CN112099598A - Cloud computing fan-free industrial personal computer - Google Patents
Cloud computing fan-free industrial personal computer Download PDFInfo
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- CN112099598A CN112099598A CN202010930856.4A CN202010930856A CN112099598A CN 112099598 A CN112099598 A CN 112099598A CN 202010930856 A CN202010930856 A CN 202010930856A CN 112099598 A CN112099598 A CN 112099598A
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- heat
- heat conduction
- personal computer
- industrial personal
- cloud computing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/32—Monitoring with visual or acoustical indication of the functioning of the machine
- G06F11/324—Display of status information
- G06F11/327—Alarm or error message display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Human Computer Interaction (AREA)
- Computing Systems (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of cloud computing equipment, and discloses a cloud computing fan-free industrial personal computer which comprises a shell, wherein an integrated circuit board is fixedly installed at the bottom end of an inner cavity of the shell, a power supply element is fixedly installed on one side of the surface of the integrated circuit board, and a CPU element is fixedly installed on the other side of the surface of the integrated circuit board. The semiconductor refrigeration piece is adopted to generate the states of heat and cold ends, the cold end absorbs the heat generated by the CPU end, so that the effect of direct cooling is achieved, the heat-conducting rubber air bag is heated to generate gas expansion, and the heat-conducting rubber air bag is pressed against the upper heat-radiating fins to generate a certain distance gap with the CPU end, when the heat-radiating fins move downwards under the action of external pressure, the gap can have an auxiliary buffering effect, and the heat-conducting rubber air bag is not in direct contact with the CPU end, so that when the pressure is transmitted downwards, the pressure is directly transmitted to the heat-conducting rubber air bag, and certain buffering loss occurs, so that the purposes of shock absorption and buffering and CPU end safety protection are achieved.
Description
Technical Field
The invention relates to the technical field of cloud computing equipment, in particular to a cloud computing fan-free industrial personal computer.
Background
With the innovation and development of internet technology, cloud computing becomes a new network technology, which mainly takes the internet as a center and provides fast and safe data service and storage on the network, wherein a fanless industrial personal computer is particularly applied, and the fanless industrial personal computer is an integrated and enhanced industrial computer and operates in an industrial environment as a controller.
Compared with the fan heat dissipation function of the traditional industrial personal computer, the fan-free industrial personal computer adopts the metal sheet and the heat conduction silica gel sheet adhered on the CPU to conduct heat, and then utilizes the heat dissipation fins to conduct shell heat dissipation, thereby greatly reducing the maintenance requirement, leading the structure of the industrial personal computer to be more compact and being better suitable for industrial environment, but because the fan-free industrial personal computer only adopts the metal sheet and the heat conduction silica gel sheet, the speed of heat conduction output of the CPU end is not high in the heat conduction process, further leading the heat dissipated by the heat dissipation fins to be limited, the heat dissipation effect of the whole mechanism of the industrial personal computer is not good, in addition, because the metal sheet, the heat conduction silica gel sheet and the heat dissipation fins are sequentially and directly contacted and connected with the CPU, when the heat dissipation fins receive external pressure, the metal sheet and the heat conduction silica gel sheet have the impact resistance effect, therefore, the pressure received by the heat dissipation, accidental damage occurs, and further the industrial personal computer is caused to have operation failure.
Disclosure of Invention
Aiming at the defects of the existing fan-free industrial personal computer in the use process in the background technology, the invention provides the cloud computing fan-free industrial personal computer which has the advantages of improving the heat conduction effect, strengthening the heat dissipation function, damping and buffering and protecting a CPU end, and solves the technical problems in the background technology.
The invention provides the following technical scheme: a cloud computing fan-free industrial personal computer comprises a shell, wherein an integrated circuit board is fixedly arranged at the bottom end of an inner cavity of the shell, a power supply element is fixedly arranged on one side of the surface of the integrated circuit board, a CPU element is fixedly arranged on the other side of the surface of the integrated circuit board, the top end of the CPU element is fixedly provided with a heat-conducting silica gel sheet, the middle part of the top end of the heat-conducting silica gel sheet is fixedly provided with a semiconductor refrigerating sheet, two heat conducting fins are fixedly arranged on two sides of the semiconductor refrigerating fin, the top ends of the two heat conducting fins are fixedly connected with a heat conducting hose, one end of the heat conduction hose is fixedly provided with a heat conduction connecting sheet, one end of the heat conduction connecting sheet is fixedly connected with a heat conduction rubber air bag, one of the heat conducting rubber air bag is fixedly provided with a vent pipe in the middle of one end, one end of the vent pipe is fixedly provided with a two-way pressure valve, and the top end of the casing is movably provided with a heat radiating fin capable of moving up and down.
Preferably, the middle of the top end of the casing is provided with a circle of channel, and the position of the channel is opposite to the protruding position of the middle of the bottom end of the radiating fin.
Preferably, the current supplied by the power supply element is direct current and is positively connected with two poles of the semiconductor chilling plate.
Preferably, the length and width values of the heat-conducting silica gel sheet are equal to those of the CPU element.
Preferably, the heat conduction silicone grease is coated on the outer part of the heat conduction hose and the inner wall of the tube cavity, and the tube body has the characteristic of reversible deformation.
Preferably, the shape of heat conduction rubber gasbag is rectangle, and the top both sides are equipped with the pincher trees texture, two the relative inboard one end intercommunication of heat conduction rubber gasbag.
Preferably, the bidirectional pressure valve can be opened bidirectionally, and the opening and closing of the valve is determined by the pressure value applied to the valve.
The invention has the following beneficial effects:
1. according to the invention, by adopting the semiconductor refrigeration piece and utilizing the direct current power supply element, the thermoelectric effect is generated at two ends of the semiconductor refrigeration piece through the internal energy change of the thermoelectric element group in the semiconductor refrigeration piece, the states of the hot end at the upper end and the cold end at the lower end are generated, the environment is absorbed due to the temperature reduction of the cold end, and the heat generated at the CPU end can be absorbed, so that the direct cooling effect is achieved, the heat conduction efficiency is improved, the heat dissipation effect is enhanced, when the cold end absorbs heat, the heat contained in the hot end is conducted and dissipated through the heat dissipation fins, the heat energy is prevented from being accumulated in the industrial personal.
2. The invention adopts the heat-conducting hose and the heat-conducting rubber air bag, and the heat-conducting sheet and the heat-conducting connecting sheet to conduct the heat energy generated at the hot end of the semiconductor refrigerating sheet to the heat-conducting rubber air bag, and the temperature is increased due to the heating of the gas, so as to cause the air bag to generate gas expansion, when the gas expands, the top of the heat-conducting rubber air bag pushes against the upper heat-radiating fins, so that the position of the heat-conducting rubber air bag moves upwards, and a certain distance gap is generated between the heat sink and the CPU end, if the heat sink is pressed by the external force to move down, the gap has an auxiliary buffering effect, and in addition, when the pressure applied on the heat dissipation fins is transferred downwards, because the heat conduction rubber air bag has upward supporting force to the heat dissipation fins, and the heat conduction rubber air bag is not in direct contact with the CPU end, therefore, when pressure is transmitted downwards, the pressure can be directly transmitted to the heat-conducting rubber air bag, and certain buffer loss occurs, so that the purposes of shock absorption and buffering and CPU end safety protection are achieved.
3. The invention uses the two-way pressure valve, when the heat-conducting rubber air bag is heated and expanded to a certain limit, the internal pressure is too high, the gas squeezes the valve to make the valve bear a certain pressure, when the pressure reaches a rated value, the valve is opened, the gas in the heat-conducting rubber air bag is discharged, and a large amount of gas flows out from the vent pipe orifice, so that the pipe orifice generates gas whistling sound, and when the heat-conducting rubber air bag is deflated, the heat-radiating fins move downwards due to the reduction of the bottom supporting force, thereby achieving the effect that the industrial personal computer can automatically warn when the internal temperature is too high, in addition, when the heat-conducting rubber air bag is deflated, the internal pressure is reduced, when the pressure is reduced to the standard atmospheric pressure, the vent pipe orifice generates a negative pressure state, thereby the external gas is sucked in a backflow manner, the heat-conducting rubber air bag is filled, when the internal pressure of, thereby closing the valve again and realizing the effect of gas recycling.
Drawings
FIG. 1 is a schematic cross-sectional perspective view of the present invention;
FIG. 2 is a perspective view of the structural enclosure of the present invention;
FIG. 3 is a perspective view of a CPU component according to the present invention;
FIG. 4 is a perspective view of the heat-conducting rubber bladder of the present invention.
In the figure: 1. a housing; 2. an integrated circuit board; 3. a power supply element; 4. a CPU element; 5. a heat-conducting silica gel sheet; 6. a semiconductor refrigeration sheet; 7. a heat conductive sheet; 8. a heat conducting hose; 9. a heat conducting connecting sheet; 10. a heat-conducting rubber bladder; 11. a breather pipe; 12. a bi-directional pressure valve; 13. and heat dissipation fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a cloud computing fan-less industrial personal computer comprises a housing 1, an integrated circuit board 2 is fixedly installed at the bottom end of an inner cavity of the housing 1, a power supply element 3 is fixedly installed at one side of the surface of the integrated circuit board 2, a CPU element 4 is fixedly installed at the other side of the surface of the integrated circuit board 2, a heat-conducting silicon sheet 5 is fixedly installed at the top end of the CPU element 4, a semiconductor refrigerating sheet 6 is fixedly installed at the middle part of the top end of the heat-conducting silicon sheet 5, and a thermoelectric effect is generated at two ends of the semiconductor refrigerating sheet 6 by utilizing the internal energy change of a thermoelectric element group inside the semiconductor refrigerating sheet 6 through the direct current power supply element 3 to generate a state of an upper end hot end and a lower end cold end, so that the environment is absorbed by the temperature of the cold end, heat generated at the, two sides fixed mounting of semiconductor refrigeration piece 6 has two conducting strips 7, the top fixedly connected with heat conduction hose 8 of two conducting strips 7, the one end fixed mounting of heat conduction hose 8 has heat conduction connection piece 9, the one end fixedly connected with heat conduction rubber gasbag 10 of heat conduction connection piece 9, the one end middle part fixed mounting of one of them heat conduction rubber gasbag 10 has breather pipe 11, the one end fixed mounting of breather pipe 11 has two-way pressure valve 12, the top movable mounting of casing 1 has heat radiation fins 13 that can reciprocate, heat radiation fins 13 can adopt flexible bag with being connected of casing 1, can spacing piston installation.
The middle of the top end of the case 1 is provided with a circle of channel, the position of the channel is opposite to the protruding position of the middle of the bottom end of the heat dissipation fin 13, when the heat conduction rubber air bag 10 upwards presses the heat dissipation fin 13, the heat dissipation fin 13 can stably move upwards, and when a gap is generated between the heat dissipation fin 13 and the case 1, the protruding part of the middle of the bottom end of the heat dissipation fin 13 can block the external environment, so that the whole tightness of the industrial personal computer is kept.
When the direct current supplied by the power element 3 passes through the semiconductor refrigerating sheet 6, the junction of the thermoelectric element group generates electron hole pairs, the internal energy is reduced, the temperature is reduced, so that a heat absorption effect is generated, a cold end is formed, and the effects of absorbing heat, cooling and radiating heat of the end of the CPU element 4 are achieved.
Wherein, the length of heat conduction silica gel piece 5, wide value equals the length of CPU component 4, wide value, can guarantee that 4 end heats of CPU component are conducted to the cold junction position of semiconductor refrigeration piece 6 completely, and avoid semiconductor refrigeration piece cold junction direct contact CPU component 4 end, prevent when the difference in temperature is too big, the cold junction direct cooling is excessive, indirectly damages CPU component 4 mechanism.
Wherein, heat conduction silicone grease is all scribbled to heat conduction hose 8's outside and lumen inner wall, and the body has reversible deformation's characteristic, and heat conduction silicone grease has good heat conductivity, and the hot junction heat energy transmission loss of semiconductor refrigeration piece 6 that can make is less, improves heat conduction efficiency, and heat conduction hose 8 has reversible deformation characteristic, makes to form flexonics between heat conduction rubber gasbag 10 and the semiconductor refrigeration piece 6, can not hinder heat conduction rubber gasbag 10 inflation.
The shape of the heat-conducting rubber air bag 10 is rectangular, the two sides of the top end of the heat-conducting rubber air bag are provided with wrinkle textures, one ends of the two opposite inner sides of the heat-conducting rubber air bags 10 are communicated with each other, when the heat-conducting rubber air bag 10 is heated, gas expands, wrinkles on the two sides of the top end of the heat-conducting rubber air bag 10 can be unfolded upwards through expansion, so that the heat-radiating fins 13 are jacked, gaps with a certain distance are formed between the heat-radiating fins 13 and the end of the CPU element 4, and when the heat-radiating fins 13.
Wherein, the two-way pressure valve 12 can be opened in two ways, and the valve is opened and closed according to the pressure value of the valve, when the heat-conducting rubber air bag 10 is heated and expanded to a certain limit, the pressure inside the two-way pressure valve 12 is too high, the gas presses the valve to make it bear a certain pressure, when the pressure reaches a certain value, the valve is opened, the gas inside the heat-conducting rubber air bag 10 is discharged, because a large amount of gas flows out from the vent pipe 11, the pipe orifice generates gas whistling, and when the heat-conducting rubber air bag 10 is deflated, the heat-radiating fins 13 move downwards because of the reduction of the bottom supporting force, thereby achieving the effect that the industrial personal computer can automatically warn when the inside is too high, in addition, when the heat-conducting rubber air bag 10 is deflated, the internal pressure thereof becomes small, when the pressure is as standard atmospheric pressure, the vent pipe 11 can generate a negative pressure state, thereby the external gas is inhaled, and, when the pressure inside the heat-conducting rubber air bag 10 tends to be balanced, the valve loses the pressure, so that the valve is closed again, and the effect of recycling the gas is realized.
In order to ensure that the heat-conducting rubber air bag 10 can stably suck air under negative pressure in the air cooling and refluxing stage, a ventilation frame for supporting the heat-conducting rubber air bag 10 to control the minimum retraction amount in the normal temperature stage is arranged in the heat-conducting rubber air bag.
The use method (working principle) of the invention is as follows:
the method comprises the steps that firstly, the positive pole and the negative pole of a power supply element 3 are positively connected with the two poles of a semiconductor refrigeration sheet 6, after the connection is finished, the fan-free industrial personal computer is started, after the industrial personal computer works for a period of time, the CPU end of the industrial personal computer generates heat, the heat is absorbed by the cold end of the semiconductor refrigeration sheet 6 and is conducted to the hot end, the heat at the hot end is conducted to a heat dissipation fin 13, the heat is dissipated to the external environment through the heat dissipation fin 13, when the semiconductor refrigeration sheet 6 absorbs heat and cools, the heat at the hot end is conducted to a heat conduction rubber air bag 10 through a heat conduction sheet 7, a heat conduction hose 8 and a heat conduction connection sheet 9 in sequence, when the heat conduction rubber air bag 10 is heated.
If the heat dissipating fins 13 are subjected to external pressure, the heat dissipating fins 13 move downward and generate downward pressure, and because the heat conducting rubber bladder 10 supports the heat dissipating fins upward, and the heat conducting rubber bladder 10 is not in direct contact with the end of the CPU element 4, when the pressure is transmitted downward, the pressure is directly transmitted to the heat conducting rubber bladder 10, and a certain buffer loss occurs, thereby protecting the safety of the end of the CPU element 4.
If the heat-conducting rubber air bag 10 is heated and expanded to a certain limit, gas extrudes the two-way pressure valve 12, the valve is flushed, gas in the heat-conducting rubber air bag 10 is discharged, a pipe opening generates gas whistle, and the heat-radiating fins 13 move downwards, the industrial personal computer realizes the automatic early warning effect, when the internal pressure of the heat-conducting rubber air bag 10 is as low as the standard atmospheric pressure, a negative pressure state is generated at the opening of the vent pipe 11, so that external gas is sucked in a backflow mode, the heat-conducting rubber air bag 10 is filled, when the internal pressure of the heat-conducting rubber air bag 10 tends to be balanced, the two-way pressure valve 12 loses pressure, the valve is closed again, and the effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a cloud calculates no fan industrial computer, includes casing (1), its characterized in that: the inner chamber bottom fixed mounting of casing (1) has integrated circuit board (2), the fixed mounting of surface one side of integrated circuit board (2) has power component (3), the fixed mounting of the surperficial opposite side of integrated circuit board (2) has CPU component (4), the top fixed mounting of CPU component (4) has heat conduction silica gel piece (5), the top middle part fixed mounting of heat conduction silica gel piece (5) has semiconductor refrigeration piece (6), the both sides fixed mounting of semiconductor refrigeration piece (6) has two conducting strips (7), two the top fixedly connected with heat conduction hose (8) of conducting strip (7), the one end fixed mounting of heat conduction hose (8) has heat conduction connection piece (9), the one end fixedly connected with heat conduction rubber gasbag (10) of heat conduction connection piece (9), one of them the one end middle part fixed mounting of heat conduction rubber gasbag (10) has breather pipe (11), one end of the vent pipe (11) is fixedly provided with a two-way pressure valve (12), and the top end of the machine shell (1) is movably provided with a heat radiation fin (13) which can move up and down.
2. The cloud computing fanless industrial personal computer of claim 1, wherein: a circle of channel is formed in the middle of the top end of the machine shell (1), and the position of the channel is opposite to the protruding position of the middle of the bottom end of the radiating fin (13).
3. The cloud computing fanless industrial personal computer of claim 1, wherein: the current supplied by the power supply element (3) is direct current and is positively connected with two poles of the semiconductor refrigeration sheet (6).
4. The cloud computing fanless industrial personal computer of claim 1, wherein: the length and width values of the heat-conducting silica gel sheet (5) are equal to those of the CPU element (4).
5. The cloud computing fanless industrial personal computer of claim 1, wherein: the outside of heat conduction hose (8) and lumen inner wall all scribble heat conduction silicone grease, and the body has reversible deformation's characteristic.
6. The cloud computing fanless industrial personal computer of claim 1, wherein: the shape of heat conduction rubber gasbag (10) is rectangle, and the top both sides are equipped with the pincher trees texture, two the relative inboard one end intercommunication of heat conduction rubber gasbag (10).
7. The cloud computing fanless industrial personal computer of claim 1, wherein: the bidirectional pressure valve (12) can be opened in two directions, and the opening and closing of the valve are determined by the pressure value borne by the valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930856.4A CN112099598A (en) | 2020-09-07 | 2020-09-07 | Cloud computing fan-free industrial personal computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010930856.4A CN112099598A (en) | 2020-09-07 | 2020-09-07 | Cloud computing fan-free industrial personal computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112099598A true CN112099598A (en) | 2020-12-18 |
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ID=73750686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010930856.4A Withdrawn CN112099598A (en) | 2020-09-07 | 2020-09-07 | Cloud computing fan-free industrial personal computer |
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| Country | Link |
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| CN (1) | CN112099598A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113096696A (en) * | 2021-03-02 | 2021-07-09 | 江西理工大学南昌校区 | External memory for computer |
| CN113543554A (en) * | 2021-07-19 | 2021-10-22 | 深圳市百氏源科技有限公司 | Power adapter with better heat dissipation performance and heat dissipation method thereof |
-
2020
- 2020-09-07 CN CN202010930856.4A patent/CN112099598A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113096696A (en) * | 2021-03-02 | 2021-07-09 | 江西理工大学南昌校区 | External memory for computer |
| CN113543554A (en) * | 2021-07-19 | 2021-10-22 | 深圳市百氏源科技有限公司 | Power adapter with better heat dissipation performance and heat dissipation method thereof |
| CN113543554B (en) * | 2021-07-19 | 2022-08-05 | 深圳市百氏源科技有限公司 | Power adapter with better heat dissipation performance and heat dissipation method thereof |
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Application publication date: 20201218 |