Nb] RJSRQTFBFAJJIL-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an epoxy resin composite material for a superconducting magnet and a preparation method thereof, wherein the composite material comprises the following components in parts by weight: 90-100 parts of bisphenol A epoxy resin, 10-30 parts of inorganic filler, 5-10 parts of toughening agent and 5-10 parts of curing agent. According to the epoxy resin matrix composite material of the superconducting magnet, bisphenol A epoxy resin is used as a matrix, a toughening agent and a curing agent are added, and the resin matrix composite material with low thermal expansion coefficient, high thermal conductivity and high elastic modulus is obtained by modifying the nano aluminum oxide rod-shaped particles with high length-diameter ratio. According to the epoxy resin matrix composite material of the superconducting magnet, bisphenol A epoxy resin is used as a matrix, a toughening agent and a curing agent are added, and the resin matrix composite material with low thermal expansion coefficient, high thermal conductivity and high elastic modulus is obtained by modifying the nano aluminum oxide rod-shaped particles with high length-diameter ratio.
Description
Technical Field
The invention relates to the technical field of superconduction, in particular to an epoxy resin composite material for a superconducting magnet and a preparation method thereof.
Background
In the superconducting state, the superconductor has complete diamagnetism in addition to zero resistance properties. The complete diamagnetism refers to the phenomenon that under the condition that the magnetic field intensity is lower than a critical value, magnetic lines of force cannot penetrate through a superconductor, and the magnetic field in the superconductor is zero. The wire strip prepared by using low-temperature superconductors such as niobium titanium, niobium tri-tin and the like or high-temperature superconductors such as bismuth strontium calcium copper oxygen, yttrium barium copper oxygen and the like can be wound into a superconducting coil, and the superconducting coil can be further prepared into a superconducting magnet after being assembled and solidified. The superconducting magnet can be used in the fields of superconducting current limiters, superconducting energy storage, rail transit and the like, and has good and wide application prospects.
The curing of the superconducting magnet is generally performed by impregnating with a resin-based material such as epoxy resin. However, the use of resin-based materials presents several significant problems: 1. the thermal expansion coefficient of the resin-based material is higher than that of the superconducting magnet, so that large internal stress is easily generated after curing, and the risk of cracking and peeling exists after long-time use; 2, the thermal conductivity of the resin-based material is low, and heat generated by loss of the superconducting magnet in the use process cannot be dissipated in time, so that local overheating can be caused, and the operation stability of superconducting magnet equipment is influenced; 3. the resin-based material has a lower elastic modulus, and under the same stress, the elastic deformation of the resin-based material is higher than that of an inorganic material, so that the curing of the superconducting magnet is not facilitated.
In the prior art, for example, in patent 201310040934.3, an adhesive is provided, which is prepared by compounding epoxy resin and a compound curing agent, and aims to improve the shear strength, reduce the curing time, and consider the low temperature resistance, and the performance improvement requirement of the invention on resin-based materials cannot be solved.
In the prior art, for example, patent 201510486139.6 provides a low temperature resistant epoxy resin adhesive and a preparation method thereof, the low temperature resistant epoxy resin adhesive is prepared from bisphenol F epoxy resin, tetrahydrofuran and the like, quartz sand and aluminum powder, and aims to improve the shear strength and reduce the curing time, and the performance improvement requirement of the invention on resin-based materials cannot be solved.
However, no better solution is available for the above problems.
Disclosure of Invention
In order to make up the defects of the prior art, the invention provides an epoxy resin composite material for a superconducting magnet and a preparation method thereof.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an epoxy resin composite material for a superconducting magnet comprises the following components in parts by weight:
90-100 parts of bisphenol A epoxy resin, 10-30 parts of inorganic filler, 5-10 parts of toughening agent and 5-10 parts of curing agent.
Optionally, the inorganic filler is nano alumina.
Optionally, the nano-alumina is rod-shaped particles with the length of 100-200 nm and the diameter of 10-20 nm.
Optionally, the toughening agent is a mixture of polyetherimide and inositol phosphate in a ratio of 1: 1.
Optionally, the curing agent is a mixture of m-phenylenediamine and trihexylamine in a ratio of 3: 2.
The invention also provides a preparation method of the epoxy resin composite material for the superconducting magnet, which comprises the following specific steps:
mixing bisphenol A epoxy resin and nano aluminum oxide powder, and stirring at room temperature to obtain a product A;
adding a toughening agent and a curing agent into the product A, and stirring at room temperature to obtain a product B;
and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Optionally, the bisphenol a epoxy resin and the nano aluminum oxide powder are mixed in a way that the nano aluminum oxide powder is added into the liquid bisphenol a epoxy resin.
According to the epoxy resin matrix composite material of the superconducting magnet, bisphenol A epoxy resin is used as a matrix, a toughening agent and a curing agent are added, and modification is carried out through the nano aluminum oxide rod-shaped particles with high length-diameter ratio, so that the resin matrix composite material with low thermal expansion coefficient, high thermal conductivity and high elastic modulus is obtained. Because the epoxy resin matrix has high thermal expansion coefficient, low thermal conductivity and low elastic modulus, the whole mechanical property and thermal property of the organic-inorganic composite material can tend to meet the application requirement of the superconducting magnet by introducing the aluminum oxide powder. In addition, the added nano aluminum oxide powder has high length-diameter ratio, and can be helpful for prolonging the stress release path and further improving the service performance of the epoxy resin matrix composite material.
Detailed Description
The invention is described in detail below with reference to preferred embodiments.
Example 1: in this example, the epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 90 parts of bisphenol A epoxy resin, 10 parts of nano aluminum oxide, 5 parts of plasticizer and 5 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Example 2: in this embodiment, an epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 90 parts of bisphenol A epoxy resin, 20 parts of nano aluminum oxide, 8 parts of plasticizer and 8 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Example 3: in this embodiment, an epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 90 parts of bisphenol A epoxy resin, 30 parts of nano aluminum oxide, 10 parts of plasticizer and 10 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Example 4: in this embodiment, an epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 100 parts of bisphenol A epoxy resin, 10 parts of nano aluminum oxide, 5 parts of plasticizer and 5 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Example 5: in this embodiment, an epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 100 parts of bisphenol A epoxy resin, 20 parts of nano aluminum oxide, 8 parts of plasticizer and 8 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Example 6: in this embodiment, an epoxy resin composite material for a superconducting magnet comprises the following components (in parts by weight): 100 parts of bisphenol A epoxy resin, 30 parts of nano aluminum oxide, 10 parts of plasticizer and 10 parts of curing agent. Firstly, adding nano aluminum oxide powder into liquid bisphenol A epoxy resin, and fully stirring at room temperature to obtain a product A; sequentially adding a toughening agent and a curing agent into the product A, and fully stirring at room temperature to obtain a product B; and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
Comparative example: in the comparative example, the epoxy resin material comprises the following components in parts by weight: 90 parts of bisphenol A epoxy resin, 5 parts of plasticizer and 5 parts of curing agent. And (3) sequentially adding a toughening agent and a curing agent into the liquid bisphenol A epoxy resin, fully stirring at room temperature, and curing for 6-12 hours at room temperature to obtain the epoxy resin material.
The epoxy resin composite material for superconducting magnets prepared in the above examples was subjected to performance tests, and the results are shown in table 1.
TABLE 1 Properties of epoxy resin composites for superconducting magnets
Compared with the comparative example, the inorganic powder nano-alumina is added, so that the thermal expansion coefficient is reduced, the thermal conductivity is improved, and the elastic modulus is increased in the examples 1 to 6. In examples 1 to 6, the ratio of nano-alumina was from low to high: example 4< example 1< example 5< example 2< example 6< example 3, the coefficient of thermal expansion, thermal conductivity, and elastic modulus also change in a corresponding regular manner.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The epoxy resin composite material for the superconducting magnet is characterized by comprising the following components in parts by weight:
90-100 parts of bisphenol A epoxy resin, 10-30 parts of inorganic filler, 5-10 parts of toughening agent and 5-10 parts of curing agent.
2. The epoxy resin composite for a superconducting magnet according to claim 1, wherein the inorganic filler is nano alumina.
3. The epoxy resin composite material for a superconducting magnet as claimed in claim 2, wherein the nano-alumina is rod-like particles having a length of 100-200 nm and a diameter of 10-20 nm.
4. The epoxy resin composite for a superconducting magnet according to claim 1,
the toughening agent is a mixture of polyetherimide and inositol phosphate in a ratio of 1: 1.
5. The epoxy resin composite for a superconducting magnet according to claim 1,
the curing agent is a mixture of m-phenylenediamine and trihexylamine in a ratio of 3: 2.
6. A preparation method of an epoxy resin composite material for a superconducting magnet is characterized by comprising the following specific steps:
mixing bisphenol A epoxy resin and nano aluminum oxide powder, and stirring at room temperature to obtain a product A;
adding a toughening agent and a curing agent into the product A, and stirring at room temperature to obtain a product B;
and curing the product B for 6-12 hours at room temperature to obtain a composite material C.
7. The method of producing an epoxy resin composite material for a superconducting magnet according to claim 6,
the bisphenol A epoxy resin and the nano aluminum oxide powder are mixed to point to the liquid bisphenol A epoxy resin and the nano aluminum oxide powder is added.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011050000.4A CN112143175A (en) | 2020-09-29 | 2020-09-29 | Epoxy resin composite material for superconducting magnet and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011050000.4A CN112143175A (en) | 2020-09-29 | 2020-09-29 | Epoxy resin composite material for superconducting magnet and preparation method thereof |
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| CN112143175A true CN112143175A (en) | 2020-12-29 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4652597A (en) * | 1985-02-12 | 1987-03-24 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin composition |
| CN1613888A (en) * | 2003-11-05 | 2005-05-11 | 北京航空航天大学 | Ultra-low temperature adhesive of epoxy resin and preparation thereof |
| CN103897643A (en) * | 2014-03-12 | 2014-07-02 | 南京艾布纳密封技术有限公司 | Room-temperature cured high heat-proof epoxy adhesive |
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
| CN107118724A (en) * | 2017-03-30 | 2017-09-01 | 湖北绿色家园材料技术股份有限公司 | A kind of high tenacity, high intensity, heat superconducting electron pouring sealant and preparation method thereof |
| CN111087958A (en) * | 2019-12-20 | 2020-05-01 | 北京高盟新材料股份有限公司 | Room-temperature fast-curing epoxy adhesive and preparation method thereof |
-
2020
- 2020-09-29 CN CN202011050000.4A patent/CN112143175A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4652597A (en) * | 1985-02-12 | 1987-03-24 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin composition |
| CN1613888A (en) * | 2003-11-05 | 2005-05-11 | 北京航空航天大学 | Ultra-low temperature adhesive of epoxy resin and preparation thereof |
| CN103897643A (en) * | 2014-03-12 | 2014-07-02 | 南京艾布纳密封技术有限公司 | Room-temperature cured high heat-proof epoxy adhesive |
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
| CN107118724A (en) * | 2017-03-30 | 2017-09-01 | 湖北绿色家园材料技术股份有限公司 | A kind of high tenacity, high intensity, heat superconducting electron pouring sealant and preparation method thereof |
| CN111087958A (en) * | 2019-12-20 | 2020-05-01 | 北京高盟新材料股份有限公司 | Room-temperature fast-curing epoxy adhesive and preparation method thereof |
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