CN112099150A - Optical fiber array and manufacturing method thereof - Google Patents
Optical fiber array and manufacturing method thereof Download PDFInfo
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- CN112099150A CN112099150A CN202011038365.5A CN202011038365A CN112099150A CN 112099150 A CN112099150 A CN 112099150A CN 202011038365 A CN202011038365 A CN 202011038365A CN 112099150 A CN112099150 A CN 112099150A
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- base
- optical fiber
- cover plate
- layer
- cladding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
Abstract
The invention relates to an optical fiber array and a manufacturing method thereof, the optical fiber array comprises a base, a cover plate, a group of optical fibers, a welding flux layer and curing glue, wherein one end of the base is higher than the other end of the base and forms a step, a plurality of V-shaped grooves are formed in the upper surface of the higher end of the base, a coating layer is stripped from one end of each optical fiber, a cladding layer is exposed out of one end of each optical fiber, the ends, exposed out of the cladding layer, of the optical fibers are correspondingly arranged in the V-shaped grooves one by one, the cover plate is covered on the base, the welding flux layer is positioned between the upper surface of the base and the cover plate, the base and the cover plate are fixed, so that one end of each optical fiber is fixed in the V. The optical fiber array ensures the stability of optical fibers, improves the reliability of the whole optical fiber array, and avoids the phenomenon that the optical fibers are fixed to be loosened or dislocated due to the rise of temperature in the working process so as to influence the stability of the optical fiber array.
Description
Technical Field
The invention relates to the technical field of optical fibers, in particular to an optical fiber array and a manufacturing method thereof.
Background
With the rapid development of technologies such as big data and 5G, the optical fiber array is beginning to be widely applied to products such as a photovoltaic module, a wavelength division multiplexing system, and a wavelength selective switch. The traditional optical fiber array positioning assembly adopts glass and is bonded by ultraviolet curing glue, and the following problems exist in the production and practical process: the reliability is poor. The photoelectric module usually generates heat during working, so that the temperature of the photoelectric module is increased, and after temperature circulation or a high-temperature and high-humidity environment, glue can crack or degum the positioning assembly, so that the product cannot normally and reliably work due to the problem.
Disclosure of Invention
The present invention provides an optical fiber array and a method for manufacturing the same, which aims to overcome the above-mentioned shortcomings in the prior art.
The technical scheme for solving the technical problems is as follows: an optical fiber array comprises a base, a cover plate matched with the base, a group of optical fibers, a welding flux layer matched with the base and curing adhesive, wherein one end of the base is higher than the other end, a step is formed on the upper surface of the base, a plurality of V-shaped grooves are formed on the upper surface of the higher end of the base, one end of the optical fiber is stripped from the coating layer and exposes out of the cladding, and one ends of the optical fibers exposed out of the cladding are correspondingly arranged in the V-shaped grooves one by one, the cover plate is covered on the base, the solder layer is positioned between the upper surface of the base and the cover plate and fixes the base and the cover plate, so as to fix one end of the optical fiber, which is exposed out of the cladding, in the V-shaped groove, wherein one end of the optical fiber, which is provided with the coating layer, is positioned at the lower end of the base, and the curing glue fixes the end of the optical fiber with the coating layer at the lower end of the base.
The invention has the beneficial effects that: according to the optical fiber array, the base, the cover plate and the optical fibers are welded and fixed through the welding flux layer, the stability of the optical fibers is guaranteed, the reliability of the whole optical fiber array is greatly improved, and the problem that the stability of a photoelectric module is influenced due to the fact that the optical fibers are fixed to be loose or dislocated due to the fact that the temperature of the photoelectric module comprising the optical fiber array is increased when the photoelectric module works is avoided.
On the basis of the technical scheme, the invention can be further improved as follows:
further: the base and the cover plate are made of glass materials, and metal layers are plated on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding respectively.
The beneficial effects of the further scheme are as follows: through be in the lower surface of apron and the surface metallization of covering, can be convenient base, apron and covering pass through under high temperature the solder layer is fixed, guarantee whole fiber array's structural stability and high temperature resistance.
Further: the metal layer comprises a nickel layer and a gold layer, and the nickel layer is positioned on the upper surface of the base, the lower surface of the cover plate and between the surface of the cladding and the gold layer.
The beneficial effects of the further scheme are as follows: the nickel layer is arranged on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding, and the gold layer is arranged on the surface layer of the nickel layer, so that the nickel layer can be better attached to the surface of the glass material, the gold layer can be conveniently attached, the cost can be reduced, and meanwhile, the gold layer and the solder layer can be conveniently fused and welded at high temperature.
Further: the thickness of the nickel layer is more than 2.5 μm, and the thickness of the gold layer is more than 0.5 μm.
Further: and the lower surface and the side surface of the base and the upper surface and the side surface of the cover plate are plated with metal layers.
The beneficial effects of the further scheme are as follows: the metal layers are plated on the lower surface and the side surface of the base and the upper surface and the side surface of the cover plate, so that the whole optical fiber array can be conveniently welded with other parts, and the airtightness of a product containing the optical fiber array is guaranteed.
Further: the solder layer is made of solder material, and the welding temperature is lower than 190 ℃.
Further: the curing glue is ultraviolet curing glue, and the hardness of the curing glue is not more than 50 degrees Shore.
The invention also provides a manufacturing method of the optical fiber array, which comprises the following steps:
stripping a coating layer at one end of the optical fiber and exposing the cladding;
respectively plating metal layers on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding;
one end of the optical fiber with the coating layer is correspondingly arranged in the V-shaped groove one by one, and the end of the optical fiber with the coating layer is positioned at the lower end of the base;
arranging the solder layer on the lower surface of the cover plate, heating and melting the solder layer, and welding the solder layer on the lower surface of the cover plate after cooling;
covering the cover plate at the higher end of the base, heating the base, the cover plate and the end of the optical fiber exposed out of the cladding to melt the solder layer, and welding and fixing the base, the cover plate and the optical fiber after cooling;
and coating the end, provided with the coating layer, of the optical fiber with the curing adhesive, and fixing the end, provided with the coating layer, of the optical fiber with the lower end of the base after the curing adhesive is solidified to finish the manufacturing.
According to the manufacturing method of the optical fiber array, the base, the cover plate and the optical fiber are welded and fixed through the solder layer, the stability of the optical fiber is guaranteed, the reliability of the whole optical fiber array is greatly improved, and the problem that the stability of a photoelectric module is influenced due to the fact that the optical fiber is fixed to be loose or misplaced due to the fact that the temperature of the photoelectric module comprising the optical fiber array is increased when the photoelectric module works is avoided.
On the basis of the technical scheme, the invention can be further improved as follows:
further: the step of respectively plating metal layers on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding specifically comprises the following steps:
firstly, plating nickel layers on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding;
plating gold layers on the nickel layers on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding;
wherein the thickness of the nickel layer is more than 2.5 μm, and the thickness of the gold layer is more than 0.5 μm.
The beneficial effects of the further scheme are as follows: the nickel layer is arranged on the upper surface of the base, the lower surface of the cover plate and the surface of the cladding, and the gold layer is arranged on the surface layer of the nickel layer, so that the nickel layer can be better attached to the surface of the glass material, the gold layer can be conveniently attached, the cost can be reduced, and meanwhile, the gold layer and the solder layer can be conveniently fused and welded at high temperature.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an optical fiber array according to the present invention;
fig. 2 is a schematic diagram of an exploded structure of an optical fiber array according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the optical fiber module comprises a bottom plate, 2, a cover plate, 3, optical fibers, 4, solder, 5 and curing glue;
11. v-shaped groove 12, step 31, cladding 32 and coating.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 and fig. 2, an optical fiber array includes a base 1, a cover plate 2 matched with the base 1, a set of optical fibers 3, a solder layer 4 matched with the base 1, and a curing adhesive 5, wherein one end of the base 1 is higher than the other end, and a step 12 is formed on the upper surface of the base 1, a plurality of V-shaped grooves 11 are formed on the upper surface of the higher end of the base 1, one end of each optical fiber 3 is peeled off from the coating 32 and exposes the cladding 31, and the ends of the optical fibers 3 exposed from the cladding are correspondingly arranged in the V-shaped grooves 11, the cover plate 2 is covered on the base 1, the solder layer 4 is located between the upper surface of the base 1 and the cover plate 2, and the base 1 and the cover plate 2 are fixed, so that the end of the optical fiber 3 exposed from the cladding 31 is fixed in the V-shaped groove 11, the end of the optical fiber 3 having the coating 32 is located at the lower end of the, and the end of the optical fiber 3 with the coating layer 32 is fixed at the lower end of the base 1 by the curing glue 5.
According to the optical fiber array, the base 1, the cover plate 2 and the optical fibers 3 are welded and fixed through the solder layer, so that the stability of the optical fibers 3 is ensured, the reliability of the whole optical fiber array is greatly improved, and the condition that the stability of a photoelectric module is influenced due to the fact that the optical fibers are fixed to be loose or dislocated caused by the temperature rise of the photoelectric module comprising the optical fiber array when the photoelectric module works is avoided.
In one or more embodiments of the present invention, the base 1 and the cover plate 2 are made of glass, and the upper surface of the base 1, the lower surface of the cover plate 2, and the surface of the cladding 31 are respectively plated with a metal layer. Through the metal coating on the lower surface of apron 2 and the surface of covering 31, can make things convenient for base 1, apron 2 and covering 31 pass through under the high temperature welding material layer 4 is fixed, guarantee the structural stability and the high temperature resistance performance of whole fiber array.
Optionally, in one or more embodiments of the present invention, the metal layer includes a nickel layer and a gold layer, and the nickel layer is located between the upper surface of the base 1, the lower surface of the cover plate 2, and the surface of the cladding 31 and the gold layer. The nickel layer is arranged on the upper surface of the base 1, the lower surface of the cover plate 2 and the surface of the cladding 31, and the gold layer is arranged on the surface layer of the nickel layer, so that the nickel layer can be better attached to the surface of the glass material, the gold layer is convenient to attach, the cost can be reduced, and meanwhile, the gold layer and the solder layer 4 can be conveniently fused and welded at high temperature.
In one or more embodiments of the invention, the nickel layer is greater than 2.5 μm thick and the gold layer is greater than 0.5 μm thick.
Optionally, in one or more embodiments of the present invention, the lower surface and the side surface of the base 1 and the upper surface and the side surface of the cover plate 2 are plated with metal layers. The metal layers are plated on the lower surface and the side surface of the base 1 and the upper surface and the side surface of the cover plate 2, so that the whole optical fiber array can be conveniently welded with other parts, and the airtightness of a product containing the optical fiber array is favorably ensured.
In one or more embodiments of the present invention, the solder layer 4 is made of solder material, and the soldering temperature is lower than 190 ℃.
In one or more embodiments of the present invention, the curing glue 5 is an ultraviolet curing glue, and the hardness thereof is not greater than 50 degrees shore.
The invention also provides a manufacturing method of the optical fiber array, which comprises the following steps:
s1: peeling off the coating layer 32 at one end of the optical fiber 3 and exposing the cladding 31;
s2: respectively plating metal layers on the upper surface of the base 1, the lower surface of the cover plate 2 and the surface of the cladding 31;
s3: one end of the optical fiber 3, which is stripped of the coating layer 32, is arranged in the V-shaped groove 11 in a one-to-one correspondence manner, and the end, provided with the coating layer 32, of the optical fiber 3 is positioned at the lower end of the base 1;
s4: arranging the solder layer 4 on the lower surface of the cover plate 2, heating and melting the solder layer, and welding the solder layer on the lower surface of the cover plate 2 after cooling;
s5: covering the cover plate 2 at the higher end of the base 1, heating the base 1, the cover plate 2 and the end of the optical fiber 3 exposed out of the cladding 31 to melt the solder layer 4, and welding and fixing the three after cooling;
s6: and (3) coating the end, provided with the coating layer 32, of the optical fiber 3 with the curing adhesive 5, and fixing the end, provided with the coating layer 32, of the optical fiber 3 with the lower end of the base 1 after the curing adhesive 5 is solidified, so as to finish the manufacturing.
According to the manufacturing method of the optical fiber array, the base 1, the cover plate 2 and the optical fiber 3 are welded and fixed through the solder layer, so that the stability of the optical fiber 3 is ensured, the reliability of the whole optical fiber array is greatly improved, and the condition that the optical fiber is fixed to be loose or dislocated due to the temperature rise of a photoelectric module comprising the optical fiber array when the photoelectric module works is avoided, and the stability of the photoelectric module is further influenced.
In one or more embodiments of the present invention, the plating of the metal layers on the upper surface of the base 1, the lower surface of the cover plate 2, and the surface of the cladding 31 respectively specifically includes the following steps:
firstly, plating nickel layers on the upper surface of the base 1, the lower surface of the cover plate 2 and the surface of the cladding 31;
plating gold layers on the nickel layers on the upper surface of the base 1, the lower surface of the cover plate 2 and the surface of the cladding 31;
wherein the thickness of the nickel layer is more than 2.5 μm, and the thickness of the gold layer is more than 0.5 μm.
The beneficial effects of the further scheme are as follows: by arranging the nickel layer on the upper surface of the base 1, the lower surface of the cover plate 2 and the surface of the cladding 31 and arranging the gold layer on the surface layer of the nickel layer, the nickel layer can be better attached to the surface of the glass material, the gold layer is convenient to attach, the cost can be reduced, and meanwhile, the gold layer and the solder layer 4 can be conveniently fused and welded at high temperature.
It should be noted that, in the present invention, the solder layer 4 is fixed at normal temperature, and is matched with the shapes of the base 1 and the cover plate 2, and the thickness of the solder layer is smaller than that of the cover plate 2, when the solder layer 4 is disposed on the lower surface of the cover plate 2 and heated to melt, the cover plate 2 is firstly turned over to make the lower surface of the cover plate face upward, then the solder layer 4 is disposed on the lower surface of the cover plate 2, and then heated, when the solder layer 4 is heated to melt into a liquid state, because the surface of the cover plate 2 is plated with a gold layer, the solder layer has good dispersibility, so that the liquid solder can be uniformly distributed on the lower surface of the cover plate 2, and then the solder layer 4 is cooled to form a solid solder layer 4, and the solder layer 4 and the lower surface of the cover plate 2.
When will apron 2 lid is established the higher one end of base 1, and will base 1, apron 2 and optic fibre 3 expose 31 one end heating, because base 1, apron 2 and optic fibre 3 expose 31 one end surface all plates the gold layer, at this moment, treat when solder layer 4 heats once more and melts into liquid, because the gold layer has better sparsity, liquid solder can the homodisperse, and distribute with the lower surface of apron 2 with between the upper surface of base 1, form solid-state solder layer 4 again after cooling, and will base 1, apron 2 and optic fibre 3 expose 31 one end welding as a whole.
In practice, the shape of the solder layer 4 is matched with the cover plate 2 and the base 1, and the appropriate thickness is selected, so as to ensure that the solder can be fully distributed between the lower surface of the cover plate 2 and the upper surface of the base 1 and cannot overflow after melting, and ensure the welding quality.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. An optical fiber array, characterized by: comprises a base (1), a cover plate (2) matched with the base (1), a group of optical fibers (3), a solder layer (4) matched with the base (1) and a curing adhesive (5), wherein one end of the base (1) is higher than the other end, a step (12) is formed on the upper surface of the base, a plurality of V-shaped grooves (11) are arranged on the upper surface of a higher end of the base (1), one end of each optical fiber (3) is stripped from a coating layer (32) and exposed out of a cladding layer (31), one end of each optical fiber (3) exposed out of the cladding layer is correspondingly arranged in each V-shaped groove (11), the cover plate (2) is covered on the base (1), the solder layer (4) is positioned between the upper surface of the base (1) and the cover plate (2), the base (1) and the cover plate (2) are fixed, one end of each optical fiber (3) exposed out of the cladding layer (31) is fixed in each V-shaped groove (11), the end, provided with the coating layer (32), of the optical fiber (3) is located at the lower end of the base (1), and the end, provided with the coating layer (32), of the optical fiber (3) is fixed at the lower end of the base (1) through the curing adhesive (5).
2. The optical fiber array of claim 1, wherein: the base (1) and the cover plate (2) are made of glass materials, and metal layers are plated on the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31) respectively.
3. The optical fiber array of claim 2, wherein: the metal layer comprises a nickel layer and a gold layer, and the nickel layer is positioned between the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31) and the gold layer.
4. The optical fiber array of claim 3, wherein: the thickness of the nickel layer is more than 2.5 μm, and the thickness of the gold layer is more than 0.5 μm.
5. The optical fiber array of claim 2, wherein: and the lower surface and the side surface of the base (1) and the upper surface and the side surface of the cover plate (2) are plated with metal layers.
6. The optical fiber array of claim 2, wherein: the solder layer (4) is made of soldering tin, and the soldering temperature is lower than 190 ℃.
7. The optical fiber array of any of claims 1-6, wherein: the curing glue (5) is ultraviolet curing glue, and the hardness of the curing glue is not more than 50 degrees Shore.
8. A method of fabricating an optical fiber array according to any one of claims 1 to 7, comprising the steps of:
stripping off the coating layer (32) at one end of the optical fiber (3) and exposing the cladding (31);
respectively plating metal layers on the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31);
one end of the optical fiber (3) with the coating layer (32) stripped is arranged in the V-shaped groove (11) in a one-to-one correspondence mode, and the end, provided with the coating layer (32), of the optical fiber (3) is located at the lower end of the base (1);
arranging the solder layer (4) on the lower surface of the cover plate (2), heating and melting the solder layer, and welding the solder layer on the lower surface of the cover plate (2) after cooling;
covering the cover plate (2) at the higher end of the base (1), heating the base (1), the cover plate (2) and one end of the optical fiber (3) exposed out of the cladding (31) to melt the solder layer (4), and welding and fixing the base, the cover plate and the optical fiber after cooling;
and (3) coating the end, provided with the coating layer (32), of the optical fiber (3) with the curing adhesive (5), and fixing the end, provided with the coating layer (32), of the optical fiber (3) with the lower end of the base (1) after the curing adhesive (5) is solidified, so as to finish the manufacture.
9. The method for manufacturing an optical fiber array according to claim 8, wherein the step of plating the metal layers on the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31) respectively comprises the following steps:
firstly, plating nickel layers on the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31);
plating gold layers on the nickel layers on the upper surface of the base (1), the lower surface of the cover plate (2) and the surface of the cladding (31);
wherein the thickness of the nickel layer is more than 2.5 μm, and the thickness of the gold layer is more than 0.5 μm.
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| CN202011038365.5A CN112099150A (en) | 2020-09-28 | 2020-09-28 | Optical fiber array and manufacturing method thereof |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244074A (en) * | 1993-03-31 | 2000-02-09 | 住友电气工业株式会社 | Parallel transmitting module and manufacture thereof |
| TW554056B (en) * | 2002-05-24 | 2003-09-21 | Ritek Corp | Formation method of fiber array base surface soldering layer |
| TW571137B (en) * | 2002-08-28 | 2004-01-11 | Ritek Corp | Fiber array substrate having bump solder |
| CN102374903A (en) * | 2010-08-13 | 2012-03-14 | 北京广微积电科技有限公司 | Infrared transmission window and manufacturing method thereof, air-tight box body and infrared sensing device |
| CN202494801U (en) * | 2012-03-19 | 2012-10-17 | 武汉楚星光纤应用技术有限公司 | Sealed type ribbon optical fiber array |
| TW201247047A (en) * | 2011-05-04 | 2012-11-16 | Subtron Technology Co Ltd | Circuit structure and manufacturing method thereof |
| CN103018848A (en) * | 2013-01-23 | 2013-04-03 | 无锡创润传感科技有限公司 | Optical fiber array positioning assembly and manufacturing method thereof |
| CN108367968A (en) * | 2015-09-25 | 2018-08-03 | 美题隆公司 | Utilize the light conversion device of the high luminous power for the phosphor elements being attached by welding |
| CN108562971A (en) * | 2018-05-02 | 2018-09-21 | 华中科技大学 | A kind of waveguide optical grating filter and preparation method thereof |
| CN111007591A (en) * | 2019-12-24 | 2020-04-14 | 武汉驿路通科技股份有限公司 | Optical fiber array with high reliability |
| CN111158090A (en) * | 2020-03-17 | 2020-05-15 | 中山市美速光电技术有限公司 | 45-degree optical fiber array with small optical fiber diameter and operation method thereof |
| CN111198417A (en) * | 2020-03-17 | 2020-05-26 | 中山市美速光电技术有限公司 | 2XN optical fiber array and manufacturing method thereof |
-
2020
- 2020-09-28 CN CN202011038365.5A patent/CN112099150A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244074A (en) * | 1993-03-31 | 2000-02-09 | 住友电气工业株式会社 | Parallel transmitting module and manufacture thereof |
| TW554056B (en) * | 2002-05-24 | 2003-09-21 | Ritek Corp | Formation method of fiber array base surface soldering layer |
| TW571137B (en) * | 2002-08-28 | 2004-01-11 | Ritek Corp | Fiber array substrate having bump solder |
| CN102374903A (en) * | 2010-08-13 | 2012-03-14 | 北京广微积电科技有限公司 | Infrared transmission window and manufacturing method thereof, air-tight box body and infrared sensing device |
| TW201247047A (en) * | 2011-05-04 | 2012-11-16 | Subtron Technology Co Ltd | Circuit structure and manufacturing method thereof |
| CN202494801U (en) * | 2012-03-19 | 2012-10-17 | 武汉楚星光纤应用技术有限公司 | Sealed type ribbon optical fiber array |
| CN103018848A (en) * | 2013-01-23 | 2013-04-03 | 无锡创润传感科技有限公司 | Optical fiber array positioning assembly and manufacturing method thereof |
| CN108367968A (en) * | 2015-09-25 | 2018-08-03 | 美题隆公司 | Utilize the light conversion device of the high luminous power for the phosphor elements being attached by welding |
| CN108562971A (en) * | 2018-05-02 | 2018-09-21 | 华中科技大学 | A kind of waveguide optical grating filter and preparation method thereof |
| CN111007591A (en) * | 2019-12-24 | 2020-04-14 | 武汉驿路通科技股份有限公司 | Optical fiber array with high reliability |
| CN111158090A (en) * | 2020-03-17 | 2020-05-15 | 中山市美速光电技术有限公司 | 45-degree optical fiber array with small optical fiber diameter and operation method thereof |
| CN111198417A (en) * | 2020-03-17 | 2020-05-26 | 中山市美速光电技术有限公司 | 2XN optical fiber array and manufacturing method thereof |
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Application publication date: 20201218 |
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| RJ01 | Rejection of invention patent application after publication |