CN112086288B - Manufacturing method of surface mount type solid plastic package capacitor - Google Patents
Manufacturing method of surface mount type solid plastic package capacitor Download PDFInfo
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- CN112086288B CN112086288B CN202011117024.7A CN202011117024A CN112086288B CN 112086288 B CN112086288 B CN 112086288B CN 202011117024 A CN202011117024 A CN 202011117024A CN 112086288 B CN112086288 B CN 112086288B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
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- 238000001723 curing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 229920000180 alkyd Polymers 0.000 claims description 6
- 229920003180 amino resin Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000012778 molding material Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
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- 238000004804 winding Methods 0.000 claims description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 4
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
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- 238000004026 adhesive bonding Methods 0.000 description 1
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- 238000005266 casting Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/153—Skin fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a manufacturing method of a surface mount type solid plastic package capacitor, which is characterized by comprising the following steps of: s1, providing a plurality of elements, wherein each element comprises two L-shaped connecting terminals, an anode foil and a cathode foil, a first arm of each L-shaped connecting terminal is respectively connected with the anode foil and the cathode foil, and a second arm of each L-shaped connecting terminal extends out of the bottom of each element; s2, providing a lead frame with a plurality of pairs of lead pins arranged at intervals; s3, fixing the second arm of the element to a lead pin of the lead frame by conductive adhesive; s4, placing the lead frame fixed with the element in an injection mold, and performing injection molding; s5, electroplating the lead frame group after injection molding; and S6, cutting the terminal pins to obtain a plurality of patch type solid plastic package capacitors. The invention aims to solve the problems of poor comprehensive performance and high manufacturing cost of the metal shell of the solid capacitor.
Description
Technical Field
The invention relates to the technical field of surface mount solid capacitors, in particular to a manufacturing method of a surface mount solid plastic package capacitor.
Background
The capacitor is an indispensable important element in a power supply circuit of a computer system, various boards and chip sets on the mainboard need to use power supplies with various voltages, and the capacitor is needed to be adopted for filtering the power supplies to ensure stable voltage for ensuring stable operation of the mainboard and the boards. Compared with the common liquid aluminum electrolytic capacitor, the solid capacitor adopts conductive polymer as a dielectric material, the material can not react with aluminum oxide, and the phenomenon of explosion after electrification can not occur; meanwhile, the product is a solid product, and the situation of bursting caused by thermal expansion does not exist. The solid capacitor has the advantages of environmental protection, low impedance, high and low temperature stability, high ripple resistance, high reliability and the like, and is the highest-order product in the current electrolytic capacitor products. The existing solid capacitor is an aluminum shell, and is easy to damage under various severe environments with high temperature, low temperature, high pressure or ozone and the like, so that the normal work of the capacitor is influenced, the waste of data is caused, and the safety aspect is not effectively guaranteed.
In view of the above, it is necessary to provide a method for manufacturing a chip type solid plastic package capacitor to solve the above problems.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a surface mount type solid plastic package capacitor, which aims to solve the problems of poor comprehensive performance and high manufacturing cost of a metal shell of a solid capacitor, provide higher-strength protection for the solid capacitor, ensure the normal work of the capacitor under different severe conditions and prolong the service life of the capacitor.
In order to achieve the above object, the present invention provides a method for manufacturing a surface mount type solid plastic package capacitor, comprising the following steps:
s1, providing a plurality of elements, wherein each element comprises two L-shaped connecting terminals, an anode foil and a cathode foil, a first arm of each L-shaped connecting terminal is respectively connected with the anode foil and the cathode foil, and a second arm of each L-shaped connecting terminal extends out of the bottom of each element;
s2, providing a lead frame with a plurality of pairs of lead pins arranged at intervals;
s3, fixing the second arm of the element to a lead pin of the lead frame by conductive adhesive;
s4, placing the lead frame fixed with the element in an injection mold, and performing injection molding; the lead frame is positioned in a lower die of the injection mold, and a plurality of communicated or isolated injection molding cavities are formed between the upper die and the lower die; the bottom of the terminal pin and the far end of the extension part of the terminal pin, which extends from the joint of the terminal pin and the second arm to the outer side of the element, are exposed outside the injection molding cavity;
S5, electroplating the lead frame group after injection molding;
and S6, cutting the terminal pins to obtain a plurality of patch type solid plastic package capacitors.
Further, the lead frame includes that a plurality of lead wire units that are the array and set up on the frame body, every lead wire unit includes a pair of pin and at least one fretwork portion that the interval set up, every the pin includes the root and certainly the root extends the pin portion that the length direction of this pin extends, the pin passes through the root with the frame body links to each other, fretwork portion encircles pin portion, so that pin portion with frame body detachable sets up.
Further, the second arm of the L-shaped connection terminal is parallel to the body of the element.
Furthermore, the injection mold comprises an upper mold and a lower mold, and two pin positioning grooves, a first injection molding area, a second injection molding area and injection molding holes are sequentially arranged in the injection molding cavity from bottom to top; the injection molding material wraps the element and the lead pins, and a positioning groove for fixing the lead frame is formed in the upper top surface of the lower die.
Further, the second district of moulding plastics is the cuboid structure, two adjacent angle departments in the second district of moulding plastics are provided with positive negative pole mark, the first district of moulding plastics is cylindrical structure.
Further, one end of the terminal pin connected with the lead frame is arranged outside the terminal pin positioning groove.
Further, S1 includes winding the electrolytic paper into the core package at an interval between the anode foil and the cathode foil, and performing a formation treatment on the element.
Further, at S3, the method further includes curing the lead frame and the element thereon. The curing is thermal curing, the curing temperature is 120-180 ℃, and the curing time is 20-30 minutes.
Further, the lead frame is a metal piece.
Further, the conductive adhesive is copper adhesive or silver adhesive.
Further, the injection molding material is a polymer, and the polymer is selected from one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin and polyurethane resin.
The scheme of this application, the mode through moulding plastics provides the one deck plastic-sealed body for SMD solid-state electrical apparatus, and the plastic-sealed body wraps up plain son and pin wherein, for solid-state electric capacity provides the protection of higher intensity, guarantees that electric capacity normally works under the adverse conditions of difference, increases the life of electric capacity. The problems of poor comprehensive performance and high manufacturing cost of the solid capacitor metal shell are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a manufacturing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a surface mount type solid plastic package capacitor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a surface mount type solid plastic packaged capacitor according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a plastic package body according to an embodiment of the invention;
FIG. 5 is a schematic structural diagram of an element according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an injection mold according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of the operation of a lead frame according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a lead frame according to an embodiment of the invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
The reference numbers indicate:
100-capacitor, 110-element, 111-core cladding, 112-connecting terminal, 1121-first arm, 1122-second arm, 120-plastic package body, 121-cylindrical body, 122-square base body and 1221-positive and negative pole mark;
200-lead frame, 210-frame body, 220-lead unit, 221-lead pin and 222-hollow part;
300-injection mold, 310-upper mold, 320-lower mold, 330-injection molding hole, 340-first injection molding area, 350-second injection molding area and 360-terminal pin positioning groove.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Please refer to fig. 1 to 8.
The invention provides a manufacturing method of a surface mount type solid plastic package capacitor, which comprises the following steps:
s1, providing a plurality of elements 110 having two L-shaped connection terminals 112, wherein the elements 110 include an anode foil (not shown) and a cathode foil (not shown), the first arms 1121 of the L-shaped connection terminals 112 are connected to the anode foil (not shown) and the cathode foil (not shown), respectively, and the second arms 1122 of the L-shaped connection terminals 112 are parallel to the core package 111 of the elements 110.
S1 further comprises winding the anode foil (not shown) and the cathode foil (not shown) with electrolytic paper at an interval into a core pack 111, and performing a formation treatment on the element 110.
The element 110 includes a core package 111 and an L-shaped connection terminal 112, the core package 111 includes an anode foil (not shown), a cathode foil (not shown), and an electrolytic paper (not shown), the anode foil (not shown) and the cathode foil (not shown) are wound into the core package 111 with the electrolytic paper (not shown) therebetween, and the anode foil (not shown) and the cathode foil (not shown) are respectively connected to the first arms 1121 of the L-shaped connection terminal 112.
S2, a lead frame 200 having pairs of spaced apart terminal pins 221 is provided.
Referring to fig. 7 and 8 together, the lead frame 200 includes:
a frame body 210;
the plurality of lead units 220 are arranged on the frame body 210 in an array, each lead unit 220 includes a pair of spaced lead pins 221 and at least one hollow portion 222, each lead pin 221 includes a root portion 2211 and a lead portion 2212 extending from the root portion in a length direction of the lead pin 221, the lead pin 221 is connected to the frame body 210 through the root portion 2211, and the hollow portion 222 surrounds the lead portion 2212, so that the lead portion 2212 is detachably arranged with the frame body 210.
S3, the element 110 is fixed to the lead pins 221 of the lead frame 200 by conductive paste.
Specifically, the picked elements may be positioned on a lead frame with conductive adhesive by a special chip mounter or positioning and gluing equipment, and then the lead frame 200 and the elements 110 thereon are cured. Specifically, the curing is thermal curing, the curing temperature is 120-180 ℃, and the curing time is 20-30 minutes.
S4, placing the lead frame 200 fixed with the element 110 in the injection mold 300, and performing injection molding; a plurality of cavities (330, 340, 350 and 360) which correspond to the elements 110 and wrap the elements 110 are arranged in an upper die 310 of the injection mold 300, the lead frame 200 is positioned in a lower die of the injection mold 300, and a plurality of communicated or isolated injection molding cavities (330, 340, 350 and 360) are formed between the upper die 310 and the lower die 310; the bottom of the terminal pin 221 and the distal end of the extension portion of the terminal pin 221 extending from the connection point of the terminal pin 221 and the second arm 1122 to the outside of the element 110 are exposed outside the injection molding cavity (330, 340, 350, 360).
S5, electroplating the lead frame 200 group after injection molding;
specifically, the lead frame 200 and the connection terminals 112 of the elements 110 on the lead frame 200 are tin-plated.
S6, cutting the terminal pins 221 to obtain a plurality of surface mount solid plastic-packaged capacitors 100.
Specifically, the distal ends of the extensions of the terminal pins 221 that extend from the connection of the terminal pins 221 and the second arm 1122 toward the outside of the element 110 are cut by a wire cut or a guillotine.
Further, the second arm 1122 of the L-shaped connection terminal 112 is parallel to the core package 111 of the element 110.
Further, the injection mold 300 comprises an upper mold 310 and a lower mold 320, and two terminal pin positioning grooves 360, a second injection molding area 350, a first injection molding area 340 and an injection molding hole 330 are sequentially arranged in a mold cavity from bottom to top; the molding compound encapsulates the element 110 and the terminal pins 221. The first molding area 340 is used for wrapping the core package 111 of the element 110, and the second molding area 350 is used for wrapping the L-shaped connection terminal 112 and the lead pin 221; the terminal pin positioning groove 360 is disposed at the bottom of the second injection molding region 350 for fixing the terminal pin 221, and the injection molding hole 330 is disposed at the top of the first injection molding region 340 for injection molding.
Further, the second injection molding area 350 is of a cuboid structure, two adjacent corners of the second injection molding area 350 are provided with positive and negative electrode marks 1221, and the first injection molding area 340 is of a cylindrical structure. The core pack 111 is formed by winding electrolytic paper in an interval between an anode foil (not shown) and a cathode foil (not shown) and is cylindrical, and the first injection molding area 340 for wrapping the core pack 111 is cylindrical and can be wrapped by the injection molding material as less as possible. Terminal pin 221 is the cuboid structure, and the second of parcel terminal pin 221 is moulded plastics district 350 and is set up to the cuboid structure and can wrap up it with as few as possible material of moulding plastics.
Further, the end of the terminal pin 221 connected to the lead frame 200 is outside the terminal pin positioning groove 360. The second injection molding region 350 wraps the free ends of the terminal pins 221, the fixed ends of the second injection molding region are connected with the lead frame 200 and are exposed outside the second injection molding region 350, and the inner walls of the terminal pin positioning grooves 360 are attached to the outer walls of the terminal pins 221 to form a closed cavity.
Further, the lead frame 200 is a metal piece. Specifically, the lead frame 200 is a copper piece. Copper has good electrical conductivity.
Further, the conductive adhesive is copper adhesive or silver adhesive. Both the copper glue and the silver glue have good conductivity. Specifically, in the present embodiment, the conductive paste is made of copper paste, on one hand, the terminal pin 221 is a copper piece, and the copper paste has better compatibility than silver paste, and on the other hand, the copper paste is lower in cost.
Further, the injection molding material is a polymer, and the polymer is selected from one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin and polyurethane resin. Alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin and polyurethane resin all have good wear resistance, corrosion resistance and insulativity, and the materials are common plastic raw materials and are easy to obtain in the production process.
Referring to fig. 7 and 8 together, the present application further provides a lead frame 200 for manufacturing a surface mount solid plastic package capacitor, including:
a frame body 210;
the plurality of lead units 220 are arranged on the frame body 210 in an array, each lead unit 220 includes a pair of spaced lead pins 221 and at least one hollow portion 222, each lead pin 221 includes a root portion 2211 and a lead portion 2212 extending from the root portion in a length direction of the lead pin 221, the lead pin 221 is connected to the frame body 210 through the root portion 2211, and the hollow portion 222 surrounds the lead portion 2212, so that the lead portion 2212 is detachably arranged with the frame body 210.
Further, the hollowed portions 222 are rectangular holes and are distributed on two opposite sides of the terminal pins 221, the root portions of the two terminal pins 221 are respectively connected to two opposite sidewalls of the rectangular holes, and the end portions of the lead portions 2212 of the two terminal pins 221 in each lead unit 220 are oppositely arranged in the length direction of the terminal pins 221. The hollow portions 222 distributed on the opposite sides of the terminal pins 221 are communicated with the gaps between the terminal pins 221, so as to form "i" shaped holes penetrating through the frame body 210. It is understood that the shape of the hollowed-out portion 222 is not limited to the rectangular hole shown in the present embodiment, and may also be in the form of a pinhole, etc., as long as the lead portion 2212 can be separated from the frame body 210. And the arrangement of the hollow-out portion 222 can also adopt the forms of three-side surrounding, surrounding all around, and the like.
Preferably, the ends of the lead portions 2212 of the pair of terminal pins 221 are disposed opposite to, adjacent to, or offset from each other in the longitudinal direction. Lead portion 2212 of terminal pin 221 may be arranged in different ways depending on the requirements of capacitor 100. Specifically, in the present embodiment, the end portions of the lead portions 2212 of the pair of terminal pins 221 are disposed opposite to each other in the longitudinal direction.
Specifically, the lead elements 220 are arranged in a rectangular array. It is understood that the arrangement of the lead elements 220 is not limited to the rectangular array given in the present embodiment, and the lead elements 220 may be arranged in a circular array, a rectangular array, or the like, and the most common rectangular array arrangement is adopted in the present embodiment, which not only has low manufacturing cost, but also facilitates the cutting of the lead pins 221.
Specifically, the terminal pin 221 has a rectangular parallelepiped structure. The terminal pin 221 is used to mount the element 110, and the element 110 is connected to the terminal pin 221 through the second arm 1122 of the connection terminal 112. The terminal pins 221 having a rectangular parallelepiped structure can fit into the L-shaped connection terminals 112 with the largest area.
Preferably, the terminal pins 221 are disposed on the same plane as the frame body 210. The lead frame 200 and the lead pins 221 are integrally manufactured in the manufacturing process and directly formed by casting, and the lead pins 221 and the frame body 210 are arranged on the same plane, so that the manufacturing of the lead frame 200 is facilitated, and the production cost is reduced.
Preferably, the lead frame 200 is a metal piece. Specifically, the lead frame 200 is a copper piece. Copper has good electrical conductivity.
The invention also provides a patch type solid plastic package capacitor, preferably, the patch type solid plastic package capacitor is prepared by the manufacturing method of the patch type solid plastic package capacitor; this SMD solid-state plastic envelope condenser includes:
the element 110, the element 110 includes a core pack 111 and an L-shaped connection terminal 112, the core pack 111 includes an anode foil (not shown), a cathode foil (not shown) and an electrolytic paper (not shown), the anode foil (not shown) and the cathode foil (not shown) are wound into the core pack 111 with the electrolytic paper (not shown) therebetween, and the anode foil (not shown) and the cathode foil (not shown) are respectively connected to the first arms 1121 of the L-shaped connection terminal 112;
two terminal pins 221, wherein the two terminal pins 221 are respectively connected with the second arm 1122 of the connection terminal 112 through conductive adhesive;
the plastic package body 120 of the element 110 and the terminal pins 221 is wrapped by injection molding, the plastic package body 120 is made of resin material, and the bottoms and the free ends of the terminal pins 221 are exposed outside the plastic package body 120.
The second arm 1122 of the L-shaped connection terminal 112 is parallel to the core package 111 of the element 110.
Further, the plastic package body 120 includes a cylindrical body 121 and a square base 122, the cylindrical body 121 wraps the core package 111 of the element 110, and the square base 122 wraps the L-shaped connection terminal 112 and the lead pin 221; the free ends of the terminal pins 221 respectively extend from two opposite side surfaces of the square base 122. The plastic package body 120 has an inner cavity structure of the injection mold 300, and is formed naturally after injection molding, which is not described herein again. The free ends of the terminal pins 221 extend from two opposite sides of the square base 122, respectively, to facilitate the cutting of the terminal pins 221, so that the capacitor 100 can be removed from the lead frame 200 to form a separate product.
Preferably, the terminal pins 211 are formed by cutting from a lead frame 200 connected to the element 110. Specifically, the distal ends of the extensions of the terminal pins 221 that extend from the connection of the terminal pins 221 and the second arm 1122 toward the outside of the element 110 are cut by a wire cut or a guillotine.
Specifically, positive and negative marks 1221 are formed at two corners on the side where one of the terminal pins 221 is located. The positive and negative indicia 1221 are provided to facilitate identification of the positive and negative electrodes of the capacitor 100 during use. In this embodiment, the positive electrode is marked by cutting off two corners of the side surface where the positive electrode lead pin 221 is located, and the second injection molding area 350 with a corresponding structure is directly used in the manufacturing process, and the direct injection molding is performed.
Preferably, the bottom surfaces of the terminal pins 221 are flush with the bottom surface of the square seat 122 or protrude from the bottom surface of the square seat 122. The square base is formed by the second injection molding area 350 of the injection mold 300 during the injection molding process, since the terminal pin 221 is connected to the frame body 210, the inner wall of the second injection molding area 350 is attached to the remaining three surfaces of the terminal pin 221 except the bottom surface, and the bottom surface of the square base formed by the second injection molding area 350 is flush with the bottom surface of the terminal pin 221 or slightly higher than the bottom surface of the terminal pin 221.
Specifically, the length of the free end of the terminal pin 221 extending out of the side surface is 0.5 to 4 mm. The free end protrusion length of the terminal pin 221 is as short as possible under the condition that the condition for facilitating cutting is satisfied, and the length of the free end protrusion and the side surface of the terminal pin 221 is 2mm in this embodiment.
Further, the conductive adhesive is copper adhesive or silver adhesive. Both the copper glue and the silver glue have good conductivity. Specifically, in the present embodiment, the conductive paste is made of copper paste, on one hand, the terminal pin 221 is a copper piece, and the copper paste has better compatibility than silver paste, and on the other hand, the copper paste is lower in cost.
Specifically, the anode foil (not shown in the figure) and the cathode foil (not shown in the figure) are both aluminum foils. Aluminum foil is a common electrode material for capacitor 100 because it has good electrical conductivity and is inexpensive.
Preferably, the resin material is one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, polyurethane resin. Alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin and polyurethane resin all have good wear resistance, corrosion resistance and insulativity, and the materials are common plastic raw materials and are easy to obtain in the production process.
The scheme of this application, the mode through moulding plastics provides one deck plastic-sealed body 120 for SMD solid-state electrical apparatus, and plastic-sealed body 120 wraps up plain son 110 and pin 221 wherein, for solid-state electric capacity provides the protection of higher intensity, guarantees that electric capacity normally works under the adverse circumstances of difference, increases electric capacity's life. The problems of poor comprehensive performance and high manufacturing cost of the solid capacitor metal shell are solved.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A manufacturing method of a surface mount type solid plastic package capacitor is characterized by comprising the following steps:
S1, providing a plurality of elements, wherein each element comprises two L-shaped connecting terminals, an anode foil and a cathode foil, a first arm of each L-shaped connecting terminal is respectively connected with the anode foil and the cathode foil, and a second arm of each L-shaped connecting terminal extends out of the bottom of each element;
s2, providing a lead frame with a plurality of pairs of lead pins arranged at intervals, wherein the lead frame comprises a plurality of lead units arranged on a frame body in an array manner, each lead unit comprises a pair of lead pins arranged at intervals and at least one hollow-out part, each lead pin comprises a root part and a pin part extending from the root part in the length direction of the lead pin, the lead pins are connected with the frame body through the root parts, the hollow-out parts surround the lead pin parts so that the lead pin parts can be separately arranged with the frame body, the hollow-out parts are rectangular holes and distributed on two opposite sides of the lead pins, the root parts of the two lead pins are respectively connected on two opposite side walls of the rectangular holes, the end parts of the pin parts of the two lead pins in each lead unit are oppositely arranged in the length direction of the lead pins, and the hollow-out parts distributed on two opposite sides of the lead pins are communicated with gaps between the lead pins, the frame body and the frame body form an I-shaped hole;
S3, fixing the second arm of the element on a lead pin of the lead frame by conductive adhesive;
s4, placing the lead frame fixed with the elements in an injection mold, and performing injection molding; the lead frame is positioned in a lower die of the injection mold, and a plurality of communicated or isolated injection molding cavities are formed between the upper die and the lower die; the bottom of the terminal pin and the far end of the extension part of the terminal pin, which extends from the joint of the terminal pin and the second arm to the outer side of the element, are exposed outside the injection molding cavity; the injection mold comprises an upper mold and a lower mold, and two pin positioning grooves, a first injection molding area, a second injection molding area and injection molding holes are sequentially arranged in the injection molding cavity from bottom to top; the element and the lead pins are wrapped in the injection molding material, and a positioning groove for fixing the lead frame is formed in the upper top surface of the lower die; the second injection molding area is of a cuboid structure, positive and negative marks are arranged at two adjacent corners of the second injection molding area, and the first injection molding area is of a cylindrical structure; one end of the lead pin connected with the lead frame is arranged outside the lead pin positioning groove;
S5, electroplating the lead frame group after injection molding;
and S6, cutting the terminal pins to obtain a plurality of patch type solid plastic package capacitors.
2. The method for manufacturing the chip mounted solid plastic-packaged capacitor according to claim 1, wherein S1 further includes winding electrolytic paper into a core package at a gap between the anode foil and the cathode foil, and performing a formation process on the element.
3. The method as set forth in claim 1, wherein the step S3 further comprises curing the lead frame and the elements thereon, wherein the curing is thermal curing, the curing temperature is 120-180 degrees, and the curing time is 20-30 minutes.
4. The manufacturing method of the SMD solid plastic packaged capacitor according to any one of claims 1-3, wherein said lead frame is a metal member.
5. The method for manufacturing the surface mounted solid plastic packaged capacitor according to any one of claims 1 to 3, wherein the conductive adhesive is copper adhesive or silver adhesive.
6. The method for manufacturing the patch type solid plastic package capacitor according to any one of claims 1 to 3, wherein the injection molding material is a polymer, and the polymer is one or more selected from alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, and polyurethane resin.
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| CN101409157B (en) * | 2008-11-21 | 2010-12-08 | 福建国光电子科技股份有限公司 | Packaging technique for solid electrolyte capacitor |
| CN108054012A (en) * | 2017-12-15 | 2018-05-18 | 株洲中电电容器有限公司 | It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor |
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