CN112066340A - Heat dissipation device for car lamp LED array module and control method thereof - Google Patents

Heat dissipation device for car lamp LED array module and control method thereof Download PDF

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Publication number
CN112066340A
CN112066340A CN201910494652.8A CN201910494652A CN112066340A CN 112066340 A CN112066340 A CN 112066340A CN 201910494652 A CN201910494652 A CN 201910494652A CN 112066340 A CN112066340 A CN 112066340A
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CN
China
Prior art keywords
heat dissipation
led array
array module
fan
heat
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Pending
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CN201910494652.8A
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Chinese (zh)
Inventor
薛金诚
叶盾
唐芝彬
周圣叶
刘维茜
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Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Application filed by Changzhou Xingyu Automotive Lighting Systems Co Ltd filed Critical Changzhou Xingyu Automotive Lighting Systems Co Ltd
Priority to CN201910494652.8A priority Critical patent/CN112066340A/en
Publication of CN112066340A publication Critical patent/CN112066340A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/46—Forced cooling using liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/57—Cooling arrangements using liquid coolants characterised by control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/61—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention belongs to the technical field of heat dissipation of vehicle illuminating lamps, and particularly relates to a heat dissipation device of a vehicle lamp LED array module, which comprises an LED chip array, a PCB and a heat radiator, wherein the LED chip array is arranged on the PCB, the heat radiator comprises a base and a plurality of mutually communicated heat dissipation columns, the PCB is arranged on the base, the heat dissipation columns are arranged on one side of the base, which is far away from the PCB, a fan is arranged on one side of the heat dissipation columns, which is far away from the base, a loop is formed between each heat dissipation column and a water tank, and a micro water pump and a heat dissipation structure are arranged between one side of the water tank and each. The invention can meet the requirement of the LED array module on a high-performance heat dissipation device, can improve the heat dissipation performance of the LED array module according to the change of the power of the LED array module, achieves the purposes of energy conservation and environmental protection, can always control the junction temperature of the chip within the standard working temperature, can effectively dissipate heat when the LED array module is at the maximum power, maintains the illumination performance of the LED, and can adapt to the power change of the LED array module.

Description

Heat dissipation device for car lamp LED array module and control method thereof
Technical Field
The invention belongs to the technical field of heat dissipation of vehicle illuminating lamps, and particularly relates to a heat dissipation device of a vehicle lamp LED array module and a control method thereof.
Background
With the continuous development of automobile illumination, LEDs have already occupied most of markets in the field of automobile illumination, however, due to the excessively low electro-optic conversion efficiency of LEDs, a large amount of electric energy is converted into heat energy, which causes the increase of chip junction temperature, and further affects the performance and service life of LEDs.
LED array modules have gradually become a trend in the field of automotive lighting, which means higher heating power and put higher demands on the heat dissipation performance of LED modules, and the current mainstream active heat dissipation mode is forced convection heat dissipation by air, i.e. a fan is used to make airflow around the device flow to take away heat. But in the face of higher heat dissipation requirements, the air-cooled heat dissipation effect is limited, and the water-cooled heat dissipation can achieve a better heat dissipation effect than air cooling.
Compared with the common LED module, the LED array module has larger heat dissipation requirement, so that the size of the radiator is larger than that of the common LED module, and the radiator cannot be arranged in the car lamp. Therefore, an external heat sink is often used, that is, the lower part of the heat sink base is placed outside the lamp.
Different from a common LED lighting module, the LED array module has higher flexibility, the number of LEDs emitting light can be automatically adjusted according to the situation, the whole power of the LED module is in a changing state, and if the heat dissipation structure is designed according to the maximum power of the LED module, the requirements of energy conservation and environmental protection cannot be well met.
Therefore, a heat dissipation device for a vehicle lamp LED array module and a control method thereof need to be designed, which not only can meet the requirement of the LED array module on a high-performance heat dissipation device, but also can improve the heat dissipation performance of the vehicle lamp LED array module according to the power change of the LED array module, thereby achieving the purposes of energy saving and environmental protection.
Disclosure of Invention
The invention aims to solve the defects and shortcomings in the prior art, and provides a heat dissipation device for an LED array module of a vehicle lamp and a control method thereof, which are used for controlling the junction temperature of an LED chip within a standard working temperature all the time, so that the heat can be effectively dissipated when the LED array module is at the maximum power, the illumination performance of an LED can be maintained, and the heat dissipation device can adapt to the power change of the LED array module.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: the utility model provides a car light LED array module heat abstractor, includes LED chip array, PCB board and radiator, LED chip array sets up on the PCB board, the radiator includes base and a plurality of heat dissipation post that communicate each other, the PCB board sets up on the base, the heat dissipation post sets up the one side of keeping away from the PCB board at the base, one side that the base was kept away from to the heat dissipation post is equipped with the fan, form the return circuit between heat dissipation post and the water tank, and be equipped with micro-water pump and heat radiation structure between water tank one side and the heat dissipation post.
Preferably, the heat dissipation columns are of cylindrical hollow structures, and the adjacent heat dissipation columns are sequentially connected end to end.
Preferably, a plurality of the heat dissipation columns are communicated with each other to form a whole, a water inlet and a water outlet are respectively formed in the left end and the right end of the whole, and the water inlet and the water outlet are respectively communicated with the inside of the water tank through pipelines.
Preferably, a plurality of radiating fins are uniformly distributed on the outer surface of the radiating column.
Preferably, four radiating fins are distributed on each radiating column.
Preferably, the heat dissipation structure is provided with annular fins, and the annular fins are in interference fit with the pipeline.
Preferably, the base is symmetrically provided with temperature sensors at positions corresponding to the left side and the right side of the PCB.
Preferably, the micro water pump and the fan are both connected with a controller, and the controller controls the opening and closing of the fan and the micro water pump and the flow regulation of the micro water pump through the control driving module.
A control method for a car lamp LED array module heat dissipation device sets a standard temperature T for normal work of an LED chip array0Chip junction temperature TjFlow Q, T of micro water pumpj＝T0Temperature T of stable chip junction temperature after fan is turned on1；
As chip junction temperature Tj≤T0When the fan is started, the fan is started;
when T isj＞T0When the fan is started, the fan is started;
after the fan is started for a period of time T, if TjStill above T0The controller starts the micro water pump, wherein the flow Q of the micro water pump and the junction temperature T of the chipjAnd a standard temperature T0Satisfies the functional relationship: q ═ f (T)j-T0)；
As chip junction temperature TjBelow T0Then, the micro water pump is closed; at this time, if Tj＜T1The fan is turned off.
Preferably, the measured temperature T of the temperature sensor is set, the value of T is the time elapsed until the value T measured by the temperature sensor is stable after the fan is turned on, and the value T stable measured by the temperature sensor means the value T currently measured by the temperature sensor and the value T stable thereof0Value T measured before secondKIs less than the constant b.
Wherein the measured temperature T of the temperature sensor is the average value of the measured values of the left and right sensors and the chip junction temperature Tj＝T+P0·RS，P0For thermal power, R, of the LED array moduleSIs the thermal resistance, P, of the LED chip to the heat sink0＝PT·(1-η)，PTThe total power of the LED array module is eta, the electro-optical conversion efficiency of the chips is eta, and the total power P of the LED array module is P because the number of the lighted chips in the LED array module always changes along with the change of road conditionsTNot a constant value. PTAnd n is counted by a controller of the LED array module and transmitted to the controller of the heat dissipation device through a bus.
After the technical scheme is adopted, the invention has the following beneficial effects:
by adopting the heat dissipation device for the vehicle lamp LED array module, which is provided by the invention, the plurality of hollow heat dissipation columns are arranged on the heat radiator, and the adjacent heat dissipation columns are connected end to form a communicated whole, so that cooling water can conveniently flow through the interiors of all the heat dissipation columns, and heat is taken away; the radiating fins are arranged outside the radiating column, so that the contact area between the radiating column and the air can be increased, and the radiating is facilitated; a loop is formed between the heat dissipation column and the water tank, so that the heat dissipation column can be conveniently and continuously cooled circularly by cooling liquid under the action of the micro water pump; through annular fin and pipeline interference fit on the heat radiation structure, be favorable to going in the heat transfer to the air with liquid in the pipeline, be favorable to promptly cooling to liquid in the pipeline, the cyclic utilization of the coolant liquid of being convenient for.
The control method of the vehicle lamp LED array module heat dissipation device provided by the invention can meet the requirement of the LED array module on the high-performance heat dissipation device, can improve the heat dissipation performance of the vehicle lamp LED array module according to the change of the power of the LED array module, achieves the purposes of energy conservation and environmental protection, can control the junction temperature of the chip within the standard working temperature all the time, can effectively dissipate heat when the LED array module is at the maximum power, maintains the illumination performance of the LED, and can adapt to the power change of the LED array module.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation device for a vehicular lamp LED array module according to the present invention;
FIG. 2 is a schematic structural diagram of a heat sink in the heat dissipation device of the LED array module of the vehicular lamp according to the present invention;
FIG. 3 is a bottom view of a heat sink in the heat dissipation device of the LED array module of the vehicular lamp of the present invention;
FIG. 4 is a schematic structural diagram of a heat dissipation pillar in the heat dissipation device of the LED array module of the vehicle lamp according to the present invention;
FIG. 5 is a schematic structural diagram of a heat dissipation structure of a heat dissipation device of an LED array module for a vehicle lamp according to the present invention;
fig. 6 is a control flow chart of the heat dissipation device for the vehicle lamp LED array module according to the present invention.
Wherein: the LED chip array comprises an LED chip array 1, a PCB 2, a radiator 3, a base 4, a radiating column 5, a fan 6, a water tank 7, a micro water pump 8, a radiating structure 9, a water inlet 10, a water outlet 11, a pipeline 12, radiating fins 13, a temperature sensor 14, a controller 15 and a driving module 16.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1-5, the heat dissipation device for the vehicle lamp LED array module according to the present invention includes an LED chip array 1, a PCB 2 and a heat sink 3, wherein the LED chip array 1 is disposed on the PCB 2, the heat sink 3 includes a base 4 and a plurality of heat dissipation pillars 5 that are mutually communicated, the PCB 2 is disposed on the base 4, the heat dissipation pillars 5 are disposed on one side of the base 4 away from the PCB 2, a fan 6 is disposed on one side of the heat dissipation pillars 5 away from the base 4, a loop is formed between the heat dissipation pillars 5 and a water tank 7, and a micro water pump 8 and a heat dissipation structure 9 are disposed between one side of the water tank 7 and the heat dissipation pillars 5.
Wherein, the heat dissipation post 5 is cylinder type hollow structure, and is adjacent in proper order end to end connection between the heat dissipation post 5, a plurality of heat dissipation post 5 communicates each other and forms a whole, and both ends are equipped with water inlet 10 and delivery port 11 respectively about this whole, water inlet 10 and delivery port 11 communicate with the inside of water tank 7 from water tank 7 both sides through pipeline 12 respectively, micro water pump 8 and heat radiation structure 9 set up in delivery port 11 one side, and heat radiation structure 9 is used for giving off the heat that the cooling water brought out to the external world again, and the quantity of heat radiation structure 9 can increase and decrease as required, evenly distributed has a plurality of radiating fins 13 on the surface of heat dissipation post 5, specifically, every it has four radiating fins 13 to equally distribute on the heat dissipation post 5, heat radiation structure 9 is the heat radiation structure who is equipped with annular fin, interference fit between annular fin and pipeline 12, the symmetry is equipped with temperature sensor 14 on the position of base 4 corresponding PCB board 2 left and right sides, miniature pump 8 and fan 6 all are connected with controller 15, controller 15 controls opening and closing of fan 6 and miniature pump 8 and the flow control of miniature pump 8 through control drive module 16, and miniature pump 8 flow is big more, and the velocity of flow is high more promptly, and then the heat of taking away is more.
The radiator 3 is an external radiator, and the fan 6, the water tank 7, the micro water pump 8, the heat dissipation structure 9, the controller 15 and the driving module 16 are all arranged outside the lamp.
When the heat dissipation device for the vehicle lamp LED array module is used, when the LED chip array 1 arranged on the PCB 2 works, a small part of generated heat is dissipated to the outside through radiation, most of the heat is transferred to the base 4 of the heat sink 3 through heat conduction, and the heat dissipation column 5 on the base 4 is cooled and dissipated through the fan 6 and cooling water in the water tank 7, so that the LED array module is effectively dissipated, and the fan 6 and the water tank 7 can be used independently or in combination according to heat dissipation requirements; and the water cooled by the heat dissipation column 5 can be cooled by the heat dissipation structure 9 and then returns to the water tank again for recycling.
According to the heat dissipation device for the LED array module of the car lamp, the plurality of hollow heat dissipation columns are arranged on the heat radiator, and the adjacent heat dissipation columns are connected end to form a communicated whole, so that cooling water can conveniently flow through the interiors of all the heat dissipation columns, and heat is taken away; the radiating fins are arranged outside the radiating column, so that the contact area between the radiating column and the air can be increased, and the radiating is facilitated; a loop is formed between the heat dissipation column and the water tank, so that the heat dissipation column can be conveniently and continuously cooled circularly by cooling liquid under the action of the micro water pump; through annular fin and pipeline interference fit on the heat radiation structure, be favorable to going in the heat transfer to the air with liquid in the pipeline, be favorable to promptly cooling to liquid in the pipeline, the cyclic utilization of the coolant liquid of being convenient for.
As shown in fig. 6, in order to control the heat dissipation device of the LED array module of the vehicle lamp according to the present invention, the standard temperature T of the LED chip array 1 for normal operation is set0Chip junction temperature T j8 flow Q, T of micro water pumpj＝T0Temperature T of stable chip junction temperature after fan 6 is turned on1；
After the power of the LED array module rises, the junction temperature of the LED chip rises;
as chip junction temperature Tj≤T0When the fan 6 is not started;
when T isj＞T0When the fan is started, the fan 6 is started;
after the fan 6 is started for a period of time T, if TjStill above T0The controller 15 starts the micro-water pump 8, wherein the flow Q of the micro-water pump 8 and the chip junction temperature TjAnd a standard temperature T0Satisfies the functional relationship: q ═ f (T)j-T0)；
As chip junction temperature TjBelow T0Then, the micro water pump 8 is turned off; at this time, if Tj＜T1The fan 6 is turned off.
Further, the measured temperature T of the temperature sensor 14 is set, the value of T is the time that elapses after the fan 6 is turned on until the value T measured by the temperature sensor 14 stabilizes, and the value T measured by the temperature sensor 14 stabilizes refers to the value T currently measured by the temperature sensor 14 and the value T thereof0Value T measured before secondKIs less than the constant b.
Wherein the temperature is transmittedThe measured temperature T of the sensor is the average value of the measured values of the left and right sensors and the chip junction temperature Tj＝T+P0·RS，P0For thermal power, R, of the LED array moduleSIs the thermal resistance, P, of the LED chip to the heat sink0＝PT·(1-η)，PTThe total power of the LED array module is eta, the electro-optical conversion efficiency of the chips is eta, and the total power P of the LED array module is P because the number of the lighted chips in the LED array module always changes along with the change of road conditionsTNot a constant value. PTAnd n is counted by a controller of the LED array module and transmitted to the controller of the heat dissipation device through a bus.
The control method of the vehicle lamp LED array module heat dissipation device provided by the invention can meet the requirement of the LED array module on the high-performance heat dissipation device, can improve the heat dissipation performance of the vehicle lamp LED array module according to the change of the power of the LED array module, achieves the purposes of energy conservation and environmental protection, can control the junction temperature of the chip within the standard working temperature all the time, can effectively dissipate heat when the LED array module is at the maximum power, maintains the illumination performance of the LED, and can adapt to the power change of the LED array module.
Therefore, the invention has wide market prospect and is worth popularizing and utilizing.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (10)

1. The utility model provides a car light LED array module heat abstractor, includes LED chip array (1), PCB board (2) and radiator (3), its characterized in that: LED chip array (1) sets up on PCB board (2), radiator (3) include base (4) and a plurality of heat dissipation post (5) that communicate each other, PCB board (2) set up on base (4), heat dissipation post (5) set up the one side of keeping away from PCB board (2) in base (4), one side that base (4) were kept away from in heat dissipation post (5) is equipped with fan (6), form the return circuit between heat dissipation post (5) and water tank (7), and be equipped with micro-water pump (8) and heat radiation structure (9) between water tank (7) one side and heat dissipation post (5).
2. The heat sink for the LED array module of the car light as claimed in claim 1, wherein: the heat dissipation columns (5) are of cylindrical hollow structures, and the adjacent heat dissipation columns (5) are sequentially connected end to end.
3. The heat sink for the LED array module of the car lamp as claimed in claim 2, wherein: a plurality of heat dissipation post (5) communicate each other and form a whole, and both ends are equipped with water inlet (10) and delivery port (11) respectively about this whole, water inlet (10) and delivery port (11) are respectively through pipeline (12) and water tank (7) inside intercommunication.
4. The heat sink for the LED array module of the car light as claimed in claim 1, wherein: a plurality of radiating fins (13) are uniformly distributed on the outer surface of the radiating column (5).
5. The heat sink for the LED array module of the car light as claimed in claim 4, wherein: four radiating fins (13) are uniformly distributed on each radiating column (5).
6. The heat sink for the LED array module of the car light as claimed in claim 3, wherein: the heat dissipation structure (9) is provided with annular fins, and the annular fins are in interference fit with the pipeline (12).
7. The heat sink for the LED array module of the car light as claimed in claim 1, wherein: and temperature sensors (14) are symmetrically arranged on the positions, corresponding to the left side and the right side of the PCB (2), of the base (4).
8. The heat sink for the LED array module of the car light as claimed in claim 1, wherein: the miniature water pump (8) and the fan (6) are connected with the controller (15), and the controller (15) controls the opening and closing of the fan (6) and the miniature water pump (8) and the flow regulation of the miniature water pump (8) through the control driving module (16).
9. The method for controlling the heat dissipation device of the LED array module of the vehicle lamp according to any one of claims 1 to 8, wherein: setting the standard temperature T of the normal work of the LED chip array (1)0Chip junction temperature TjFlow Q, T of the micro water pump (8)j＝T0The temperature T of the chip junction temperature after the fan (6) is started1；
As chip junction temperature Tj≤T0When the fan (6) is turned off;
when T isj＞T0When the fan is started, the fan (6) is started;
after the fan (6) is started for a period of time T, if T is reachedjStill above T0The controller (15) starts the micro water pump (8), wherein the flow Q of the micro water pump (8) and the chip junction temperature TjAnd a standard temperature T0Satisfies the functional relationship: q ═ f (T)j-T0)；
As chip junction temperature TjBelow T0Then, the micro water pump (8) is closed; at this time, if Tj＜T1And the fan (6) is turned off.
10. The method for controlling the heat dissipation device of the LED array module of the vehicle lamp according to claim 9, wherein: setting the measurement temperature T of the temperature sensor (14), wherein the value of T is the time elapsed until the value T measured by the temperature sensor (14) is stable after the fan (6) is started, and the value T stable measured by the temperature sensor (14) refers to the value T currently measured by the temperature sensor (14) and the T stable thereof0Value T measured before secondKIs less than the constant b.
CN201910494652.8A 2019-06-10 2019-06-10 Heat dissipation device for car lamp LED array module and control method thereof Pending CN112066340A (en)

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Application Number Priority Date Filing Date Title
CN201910494652.8A CN112066340A (en) 2019-06-10 2019-06-10 Heat dissipation device for car lamp LED array module and control method thereof

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Application Number Priority Date Filing Date Title
CN201910494652.8A CN112066340A (en) 2019-06-10 2019-06-10 Heat dissipation device for car lamp LED array module and control method thereof

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113203076A (en) * 2021-04-08 2021-08-03 一汽奔腾轿车有限公司 Matrix type high beam active heat dissipation system for passenger vehicle and control method thereof
CN115013781A (en) * 2022-06-02 2022-09-06 桂林电子科技大学 LED car light radiator
CN117193424A (en) * 2023-10-18 2023-12-08 中诚华隆计算机技术有限公司 3D (three-dimensional) on-chip hybrid cooling control method and system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113203076A (en) * 2021-04-08 2021-08-03 一汽奔腾轿车有限公司 Matrix type high beam active heat dissipation system for passenger vehicle and control method thereof
CN115013781A (en) * 2022-06-02 2022-09-06 桂林电子科技大学 LED car light radiator
CN117193424A (en) * 2023-10-18 2023-12-08 中诚华隆计算机技术有限公司 3D (three-dimensional) on-chip hybrid cooling control method and system
CN117193424B (en) * 2023-10-18 2024-04-12 中诚华隆计算机技术有限公司 3D (three-dimensional) on-chip hybrid cooling control method and system

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