CN112063877A - Preparation method of copper-tungsten alloy - Google Patents

Preparation method of copper-tungsten alloy Download PDF

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Publication number
CN112063877A
CN112063877A CN202011023825.7A CN202011023825A CN112063877A CN 112063877 A CN112063877 A CN 112063877A CN 202011023825 A CN202011023825 A CN 202011023825A CN 112063877 A CN112063877 A CN 112063877A
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China
Prior art keywords
copper
powder
tungsten alloy
steps
tungsten
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CN202011023825.7A
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Chinese (zh)
Inventor
胡强
张友亮
魏仕勇
程香平
罗凤凤
韦江
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Institute of Applied Physics of Jiangxi Academy of Sciences
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Institute of Applied Physics of Jiangxi Academy of Sciences
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Priority to CN202011023825.7A priority Critical patent/CN112063877A/en
Publication of CN112063877A publication Critical patent/CN112063877A/en
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/05Mixtures of metal powder with non-metallic powder
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/045Alloys based on refractory metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C27/00Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04Alloys based on tungsten or molybdenum

Abstract

The invention relates to the field of alloy preparation, in particular to a preparation method of a copper-tungsten alloy, which comprises the following steps: respectively mixing metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder according to the mass percentage of 92.98-65.1 wt%: 5-30 wt%: 2-3 wt% and 1-1.5 wt%: performing ball milling and mixing on 0.2-0.4 wt% of the raw materials, and pressing the raw blocks into skeleton raw blocks; spraying a layer of copper powder slurry with the thickness of 3-5 mm on six side surfaces of the framework briquette respectively, then putting the framework briquette into a mullite crucible with the inner wall coated with a far infrared radiation coating, sintering the framework briquette in a microwave manner at 1000-1200 ℃ for 1-3 hours, and naturally cooling to obtain the copper-tungsten alloy. The method can realize the rapid preparation of the copper-tungsten alloy and can effectively improve the densification degree and the comprehensive performance of the alloy.

Description

Preparation method of copper-tungsten alloy
Technical Field
The invention relates to the field of alloy preparation, in particular to a preparation method of a copper-tungsten alloy.
Background
The copper-tungsten alloy has the high melting point, high density, electric corrosion resistance and fusion welding resistance of W, higher high-temperature strength, and high electric and thermal conductivity, plasticity and easy processability of Cu. Since Cu absorbs a large amount of arc energy when it is evaporated at high temperature, reduces the arc temperature, improves the use conditions and reduces the effect of galvanic corrosion, it is widely used as electrical contact material for high-voltage electrical appliances, as well as electrode for electrical processing, high-temperature mold and other occasions requiring electrical and thermal conductivity and high-temperature use. At present, the infiltration method and the activated liquid phase sintering method are generally adopted to prepare the W-Cu material. However, because the two phases of W and Cu are not compatible, the traditional infiltration W-Cu material has the defects of segregation and coarseness of the structure and low relative density, and in addition, heterogeneous impurities are introduced into the activated liquid phase sintering to influence the performance of the material. The microwave sintering technology is a method for realizing densification by utilizing the heat generated by coupling a special wave band of microwaves with a material and integrally heating the material to a sintering temperature, and compared with the conventional sintering technology, the microwave sintering technology has the advantages of low sintering temperature, short sintering time, high energy utilization rate, high heating efficiency and the like, and a manufactured workpiece has higher density, hardness and toughness and excellent comprehensive performance.
Disclosure of Invention
In order to solve the problems, the invention provides a preparation method of a copper-tungsten alloy, which can effectively improve the densification degree and comprehensive performance of the alloy while realizing the rapid preparation of the copper-tungsten alloy.
In order to achieve the purpose, the invention adopts the technical scheme that:
a preparation method of a copper-tungsten alloy comprises the following steps:
s1, respectively mixing metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder according to the mass percentage of 92.98-65.1 wt%: 5-30 wt%: 2-3 wt% and 1-1.5 wt%: performing ball milling and mixing on 0.2-0.4 wt% of the mixture to obtain mixed powder;
s2, pressing the obtained mixed powder compact into a skeleton compact;
s3, respectively spraying a layer of copper powder slurry with the thickness of 3-5 mm on six side faces of the framework briquette, then putting the framework briquette into a mullite crucible with the inner wall coated with a far infrared radiation coating, placing the mullite crucible in a condition that the microwave frequency is 2500-2600 MHz, the power is 4-6 KW and the vacuum degree is less than 0.1KPa, keeping the heating speed of 20-30 ℃/min, raising the temperature to 1000-1200 ℃, sintering for 1-3 hours, and naturally cooling to obtain the copper-tungsten alloy.
Furthermore, the granularity of the metal tungsten powder and the copper powder is less than 200 meshes, and the purity of the metal tungsten powder and the purity of the copper powder are both more than 99.8 wt%;
further, in the step S1, when the materials are mixed by ball milling, the ratio of the balls to the materials is 8-40: 1, ball milling for 30-60 min under the condition of the rotating speed of 200-300 r/min.
Further, in the step S2, the pressure during the pressing of the compact is controlled to be 30-50 MPa.
Further, the conductive carbon black is conductive carbon black with a chain structure.
Further, in the step S3, the copper powder slurry is obtained by mixing copper powder and deionized water according to a mass ratio of 1: 3.
The invention has the following beneficial effects:
1) by adopting microwave sintering, the copper powder can be directly melted, the heating speed is high, the thermal efficiency is high, the copper powder can be melted in 30-40 min by cooperating with the thermal synergistic function of the far infrared radiation coating;
2) the used infiltration copper is copper powder slurry instead of a metal copper billet, the copper powder slurry can be uniformly coated on six side surfaces of the framework billet, and the copper powder slurry can be used as a wave-absorbing carrier and an infiltration substance, can also prevent the surface of the alloy from being oxidized in the sintering process of the alloy, and can improve the quality of the obtained alloy;
3) conductive carbon black, antimony powder and Re rare earth powder are introduced, so that the densification degree and comprehensive performance of the alloy can be effectively improved.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1
A preparation method of a copper-tungsten alloy comprises the following steps:
s1, respectively mixing metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder according to the mass percentage of 92.98 wt%: 5 wt%: 2wt% to 1 wt%: performing ball milling and mixing on 0.2 wt% of the mixture to obtain mixed powder; wherein the granularity of the metal tungsten powder and the copper powder is less than 200 meshes, and the purity of the metal tungsten powder and the copper powder is more than 99.8 wt%; the conductive carbon black is conductive carbon black with a chain structure; during ball milling and material mixing, the ball material ratio is 8-40: 1, ball milling for 30-60 min under the condition that the rotating speed is 200-300 r/min;
s2, pressing the obtained mixed powder compact into a skeleton compact; wherein the pressure during the pressing of the compact is controlled to be 30-50 MPa;
s3, respectively spraying a layer of copper powder slurry (obtained by mixing copper powder and deionized water according to the mass ratio of 1: 3) with the thickness of 5mm on six side faces of a framework briquette, then putting the framework briquette into a mullite crucible with an inner wall coated with a far infrared radiation coating, placing the mullite crucible in a condition that the microwave frequency is 2500-2600 MHz, the power is 4-6 KW and the vacuum degree is less than 0.1KPa, keeping the heating speed of 20-30 ℃/min, raising the temperature to 1000-1200 ℃, sintering for 1-3 hours, naturally cooling to obtain a copper-tungsten alloy, and analyzing the obtained copper-tungsten alloy, wherein the Brinell hardness of the copper-tungsten alloy is 287, the density is 99.3% and the conductivity is 45.5%.
Example 2
A preparation method of a copper-tungsten alloy comprises the following steps:
s1, respectively mixing 65.1wt% of metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder: 30 wt%: 3 wt% to 1.5 wt%: performing ball milling and mixing on 0.4 wt% of the mixture to obtain mixed powder; wherein the granularity of the metal tungsten powder and the copper powder is less than 200 meshes, and the purity of the metal tungsten powder and the copper powder is more than 99.8 wt%; the conductive carbon black is conductive carbon black with a chain structure; during ball milling and material mixing, the ball material ratio is 8-40: 1, ball milling for 30-60 min under the condition that the rotating speed is 200-300 r/min;
s2, pressing the obtained mixed powder compact into a skeleton compact; wherein the pressure during the pressing of the compact is controlled to be 30-50 MPa;
s3, respectively spraying a layer of copper powder slurry (obtained by mixing copper powder and deionized water in a mass ratio of 1: 3) with the thickness of 3mm on six side faces of a framework briquette, then putting the framework briquette into a mullite crucible with an inner wall coated with a far infrared radiation coating, placing the mullite crucible in a condition that the microwave frequency is 2500-2600 MHz, the power is 4-6 KW and the vacuum degree is less than 0.1KPa, keeping the heating speed of 20-30 ℃/min, raising the temperature to 1000-1200 ℃, sintering for 1-3 hours, naturally cooling to obtain copper-tungsten alloy, and analyzing the obtained copper-tungsten alloy, wherein the Brinell hardness of the copper-tungsten alloy is 257, the density is 98.7% and the conductivity is 47.3%.
Example 3
A preparation method of a copper-tungsten alloy comprises the following steps:
s1, respectively mixing metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder according to the mass percentage of 78.45 wt%: 17.5 wt%: 2.5 wt% and 1.25 wt%: performing ball milling and mixing on 0.3 wt% of the mixture to obtain mixed powder; wherein the granularity of the metal tungsten powder and the copper powder is less than 200 meshes, and the purity of the metal tungsten powder and the copper powder is more than 99.8 wt%; the conductive carbon black is conductive carbon black with a chain structure; during ball milling and material mixing, the ball material ratio is 8-40: 1, ball milling for 30-60 min under the condition that the rotating speed is 200-300 r/min;
s2, pressing the obtained mixed powder compact into a skeleton compact; wherein the pressure during the pressing of the compact is controlled to be 30-50 MPa;
s3, respectively spraying a layer of copper powder slurry (obtained by mixing copper powder and deionized water in a mass ratio of 1: 3) with the thickness of 4mm on six side faces of a framework briquette, then putting the framework briquette into a mullite crucible with an inner wall coated with a far infrared radiation coating, placing the mullite crucible in a condition that the microwave frequency is 2500-2600 MHz, the power is 4-6 KW and the vacuum degree is less than 0.1KPa, keeping the heating speed of 20-30 ℃/min, raising the temperature to 1000-1200 ℃, sintering for 1-3 hours, naturally cooling to obtain a copper-tungsten alloy, and analyzing the obtained copper-tungsten alloy, wherein the Brinell hardness of the copper-tungsten alloy is 269, the density is 99.1% and the conductivity is 46.3%.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (5)

1. A preparation method of copper-tungsten alloy is characterized by comprising the following steps: the method comprises the following steps:
s1, respectively mixing metal tungsten powder, copper powder, conductive carbon black, antimony powder and Re rare earth powder according to the mass percentage of 92.98-65.1 wt%: 5-30 wt%: 2-3 wt% and 1-1.5 wt%: performing ball milling and mixing on 0.2-0.4 wt% of the mixture to obtain mixed powder;
s2, pressing the obtained mixed powder compact into a skeleton compact;
s3, respectively spraying a layer of copper powder slurry with the thickness of 3-5 mm on six side faces of the framework briquette, then putting the framework briquette into a mullite crucible with the inner wall coated with a far infrared radiation coating, placing the mullite crucible in a condition that the microwave frequency is 2500-2600 MHz, the power is 4-6 KW and the vacuum degree is less than 0.1KPa, keeping the heating speed of 20-30 ℃/min, raising the temperature to 1000-1200 ℃, sintering for 1-3 hours, and naturally cooling to obtain the copper-tungsten alloy.
2. The method for preparing the copper-tungsten alloy according to claim 1, wherein the method comprises the following steps: the granularity of the metal tungsten powder and the copper powder is less than 200 meshes, and the purity of the metal tungsten powder and the copper powder is more than 99.8 wt%;
the method for preparing the copper-tungsten alloy according to claim 1, wherein the method comprises the following steps: in the step S1, when the materials are mixed by ball milling, the ball-material ratio is 8-40: 1, ball milling for 30-60 min under the condition of the rotating speed of 200-300 r/min.
3. The method for preparing the copper-tungsten alloy according to claim 1, wherein the method comprises the following steps: in the step S2, the pressure during the pressing of the compact is controlled to be 30-50 MPa.
4. The method for preparing the copper-tungsten alloy according to claim 1, wherein the method comprises the following steps: the conductive carbon black is conductive carbon black with a chain structure.
5. The method for preparing the copper-tungsten alloy according to claim 1, wherein the method comprises the following steps: in the step S3, the copper powder slurry is obtained by mixing copper powder and deionized water in a mass ratio of 1: 3.
CN202011023825.7A 2020-09-25 2020-09-25 Preparation method of copper-tungsten alloy Pending CN112063877A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101728093A (en) * 2009-12-11 2010-06-09 西安理工大学 WCu-La2O3 contact material and preparation method thereof
WO2012050271A1 (en) * 2010-10-12 2012-04-19 Agency For Defense Development Alloy of tungsten (w) and copper (cu) having functionally graded material (fgm) layers, metal material having the same and manufacturing method for alloy of w and cu
CN102732743A (en) * 2012-07-11 2012-10-17 中国兵器工业第五九研究所 W-Cu composite material with high Cu content and preparation method of W-Cu composite material
CN103526060A (en) * 2013-10-09 2014-01-22 昆明理工大学 Rapid preparation method of copper-tungsten alloy
CN111230103A (en) * 2018-11-29 2020-06-05 西安西电高压开关有限责任公司 Preparation method of tungsten-copper alloy wear-resistant electrode

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101728093A (en) * 2009-12-11 2010-06-09 西安理工大学 WCu-La2O3 contact material and preparation method thereof
WO2012050271A1 (en) * 2010-10-12 2012-04-19 Agency For Defense Development Alloy of tungsten (w) and copper (cu) having functionally graded material (fgm) layers, metal material having the same and manufacturing method for alloy of w and cu
CN102732743A (en) * 2012-07-11 2012-10-17 中国兵器工业第五九研究所 W-Cu composite material with high Cu content and preparation method of W-Cu composite material
CN103526060A (en) * 2013-10-09 2014-01-22 昆明理工大学 Rapid preparation method of copper-tungsten alloy
CN111230103A (en) * 2018-11-29 2020-06-05 西安西电高压开关有限责任公司 Preparation method of tungsten-copper alloy wear-resistant electrode

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
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邢焰等: "《航天器材料》", 31 March 2018, 北京理工大学出版社 *

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Application publication date: 20201211