CN112105223B - Heat radiating device for electronic equipment and electronic equipment - Google Patents

Heat radiating device for electronic equipment and electronic equipment Download PDF

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Publication number
CN112105223B
CN112105223B CN202010908913.9A CN202010908913A CN112105223B CN 112105223 B CN112105223 B CN 112105223B CN 202010908913 A CN202010908913 A CN 202010908913A CN 112105223 B CN112105223 B CN 112105223B
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Prior art keywords
cavity
metal plate
capillary
evaporation
channel
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CN202010908913.9A
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Chinese (zh)
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CN112105223A (en
Inventor
冯斌
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Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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Priority to CN202010908913.9A priority Critical patent/CN112105223B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application discloses a heat dissipation device for electronic equipment and the electronic equipment, wherein the heat dissipation device comprises: the metal plate is internally provided with an evaporation cavity and a condensation cavity, the evaporation cavity and the condensation cavity are spaced apart, a communication channel is further formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity; and the cooling liquid is filled in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel. The heat dissipation device can be arranged in electronic equipment, heat dissipation efficiency can be improved, and cooling liquid is sealed in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel, so that the circuit of the electronic equipment is not damaged due to outflow.

Description

Heat radiating device for electronic equipment and electronic equipment
Technical Field
The present application relates to the field of electronic devices, and in particular, to a heat dissipation device for an electronic device and an electronic device.
Background
In the related art, heat dissipation is performed in electronic equipment such as a mobile phone by arranging stacked heat dissipation fins, but the stacked heat dissipation fins have low heat dissipation efficiency, and the heat pipe device with high heat dissipation efficiency has a thick pipe body because of the integration of the pipe shell and the pipe core, so that the heat pipe device cannot be directly stacked in the electronic equipment.
Disclosure of Invention
The application provides a heat dissipation device for electronic equipment, which is convenient to be arranged in the electronic equipment and has high heat dissipation efficiency.
The application also provides electronic equipment, which comprises the heat dissipation device for the electronic equipment.
According to an embodiment of the application, a heat dissipating device for an electronic device includes: the evaporation cavity and the condensation cavity are formed in the metal plate, the evaporation cavity and the condensation cavity are spaced apart, a communication channel is further formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity; and the cooling liquid is filled in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel.
According to the heat dissipation device for the electronic equipment, the heat dissipation device is arranged to be of the metal plate-shaped structure, so that the heat dissipation device is internally stacked in the electronic equipment, the heat dissipation efficiency can be improved, cooling liquid is sealed in the closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel, the circuit of the electronic equipment is not damaged due to outflow, and the working reliability of the electronic equipment is ensured. In addition, the heat dissipation device can take away the redundant heat generated by the heating element of the electronic equipment, and dissipate the heat in the transmission process, so that the overhigh temperature around the components is avoided, and the problem of fever of the electronic equipment is solved. In addition, the evaporating cavity, the condensing cavity, the communicating channel and the capillary channel are all built in the metal plate, and the sizes of all parts can be adjusted according to the internal space of the electronic equipment, so that the application universality is enhanced. In addition, the heat dissipation device is not provided with devices such as a fan and the like to increase the power consumption of the electronic equipment, and the water pump is not used for controlling the liquid to move, so that the heat dissipation device is a passive device and is effective in increasing heat dissipation and saving energy.
An electronic device according to an embodiment of the present application includes: a housing; the main board is arranged in the shell; the heat dissipation device for the electronic equipment is arranged in the shell, and the part of the metal plate with the evaporation cavity is attached to the main board.
According to the electronic equipment provided by the embodiment of the application, the heat dissipation device is arranged into the metal plate-shaped structure, so that the heat dissipation device is internally stacked in the electronic equipment, the heat dissipation efficiency can be improved, and the cooling liquid is sealed in the closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel, so that the circuit of the electronic equipment is not damaged due to outflow, and the working reliability of the electronic equipment is ensured. In addition, the heat dissipation device can take away the redundant heat generated by the heating element of the electronic equipment, and dissipate the heat in the transmission process, so that the overhigh temperature around the components is avoided, and the problem of fever of the electronic equipment is solved. In addition, the evaporating cavity, the condensing cavity, the communicating channel and the capillary channel are all built in the metal plate, and the sizes of all parts can be adjusted according to the internal space of the electronic equipment, so that the application universality is enhanced. In addition, the heat dissipation device is not provided with devices such as a fan and the like to increase the power consumption of the electronic equipment, and the water pump is not used for controlling the liquid to move, so that the heat dissipation device is a passive device and is effective in increasing heat dissipation and saving energy.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural view of a heat dissipating device for an electronic apparatus according to an embodiment of the present application;
fig. 2 is a schematic view of an internal structure of an electronic device according to an embodiment of the present application;
fig. 3 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the present application.
Reference numerals:
the electronic device 100 is configured to provide a user interface,
the heat sink 10 is provided with a heat sink,
a metal plate 1, an evaporation chamber 11, a heat exchange channel 111, a baffle 112, a condensation chamber 12, a communication channel 13, a capillary channel 14, a capillary structure 141, a cooling liquid inlet 15,
a housing 20, a main board 30, and a battery 40.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
A heat sink 10 for an electronic device 100 according to an embodiment of the present application is described below with reference to fig. 1.
As shown in fig. 1, a heat dissipating device 10 for an electronic apparatus 100 according to an embodiment of the present application includes a metal plate 1.
Specifically, an evaporation cavity 11 and a condensation cavity 12 are formed in the metal plate 1, the evaporation cavity 11 and the condensation cavity 12 are spaced apart, a communication channel 13 is further formed in the metal plate 1, one end of the communication channel 13 is communicated with one end of the evaporation cavity 11, the other end of the communication channel 13 is communicated with one end of the condensation cavity 12, a capillary channel 14 is further defined in the metal plate 1, a capillary structure 141 is arranged in the capillary channel 14, one end of the capillary channel 14 is communicated with the other end of the evaporation cavity 11, and the other end of the capillary channel 14 is communicated with the other end of the condensation cavity 12. It can be understood that the metal plate 1 has a metal plate structure, and the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are arranged at intervals in the plane of the metal plate 1, and the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 form a closed loop closed chamber.
The cooling liquid is filled in a closed cavity formed by the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14. The portion of the metal plate 1 with the evaporation cavity 11 may be attached to a heating element of the electronic device 100, the heating element transfers heat to a cooling liquid in the evaporation cavity 11, the liquid is vaporized to take away the heat, then the vapor is transferred to the condensation cavity 12 through the communication channel 13, the heat is released in the condensation cavity 12 to be condensed into droplets, and then the liquid flows back into the evaporation cavity 11 through the capillary channel 14. This process is repeated to continuously take out the heat generated by the heat generating element of the electronic device 100, so as to solve the heat generating problem of the electronic device 100.
The capillary structure 141 is a conventional structure known to those skilled in the art for drawing liquid into the evaporation chamber 11, and has fine slits along which liquid rises or permeates in the case of infiltration, which will not be described in detail.
Alternatively, the heating element of the electronic device 100 may be a processor chip, a memory chip, or the like of the electronic device 100.
Alternatively, the metal plate 1 may be a metal plate 1 of a copper plate, an aluminum plate, or the like.
According to the heat dissipating device 10 for the electronic apparatus 100 of the embodiment of the present application, by arranging the heat dissipating device 10 in a metal plate structure, the heat dissipating device 10 is built-in stacked in the electronic apparatus 100, and heat dissipating efficiency can be improved, and the cooling liquid is sealed in the closed chamber formed by the evaporation chamber 11, the condensation chamber 12, the communication channel 13 and the capillary channel 14, so that the circuit of the electronic apparatus 100 is not damaged due to outflow, and the reliability of the operation of the electronic apparatus 100 is ensured. In addition, the heat dissipating device 10 can take away the excessive heat generated by the heating element of the electronic device 100, and dissipate the heat in the transmission process, so as to avoid the overhigh temperature around the components and solve the fever problem of the electronic device 100. In addition, the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are all built in the metal plate 1, and the sizes of the parts can be adjusted according to the internal space of the electronic equipment 100, so that the application universality is enhanced. The heat sink 10 is a passive device that is effective in increasing heat dissipation and saves energy, and does not include a device such as a fan to increase power consumption of the electronic device 100 or a water pump to control movement of liquid.
In some embodiments of the application, at least one of the evaporation chamber 11 and the condensation chamber 12 is provided with a cooling fluid inlet 15. Thereby facilitating the pouring of the cooling liquid, which can be poured into the evaporation chamber 11 or the condensation chamber 12 through the cooling liquid inlet 15 after the start of use or after loss of the cooling liquid during use. For example, in the example shown in fig. 1, the end of the evaporation chamber 11 remote from the condensation chamber 12 is provided with a cooling liquid inlet 15.
Further, the heat sink 10 further includes a plug for plugging the coolant inlet 15, so that leakage of the coolant can be avoided. Of course, the cooling liquid inlet 15 may also be blocked by welding or other processes during the processing of the heat sink 10.
Optionally, as shown in fig. 1, the cooling liquid inlet 15 is opposite to the capillary channel 14, in order to prevent the cooling liquid injected into the evaporation cavity 11 from entering the capillary channel 14 or damaging the capillary structure 141 in the capillary channel 14, a baffle 112 is disposed in the evaporation cavity 11, and the baffle 112 is located between the capillary channel 14 and the cooling liquid inlet 15 to prevent the cooling liquid injected into the evaporation cavity 11 from the cooling liquid inlet 15 from impacting the capillary channel 14.
Alternatively, as shown in fig. 1, the capillary channel 14 extends in a straight line. Thereby facilitating the conduction of the cooling liquid in the condensation chamber 12 into the evaporation chamber 11 through the capillary phenomenon, and improving the circulation efficiency of the cooling liquid, thereby improving the heat dissipation efficiency of the electronic device 100. Of course, the application is not limited thereto and the capillary channel 14 may extend along a curve, without limitation.
As shown in fig. 1, the evaporation chamber 11 has a plurality of heat exchange channels 111 therein, one end of each heat exchange channel 111 communicates with the capillary channel 14, and the other end of each heat exchange channel 111 communicates with the communication channel 13. The plurality of heat exchange channels 111 are defined by the metal plate 1, and the inner peripheral wall of each heat exchange channel 111 is a metal piece, so that the heat exchange area of the cooling liquid and the metal plate 1 can be increased by the plurality of heat exchange channels 111, the heat exchange efficiency of the cooling liquid and the metal plate 1 is improved, the vaporization efficiency of the cooling liquid is improved, and the heat dissipation efficiency of the electronic equipment 100 is further improved.
In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Further, as shown in fig. 1, a plurality of heat exchange channels 111 may be arranged in parallel, thereby facilitating the flow of the cooling liquid. For example, in the example shown in fig. 1, the extending direction of each heat exchanging channel 111 is the direction from the condensation chamber 12 to the evaporation chamber 11 (the up-down direction as shown in fig. 1), and the plurality of heat exchanging channels 111 are arranged in parallel in the left-right direction.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
Alternatively, the heat exchange channels 111 extend along straight lines, or along fold lines, or along curved lines. Thereby increasing the variety of structures of the heat sink 10.
In the example shown in fig. 1, the evaporation chamber 11 and the condensation chamber 12 are respectively located at opposite ends of the metal plate 1, and the communication channel 13 and the capillary channel 14 are respectively located at other opposite ends of the metal plate 1. The evaporation chamber 11, the condensation chamber 12, the communication channel 13, and the capillary channel 14 generally form a rectangular closed loop, thereby being adaptable to the shape of more electronic devices 100. Of course, the present application is not limited thereto, and the positions of the evaporation chamber 11, the condensation chamber 12, the communication channel 13, and the capillary channel 14 may be flexibly adjusted according to the internal structure of the electronic device 100.
As shown in fig. 1, the metal plate 1 is hollowed out except for the evaporation chamber 11, the condensation chamber 12, the communication channel 13 and the capillary channel 14. It can be understood that the portion of the metal plate 1 excluding the evaporation chamber 11, the condensation chamber 12, the communication channel 13 and the capillary channel 14 has no metal plate 1 structure, whereby the area of the metal plate 1 can be reduced, the weight of the heat sink 10 can be reduced, the weight of the electronic device 100 can be reduced, and the material cost of the heat sink 10 can be saved.
Of course, the present application is not limited thereto, and the metal plate 1 may be a complete flat plate-like structure, and the evaporation chamber 11, the condensation chamber 12, the communication channel 13, and the capillary channel 14 are provided in the metal plate 1 and occupy portions of the metal plate 1, so that heat dissipation to other components of the electronic device 100 may be achieved by other structures on the metal plate 1 contacting with other components.
Optionally, the cooling liquid is a mixed liquid of ethylene glycol and water, the mixed liquid of ethylene glycol and water has a larger use temperature range than that of water liquid, and has a higher specific heat capacity than that of organic liquid. Wherein the proportion of glycol in the cooling liquid can be 50-60%, and the working temperature range is-35-110 ℃.
An electronic device 100 according to an embodiment of the present application is described below with reference to fig. 2 and 3.
As shown in fig. 2 and 3, the electronic device 100 according to the embodiment of the present application includes the housing 20, the motherboard 30, and the heat dissipating device 10 for the electronic device 100 described above.
Specifically, the main board 30 is disposed in the housing 20, the heat dissipating device 10 is disposed in the housing 20, the portion of the metal plate 1 having the evaporation cavity 11 is attached to the main board 30, the processor chip and the memory chip may be disposed on the main board 30, the heat on the main board 30 may be transferred to the cooling liquid in the evaporation cavity 11, the liquid may be vaporized to remove the heat, then the vapor may be transferred to the condensation cavity 12 through the communication channel 13, the heat is released in the condensation cavity 12 to be re-condensed into droplets, and then the liquid flows back into the evaporation cavity 11 through the capillary channel 14. This process is repeated to continuously take out the heat generated by the motherboard 30 of the electronic device 100, so as to solve the heat generation problem of the electronic device 100.
According to the electronic device 100 of the embodiment of the application, the heat dissipation device 10 is arranged in the metal plate 1-shaped structure, so that the heat dissipation device 10 is internally stacked in the electronic device 100, the heat dissipation efficiency can be improved, and the cooling liquid is sealed in the closed cavity formed by the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14, so that the circuit of the electronic device 100 is not damaged due to outflow, and the reliability of the operation of the electronic device 100 is ensured. In addition, the heat dissipating device 10 can take away the excessive heat generated by the heating element of the electronic device 100, and dissipate the heat in the transmission process, so as to avoid the overhigh temperature around the components and solve the fever problem of the electronic device 100. In addition, the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are all built in the metal plate 1, and the sizes of the parts can be adjusted according to the internal space of the electronic equipment 100, so that the application universality is enhanced. The heat sink 10 is a passive device that is effective in increasing heat dissipation and saves energy, and does not include a device such as a fan to increase power consumption of the electronic device 100 or a water pump to control movement of liquid.
Optionally, the electronic device 100 further includes a battery 40, the battery 40 is disposed in the housing 20 and spaced apart from the main board 30, the metal plate 1 is located on the same side of the main board 30 and the battery 40, the portion of the metal plate 1 having the communication channel 13 is attached to the battery 40, and the portion of the metal plate 1 having the condensation chamber 12 is spaced apart from both the battery 40 and the main board 30. The battery 40 can provide electric quantity for the electronic device 100, so that the electronic device 100 is more convenient to use without plugging in, and in addition, the part of the metal plate 1 with the communication channel 13 is attached to the battery 40, so that heat on the battery 40 can be further dissipated through the heat dissipating device 10.
By way of example, the electronic device 100 may be any of a variety of types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device 100 may be a mobile phone or a smart phone (e.g., an iPhone-based (TM) -based phone), a Portable game device (e.g., nintendo DS (TM) -based phone, playStation Portable (TM) -Gameboy Advance TM, iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headsets, etc., the electronic device 100 may also be other wearable devices (e.g., a head-mounted device (HMD) such as e-glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).
The electronic device 100 may also be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.
In some cases, the electronic device 100 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending phone calls). If desired, the electronic device 100 may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A heat sink for an electronic device, comprising:
the metal plate is of a metal plate structure, an evaporation cavity and a condensation cavity are formed in the metal plate, the evaporation cavity and the condensation cavity are spaced apart, a communication channel is further formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity;
the cooling liquid is filled in the evaporation cavity, the condensation cavity, the communication channel and the closed cavity formed by the capillary channels, a cooling liquid inlet is arranged on the evaporation cavity, the cooling liquid inlet is opposite to the capillary channels, a baffle is arranged in the evaporation cavity, and the baffle is positioned between the capillary channels and the cooling liquid inlet.
2. The heat sink for an electronic device according to claim 1, wherein the capillary channel extends along a straight line.
3. The heat dissipating device for an electronic apparatus of claim 1, wherein the evaporation chamber has a plurality of heat exchanging channels therein, one end of each of the heat exchanging channels being in communication with the capillary channel, and the other end of each of the heat exchanging channels being in communication with the communication channel.
4. A heat sink for an electronic device according to claim 3, wherein the heat exchanging channels extend along a straight line, or along a fold line, or along a curve.
5. The heat dissipating device for an electronic apparatus of claim 1, wherein the evaporation chamber and the condensation chamber are located at opposite ends of the metal plate, respectively, and the communication channel and the capillary channel are located at opposite ends of the metal plate, respectively.
6. The heat sink for electronic equipment according to claim 1, wherein the metal plate is hollowed out except for the evaporation chamber, the condensation chamber, the communication channel and the capillary channel.
7. The heat dissipating device for an electronic apparatus of claim 1, wherein the cooling liquid is a mixture of ethylene glycol and water.
8. An electronic device, comprising:
a housing;
the main board is arranged in the shell;
the heat dissipating device for electronic equipment according to any one of claims 1 to 7, wherein the heat dissipating device is provided inside the case, and a portion of the metal plate having the evaporation chamber is attached to the main board.
9. The electronic device of claim 8, further comprising:
the battery is arranged in the shell and is spaced from the main board, the metal plate is positioned on the same side of the main board and the battery, the part of the metal plate with the communication channel is attached to the battery, and the part of the metal plate with the condensation cavity is spaced from the battery and the main board.
CN202010908913.9A 2020-09-02 2020-09-02 Heat radiating device for electronic equipment and electronic equipment Active CN112105223B (en)

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Application Number Priority Date Filing Date Title
CN202010908913.9A CN112105223B (en) 2020-09-02 2020-09-02 Heat radiating device for electronic equipment and electronic equipment

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Application Number Priority Date Filing Date Title
CN202010908913.9A CN112105223B (en) 2020-09-02 2020-09-02 Heat radiating device for electronic equipment and electronic equipment

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Publication Number Publication Date
CN112105223A CN112105223A (en) 2020-12-18
CN112105223B true CN112105223B (en) 2023-08-15

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113133283B (en) * 2021-04-13 2023-10-20 上海天马微电子有限公司 Heat dissipation device and manufacturing method thereof
CN115551302A (en) * 2022-09-28 2022-12-30 华为数字能源技术有限公司 Heat dissipation system and electronic equipment

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TW201041492A (en) * 2009-05-08 2010-11-16 Foxconn Tech Co Ltd Heat dissipation device
CN102202488A (en) * 2010-03-26 2011-09-28 富准精密工业(深圳)有限公司 Heat-pipe heat radiation apparatus
CN103123234A (en) * 2011-11-18 2013-05-29 奇鋐科技股份有限公司 Thin heat pipe structure and forming method thereof

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CN100554852C (en) * 2005-09-23 2009-10-28 鸿富锦精密工业（深圳）有限公司 Heat pipe and heat radiation module

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Publication number Priority date Publication date Assignee Title
CN101307996A (en) * 2007-05-17 2008-11-19 私立淡江大学 Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure
TW201041492A (en) * 2009-05-08 2010-11-16 Foxconn Tech Co Ltd Heat dissipation device
CN102202488A (en) * 2010-03-26 2011-09-28 富准精密工业(深圳)有限公司 Heat-pipe heat radiation apparatus
CN103123234A (en) * 2011-11-18 2013-05-29 奇鋐科技股份有限公司 Thin heat pipe structure and forming method thereof

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