CN112080769B - Gold plating process for acoustic shielding cover - Google Patents
Gold plating process for acoustic shielding cover Download PDFInfo
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- CN112080769B CN112080769B CN202010741158.XA CN202010741158A CN112080769B CN 112080769 B CN112080769 B CN 112080769B CN 202010741158 A CN202010741158 A CN 202010741158A CN 112080769 B CN112080769 B CN 112080769B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
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- General Chemical & Material Sciences (AREA)
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses an acoustic shielding cover gold plating process, which comprises the following steps of; the method comprises the steps of carrying out pretreatment of chemical degreasing, electrolytic degreasing and acid washing activation on a workpiece, removing impurities such as grease on the surface of the workpiece, then carrying out chemical nickel plating, immersing the workpiece into a nickel salt solution for chemical plating, plating a nickel layer on the surface of the workpiece, finally connecting the workpiece to a cathode of a circuit, placing the workpiece into electroplating solution for electroplating, plating a gold layer on the surface of the nickel layer, wherein the electroplating solution comprises soluble gold salt, calculated by gold ion concentration, of 0.8-3.0g/L, 10-20g/L conductive salt, 0.1-0.6g/L wetting agent, 0.1-0.5g/L brightening agent and 20-35g/L complex complexing agent, the rest components are water, and the complex complexing agent comprises acetohydroxyamine and aminotrimethylene phosphonic acid. The electroplating solution is stable, and the density of the gold layer plated on the surface of the workpiece is high.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a gold plating process for an acoustic shielding case.
Background
The acoustic shield is used for surrounding the component, the circuit, the assembly, the cable or the interference source of the whole system by the shield to prevent the interference electromagnetic field from diffusing outwards. Such a shielding body is widely used in the fields of mobile phones, microphones, sound boxes, etc. for shielding a receiving circuit, device or system from an external electromagnetic field by surrounding them with a shielding body. Therefore, the quality of the acoustic shield is related to its excellent shielding performance. The acoustic shield is typically copper-based or stainless steel and is typically surface treated to improve the stability and utility of the acoustic shield. The gold tool has the advantages of good ductility, easy polishing, high chemical stability, strong corrosion resistance of the gold-plating layer, good electric conduction, easy welding, high temperature resistance, capability of prolonging the service life of metal parts and the like. Thus, electroplating gold onto the surface of the acoustic shield can greatly improve its utility.
Because the bonding force between the gold and the substrate of the acoustic shielding case is poor, the gold plating generally comprises two steps, namely plating a nickel layer on the surface of the gold and the substrate in a chemical plating mode, wherein the nickel layer has better bonding force with the substrate, and then plating the gold layer on the surface of the nickel layer. Besides the gold layer can protect the nickel layer from being oxidized, the gold layer also has the functions of good welding wettability, conductivity and the like, and the welding property and the welding strength of the acoustic shielding cover are effectively improved.
The prior publication No. CN101906649A discloses a plating solution and a plating method using cyanide-free gold electroplating, wherein the plating solution comprises gold trichloride, potassium carbonate, a complexing agent, potassium pyrophosphate and a compound additive, wherein the gold trichloride provides gold ions, and the complexing agent, the potassium pyrophosphate and the gold ions are used for complexing, so that the gold ions can exist in the solution in the form of complex ions, thereby increasing the cathode polarization and enabling the plating layer to be more delicate.
However, due to the existence of P-O bonds in potassium pyrophosphate, the electronegativity of O atoms is large, so that the P-O bonds have large polarity and are easy to hydrolyze in water, complex ions formed in a solution are unstable, and the quality of a plating layer is easy to influence.
Disclosure of Invention
In view of the defects in the prior art, a first object of the present invention is to provide an acoustic shield gold plating process, which has the advantages of stable electroplating solution and high density of gold layer plated on the surface of a workpiece.
In order to achieve the first object, the invention provides the following technical scheme:
an acoustic shield gold plating process is characterized by comprising the following steps;
(1) pretreatment: carrying out chemical degreasing, electrolytic degreasing, acid pickling and activation on the workpiece, and then washing and drying the workpiece;
(2) chemical nickel plating: dipping the workpiece obtained in the step (1) in a nickel salt solution, chemically plating a nickel layer on the surface of the workpiece, and then washing and drying;
(3) gold electroplating: dipping the workpiece obtained in the step (2) in electroplating solution, connecting the workpiece to be plated to a cathode of a circuit, electroplating, taking out the workpiece after electroplating, washing with water and drying;
wherein, the electroplating solution in the step (3) comprises the following components: the soluble gold salt is 0.8-3.0g/L, 10-20g/L of conductive salt, 0.1-0.6g/L of wetting agent, 0.1-0.5g/L of brightening agent and 20-35g/L of compound complexing agent by calculating the concentration of gold ions, and the rest components are water, wherein the compound complexing agent comprises acetohydroxyamine and aminotrimethylene phosphonic acid, and the weight ratio of the acetohydroxyamine to the aminotrimethylene phosphonic acid is 1: 1.5.
By adopting the technical scheme, acetohydroxyamine is used as a main complexing agent, aminotrimethylene phosphonic acid is used as an auxiliary complexing agent, both the acetohydroxyamine and the aminotrimethylene phosphonic acid can form complex ions with gold ions, and after the acetohydroxyamine and the gold ions form the complex ions, part of aminotrimethylene phosphonic acid can also form hydrogen bonds with the complex ions formed by the acetohydroxyamine and the gold ions, so that a second complex layer is continuously formed outside the complex ions formed by the acetohydroxyamine and the gold ions, and the complexing effect on the gold ions is greatly improved. In the electroplating process, the gold ions are reduced on the surface of the workpiece after being separated from the two complexing layers, so that the discharge potential of the gold ions becomes negative, the polarization effect of the cathode becomes large, the crystal grains of the coating are more refined, the surface of the coating is finer, and the coating has better hardness.
In addition, the P-C bond exists in the aminotrimethylene phosphonic acid, and compared with P-O, the aminotrimethylene phosphonic acid has the advantages of better chemical stability, difficult hydrolysis and the like, so that the aminotrimethylene phosphonic acid and the gold ions can stably exist in water after being complexed, and the stability of the electroplating solution is better.
Further, the electroplating solution comprises soluble gold salt, calculated by gold ion concentration, of 1.5-2.0g/L, 15-18g/L of conductive salt, 0.2-0.4g/L of wetting agent, 0.2-0.4g/L of brightening agent and 25-30g/L of compound complexing agent, the balance of the components are water, the compound complexing agent comprises acetohydroxyamine and aminotrimethylene phosphonic acid, and the weight ratio of the acetohydroxyamine to the aminotrimethylene phosphonic acid is 1: 1.5.
By adopting the technical scheme, the electroplating solution has better stability by using better proportion, and the electroplated coating has better performance.
Further, the brightening agent is sodium thiosulfate or potassium thiosulfate.
Through adopting above-mentioned technical scheme, sodium thiosulfate or potassium thiosulfate can let the gold ion become the burden at the electric potential that the negative pole crystallization is reduced, thereby further improve the polarization of negative pole, make the growth rate that the formation rate of negative pole surface crystal nucleus is greater than the crystalline grain, the crystal nucleus that obtains is thinner, thereby make cladding material surface more bright, and, thiosulfate ion can and the gold ion between have weak complexation, further improve the complexation effect to the gold ion, thereby make the crystal nucleus that the electroplating process formed more meticulous, higher density has.
Further, the wetting agent is a mixture of heterogeneous lauryl polyoxyethylene ether and octyl phenol polyoxyethylene ether, and the weight ratio of the heterogeneous lauryl polyoxyethylene ether to the octyl phenol polyoxyethylene ether is 1:1.
By adopting the technical scheme, the isomeric dodecyl alcohol polyoxyethylene ether and the octyl phenol polyoxyethylene ether are both nonionic surfactants, and the isomeric dodecyl alcohol polyoxyethylene ether and the octyl phenol polyoxyethylene ether are used cooperatively, so that the surface tension of the electroplating solution can be better reduced, a small amount of hydrogen generated on a cathode can be more conveniently discharged, air holes generated on a plating layer are reduced, and the quality of the plating layer is improved; in addition, the isomeric dodecyl alcohol polyoxyethylene ether and the octyl phenol polyoxyethylene ether both have higher cloud points, can be used at higher temperature, and improve the electroplating temperature selectivity in a wider range.
Further, the electroplating solution also comprises 0.5-0.8g/L of N-phenyliminodiacetic acid.
By adopting the technical scheme, the electroplating solution also comprises N-phenyliminodiacetic acid, the workpiece is plated with nickel and then plated with gold, when the workpiece is immersed into the electroplating solution, a small part of nickel and gold ions in the electroplating solution are subjected to a displacement reaction, nickel ions enter the electroplating solution, and can be formed on a cathode by obtaining electrons at the cathode in the electroplating process, so that spots are formed on the surface of a gold layer, the N-phenyliminodiacetic acid tends to be coordinated with 2-valent metal ions, the nickel ions in the electroplating solution can be captured, the 2-valent impurity ions in the electroplating solution can be captured, the influence of the impurity ions on the quality of the plating layer is reduced, and the quality of the plating layer is improved.
Further, the current density in the electroplating process is 0.4-0.7A/dm2。
By adopting the technical scheme, when the current density is small, the obtained coating has higher density under the polarization action of the cathode, the scorching phenomenon is easy to occur when the current density is overlarge, and the density is 0.4-0.7A/dm in an experiment2Has better electroplating effect, and the obtained plating layer has better hardness.
Further, in the electroplating process of the step (3), the temperature of the electroplating solution is 35-50 ℃.
By adopting the technical scheme, the temperature is increased by a certain value, the upper limit of the current density can be improved, the current efficiency of the cathode is improved, the crystal grains of the coating can be finer, and the binding force of the coating is improved.
Further, in the preparation process of the electroplating solution, firstly, soluble gold salt and acetohydroxamic acid are dissolved in water, then, aminotrimethylene phosphonic acid is added and uniformly stirred, and finally, a brightener, a wetting agent and N-phenyliminodiacetic acid are added and uniformly stirred to obtain the electroplating solution.
By adopting the technical scheme, the soluble gold salt and the acetohydroxamic acid are dissolved in water to carry out a complexing reaction, then the aminotrimethylene phosphonic acid is dissolved in the obtained solution, the aminotrimethylene phosphonic acid and the complexing ions form a wrapping layer of a second layer through hydrogen bonds, the complexing effect is further improved, and finally the brightener, the wetting agent and the N-phenyliminodiacetic acid are added, and the obtained electroplating solution is stirred uniformly, so that the electroplating solution has better stability.
In conclusion, the invention has the following beneficial effects:
gold ions are complexed through main acetohydroxamic acid and aminotrimethylene phosphonic acid, and hydrogen bonds can exist between the aminotrimethylene phosphonic acid and the complex ions of the acetohydroxamic acid and the gold ions, so that the complexing effect on the gold ions is further improved, and a gold layer obtained in the electroplating process can be more detailed and has better density and hardness; the performance of the obtained coating can be further improved by adding a brightener and a wetting agent.
Detailed Description
The present invention will be described in further detail with reference to examples.
The raw materials used in the present application are all commercially available products.
Example 1: an acoustic shield gold plating process comprising the steps of;
(1) pretreatment: chemically removing oil from the workpiece, putting the workpiece into an aqueous solution containing 10 wt% of sodium hydroxide, 5 wt% of sodium carbonate and 5 wt% of sodium dodecyl sulfate during chemical oil removal, heating to 80 ℃ for oil removal, taking out, washing and drying; then electrolytic degreasing is carried out, the workpiece is connected to a circuit cathode in the electrolytic degreasing process, the workpiece is immersed into 20 wt% of sodium hydroxide solution for electrolytic degreasing for 3 minutes, and then the workpiece is taken out for washing and drying; and then carrying out acid washing activation, wherein the acid washing activation process comprises the steps of immersing the obtained workpiece into a 5 wt% hydrochloric acid solution for 3 minutes, taking out, washing and drying to finish pretreatment.
(2) Chemical nickel plating: and (2) dipping the workpiece obtained in the step (1) into a nickel salt solution, chemically plating a nickel layer on the surface of the workpiece, wherein the nickel salt solution comprises 12g/L nickel sulfate, 4g/L sodium hypophosphite, 20g/L sodium citrate and 0.5g/L stannous chloride, chemically plating for 5 minutes to plate the nickel layer on the surface of the workpiece, and then taking the workpiece out to wash and dry.
(3) Gold electroplating: firstly preparing electroplating solution, dissolving soluble gold salt and acetohydroxyamine acid in water, adding aminotrimethylene phosphonic acid, uniformly stirring, finally adding brightener, wetting agent and N-phenyliminodiacetic acid, and uniformly stirring to obtain the electroplating solution. Wherein, the component content of the electroplating solution is as follows: the concentration of the soluble gold salt is 0.8g/L calculated by gold ion, the concentration of the conductive salt is 10g/L, the concentration of the wetting agent is 0.1g/L, the concentration of the brightening agent is 0.1g/L, the concentration of the complex complexing agent is 20g/L, the concentration of the N-phenyliminodiacetic acid is 0.5g/L, and the rest components are water. The complex complexing agent comprises acetohydroxamic acid and aminotrimethylene phosphonic acid, and the weight ratio of the acetohydroxamic acid to the aminotrimethylene phosphonic acid is 1: 1.5. The wetting agent is a mixture of isomeric decyl alcohol polyoxyethylene ether and octyl phenol polyoxyethylene ether, and the weight ratio of isomeric decyl alcohol polyoxyethylene ether to octyl phenol polyoxyethylene ether is 1:1. The brightener is sodium thiosulfate. The soluble gold salt is gold trichloride, and the conductive salt is potassium carbonate.
Immersing the workpiece obtained in the step (2) in an electroplating solution, wherein the temperature of the electroplating solution is 35 ℃, the workpiece to be electroplated is connected with a cathode of a circuit, an anode for electroplating can be a gold plate or an inert anode, graphite is preferably used as the anode for electroplating, and the current density is controlled to be 0.4A/dm2Plating gold layer on the surface of the workpiece, and taking out the workpiece after electroplatingAnd washing and drying.
The process steps and raw materials of examples 2 to 5 were the same as those of example 1, except that the formulation of the plating solution and the process parameters of plating were different, and the formulation and process parameters of the plating solutions of examples 1 to 5 are shown in Table 1;
TABLE 1 formulation and Process parameters for electroplating baths of examples 1-5
Comparative example 1
The comparative example differs from example 3 in that no brightener was added to the plating bath and the other formulations and process parameters were the same.
Comparative example 2
The comparative example is different from example 3 in that only acetohydroxyamine acid is added as a complexing agent in the plating solution, and the other formulation and process parameters are the same.
Comparative example 3
This comparative example differs from example 3 in that only aminotrimethylene phosphonic acid was added as a complexing agent in the plating bath, and the other formulation and process parameters were the same.
Comparative example 4
The difference between the comparative example and the example 5 is that only isomeric dodecyl alcohol polyoxyethylene ether is added as the wetting agent in the electroplating solution, and the other formulas and the process parameters are the same.
Comparative example 5
The difference between the comparative example and the example 5 is that only the octylphenol polyoxyethylene ether is added as the wetting agent in the electroplating solution, and the other formulas and the process parameters are the same.
Comparative example 6
This comparative example differs from example 5 in that no N-phenyliminodiacetic acid was added to the plating bath and the other formulation and process parameters were the same.
Comparative example 7
The comparative example differs from example 5 in that the current density during electroplating was 1.5A/dm2, and the other formulations and process parameters were the same.
Comparative example 8
The difference between the comparative example and the example 5 is that the weight ratio of the acetohydroxamic acid to the aminotrimethylene phosphonic acid in the complex complexing agent is 1: 3, and other formulas and process parameters are the same.
Detection method/test method
The coatings of examples 1-5 and comparative examples 1-8 were tested according to the GB/T34625-2017C-QA-LAB-006 standard, the results of which are given in Table 2;
TABLE 2 test results of examples 1 to 5 and comparative examples 1 to 8
| Test items | Coating Density (g/cm)-3) | Hardness (HV) |
| Example 1 | 16.1 | 154 |
| Example 2 | 16.3 | 155 |
| Example 3 | 16.9 | 158 |
| Comparative example 1 | 15.7 | 149 |
| Comparative example 2 | 16.1 | 155 |
| Comparative example 3 | 16.1 | 152 |
| Example 4 | 16.9 | 158 |
| Example 5 | 16.6 | 156 |
| Comparative example 4 | 16.2 | 153 |
| Comparative example 5 | 16.3 | 154 |
| Comparative example 6 | 16.1 | 152 |
| Comparative example 7 | 15.1 | 145 |
| Comparative example 8 | 16.0 | 151 |
As can be seen from Table 2, the addition of the brightener enables the resulting coating to have higher density and hardness, mainly because the brightener enables the reduction potential of gold ions in cathode crystallization to become negative, and improves the polarization of the cathode, so that the crystal nuclei of the coating are finer, the deposition is tighter, and the coating has high density, as can be seen from the comparison of example 3 with comparative example 1.
It can be seen from the comparison between example 3 and comparative examples 2 and 3 that the combination of acetohydroxamic acid and aminotrimethylene phosphonic acid can improve the density and hardness of the plating layer, mainly because both acetohydroxamic acid and aminotrimethylene phosphonic acid can generate complexation with gold ions, and when acetohydroxamic acid and aminotrimethylene phosphonic acid are combined, aminotrimethylene phosphonic acid can also form hydrogen bonds with the complex ions formed by acetohydroxamic acid and gold ions, so as to further improve the complexation effect and improve the polarization of the cathode. Therefore, the crystal grains of the plating layer are finer and the density is higher.
It can be seen from the comparison between example 5 and comparative examples 4 and 5 that the use of the lubricant can reduce the surface tension of the electroplating solution, so that hydrogen generated in the electroplating process can be discharged more quickly, and the existence of air holes is reduced, so that the density is higher, and the isomeric dodecyl alcohol polyoxyethylene ether and the octyl phenol polyoxyethylene ether have better wetting effect when being used in a compounding way.
As can be seen from the comparison of example 5 and comparative example 6, the addition of a certain amount of N-phenyliminodiacetic acid results in a coating with better hardness, and the N-phenyliminodiacetic acid can capture some of the impurity ions with a valence of 2 in the electroplating solution, so that the coating is not affected by other metal ions.
As can be seen from a comparison of example 5 and comparative example 7, when the current density is too high, the density of the resulting plating layer is small and the hardness is low.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (6)
1. An acoustic shield gold plating process is characterized by comprising the following steps;
(1) pretreatment: carrying out chemical degreasing, electrolytic degreasing, acid pickling and activation on the workpiece, and then washing and drying the workpiece;
(2) chemical nickel plating: dipping the workpiece obtained in the step (1) in a nickel salt solution, chemically plating a nickel layer on the surface of the workpiece, and then washing and drying;
(3) gold electroplating: dipping the workpiece obtained in the step (2) in electroplating solution, connecting the workpiece to be plated to a cathode of a circuit, electroplating, taking out the workpiece after electroplating, washing with water and drying;
wherein, the electroplating solution in the step (3) comprises the following components: the soluble gold salt is 0.8-3.0g/L, 10-20g/L of conductive salt, 0.1-0.6g/L of wetting agent, 0.1-0.5g/L of brightening agent and 20-35g/L of compound complexing agent by calculating the concentration of gold ions, and the rest components are water, wherein the compound complexing agent comprises acetohydroxyamine and aminotrimethylene phosphonic acid, and the weight ratio of the acetohydroxyamine to the aminotrimethylene phosphonic acid is 1: 1.5; the brightening agent is sodium thiosulfate or potassium thiosulfate; the wetting agent is a mixture of isomeric dodecyl alcohol polyoxyethylene ether and octyl phenol polyoxyethylene ether, and the weight ratio of the isomeric dodecyl alcohol polyoxyethylene ether to the octyl phenol polyoxyethylene ether is 1:1.
2. The process of claim 1, wherein the plating solution comprises a soluble gold salt in a concentration of gold ions of 1.5-2.0g/L, a conductive salt of 15-18g/L, a wetting agent of 0.2-0.4g/L, a brightener of 0.2-0.4g/L, and a complex complexing agent of 25-30g/L, wherein the complex complexing agent comprises acetohydroxyamine and aminotrimethylene phosphonic acid, and the weight ratio of acetohydroxyamine to aminotrimethylene phosphonic acid is 1: 1.5.
3. The acoustic shield gold plating process of claim 1, wherein the plating solution further comprises 0.5-0.8g/L N-phenyliminodiacetic acid.
4. The process of claim 1, wherein the current density during the electroplating in step (3) is 0.4-0.7A/dm2。
5. The process of plating gold on an acoustic shield according to claim 1, wherein the plating solution is at a temperature of 35 to 50 ℃ during the plating in step (3).
6. The process for plating gold on an acoustic shielding cover as set forth in claim 3, wherein the plating solution is prepared by dissolving soluble gold salt and acetohydroxamic acid in water, adding aminotrimethylene phosphonic acid, stirring, adding brightener, wetting agent and N-phenyliminodiacetic acid, and stirring to obtain the plating solution.
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| CN114892225B (en) * | 2021-09-30 | 2023-03-14 | 深圳市联合蓝海黄金材料科技股份有限公司 | Plating solution for electroplating gold on nickel coating and method for electroplating gold on nickel coating, gold-plated part and application |
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| US5434331A (en) * | 1992-11-17 | 1995-07-18 | The Catholic University Of America | Removal of radioactive or heavy metal contaminants by means of non-persistent complexing agents |
| CN102212805A (en) * | 2011-05-11 | 2011-10-12 | 深圳市精诚达电路有限公司 | Cyanogen-free gold leaching liquid and cyanogen-free gold leaching process |
| CN111364074A (en) * | 2020-02-21 | 2020-07-03 | 厦门大学 | Preparation method of composite coordination low-concentration monovalent gold cyanide-free gold-plating electroplating solution |
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| US7446265B2 (en) * | 2005-04-15 | 2008-11-04 | Parker Hannifin Corporation | Board level shielding module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5434331A (en) * | 1992-11-17 | 1995-07-18 | The Catholic University Of America | Removal of radioactive or heavy metal contaminants by means of non-persistent complexing agents |
| CN102212805A (en) * | 2011-05-11 | 2011-10-12 | 深圳市精诚达电路有限公司 | Cyanogen-free gold leaching liquid and cyanogen-free gold leaching process |
| CN111364074A (en) * | 2020-02-21 | 2020-07-03 | 厦门大学 | Preparation method of composite coordination low-concentration monovalent gold cyanide-free gold-plating electroplating solution |
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