CN112134047B - High-speed signal connector assembly and information technology equipment - Google Patents
High-speed signal connector assembly and information technology equipment Download PDFInfo
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- CN112134047B CN112134047B CN202011042515.XA CN202011042515A CN112134047B CN 112134047 B CN112134047 B CN 112134047B CN 202011042515 A CN202011042515 A CN 202011042515A CN 112134047 B CN112134047 B CN 112134047B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
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Abstract
The invention discloses a high-speed signal connector component and a server, wherein the assembly comprises: the first pin array comprises a first pin and a fourth pin which are configured to determine a transmission in-place signal and are respectively arranged at two ends of a diagonal line of the first pin array, the first pin is connected to a positive power supply, and the fourth pin is grounded; the second pin array comprises a second pin and a third pin which are configured to determine the transmission in-place signal and are respectively arranged at two ends of a diagonal line of the second pin array; the flying lead establishes connection between the second pin and the third pin; the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an on-bit signal. The invention can use the high-speed signal connector for connection and ensure that the on-site signal is sent out after all pins are well contacted, thereby reducing the design and processing difficulty of hardware equipment, being compatible with a general high-speed signal connector and improving the reliability of the on-site signal.
Description
Technical Field
The present invention relates to the field of machine learning, and more particularly, to a high-speed signal connector assembly and an information technology device.
Background
Controllers of equipment such as a storage array, a blade server and the like are interconnected with a back plate by adopting a high-speed connector, and the controllers support online replacement; the business application requires that the input and output bandwidth is continuously increased, more and more signals are interconnected between the controller and the back plate, and the number of the connectors is increased to form a high-speed signal connector wall plane. In the prior art, when a controller is inserted in a hot mode, in order to avoid sparking during plugging, a ground wire is generally required to be contacted with a long needle first; then a true power supply, a high-speed signal and the like are powered on by using a secondary long needle; and selecting the shortest needle for switching on at the site signal, and informing the system controller that the needle is stably inserted, so that the system can be normally started. When the controller is hot-drawn, the on-site signal is firstly disconnected, and the level of the on-site signal pin of the controller is changed to be high; the system knows that the controller is pulled out, can switch input and output rapidly, avoids resetting or downtime.
However, as the electrical signal rate increases, in order to support higher signal rate and better shielding effect, the pin pins of the high-speed signal connector are only long and short, and the connection of all the long pins can only be defined as ground; in-place signals and other signals can only use short pins with equal length, and the requirement of selecting the shortest pin from the in-place signals cannot be met.
Aiming at the problems that in the prior art, the reliability and the stability of an in-place signal are influenced by hot plugging caused by the small length of a pin of a high-speed signal connector are poor, and an effective solution is not available at present.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a high-speed signal connector assembly and an information technology device, which can be connected by using a high-speed signal connector and ensure that all pins send out in-place signals after good contact, thereby reducing the design and processing difficulty of hardware devices, being compatible with a general high-speed signal connector, and improving the reliability of in-place signals.
In view of the above object, a first aspect of embodiments of the present invention provides a high-speed signal connector assembly, comprising:
a first connector plane;
a second connector plane;
the first pin array is arranged on the first connector plane and comprises a first pin and a fourth pin which are configured to determine transmission of in-place signals, the first pin and the fourth pin are respectively arranged at two ends of a diagonal line of the first pin array, the first pin is connected to a positive power supply, and the fourth pin is grounded;
the second pin array is arranged on the second connector plane and corresponds to the first pin array, the second pin array comprises a second pin and a third pin which are configured to determine transmission in-place signals, the second pin and the third pin are respectively arranged at two ends of a diagonal line of the second pin array, the second pin corresponds to the first pin in position, and the third pin corresponds to the fourth pin in position;
the flying wire is used for establishing connection between the second pin and the third pin and short-circuiting the second pin and the third pin to form a channel for transmitting an in-place signal;
and the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an in-place signal.
In some embodiments, all pins in the first pin array and the second pin array have a first length, or a second length less than the first length; all pins with the first length are mutually communicated and grounded; the first pin, the second pin, the third pin, and the fourth pin all have a second length.
In some embodiments, the first pin array is a female connector pin array and the second pin array is a male connector pin array, or the first pin array is a male connector pin array and the second pin array is a female connector pin array; the first connector plane is connected to the backplane and the second connector plane is connected to a device controller of the connection device, or the first connector plane is connected to the device controller of the connection device and the second connector plane is connected to the backplane.
In some embodiments, the complex programmable logic device is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
A second aspect of an embodiment of the present invention provides another high-speed signal connector assembly, including:
a first connector plane;
a second connector plane;
a first pin array disposed on the first connector plane, the first pin array including a first pin, a fourth pin, and a fifth pin configured to determine a transmission of a bit signal, the first pin, the fourth pin, and the fifth pin being disposed at three corner positions of the first pin array, respectively, and the first pin being connected to a positive power supply;
a second pin array arranged on the second connector plane and corresponding to the first pin array, the second pin array including a second pin, a third pin and a sixth pin configured to determine transmission of in-place signals, the second pin, the third pin and the sixth pin being respectively arranged at three corner positions of the second pin array, the second pin corresponding to the first pin, the third pin corresponding to the fourth pin, the sixth pin corresponding to the fifth pin, and the sixth pin being grounded;
the flying leads are respectively connected between the second pin and the third pin and between the fourth pin and the fifth pin, and short-circuit the second pin and the third pin and the fourth pin and the fifth pin to form a channel for transmitting in-place signals;
and the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an in-place signal.
In some embodiments, all pins in the first pin array and the second pin array have a first length, or a second length less than the first length; all pins with the first length are mutually communicated and grounded; the first pin, the second pin, the third pin, the fourth pin, the fifth pin, and the sixth pin all have a second length.
In some embodiments, the first pin array is a female connector pin array and the second pin array is a male connector pin array, or the first pin array is a male connector pin array and the second pin array is a female connector pin array; the first connector plane is connected to the backplane and the second connector plane is connected to a device controller of the connection device, or the first connector plane is connected to the device controller of the connection device and the second connector plane is connected to the backplane.
In some embodiments, the complex programmable logic device is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
A third aspect of an embodiment of the present invention provides an information technology apparatus, including:
a backplane of a storage array or server device;
a connection device having a device controller;
the high-speed signal connector assembly described above is used to connect a device controller connected to a device to a backplane and to signal in place in response to a plurality of pins between the device controller and the backplane all being well connected.
In some embodiments, the high-speed signal connector assembly is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
The invention has the following beneficial technical effects: according to the high-speed signal connector assembly and the information technology equipment provided by the embodiment of the invention, the first pin array arranged on the first connector plane is used, the first pin array comprises a first pin and a fourth pin which are configured to determine the transmission in-place signal, the first pin and the fourth pin are respectively arranged at two ends of a diagonal line of the first pin array, the first pin is connected to a positive power supply, and the fourth pin is grounded; the second pin array is arranged on the second connector plane and corresponds to the first pin array, the second pin array comprises a second pin and a third pin which are configured to determine transmission in-place signals, the second pin and the third pin are respectively arranged at two ends of a diagonal line of the second pin array, the second pin corresponds to the first pin in position, and the third pin corresponds to the fourth pin in position; the flying wire is used for establishing connection between the second pin and the third pin and short-circuiting the second pin and the third pin to form a channel for transmitting an in-place signal; the complex programmable logic device is connected to the first pin, and the level of the first pin is collected to serve as an on-position signal, so that the complex programmable logic device can be connected by using the high-speed signal connector, and the on-position signal can be sent out after all the pins are well contacted, the design and processing difficulty of hardware equipment is reduced, the complex programmable logic device is compatible with a general high-speed signal connector, and the reliability of the on-position signal is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a high speed signal connector assembly according to the present invention;
FIG. 2 is a schematic diagram of the connection of one embodiment of a high-speed signal connector assembly provided by the present invention;
fig. 3 is a schematic connection diagram of another embodiment of a high-speed signal connector assembly according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above, a first aspect of the embodiments of the present invention provides an embodiment of a high-speed signal connector assembly that uses a high-speed signal connector to connect and ensure that all pins are well contacted before sending out a bit signal. Fig. 1 is a schematic diagram of a high-speed signal connector assembly according to the present invention.
The high-speed signal connector assembly, as shown in fig. 1, includes:
a first connector plane;
a second connector plane;
the first pin array is arranged on the first connector plane and comprises a first pin and a fourth pin which are configured to determine transmission of in-place signals, the first pin and the fourth pin are respectively arranged at two ends of a diagonal line of the first pin array, the first pin is connected to a positive power supply, and the fourth pin is grounded;
the second pin array is arranged on the second connector plane and corresponds to the first pin array, the second pin array comprises a second pin and a third pin which are configured to determine transmission in-place signals, the second pin and the third pin are respectively arranged at two ends of a diagonal line of the second pin array, the second pin corresponds to the first pin in position, and the third pin corresponds to the fourth pin in position;
the flying wire is used for establishing connection between the second pin and the third pin and short-circuiting the second pin and the third pin to form a channel for transmitting an in-place signal;
and the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an in-place signal.
In some embodiments, all pins in the first pin array and the second pin array have a first length, or a second length less than the first length; all pins with the first length are mutually communicated and grounded; the first pin, the second pin, the third pin, and the fourth pin all have a second length.
In some embodiments, the first pin array is a female connector pin array and the second pin array is a male connector pin array, or the first pin array is a male connector pin array and the second pin array is a female connector pin array; the first connector plane is connected to the backplane and the second connector plane is connected to a device controller of the connection device, or the first connector plane is connected to the device controller of the connection device and the second connector plane is connected to the backplane.
In some embodiments, the complex programmable logic device is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
The following further illustrates embodiments of the invention in accordance with the specific example shown in fig. 2.
The embodiment shown in fig. 2 is a diagonal loopback design for the in-place signal. The pin (pin) pins of the diagonal line of the connector are selected as in-place signals (for example, the diagonal lines of the plane wall of the signal connector of the controller are divided into (i) and (ii), and the diagonal lines of the plane wall of the signal connector of the backboard are divided into (iii)). The pin needle of the controller is designed as an on-position signal, and VCC is pulled up to a high level; the pin needle is communicated with the GND (ground) and is at a low level; the second pin needle and the third pin needle of the back plate are communicated and in a non-level state.
After the controller is inserted into the back plate, the controller is communicated with the back plate, and the back plate and the pin needle are communicated; therefore, the signals of the controller I and the controller IV are communicated, and the high level of the controller I is changed into the low level; the controller CPLD (complex programmable logic device) detects the level signal change of the first one and reports the level signal change to the system, and the controller is inserted into the backboard.
As can be seen from the foregoing embodiments, the high-speed signal connector assembly provided by the embodiments of the present invention uses the first pin array disposed on the first connector plane, where the first pin array includes a first pin and a fourth pin configured to determine a signal transmitted in place, the first pin and the fourth pin are disposed at two ends of a diagonal line of the first pin array, respectively, and the first pin is connected to a positive power supply, and the fourth pin is grounded; the second pin array is arranged on the second connector plane and corresponds to the first pin array, the second pin array comprises a second pin and a third pin which are configured to determine transmission in-place signals, the second pin and the third pin are respectively arranged at two ends of a diagonal line of the second pin array, the second pin corresponds to the first pin in position, and the third pin corresponds to the fourth pin in position; the flying wire is used for establishing connection between the second pin and the third pin and short-circuiting the second pin and the third pin to form a channel for transmitting an in-place signal; the complex programmable logic device is connected to the first pin, and the level of the first pin is collected to serve as an on-position signal, so that the complex programmable logic device can be connected by using the high-speed signal connector, and the on-position signal can be sent out after all the pins are well contacted, the design and processing difficulty of hardware equipment is reduced, the complex programmable logic device is compatible with a general high-speed signal connector, and the reliability of the on-position signal is improved.
In view of the above objects, a first aspect of an embodiment of the present invention proposes another embodiment. Fig. 1 is a schematic diagram of another high-speed signal connector assembly provided by the present invention.
The high-speed signal connector assembly, as shown in fig. 1, includes:
a first connector plane;
a second connector plane;
a first pin array disposed on the first connector plane, the first pin array including a first pin, a fourth pin, and a fifth pin configured to determine a transmission of a bit signal, the first pin, the fourth pin, and the fifth pin being disposed at three corner positions of the first pin array, respectively, and the first pin being connected to a positive power supply;
a second pin array arranged on the second connector plane and corresponding to the first pin array, wherein the second pin array comprises a second pin, a third pin and a sixth pin which are configured to determine transmission of in-place signals, the second pin, the third pin and the sixth pin are respectively arranged at three corner positions of the second pin array, the second pin corresponds to the first pin, the third pin corresponds to the fourth pin, the sixth pin corresponds to the fifth pin, and the sixth pin is grounded;
the flying leads are respectively connected between the second pin and the third pin and between the fourth pin and the fifth pin, and short-circuit the second pin and the third pin and the fourth pin and the fifth pin to form a channel for transmitting in-place signals;
and the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an in-place signal.
In some embodiments, all pins in the first pin array and the second pin array have a first length, or a second length less than the first length; all pins with the first length are mutually communicated and grounded; the first pin, the second pin, the third pin, the fourth pin, the fifth pin, and the sixth pin all have a second length.
In some embodiments, the first pin array is a female connector pin array and the second pin array is a male connector pin array, or the first pin array is a male connector pin array and the second pin array is a female connector pin array; the first connector plane is connected to the backplane and the second connector plane is connected to a device controller of the connection device, or the first connector plane is connected to the device controller of the connection device and the second connector plane is connected to the backplane.
In some embodiments, the complex programmable logic device is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
The following further illustrates an embodiment of the present invention in accordance with the embodiment shown in fig. 3.
The diagonal in-place signal of the previous embodiment ensures reliable contact of the pin pins within the diagonal. However, if the controller is inclined at a certain angle, a part of the signal connection is unstable and the contact is not in place in the area a or B far from the diagonal line of fig. 2, so that the signal is sometimes absent, and system operation failure may occur. Compared with the diagonal in-place signal design of the previous embodiment, the in-place signal planar loopback design shown in fig. 3 selects 3-point surface, which can ensure that all pin pins of the signal connector plane wall are inserted in place, and after good contact, the in-place signal changes from high level to low level.
The method comprises the steps of selecting pin pins of an on-position signal loop from 3 corners of a controller signal connector plane wall (the pin pins are designed to be on-position signals, VCC is pulled upwards to be high level; and the pin pins are directly connected with a controller), and selecting pin pins of 3 corners of a backboard signal connector plane wall (the pin pins are directly connected with GND and are low level).
After the controller is inserted into the backboard, the controller is communicated with the backboard, the backboard is directly connected with the backboard, the backboard is communicated with the controller, the controller is directly connected with the controller, and the controller is communicated with the backboard; the controller is connected to the power supply, and the high level of the controller is changed into the low level; and the CPLD detects the signal level change of the first step, reports the signal level change to the system, and the controller is inserted into the backboard.
As can be seen from the above embodiments, the high-speed signal connector assembly provided by the embodiments of the present invention is achieved by using a first pin array disposed on a first connector plane, wherein the first pin array includes a first pin, a fourth pin, and a fifth pin configured to determine a bit signal to be transmitted, the first pin, the fourth pin, and the fifth pin are disposed at three corner positions of the first pin array, respectively, and the first pin is connected to a positive power supply; the second pin array is arranged on the second connector plane and corresponds to the first pin array, the second pin array comprises a second pin, a third pin and a sixth pin which are configured to determine transmission in-place signals, the second pin, the third pin and the sixth pin are respectively arranged at three corner positions of the second pin array, the second pin corresponds to the first pin, the third pin corresponds to the fourth pin, the sixth pin corresponds to the fifth pin, and the sixth pin is grounded; the flying leads are respectively connected between the second pin and the third pin and between the fourth pin and the fifth pin, and short-circuit the second pin and the third pin and the fourth pin and the fifth pin to form a channel for transmitting in-place signals; the complex programmable logic device is connected to the first pin, and the level of the first pin is collected to serve as an on-position signal, so that the complex programmable logic device can be connected by using the high-speed signal connector, and the on-position signal can be sent out after all the pins are well contacted, the design and processing difficulty of hardware equipment is reduced, the complex programmable logic device is compatible with a general high-speed signal connector, and the reliability of the on-position signal is improved.
In view of the above object, a second aspect of the embodiments of the present invention proposes an embodiment of an information technology apparatus. The information technology device includes:
a backplane of a storage array or server device;
a connection device having a device controller;
the high-speed signal connector assembly described above is used to connect a device controller connected to a device to a backplane and to signal in place in response to a plurality of pins between the device controller and the backplane all being well connected.
In some embodiments, the high-speed signal connector assembly is configured to send an in-place signal to the device controller and/or the backplane; the device controller and/or the backplane are configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
It can be seen from the foregoing embodiments that, in the information technology device provided in the embodiments of the present invention, by using the high-speed signal connector assembly to connect the device controller connected to the backplane and send the in-place signal in response to the good connection of the plurality of pins between the device controller and the backplane, the high-speed signal connector can be used for connection and ensure that the in-place signal is sent only after all the pins make good contact, thereby reducing the difficulty in designing and processing the hardware device, being compatible with a general high-speed signal connector, and improving the reliability of the in-place signal.
It should be particularly noted that the above-mentioned embodiments of the information technology apparatus employ the embodiments of the assembly to specifically describe the working process of each module, and those skilled in the art can easily think that these modules are applied to other embodiments of the assembly. Of course, since the modules in the embodiment of the assembly can be mutually crossed, replaced, added, and deleted, these reasonable permutations and combinations should also fall within the scope of the present invention for the information technology equipment, and should not limit the scope of the present invention to the embodiment.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (6)
1. A high-speed signal connector assembly, comprising:
a first connector plane;
a second connector plane;
a first pin array disposed on the first connector plane, the first pin array including a first pin, a fourth pin, and a fifth pin configured to determine a transmission-in-place signal, the first pin, the fourth pin, and the fifth pin being disposed at three corner positions of the first pin array, respectively, and the first pin being connected to a positive power supply;
a second pin array disposed on the second connector plane and corresponding to the first pin array, the second pin array including a second pin, a third pin, and a sixth pin configured to determine a transmission in-place signal, the second pin, the third pin, and the sixth pin being disposed at three corner positions of the second pin array, respectively, and the second pin corresponding to the position of the first pin, the third pin corresponding to the position of the fourth pin, the sixth pin corresponding to the position of the fifth pin, and the sixth pin being grounded;
the flying leads are respectively connected between the second pin and the third pin and between the fourth pin and the fifth pin, and the second pin and the third pin and the fourth pin and the fifth pin are short-circuited to form a channel for transmitting in-place signals;
and the complex programmable logic device is connected to the first pin to acquire the level of the first pin as an in-place signal.
2. The high-speed signal connector assembly of claim 1, wherein all pins in the first and second pin arrays have a first length, or a second length that is less than the first length; all the pins with the first length are mutually communicated and grounded; the first pin, the second pin, the third pin, the fourth pin, the fifth pin, and the sixth pin all have the second length.
3. The high-speed signal connector assembly of claim 1, wherein the first pin array is a female connector pin array and the second pin array is a male connector pin array, or the first pin array is a male connector pin array and the second pin array is a female connector pin array; the first connector plane is connected to a backplane and the second connector plane is connected to a device controller of a connection device, or the first connector plane is connected to the device controller of the connection device and the second connector plane is connected to the backplane.
4. A high-speed signal connector assembly according to claim 3, wherein the complex programmable logic device is configured to issue the in-place signal to the device controller and/or the backplane; the device controller and/or the backplane is configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
5. An information technology device, comprising:
a backplane of a storage array or server device;
a connection device having a device controller;
a high speed signal connector assembly as claimed in any one of claims 1 to 4, for connecting the device controller of the connecting device to the backplane and signaling a live in response to a plurality of pins between the device controller and the backplane all being well connected.
6. The information technology device of claim 5, wherein the high speed signal connector assembly is configured to send the in-place signal to the device controller and/or the backplane; the device controller and/or the backplane is configured to confirm that the connected device is in place in response to the in-place signal being a stable low level.
Priority Applications (1)
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| CN202011042515.XA CN112134047B (en) | 2020-09-28 | 2020-09-28 | High-speed signal connector assembly and information technology equipment |
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| US20070018292A1 (en) * | 2005-07-22 | 2007-01-25 | Sehat Sutardja | Packaging for high speed integrated circuits |
| US7744414B2 (en) * | 2008-07-08 | 2010-06-29 | 3M Innovative Properties Company | Carrier assembly and system configured to commonly ground a header |
| CN201556733U (en) * | 2009-08-28 | 2010-08-18 | 达昌电子科技(苏州)有限公司 | Electric connector |
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| CN103080760A (en) * | 2010-11-02 | 2013-05-01 | 船井电机株式会社 | Led lighting device and cable connection detection device |
| CN103296504A (en) * | 2012-02-23 | 2013-09-11 | 微盟电子(昆山)有限公司 | Connector with sequence advanced technology additional device port and related electronic device thereof |
| CN107390822A (en) * | 2017-08-04 | 2017-11-24 | 郑州云海信息技术有限公司 | A kind of rack server |
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