CN112077691B - 一种锑化镓单晶片的抛光方法 - Google Patents
一种锑化镓单晶片的抛光方法 Download PDFInfo
- Publication number
- CN112077691B CN112077691B CN202010737567.2A CN202010737567A CN112077691B CN 112077691 B CN112077691 B CN 112077691B CN 202010737567 A CN202010737567 A CN 202010737567A CN 112077691 B CN112077691 B CN 112077691B
- Authority
- CN
- China
- Prior art keywords
- polishing
- single crystal
- crystal wafer
- gallium antimonide
- antimonide single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
抛光状态 | 粗糙度Ra | |
实施例1 | 无划痕、起雾 | 0.095nm |
实施例2 | 无划痕、起雾 | 0.085nm |
实施例3 | 无划痕、起雾 | 0.115nm |
实施例4 | 无划痕、起雾 | 0.130nm |
实施例5 | 无划痕、起雾 | 0.140nm |
实施例6 | 无划痕、起雾 | 0.135nm |
抛光状态 | 粗糙度Ra | |
A组 | 无划痕、起雾 | 0.085nm |
B组 | 稀疏浅划痕 | 0.208nm |
C组 | 密集深划痕 | 0.288nm |
D组 | 稀疏深划痕 | 0.270nm |
抛光状态 | 粗糙度Ra | |
A组 | 无划痕、起雾 | 0.125nm |
B组 | 无划痕、起雾 | 0.130nm |
C组 | 稀疏划痕 | 0.135nm |
D组 | 密集划痕、起雾 | 0.382nm |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010737567.2A CN112077691B (zh) | 2020-07-28 | 2020-07-28 | 一种锑化镓单晶片的抛光方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010737567.2A CN112077691B (zh) | 2020-07-28 | 2020-07-28 | 一种锑化镓单晶片的抛光方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112077691A CN112077691A (zh) | 2020-12-15 |
CN112077691B true CN112077691B (zh) | 2022-07-22 |
Family
ID=73735289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010737567.2A Active CN112077691B (zh) | 2020-07-28 | 2020-07-28 | 一种锑化镓单晶片的抛光方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112077691B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113894623B (zh) * | 2021-10-29 | 2023-02-17 | 广东先导微电子科技有限公司 | 一种锑化镓晶片的单面抛光方法及锑化镓抛光片 |
CN114346795B (zh) * | 2021-12-02 | 2024-02-02 | 德阳三环科技有限公司 | 一种陶瓷基片的研磨方法 |
CN114800222B (zh) * | 2022-05-13 | 2023-09-26 | 中锗科技有限公司 | 一种锗晶片双面抛光的方法 |
CN115338694B (zh) * | 2022-07-01 | 2024-02-02 | 金华博蓝特新材料有限公司 | 一种双面抛光晶片的加工方法 |
CN115070619B (zh) * | 2022-08-18 | 2023-08-22 | 苏州燎塬半导体有限公司 | 一种锑化物磨抛夹具及锑化物晶片的磨抛方法 |
CN117733719B (zh) * | 2024-02-21 | 2024-05-03 | 北京特思迪半导体设备有限公司 | 一种锑化镓晶片的抛光方法及所制备的锑化镓抛光片 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1836842A (zh) * | 2006-04-19 | 2006-09-27 | 山东大学 | 大直径高硬度6H-SiC单晶片的表面抛光方法 |
CN101378002A (zh) * | 2008-09-12 | 2009-03-04 | 山东大学 | 一种用于GaN外延的衬底的加工方法 |
CN101775257A (zh) * | 2009-01-14 | 2010-07-14 | Axt公司 | 一种用于GaAs晶片的粗抛光溶液和粗抛光方法 |
CN102709170A (zh) * | 2012-05-08 | 2012-10-03 | 常州天合光能有限公司 | 用于少子寿命测量的硅片表面处理方法 |
CN105070655A (zh) * | 2015-07-15 | 2015-11-18 | 中国电子科技集团公司第四十六研究所 | 一种锑化镓单晶片的钝化方法 |
CN106078493A (zh) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | 陶瓷盘砂轮片双面研磨加工蓝宝石晶片的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040132384A1 (en) * | 2003-01-06 | 2004-07-08 | Chih-Jung Chen | Method for post-chemical mechanical polishing cleaning |
CN101235255B (zh) * | 2008-03-07 | 2011-08-24 | 大连理工大学 | 一种化学机械抛光半导体晶片用的抛光液 |
CN102554750A (zh) * | 2010-12-29 | 2012-07-11 | 北京有色金属研究总院 | 一种锑化镓晶片双面抛光方法 |
CN106064326B (zh) * | 2016-08-01 | 2018-03-06 | 中国电子科技集团公司第四十六研究所 | 一种用于锑化镓单晶片的抛光方法 |
CN106590439B (zh) * | 2016-12-07 | 2019-02-05 | 中国电子科技集团公司第十一研究所 | 一种抛光液及应用该抛光液对锑化镓晶片进行抛光的方法 |
-
2020
- 2020-07-28 CN CN202010737567.2A patent/CN112077691B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1836842A (zh) * | 2006-04-19 | 2006-09-27 | 山东大学 | 大直径高硬度6H-SiC单晶片的表面抛光方法 |
CN101378002A (zh) * | 2008-09-12 | 2009-03-04 | 山东大学 | 一种用于GaN外延的衬底的加工方法 |
CN101775257A (zh) * | 2009-01-14 | 2010-07-14 | Axt公司 | 一种用于GaAs晶片的粗抛光溶液和粗抛光方法 |
CN102709170A (zh) * | 2012-05-08 | 2012-10-03 | 常州天合光能有限公司 | 用于少子寿命测量的硅片表面处理方法 |
CN105070655A (zh) * | 2015-07-15 | 2015-11-18 | 中国电子科技集团公司第四十六研究所 | 一种锑化镓单晶片的钝化方法 |
CN106078493A (zh) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | 陶瓷盘砂轮片双面研磨加工蓝宝石晶片的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112077691A (zh) | 2020-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112077691B (zh) | 一种锑化镓单晶片的抛光方法 | |
US7927186B2 (en) | Method for producing glass substrate for magnetic disk | |
JP3631949B2 (ja) | 半導体ウェハ、その製造方法および使用 | |
KR100420621B1 (ko) | 실리콘웨이퍼의 표면연마방법 | |
KR100420087B1 (ko) | 산화세륨 연마제 및 기판의 연마법 | |
US8092280B2 (en) | Glass substrate for magnetic disk and method for producing the same | |
TWI622687B (zh) | 硏磨墊及其製造方法 | |
US20110223840A1 (en) | Polishing Composition and Polishing Method Using The Same | |
JP2001244221A (ja) | 半導体ウェハの製造方法およびこの種の半導体ウェハ | |
US8440541B2 (en) | Methods for reducing the width of the unbonded region in SOI structures | |
TWI414012B (zh) | Single crystal silicon wafer finishing grinding method and single crystal silicon wafer | |
TWI464125B (zh) | 合成石英玻璃基板之製造方法 | |
TWI690588B (zh) | 膠體二氧化矽研磨材及使用其之合成石英玻璃基板的製造方法 | |
CN107398780B (zh) | 一种晶圆的双面抛光方法 | |
US11551922B2 (en) | Method of polishing silicon wafer including notch polishing process and method of producing silicon wafer | |
JP5493956B2 (ja) | 半導体ウェーハの製造方法 | |
CN101611477B (zh) | 用于抛光异质结构的方法 | |
US20030060020A1 (en) | Method and apparatus for finishing substrates for wafer to wafer bonding | |
WO2016180273A1 (zh) | 一种异形半导体晶片、制备方法及晶片支承垫 | |
KR20020017910A (ko) | 재생웨이퍼를 반도체웨이퍼로 변환시키는 방법 | |
TW201908056A (zh) | 研磨方法 | |
JPH097987A (ja) | 半導体ウェーハ研磨用研磨剤及び研磨方法 | |
CN116652700A (zh) | 一种锑化镓单晶片的手工抛光方法 | |
CN113894623B (zh) | 一种锑化镓晶片的单面抛光方法及锑化镓抛光片 | |
CN106590439A (zh) | 一种抛光液及应用该抛光液对锑化镓晶片进行抛光的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Huang Li Inventor after: Yan Bing Inventor after: Liang Hongyu Inventor after: Zhang Bingjie Inventor after: Zhang Chuanjie Inventor after: Liu Weihua Inventor before: Yan Bing Inventor before: Liang Hongyu Inventor before: Zhang Bingjie Inventor before: Zhang Chuanjie Inventor before: Liu Weihua |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |