CN112117221A - Semiconductor wafer wet etching equipment - Google Patents
Semiconductor wafer wet etching equipment Download PDFInfo
- Publication number
- CN112117221A CN112117221A CN202011064163.8A CN202011064163A CN112117221A CN 112117221 A CN112117221 A CN 112117221A CN 202011064163 A CN202011064163 A CN 202011064163A CN 112117221 A CN112117221 A CN 112117221A
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- plate
- block
- push
- groove
- liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The invention discloses a semiconductor wafer wet etching device, which structurally comprises a tank body, a liquid tank, a controller, a motor and a water delivery pipe, wherein reactants float on the upper layer of corrosive liquid and flow in the tank body under the thrust of the liquid to be adhered to the surface, the reactants flow in the tank body through a cleaning device and move up and down along the surface of a partition plate, the reactants on the surface of the partition plate are cleaned through a blade, the reactants are favorably reduced to be attached to the inner part of the tank body, the discharge of the reactants is accelerated, the reactants flow in the tank body along with the liquid, the surface of a treated wafer is favorably neat after being taken out, the etching time of the wafer is further reduced, the reactants are accumulated on the inner wall after entering a drainage groove, the diameter of the inner wall of the drainage groove is easily reduced, moving blocks on two sides of a push plate are movably matched with the inner wall of the drainage groove, and a brush plate, the liquid in the drainage groove can enter into the cleaning plate to push the reactant downwards.
Description
Technical Field
The invention belongs to the field of wafer etching, and particularly relates to semiconductor wafer wet etching equipment.
Background
The conductivity of the semiconductor can be controlled, so that the semiconductor wafer is used in an integrated circuit, in order to strengthen the integration of the wafer and the integrated circuit, the wafer is processed by a wet etching technology, a chemical etching solution is added into a wet etching pool, the wafer is put into the etching solution to be etched to form lines, and the floating reactant is diffused and discharged to a boundary solution by the thrust of the liquid; in the process of etching a wafer by using a wet etching tank in the prior art, because a reactant floats on the upper layer of etching liquid and flows in the tank body under the thrust of the liquid to be adhered to the surface, when the flow force of the liquid is high, the reactant is pushed by the liquid again to fall and be mixed in the liquid, and the reactant flows in the tank body along with the liquid, so that the reactant is adhered to the surface of the treated wafer after the treated wafer is taken out, the wafer needs to be cleaned again, and the time for etching the wafer is further prolonged.
Disclosure of Invention
In order to solve the problem that in the process of etching a wafer by using a wet etching tank in the technology, because a reactant floats on the upper layer of an etching solution and flows in the tank body under the thrust of the liquid to be adhered to the surface, when the flow force of the liquid is high, the reactant is pushed by the liquid again to fall and be mixed in the liquid, and the reactant flows in the tank body along with the liquid, the reactant is adhered to the surface of the treated wafer after the treated wafer is taken out, the wafer needs to be cleaned again, and the etching time of the wafer is further increased, the invention provides semiconductor wafer wet etching equipment.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor wafer wet etching equipment, its structure includes cell body, liquid tank, controller, motor, raceway, the liquid tank is installed in the positive bottom of cell body, the controller is located the positive middle part of cell body, the motor is installed at liquid tank top perpendicularly, raceway connection is between cell body and liquid tank.
The cell body is equipped with baffle, slide rail, clearing device, slider, spring, the baffle is located the cell body inside, the slide rail is sunken in baffle inboard surface, clearing device passes through slider and slide rail clearance fit, the spring mounting is between clearing device both sides and cell body inner wall.
As a further improvement of the invention, the clearing device is provided with a drainage groove, a push plate, elastic balls, a clearing plate, an opening and a push block, wherein the drainage groove penetrates through the top of the clearing device, the push plate is positioned in the drainage groove, the elastic balls are clamped between the inner wall of the drainage groove and the bottom surface of the push plate, the clearing plate is connected with the bottom end of the push plate, the opening penetrates through the bottom surface of the clearing device, the push block is clamped in the middle of the clearing plate, the elastic balls are respectively positioned at two sides below the push plate, and small raised iron blocks are arranged in the drainage groove and positioned at the middle-lower position of the drainage groove.
As a further improvement of the invention, the cleaning plate is provided with a side plate, a liquid accumulation groove, a connecting block and a contact plate, the side plate is positioned on the right side of the cleaning plate, the liquid accumulation groove is arranged in the cleaning plate, the contact plate is movably matched with the left side of the side plate through the connecting block, and the right side surface of the side plate is provided with a through small hole.
As a further improvement of the invention, the contact plate is provided with spray holes, blades and grooves, the spray holes penetrate through the right side face of the contact plate, the blades are arranged on the left side of the contact plate, the grooves are sunken on the left side of the contact plate and located between the blades, and the blades are uneven surfaces.
As a further improvement of the invention, the push plate is provided with a middle block, a push rod and a moving block, the middle block is clamped in the middle of the push plate, the push rod penetrates through two sides of the push plate and is movably matched with the middle block, the moving block is fixed at the tail end of the push rod, and the top of the moving block is concave.
As a further improvement of the invention, the moving block is provided with a supporting block, a vibration spring and two convex blocks, the supporting block is positioned on the left side of the moving block, the convex blocks are arranged on the right side surface of the supporting block through the vibration spring, and the number of the convex blocks is two.
As a further improvement of the invention, the convex block is provided with a supporting plate, a clamping groove, an elastic block, a brush plate and a clamping ball, the supporting plate is positioned on the left side of the convex block, the clamping groove is positioned inside the convex block, the elastic block is fixed on the right side of the supporting plate, the brush plate is positioned on the right side of the supporting plate and is movably matched with the elastic block, the clamping ball is arranged inside the clamping groove, and the elastic block is made of rubber.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. because the reactant floats on the corrosive liquid upper strata, the thrust that receives liquid flows and the adhesion on the surface in cell body inside, flow along the baffle surface along with the inside liquid of cell body through clearing device and reciprocate, clear away the reactant on baffle surface through the blade, be favorable to reducing the reactant and adhere to inside the cell body, accelerate the reactant and discharge, reduce the reactant and flow in cell body inside along with liquid, the wafer that is favorable to after handling takes out the rear surface clean and tidy, further reduce the time of wafer etching.
2. Because the reactant piles up at the inner wall after entering into the drainage groove, easily lead to the diameter of drainage groove inner wall to diminish, through the movable block and the drainage groove inner wall clearance fit of push pedal both sides, the brush board is clear away the reactant of drainage groove inner wall, is favorable to keeping the drainage groove unblocked for the liquid entering of drainage groove will be clear away the board and promote the reactant push down.
Drawings
FIG. 1 is a schematic structural diagram of a semiconductor wafer wet etching apparatus according to the present invention.
FIG. 2 is a schematic view of a tank body according to the present invention.
Fig. 3 is a side sectional structural schematic view of a clearing device of the present invention.
FIG. 4 is a side cross-sectional structural schematic view of a stripper plate of the present invention.
Fig. 5 is a schematic side sectional view of a contact plate according to the present invention.
FIG. 6 is a side sectional structural view of a push plate according to the present invention.
Fig. 7 is a schematic structural view of a lateral cross-section of a moving block according to the present invention.
Fig. 8 is a schematic side sectional view of a bump according to the present invention.
In the figure: the device comprises a pool body-1, a liquid tank-2, a controller-3, a motor-4, a water conveying pipe-5, a partition plate-11, a sliding rail-12, a clearing device-13, a sliding block-14, a spring-15, a drainage groove-a 1, a push plate-a 2, an elastic ball-a 3, a clearing plate-a 4, an opening-a 5, a push block-a 6, a side plate-s 1, a liquid accumulation groove-s 2, a connecting block-s 3, a contact plate-s 4, a spray hole-d 1, a blade-d 2, a groove-d 3, a middle block-e 1, a push rod-e 2, a moving block-e 3, a supporting block-r 1, a vibration spring-r 2, a bump-r 3, a supporting plate-t 1, a clamping groove-t 2, an elastic block-t 3, a brush plate-t 4 and a clamping ball-t 5.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 5:
the invention provides semiconductor wafer wet etching equipment which structurally comprises a tank body 1, a liquid tank 2, a controller 3, a motor 4 and a water delivery pipe 5, wherein the liquid tank 2 is installed at the bottom of the front face of the tank body 1, the controller 3 is located in the middle of the front face of the tank body 1, the motor 4 is vertically installed at the top of the liquid tank 2, and the water delivery pipe 5 is connected between the tank body 1 and the liquid tank 2.
The cleaning device 13 is provided with a drainage groove a1, a push plate a2, a bouncing ball a3, a cleaning plate a4, an opening a5 and a push block a6, the drainage groove a1 penetrates through the top of the cleaning device 13, the push plate a2 is positioned in the drainage groove a1, the bouncing ball a3 is clamped between the inner wall of the drainage groove a1 and the bottom surface of the push plate a2, the cleaning plate a4 is connected with the bottom end of the push plate a2, the opening a5 penetrates through the bottom surface of the cleaning device 13, the push block a6 is clamped in the middle of the cleaning plate a4, the bouncing balls a3 are respectively positioned at two sides below the push plate a2, so that the force of the push plate a2 is uniformly applied to accelerate the pushing down of the cleaning plate a4, a small iron blocks which are protruded inside the drainage groove a1 and positioned in the middle and lower position of the drainage groove a 7, so that.
Wherein, clear away board a4 and be equipped with curb plate s1, hydrops groove s2, connecting block s3, contact plate s4, curb plate s1 is located and clears away board a4 right side, hydrops groove s2 is established inside clearing away board a4, contact plate s4 is through connecting block s3 and curb plate s1 left side clearance fit, curb plate s1 right flank is equipped with the aperture that runs through, is favorable to liquid to have the aperture to enter into hydrops groove s2 in, is favorable to the floater on liquid to contact plate s4 surface to wash.
The contact plate s4 is provided with a spray hole d1, a blade d2 and a groove d3, the spray hole d1 penetrates through the right side face of the contact plate s4, the blade d2 is installed on the left side of the contact plate s4, the groove d3 is sunken on the left side of the contact plate s4 and located between the blades d2, the blade d2 is an uneven surface, the contact area between the blade d2 and the inner wall of the partition plate 11 is increased, and the pushing down of reactants on the inner wall of the partition plate 11 by the blade d2 is accelerated.
The specific use mode and function of the embodiment are as follows:
in the invention, a semiconductor wafer is placed in a tank body 1 of an etching tank, a controller 3 is controlled to start a motor 4 to convey corrosive liquid in a liquid tank 2 to the tank body 1 through a water conveying pipe 5, the corrosive liquid corrodes the outer wall of the semiconductor wafer, reactants are discharged along with the flowing of the liquid, when the flowing force of the liquid is increased, a cleaning device 13 is pushed by the liquid to be movably matched with a sliding rail 12 through a sliding block 14, the cleaning device 13 pulls a spring 15 to deform, when the liquid enters a drainage groove a1 of the device, a push plate a2 is pushed by the pushing force of the liquid to extrude and deform an elastic ball a3, a push plate a2 pushes a cleaning plate a4 to the outside of an opening 6, the bottom of a cleaning plate a4 is pulled by the floating force of the liquid to deform the push block a6, so that the cleaning plate a4 is gradually horizontal, a blade d2 of a contact plate s4 pushes the reactants adhered to the inner wall of a partition plate 11 downwards, the reactants fall down, and a small amount of the liquid enters a, liquid jets toward orifice d1 for the reactant on blade d2 surface drops, flow along 11 surfaces of baffle along with the inside liquid of cell body 1 through clearing device 13 and reciprocate, clear away the reactant on 11 surfaces of baffle through blade d2, be favorable to reducing the reactant and adhere to inside the cell body 1, accelerate the reactant and discharge, reduce the reactant and flow at 1 inside of cell body along with liquid, the wafer that is favorable to after handling takes out the back surface clean and tidy, further reduce the time of wafer etching.
Example 2:
as shown in fig. 6 to 8:
the push plate a2 is provided with a middle block e1, a push rod e2 and a moving block e3, the middle block e1 is clamped in the middle of the push plate a2, the push rod e2 penetrates through two sides of the push plate a2 and is movably matched with the middle block e1, the moving block e3 is fixed at the tail end of the push rod e2, the top of the moving block e3 is concave, the contact area between the moving block e3 and liquid is increased, the driving force of the liquid is increased, the liquid is accelerated to push the moving block e3 towards the middle of the push plate a2, and the liquid entering speed of the drainage groove a1 is increased.
The moving block e3 is provided with a supporting block r1, a vibration spring r2 and two convex blocks r3, the supporting block r1 is located on the left side of the moving block e3, the convex blocks r3 are mounted on the right side face of the supporting block r1 through the vibration spring r2, and the two convex blocks r3 are beneficial to being in contact with the drainage groove a1 for multiple times, removing reactants on the inner wall of the drainage groove a1 and keeping the drainage groove a1 unblocked.
The bump r3 is provided with a support plate t1, a clamping groove t2, an elastic block t3, a brush plate t4 and a ball t5, the support plate t1 is located on the left side of the bump r3, the clamping groove t2 is located inside the bump r3, the elastic block t3 is fixed on the right side of the support plate t1, the brush plate t4 is located on the right side of the support plate t1 and is in movable fit with the elastic block t3, the ball t5 is arranged inside the clamping groove t2, the elastic block t3 is made of rubber, has elasticity and is favorable for being in movable fit with the ball t5, generates larger elastic force to accelerate the swinging speed of the bump r3, and is favorable for dropping a reactant outside the brush plate t 4.
The specific use mode and function of the embodiment are as follows:
in the invention, when the amount of liquid in the drainage groove a1 of the removing device 13 is reduced, the pushing force of the liquid is less than the elastic force of the elastic ball a3, the elastic ball a3 is deformed and reset to push the push plate a2 upwards, the middle block e1 of the push plate a2 pushes the moving block e3 to two sides through the push rod e2, the moving block e3 is in contact with the inner wall of the drainage groove a1, the brush plate t4 on the surface of the projection r3 of the moving block e3 removes the reactant on the inner wall of the drainage groove a1, the clamping ball t5 rolls in the clamping groove t2 to make the projection r2 vibrate, and the vibrating spring r2 drives the projection r2 to vibrate to accelerate the reactant on the outer wall of the brush plate t2 to fall off, the moving block e2 on two sides of the push plate a2 is movably matched with the inner wall of the drainage groove a2, and the brush plate t2 removes the reactant on the inner wall of the drainage groove a2, so that the drainage groove a2 is kept smooth.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (7)
1. The utility model provides a semiconductor wafer wet etching equipment, its structure includes cell body (1), liquid tank (2), controller (3), motor (4), raceway (5), install in cell body (1) front bottom liquid tank (2), controller (3) are located cell body (1) front middle part, motor (4) are installed at liquid tank (2) top perpendicularly, raceway (5) are connected between cell body (1) and liquid tank (2), its characterized in that:
cell body (1) is equipped with baffle (11), slide rail (12), clearing device (13), slider (14), spring (15), baffle (11) are located cell body (1) inside, slide rail (12) are sunken in baffle (11) inboard surface, clearing device (13) are through slider (14) and slide rail (12) clearance fit, spring (15) are installed between clearing device (13) both sides and cell body (1) inner wall.
2. The semiconductor wafer wet etching apparatus as claimed in claim 1, wherein: the clearing device (13) is provided with a drainage groove (a1), a push plate (a2), a bouncing ball (a3), a clearing plate (a4), an opening (a5) and a push block (a6), wherein the drainage groove (a1) penetrates through the top of the clearing device (13), the push plate (a2) is positioned inside the drainage groove (a1), the bouncing ball (a3) is clamped between the inner wall of the drainage groove (a1) and the bottom surface of the push plate (a2), the clearing plate (a4) is connected with the bottom end of the push plate (a2), the opening (a5) penetrates through the bottom surface of the clearing device (13), and the push block (a6) is clamped in the middle of the clearing plate (a 4).
3. The semiconductor wafer wet etching apparatus as claimed in claim 2, wherein: clear away board (a4) is equipped with curb plate (s1), hydrops groove (s2), connecting block (s3), contact plate (s4), curb plate (s1) are located clear away board (a4) right side, hydrops groove (s2) are established and are clear away inside board (a4), contact plate (s4) are through connecing piece (s3) and curb plate (s1) left side clearance fit.
4. The semiconductor wafer wet etching apparatus as claimed in claim 3, wherein: the contact plate (s4) is provided with a spray hole (d1), a blade (d2) and a groove (d3), the spray hole (d1) penetrates through the right side face of the contact plate (s4), the blade (d2) is installed on the left side of the contact plate (s4), and the groove (d3) is sunken on the left side of the contact plate (s4) and located between the blades (d 2).
5. The semiconductor wafer wet etching apparatus as claimed in claim 2, wherein: the push plate (a2) is provided with a middle block (e1), a push rod (e2) and a moving block (e3), the middle block (e1) is clamped in the middle of the push plate (a2), the push rod (e2) penetrates through two sides of the push plate (a2) and is movably matched with the middle block (e1), and the moving block (e3) is fixed at the tail end of the push rod (e 2).
6. The semiconductor wafer wet etching apparatus as claimed in claim 5, wherein: the moving block (e3) is provided with a supporting block (r1), a vibration spring (r2) and a bump (r3), the supporting block (r1) is located on the left side of the moving block (e3), and the bump (r3) is installed on the right side face of the supporting block (r1) through the vibration spring (r 2).
7. The semiconductor wafer wet etching apparatus as claimed in claim 6, wherein: lug (r3) are equipped with backup pad (t1), draw-in groove (t2), elastic block (t3), brush board (t4), card ball (t5), backup pad (t1) are located lug (r3) left side, draw-in groove (t2) are located inside lug (r3), elastic block (t3) are fixed on backup pad (t1) right side, brush board (t4) are located backup pad (t1) right side, and with elastic block (t3) clearance fit, card ball (t5) are established inside draw-in groove (t 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011064163.8A CN112117221A (en) | 2020-09-30 | 2020-09-30 | Semiconductor wafer wet etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011064163.8A CN112117221A (en) | 2020-09-30 | 2020-09-30 | Semiconductor wafer wet etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112117221A true CN112117221A (en) | 2020-12-22 |
Family
ID=73797375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011064163.8A Withdrawn CN112117221A (en) | 2020-09-30 | 2020-09-30 | Semiconductor wafer wet etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112117221A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112658552A (en) * | 2021-01-07 | 2021-04-16 | 操盛继 | Electric welding machine for single chip microcomputer processing |
-
2020
- 2020-09-30 CN CN202011064163.8A patent/CN112117221A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112658552A (en) * | 2021-01-07 | 2021-04-16 | 操盛继 | Electric welding machine for single chip microcomputer processing |
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Application publication date: 20201222 |
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| WW01 | Invention patent application withdrawn after publication |