CN112099658B - Setting method of pointing device - Google Patents
Setting method of pointing device Download PDFInfo
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- CN112099658B CN112099658B CN201911200764.4A CN201911200764A CN112099658B CN 112099658 B CN112099658 B CN 112099658B CN 201911200764 A CN201911200764 A CN 201911200764A CN 112099658 B CN112099658 B CN 112099658B
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measurement Of Force In General (AREA)
Abstract
A setting method of a pointing device, comprising: the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the stressed strain deformation parts are jointed with the flexible circuit substrate; the method comprises the steps of (1) connecting a stress strain deformation part with a rigid support base through a plurality of screws, presetting a torque force of 20 cN.m for each screw, fixing the stress strain deformation part on the rigid support base, and enabling the stress strain deformation part to generate a preset deformation; and according to the collected sampling data of each piece of resistance type detection strain part, screwing in or screwing out a screw at a position corresponding to the piece of resistance type detection strain part, so that the sampling data values of all resistance type detection strain sensors of each piece of resistance type detection strain part are controlled between 2000 ohms and 3200 ohms. The invention solves the problems that the characteristics of each part before and after the embedding are possibly changed due to the embedding mode in the current manufacturing process of the pointing device, the detection process is more, the subsequent adjustment cannot be carried out, and the cost is high.
Description
Technical Field
The application relates to the technical field of resistance strain gauge sensors, in particular to a setting method of a pointing device.
Background
Currently, resistive strain gauge sensors are increasingly used in various electronic devices as pointing devices, such as notebook computers, mice, keyboards, hand-held devices, or joysticks, and the resistive strain gauge sensors can be used to provide input functions. The keyboard keys of the notebook computer are commonly provided with the resistance strain gauge sensor at a position close to the center, so that a user can sense the poking force and poking direction of the user only by touching the poking sensor with fingers, and the cursor on the screen can generate corresponding speed and displacement.
The existing resistance strain gauge sensor mainly comprises: the portable electronic device includes a housing, an operating portion housed in the housing, and a detection means for detecting deformation of the operating portion, wherein the operating portion is integrally formed with an operating portion, a fixing portion, and a deformation portion, the deformation portion is deformable by an operating force acting on the operating portion, the detection means is provided on the deformation portion, the fixing portion is fixed in the housing, and the operating portion and the deformation portion are movable in the housing. The operation portion of the input device is fixed inside a housing that is mounted to a substrate or the like of the keyboard apparatus. Therefore, when an operating force acts on the operating portion of the operating portion and deformation is applied to the deforming portion, the case is less likely to fall off from the substrate or the like.
The resistive strain gauge sensor design of this type mainly connects the deformation portion and the fixing portion in a fitting manner. However, the fitting method may cause a change in characteristics of each part before and after fitting, and the detection process is numerous and cannot be adjusted subsequently; because a plurality of quality variables simultaneously appear during the embedding, including inconsistent stress of the deformation part, micro deformation caused by the embedding process, and mutual influence generated during the embedding process of the deformation part and the fixed part; because the processing characteristics of the embedding mode lead to a plurality of processing procedures, the alignment action is difficult to be continuously carried out after the assembly, and the cost is high, so that the product application and popularization are not facilitated; moreover, the sensor has extremely high requirements on production equipment and a large number of detection and fine adjustment procedures on detection components, so that the product discreteness or the processing cost is increased. When the conventional sensor is attached to a structure of the electronic device, such as a keyboard body, through a fastening hole fastening screw of a fixing assembly, the overall height and the overall weight of the electronic device are increased, and thus, the electronic device is bulky, resulting in an increase in weight; in addition, the conventional stress sensor at present needs a large number of components, is complex in structure and large in size, cannot be miniaturized, further influences the application environment, reduces the assembly efficiency and increases the cost.
There is thus a current need for a new pointing device solution to the above problems.
Disclosure of Invention
The embodiment of the application provides a setting method of a pointing device, which solves the problems that characteristics of each part before and after embedding are possibly changed due to embedding in the current manufacturing process of the pointing device, and the detection process is more and cannot be adjusted subsequently; and a plurality of quality variables simultaneously appear during the jogging, including inconsistent stress of the deformation part, micro deformation caused by the jogging procedure, and mutual influence generated during the jogging process of the deformation part and the fixed part; meanwhile, the processing characteristics of the embedding mode lead to a plurality of processing procedures, so that the calibration action is difficult to be continuously realized after the assembly, and the cost is high, thereby being not beneficial to the application and popularization of products; the sensor has extremely high requirements on production equipment and a large number of detection and fine adjustment procedures on detection components, so that the product discreteness or the processing cost is improved; in addition, the conventional stress sensor at present needs a large number of components, is complex in structure and large in size, cannot be miniaturized, further influences the application environment, reduces the assembly efficiency and increases the cost.
In order to solve the above-mentioned problems, an embodiment of the present application provides a setting method of a pointing device, including: the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the stressed strain deformation parts are jointed with the flexible circuit substrate provided with the resistance type detection strain parts;
the method comprises the steps of presetting a torsion force of 20 cN.m for each screw in the process of bonding the stress strain deformation part after bonding with the flexible circuit substrate and the rigid support base through a plurality of screws, fixing the stress strain deformation part on the rigid support base, and enabling the stress strain deformation part to generate preset deformation; sampling data of each resistance type detection strain part are collected, screws at positions corresponding to the resistance type detection strain parts are screwed in or out according to different sampling data of the resistance type detection strain parts, so that sampling data values of all resistance type detection strain sensors of each resistance type detection strain part are controlled to be between 2000 ohms and 3200 ohms, and the bonding process of the stress strain deformation part and the rigid support base is completed.
Compared with the prior art, the through holes arranged on the stressed strain deformation part are jointed with the rigid support base through the screws, so that the defects of the previous embedding process are avoided, the process is reduced, the discreteness of products is reduced, the number of parts and the whole volume are reduced, the pointing device is miniaturized, and the pointing device can be applied to various scenes; meanwhile, after the components are combined, the components are stable, the generation efficiency is improved, and meanwhile, the processing cost is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a schematic flow chart of a specific implementation of a setting method of a pointing device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a flexible circuit board provided with the resistive sensing strain portion according to an embodiment of the present application;
fig. 3 and 4 are schematic structural views of an upright arrangement and an inverted arrangement of a stress strain deformation provided in an embodiment of the present application;
FIGS. 5, 6 and 7 are schematic diagrams of front, side and bottom cross-sections of a stress strain gage provided in an embodiment of the present application;
FIG. 8 is a schematic view of a rigid support base provided in an embodiment of the present application;
FIGS. 9 and 10 are schematic views of screws according to embodiments of the present application;
fig. 11 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;
fig. 12 and 13 are schematic diagrams of a front cross section and a bottom cross section of a flexible circuit substrate according to an embodiment of the present application.
Detailed Description
For the purposes, technical solutions and advantages of the present application, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Fig. 1 is a method for setting a pointing device according to an exemplary embodiment, which specifically includes the following steps:
step 110, arranging a plurality of resistance type detection strain parts on the flexible circuit substrate, and performing joint operation on the stress strain deformation parts and the flexible circuit substrate provided with the resistance type detection strain parts;
as shown in fig. 2, the method further comprises: the number of the resistance type detection strain parts 71 is not less than 3, the resistance type detection strain parts 71 are orderly arranged on the flexible circuit substrate 41 according to a sensor acquisition rule algorithm, and the arranged surface is opposite to the joint surface of the flexible circuit substrate and the stress strain deformation parts. When exerting effort to atress strain deformation portion, effort transfer to flexible line way base plate on, a plurality of resistance-type detection strain portions on the flexible line way base plate can be corresponding obtain feedback signal through the change that gathers resistance value, and a plurality of resistance-type detection strain portions of orderly arranged setting gather the deformation volume of atress strain deformation portion through resistance-type change, and such setting can improve the precision of gathering and improve response speed simultaneously, brings better user's use experience. In this application, the number of resistive detection strain parts is required to be not less than 3, so that the accuracy and response speed of collection can be greatly improved, and 4 resistive detection strain parts are set in fig. 2, but the positions and specific number of the set resistive detection strain parts are not limited in this application.
The resistive type strain detecting part is arranged on the flexible circuit substrate in a Printing mode or a Coating mode. The mode can ensure that the resistance type strain detecting part is arranged on the flexible circuit substrate, the thickness of the flexible circuit substrate is not greatly increased, the technology is mature, the cost is low, the yield of products is greatly improved, and the method is suitable for large-scale commercial application.
Wherein, a fitting surface positioning groove structure is arranged at the bottom of the stress strain deformation part; the stress strain deformation part provided with the bonding surface positioning groove structure is bonded with the flexible circuit substrate provided with the resistance type detection strain part through the adhesive bonding layer with high stress conductivity;
as shown in fig. 3 and 4, further comprising: the stress strain deformation portion 10 is configured as a cylindrical boss type structure, the fitting surface positioning groove 11 is configured at the bottom of the cylinder of the stress strain deformation portion, the boss is disposed at the center of the cylinder, and the boss may be in a cubic shape, or may be in a shape similar to a cube, for example: the corners are provided as cubes in the form of arcs, which are not limited in any way by the present application.
Further comprises: the middle part of the boss is also provided with a hollow structure hole 14 (the hollow structure can reduce the rigidity intensity of the stressed strain deformation part, bring better touch effect, improve the control accuracy and improve the use experience of a user, and because of the hollow structure, when the acting force is applied to the stressed strain deformation part, the acting force can be dispersed to each part of the boss of the stressed strain deformation part, the stressed strain deformation part is not easy to fatigue, and the probability of breakage of the stressed strain deformation part can be reduced); the hollow structure hole is a cylindrical hollow structure hole.
As shown in fig. 3 and 4, further comprising: the cylinder of the stress strain deformation part is provided with a plurality of through holes 13 (through holes for installing the assembly screws), the through holes 13 are uniformly arranged on the cylinder (the stress of the assembled screws after installation can be ensured to be uniform), and the stress strain deformation part passes through the corresponding through holes through the screws to be connected with the rigid support base. The number of through holes on the cylinder of the stress strain deformation part is 4, the application is not limited in any way, the 4 through holes are uniformly arranged on the cylinder, wherein two intersecting lines are formed by connecting lines of any 2 opposite through holes, 4 included angles formed by the intersecting lines are right angles, and the intersecting points of the 2 intersecting lines are on the axis of the cylinder. The arrangement mode can ensure that the stress on the assembled screw after installation is uniform.
As shown in fig. 5, 6 and 7, the diameter of the cross section of the cylinder of the stress strain deformation portion is set to 7.0mm or more and 25.0mm or less.
Four through holes 1404 arranged on the stress strain deformation part can use M1.8P0.2 specification screws, and the four through holes are arranged to be greater than or equal to 1.2mm and less than or equal to 10.0mm corresponding to horizontal pitches 1401, 1402, 1406 and 1407, so that the stress strain deformation part can be well bonded; the stress columnar structure 1403 in the stress strain deformation part is set to have a unilateral length of more than or equal to 1.2mm and less than or equal to 5.0mm; the diameter of the hollow structure aperture 1409 of the stress columnar structure in the stress strain deformation part is more than or equal to 0.2mm and less than or equal to 4.0mm; the diameter of the edges R of the hollow structure of the stress columnar structure in the stress strain deformation part is larger than or equal to 0.02mm and smaller than or equal to 2.20mm; the depth of the hollow structure of the stress columnar structure in the stress strain deformation part is set to be 1413 mm or more and 8.2mm or less.
The size and the shape of the jointing surface positioning groove arranged on the bottom surface of the stress strain deformation part are composed of 1414,1415,1416,1417,1418,1419,1421,1422,1423 in fig. 7, the size and the shape of the jointing surface positioning groove are matched with the external size of the flexible circuit substrate, the depth of the jointing surface positioning groove is more than or equal to 0.02mm and less than or equal to 4.20mm, the depth can ensure that the narrower end of the flexible circuit substrate is well placed in the stress strain deformation part, the processing is easy, the assembly is convenient, the assembly error can be reduced, and the production efficiency is improved.
The setting mode is easy to process and convenient to assemble, can reduce assembly errors and improves production efficiency.
As shown in fig. 4, further includes: the shape of the joint surface positioning groove of the stress strain deformation part is matched with the shape of the joint surface of the flexible circuit substrate, the joint surface of the flexible circuit substrate is provided with a positioning hole, and the joint surface positioning groove 11 of the stress strain deformation part is correspondingly provided with a positioning column 12 matched with the positioning hole.
Further comprises: the number of the positioning columns is at least 2, and a plurality of positioning columns are uniformly arranged in the joint surface positioning grooves 11 of the stress strain deformation parts.
When the bottom surface of the stress strain deformation part is jointed with the flexible circuit substrate, the flexible circuit substrate can be positioned by using two positioning columns, and the flexible circuit substrate can be conveniently arranged in the joint surface positioning groove of the stress strain deformation part through the positioning columns, so that the stress strain deformation part and the flexible circuit substrate are jointed. The positioning column is set to be 0.3mm or more and 5.0mm or less in size, and the positioning column is convenient to position with the base and position with the flexible circuit board in actual operation.
In practical tests, the material of the adhesive bonding layer with high stress conductivity can be a bonding material with high density, high hardness and high modulus (for example, the material with stress conductivity at least greater than 2 Pa), so that when a force is applied to the stressed strain deformation part, the force applied by the adhesive bonding layer with high stress conductivity can be transferred to the flexible circuit substrate as far as possible under the condition of reducing loss, a sensor on the flexible circuit substrate can correspondingly acquire a feedback signal through acquiring the change of a resistance value, and the sensor acquiring the deformation quantity through resistance change has high precision and high response speed, thereby bringing better user experience.
Wherein, the joint of atress strain deformation portion and flexible line way base plate that is equipped with faying face positioning groove structure is the step that can bond the two together through the high adhesive lamination layer of stress conductivity, includes: the bonding of the stress strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate is realized by adopting a dispensing mode (for example, a VISHAY M-bond 200kit quick-drying glue is adopted for dispensing), or by adopting a sheet type double-sided adhesive with high stress conductivity.
The step of joining the stress strain deformation part provided with the joint surface positioning groove structure and the flexible circuit substrate together through a sheet type double faced adhesive tape with high stress conductivity comprises the following steps: the shape of the sheet type double-sided adhesive tape is matched with the shape of the binding face positioning groove of the stressed strain deformation part, and the sheet type double-sided adhesive tape is provided with a positioning hole matched with the positioning column.
The flexible circuit substrate can be conveniently arranged in the joint surface positioning groove of the stress strain deformation part through the positioning hole of the sheet double faced adhesive tape, and the stress strain deformation part and the flexible circuit substrate are bonded.
Further, in the process of bonding the stress strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate by a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining and fixing time is not less than 5 minutes;
the pressure maintaining jig mode is used for bonding and curing operation, so that the contact surface of the pressure maintaining jig mode and the bonding jig mode is uniform and smooth, the phenomena of air bubbles, warping and degumming are avoided, and the yield of the product is greatly improved.
In practice, the pressure maintaining parameters and the curing time during dispensing are different according to the glue or the adhesive film used, taking the M-bond 200kit quick-drying glue of VISHAY as an example, and under the working environment of 20 ℃ to 30 ℃, the relative humidity ranges from 30% to 70%, 5.0 newton is used as the curing pressure maintaining acting force, and the pressure maintaining is carried out for 5 minutes to complete the curing step. When other bonding materials are used, the dwell time and the curing conditions can be slightly adjusted according to the individual characteristics of the materials, but the curing dwell force is set to be more than or equal to 5.0 newtons, and the dwell fixing time is not less than 5 minutes, so that the bonding curing effect can be ensured, the bonding contact surface of the flexible circuit substrate and the stress strain deformation part can be ensured to be even and smooth, and the phenomena of bubbles, warping and degumming can not be generated; the peristaltic glue dispenser or sheet type double sided adhesive tape is used as a bonding layer, the process of setting the bonding layer can be implemented on the back surface of the flexible circuit substrate and then bonded with the plane of the bonding surface positioning groove area set by the stress strain deformation part, or the process of setting the bonding layer can be implemented on the plane of the bonding surface positioning groove area set by the stress strain deformation part and then bonded with the back surface of the flexible circuit substrate, and the processes of setting can realize the bonding operation of the flexible circuit substrate and the stress strain deformation part, so that the bonding operation is not limited in the application.
Step 120, presetting a torque force of 20 cN.m for each screw in the process of bonding the stress strain deformation part after bonding the flexible circuit substrate and the rigid support base through a plurality of screws, fixing the stress strain deformation part on the rigid support base, and enabling the stress strain deformation part to generate a preset deformation; sampling data of each piece of resistance type detection strain part is collected, and according to different sampling data of each piece of resistance type detection strain part, a screw at a position corresponding to the piece of resistance type detection strain part is screwed in or screwed out, so that the sampling data value of each piece of resistance type detection strain part is controlled between 2000 ohms and 3200 ohms, and the process of jointing the stressed strain deformation part and the rigid support base is completed.
The rigid support base can be made of metal materials, and in practice, 304 stainless steel can be adopted, so that the material has strong environment adaptability, good water resistance and moisture resistance, low cost, high strength and convenient processing, and is very suitable for large-scale commercial application; of course, copper, aluminum, and the like may be used herein, and this is not a limitation of the present application.
As shown in fig. 8, the spacing 2102 between the centers of the two positioning holes used when the rigid support base is assembled with the finished product may be set to be 8.0mm or more and 30.0mm or less; the aperture 2108 may be set to 0.3mm or more and 5.0mm or less, which facilitates assembly of the product.
The two positioning holes 2107 of the rigid support base can be assembled by using M1.8P0.2 specification screws, so that the rigid support base can be accurately assembled on a product.
The aperture of the rigid support base and the stress strain deformation part can be set to be more than or equal to 0.2mm and less than or equal to 5.0mm by using two positioning holes 2109 when the rigid support base and the stress strain deformation part are connected; thus being convenient for positioning and convenient for installation.
Four screw holes 2104 are used when the rigid support base and the stressed strain deformation part are connected through screws, M1.8P0.2 specification screws (M is the outer diameter of a thread and is 1.8mm, and P is the pitch of a general finger thread and is 0.2 mm) are used, and the arrangement is convenient for accurately assembling products.
As shown in fig. 9 and 10, the screw connecting the rigid support base and the stressed strain deformation portion may have a cross structure dimension 3001 of 0.9mm or more and 3.2mm or less. The screw and thread engagement ramp top dimension 3002 may be set to 0.8mm or greater and 3.2mm or less. The screw cap diameter 3003 may be sized to be 1.2mm or greater and 5.0mm or less. Screw threads 3004 in the example are designed to be a M1.0P0.2 thread gauge screw. The screw cap thickness 3005 may be set to 1.5mm or less and 0.2mm or more, and the screw thread portion length 3006 may be set to 5.2mm or less and 1.0mm or more. The length of the deep-strain deformation portion 3007 other than the screw cap may be set to 0.8mm or more and 10.0mm or less. The screw design mode is convenient to install, assembly errors can be reduced, and production efficiency is improved.
The spacing 2105 between four screw holes used when the center of a positioning hole used when the rigid support base is assembled and the stressed strain deformation structure are connected can be set to be more than or equal to 0.8mm and less than or equal to 18.0mm; the above arrangement facilitates accurate assembly of the product
The spacing 2106 between four screw holes used when the center of the positioning hole used when the rigid support base is assembled with the stressed strain deformation structure is larger than or equal to 1.8mm and smaller than or equal to 20.0mm; the above arrangement facilitates accurate assembly of the product.
The design mode can enable processing to be easy and convenient to install, meanwhile, assembly errors are reduced, product precision is improved, and good user experience is brought.
The step of collecting the sampling data of each piece of resistance type detection strain part comprises the following steps: and connecting the signal contact points of the resistance type detection strain parts of the flexible circuit substrate with a testing device, and collecting sampling data of each resistance type detection strain part.
As shown in fig. 11, 12 and 13, further comprising: the flexible circuit board 41 is provided with a strip-shaped special structure, which has a width and a length, the flexible circuit board is provided with a strip-shaped special structure, the special structure is provided with two wider ends and a narrower middle part which are connected through a wire, the width of the flexible circuit board wire outlet position at the edge of the binding face positioning groove of the stress strain deformation part is reduced, a plurality of pins are arranged at one wider end and are connected with a corresponding interface of an external device, and the upper surface of the other end of the pin which is not provided with the pins is connected with the stress strain deformation part.
The length 4116 of the flexible wiring substrate is set to 50.0mm or more and 150.0mm or less.
The width 4223 of the flexible wiring board is set to 5mm or more and 10mm or less.
The flexible circuit substrate is of a special structure, the front part is thin, the rear part is wide, and the angle of edge lead angles 4113 and 4114 at the width change part is set to be 135 degrees.
The front end of the flexible wiring board is designed as a printed resistance type strain detecting member region, and the widths 4105, 4112 thereof are set to 0.5mm or more and 7.0mm or less. The smaller size can make the module compact, contributing to the miniaturization of the module of the pointing device.
The front end of the flexible circuit substrate is tightly attached in the attaching surface positioning groove of the stressed strain deformation part, and the positioning hole spacing 4102 is consistent with the size of the positioning column of the stressed strain deformation part. The design mode can ensure that the installation angle of the pointing device is accurate, the stress is even, and the detection precision can be improved.
The flexible circuit substrate is connected with the interfaces corresponding to the external device through the pins, and the flexible circuit substrate is convenient to assemble quickly due to proper length and width, so that the reliability of the product is ensured.
The plurality of pins extend along the axial direction of the flexible circuit substrate and extend out of the edge of the wider end of the flexible circuit substrate, and the arrangement is convenient for connecting with an interface corresponding to an external device. The inner portions of the pins are constrained inside the flexible circuit substrate.
The stress strain deformation part is made of a material which is prepared by blending polyphenyl ether and polystyrene into modified polyphenyl ether (MPPE) with a thermal deformation temperature of 90-175 ℃, a small dielectric constant and a small dielectric loss tangent value and good water resistance and heat resistance. The MPPE has lower melt viscosity, is easier to injection mold during processing, is not easy to generate stress cracking phenomenon after molding, has good water resistance and heat resistance and low price, is very suitable for being used as a component for long-time touch operation of the stress strain deformation part of the application, and is very suitable for large-scale commercial application.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that, in the present application, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device embodiments, since they are substantially similar to the method embodiments, the description is relatively simple, and reference is made to the description of the method embodiments in part.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises an element.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (8)
1. A setting method of a pointing device, comprising:
the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the stressed strain deformation parts are jointed with the flexible circuit substrate provided with the resistance type detection strain parts; the stress strain deformation part is arranged to be of a cylindrical boss structure, the boss is arranged at the center of the cylinder, the boss is in a cube shape, the middle part of the boss is provided with a hollow structure hole, and the hollow structure hole is a cylindrical hollow structure hole;
the method comprises the steps of presetting a torsion force of 20 cN.m for each screw in the process of bonding the stress strain deformation part after bonding with the flexible circuit substrate and the rigid support base through a plurality of screws, fixing the stress strain deformation part on the rigid support base, and enabling the stress strain deformation part to generate preset deformation; sampling data of each resistance type detection strain part are collected, screws at positions corresponding to the resistance type detection strain parts are screwed in or out according to different sampling data of the resistance type detection strain parts, so that sampling data values of all resistance type detection strain sensors of each resistance type detection strain part are controlled to be between 2000 ohms and 3200 ohms, and the bonding process of the stress strain deformation part and the rigid support base is completed.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
further comprises: the resistance type detection strain parts are arranged to be not less than 3, the not less than 3 resistance type detection strain parts are orderly arranged on the flexible circuit substrate according to a sensor acquisition rule algorithm, and the arranged surface is opposite to the joint surface of the flexible circuit substrate and the stress strain deformation parts.
3. The method of claim 2, wherein the step of determining the position of the substrate comprises,
the resistive type strain detecting part is arranged on the flexible circuit substrate in a Printing mode or a Coating mode.
4. A method according to claim 3, comprising:
further comprises: the cylinder of the stress strain deformation part is provided with a plurality of through holes which are uniformly arranged on the cylinder, and the stress strain deformation part is connected with the rigid support base by penetrating through the corresponding through holes through a plurality of screws.
5. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
further comprises: the number of through holes on the cylinder of the stress strain deformation part is 4, and the 4 through holes are uniformly arranged on the cylinder, wherein two intersecting lines are formed by connecting lines of any 2 opposite through holes, 4 included angles formed by the intersecting lines are right angles, and the intersecting points of the 2 intersecting lines are on the axis of the cylinder.
6. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
further comprises: the flexible circuit substrate is provided with a strip-shaped special structure, the two ends of the special structure are wider, the middle of the special structure is connected through a narrower wiring, a plurality of pins are arranged at one wider end of the special structure and are connected with a corresponding interface of an external device, and the upper surface of the other end of the special structure, which is not provided with the pins, is connected with the stressed strain deformation part.
7. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
the step of collecting the sampling data of each piece of resistance type detection strain part comprises the following steps: and connecting the signal contact points of the resistance type detection strain parts of the flexible circuit substrate with a testing device, and collecting sampling data of each resistance type detection strain part.
8. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
the stress strain deformation part is made of a material which is prepared by blending polyphenyl ether and polystyrene into modified polyphenyl ether with a thermal deformation temperature of 90-175 ℃, a small dielectric constant and a small dielectric loss tangent value and good water resistance and heat resistance.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200764.4A CN112099658B (en) | 2019-11-29 | 2019-11-29 | Setting method of pointing device |
| PCT/CN2020/131571 WO2021104331A1 (en) | 2019-11-29 | 2020-11-25 | Method for providing pointing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200764.4A CN112099658B (en) | 2019-11-29 | 2019-11-29 | Setting method of pointing device |
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| Publication Number | Publication Date |
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| CN112099658A CN112099658A (en) | 2020-12-18 |
| CN112099658B true CN112099658B (en) | 2024-02-20 |
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|---|---|---|---|
| CN201911200764.4A Active CN112099658B (en) | 2019-11-29 | 2019-11-29 | Setting method of pointing device |
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| CN (1) | CN112099658B (en) |
| WO (1) | WO2021104331A1 (en) |
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| CN211742091U (en) * | 2019-11-29 | 2020-10-23 | 深圳市汇创达科技股份有限公司 | Jointing device of pointing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2021104331A1 (en) | 2021-06-03 |
| CN112099658A (en) | 2020-12-18 |
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