CN112059938A - Nano silicon dioxide polishing film and preparation method thereof - Google Patents
Nano silicon dioxide polishing film and preparation method thereof Download PDFInfo
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- CN112059938A CN112059938A CN202010974639.5A CN202010974639A CN112059938A CN 112059938 A CN112059938 A CN 112059938A CN 202010974639 A CN202010974639 A CN 202010974639A CN 112059938 A CN112059938 A CN 112059938A
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- polishing
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- film
- silicon dioxide
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Abstract
The invention discloses a nano silicon dioxide polishing film and a preparation method thereof, wherein the nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, the polishing coating comprises the following components, by weight, 150 parts of nano silicon dioxide sol, 85-150 parts of bisphenol A epoxy resin, 50-200 parts of polyisocyanate, 350 parts of solvent, 250-5 parts of antistatic agent and 2-5 parts of dispersing agent, and the nano silicon dioxide sol with the particle size of 1-10nm is used as an abrasive to enable the polishing rate of zirconia ceramics and optical fibers to be close to that of the optical fibers, so that the optical fibers are prevented from sinking.
Description
Technical Field
The invention relates to the technical field of polishing film processing, in particular to a nano silicon dioxide polishing film and a preparation method thereof.
Background
With the development of optical communication technology, optical fiber connectors are required to have high return loss characteristics, which requires that the optical fiber connector has a smaller value of optical fiber recess after polishing, and is better. The optical fiber connector consists of optical fiber and zirconia ceramic, wherein the optical fiber is made of silicon dioxide and has lower hardness than the zirconia ceramic, and the optical fiber is easier to abrade than the zirconia ceramic during polishing, so that the optical fiber is sunken. After the existing silicon dioxide polishing film is used for the last polishing of an optical fiber connector, the optical fiber recess is generally about-30 to-50 nm, and the requirement of a high return loss connector cannot be met.
Disclosure of Invention
The invention aims to provide a nano silicon dioxide polishing film and a preparation method thereof, wherein 1-10nm nano silicon dioxide sol is used as an abrasive material, the polishing speed of zirconia ceramics and optical fibers is close to that of optical fibers, so that optical fiber depression is avoided, resin in a coating has good brittleness, the coating has good self-sharpening performance, the grinding force of the coating can be continuously stable, and the product has good service life.
In order to achieve the purpose, the invention adopts the technical scheme that: a nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, wherein the polishing coating comprises the following components, by weight, 150 parts of nano silicon dioxide sol, 85-150 parts of bisphenol A epoxy resin, 50-200 parts of polyisocyanate, 350 parts of solvent, 1-5 parts of antistatic agent and 2-5 parts of dispersing agent; the particle size of the nano-silica sol is 1-10 nm.
As a further optimization, the bisphenol A epoxy resin has the solid content of 10-60 percent and the molecular weight of 5000-30000.
As a further optimization, the solvent is one or more of ethyl acetate, toluene and butanone.
As a further optimization, the antistatic agent is one or more of a cationic antistatic agent, an anionic antistatic agent and a nonionic antistatic agent, and the addition of the antistatic agent is beneficial to preventing static electricity from being generated in the polishing and rubbing process.
As a further optimization, the dispersant is one or more of hydroxyl functional carboxylic ester, polybasic carboxylic acid hydroxyl ammonium salt, high molecular weight polycarboxylic acid amine, polyvinyl alcohol and modified polyacrylate, and the dispersant is added to help uniformly disperse the nano-silica sol in the polishing coating.
The invention also provides a preparation method of the nano silicon dioxide polishing film, which comprises the following steps,
s1) weighing: accurately weighing each component;
s2) preparing a dispersion: sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain bulk materials;
s3) preparing a polishing coating: adding polyisocyanate into the dispersion material, and uniformly stirring to obtain a polishing coating;
s4) preparing a polishing film: and coating the polishing coating on the polyester film, and curing to obtain the polishing film.
As a further optimization, the stirring time in S3 is 50-150 min.
As a further optimization, the curing temperature in S4 is 60-130 ℃, and the curing time is 5-24 h.
Compared with the prior art, the invention has the following beneficial effects:
the invention uses 1-10nm nanometer silicon dioxide sol, adds high brittle resin adhesive, fully stirs evenly, coats on polyester film, and heats and solidifies to make nanometer silicon dioxide polishing film; the invention is characterized in that 1-10nm nano silica sol is used as abrasive, the polishing rate of the abrasive to zirconia ceramics and optical fiber is close to that of the optical fiber, thereby avoiding the optical fiber from sinking, and because the resin in the coating has good brittleness, the coating has good self-sharpening performance, the grinding force of the coating can be continuously and stably, and the product has good service life.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
In the figure, 1. polyester film; 2. polishing the coating; 21. nano silica sol; 22. a resin mixture.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Example 1
A nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, wherein the polishing coating comprises the following components, by weight, 200 parts of nano silicon dioxide sol, 120 parts of polyisocyanate, 100 parts of bisphenol A epoxy resin, 300 parts of solvent, 2 parts of antistatic agent and 2 parts of polycarboxylic hydroxyl ammonium salt; wherein: the particle size of the nano-silica sol is 5nm, the solid content of the bisphenol A epoxy resin is 50%, the molecular weight is 30000, and the solvent is a 1:1:1 mixture of ethyl acetate, toluene and butanone.
The preparation method comprises the following steps: weighing materials, and accurately weighing each component; preparing a dispersing material, sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain the dispersing material; preparing a polishing coating, adding polyisocyanate into the dispersion material, and stirring at a high speed for 100min to obtain the polishing coating; preparing a polishing film, uniformly coating the polishing coating on the polyester film, and curing at 130 ℃ for 24 hours to obtain the polishing film.
As shown in fig. 1, the prepared polish coating 2 in which nano silica sol 21 is uniformly dispersed in a resin mixture 22 of bisphenol a epoxy resin and polyisocyanate is uniformly applied to a polyester film 1.
Example 2
A nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, wherein the polishing coating comprises the following components, by weight, 180 parts of nano silicon dioxide sol, 100 parts of polyisocyanate, 100 parts of bisphenol A epoxy resin, 300 parts of a solvent, 2 parts of an antistatic agent and 2 parts of polycarboxylic hydroxyl ammonium salt; wherein: the particle size of the nano-silica sol is 5nm, the solid content of the bisphenol A epoxy resin is 50%, the molecular weight is 25000, and the solvent is a 1:1:1 mixture of ethyl acetate, toluene and butanone.
The preparation method comprises the following steps: weighing materials, and accurately weighing each component; preparing a dispersing material, sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain the dispersing material; preparing a polishing coating, adding polyisocyanate into the dispersion material, and stirring at a high speed for 100min to obtain the polishing coating; preparing a polishing film, uniformly coating the polishing coating on the polyester film, and curing at 130 ℃ for 24 hours to obtain the polishing film.
Example 3
A nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, wherein the polishing coating comprises the following components, by weight, 200 parts of nano silicon dioxide sol, 80 parts of polyisocyanate, 100 parts of bisphenol A epoxy resin, 300 parts of solvent, 2 parts of antistatic agent and 2 parts of polycarboxylic hydroxyl ammonium salt; wherein: the particle size of the nano-silica sol is 8nm, the solid content of the bisphenol A epoxy resin is 50%, the molecular weight is 20000, and the solvent is a 1:1:1 mixture of ethyl acetate, toluene and butanone.
The preparation method comprises the following steps: weighing materials, and accurately weighing each component; preparing a dispersing material, sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain the dispersing material; preparing a polishing coating, adding polyisocyanate into the dispersion material, and stirring at a high speed for 100min to obtain the polishing coating; preparing a polishing film, uniformly coating the polishing coating on the polyester film, and curing at 130 ℃ for 24 hours to obtain the polishing film.
Example 4
A nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, wherein the polishing coating comprises the following components, by weight, 250 parts of nano silicon dioxide sol, 100 parts of polyisocyanate, 100 parts of bisphenol A epoxy resin, 300 parts of a solvent, 2 parts of an antistatic agent and 2 parts of polycarboxylic hydroxyl ammonium salt; wherein: the particle size of the nano-silica sol is 8nm, the solid content of the bisphenol A epoxy resin is 50%, the molecular weight is 20000, and the solvent is a 1:1:1 mixture of ethyl acetate, toluene and butanone.
The preparation method comprises the following steps: weighing materials, and accurately weighing each component; preparing a dispersing material, sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain the dispersing material; preparing a polishing coating, adding polyisocyanate into the dispersion material, and stirring at a high speed for 100min to obtain the polishing coating; preparing a polishing film, uniformly coating the polishing coating on the polyester film, and curing at 130 ℃ for 24 hours to obtain the polishing film.
Application examples
The nano-silica polishing films prepared in the above embodiments are applied to polishing of optical fiber connectors, respectively, and are compared with corresponding conventional polishing films, and the test conditions are as follows: a four corner pressure mill was used at 400 g/head, 100rpm for 40s, and the test data are shown in the table below.
Polishing film | Optical fiber recess |
Example 1 | -0.5nm |
Example 2 | -0.8nm |
Example 3 | -1.5nm |
Example 4 | -1.3nm |
Conventional nano-silica polishing films | -40nm |
Conventional polishing film | -150nm |
Experimental data show that the polishing rate of the abrasive nano silica sol on zirconia ceramics and optical fibers is close to that of the zirconia ceramics and the optical fibers, so that optical fiber recession is avoided and can reach-1.5 to-0.5, and the resin in the coating has good brittleness, so that the coating has good self-sharpening performance, the grinding force of the coating can be continuously stable, and the product has good service life.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. A nano silicon dioxide polishing film comprises a polyester film and a polishing coating coated on the polyester film, and is characterized in that the polishing coating comprises the following components, by weight, 150 parts of nano silicon dioxide sol, 85-150 parts of bisphenol A epoxy resin, 50-200 parts of polyisocyanate, 350 parts of solvent, 1-5 parts of antistatic agent and 2-5 parts of dispersing agent; the particle size of the nano-silica sol is 1-10 nm.
2. The nano-silica polishing film according to claim 1, wherein the bisphenol a epoxy resin has a solid content of 10-60% and a molecular weight of 5000-30000.
3. The nanosilica polishing film of claim 1, wherein the solvent is one or more of ethyl acetate, toluene, and butanone.
4. The nanosilica polishing film of claim 1, wherein the antistatic agent is one or more of a cationic antistatic agent, an anionic antistatic agent, and a nonionic antistatic agent.
5. The nanosilica polishing film of claim 1, wherein the dispersing agent is one or more of a hydroxy functional carboxylic acid ester, a hydroxy ammonium salt of a polycarboxylic acid, a high molecular weight amine polycarboxylate, polyvinyl alcohol, and a modified polyacrylate.
6. A method for producing a nano-silica polishing film according to any one of claims 1 to 5, comprising the steps of,
s1) weighing: accurately weighing each component;
s2) preparing a dispersion: sequentially adding nano silica sol, bisphenol A epoxy resin, a solvent, an antistatic agent and a dispersing agent into a slurry barrel, and uniformly stirring at a high speed to obtain bulk materials;
s3) preparing a polishing coating: adding polyisocyanate into the dispersion material, and uniformly stirring to obtain a polishing coating;
s4) preparing a polishing film: and coating the polishing coating on the polyester film, and curing to obtain the polishing film.
7. The method of claim 6, wherein the stirring time in S3 is 50-150 min.
8. The method of claim 6, wherein the curing temperature in S4 is 60-130 ℃ and the curing time is 5-24 hours.
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CN101219530A (en) * | 2008-02-03 | 2008-07-16 | 北京国瑞升科技有限公司 | Granulation type pouncing paper, preparation method and application thereof |
CN101307211A (en) * | 2007-05-15 | 2008-11-19 | 仲跻和 | Method for preparing nanometer silicon dioxide abradant polishing solution |
US20100107509A1 (en) * | 2008-11-04 | 2010-05-06 | Guiselin Olivier L | Coated abrasive article for polishing or lapping applications and system and method for producing the same. |
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CN102825561A (en) * | 2012-09-07 | 2012-12-19 | 北京国瑞升科技有限公司 | Water-base polishing film and preparation method thereof |
CN106117582A (en) * | 2016-06-27 | 2016-11-16 | 北京国瑞升科技股份有限公司 | A kind of Ludox polished film and preparation method and application |
US20160347971A1 (en) * | 2015-02-05 | 2016-12-01 | Uwiz Technology Co.,Ltd. | Chemical mechanical polishing slurry |
CN108369318A (en) * | 2015-12-08 | 2018-08-03 | 米波克斯株式会社 | Have the grinding method and manufacturing method of the abrasive sheet of nano silicon dioxide polishing particles and the optical fiber connector using the abrasive sheet |
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2020
- 2020-09-16 CN CN202010974639.5A patent/CN112059938A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101307211A (en) * | 2007-05-15 | 2008-11-19 | 仲跻和 | Method for preparing nanometer silicon dioxide abradant polishing solution |
CN101219530A (en) * | 2008-02-03 | 2008-07-16 | 北京国瑞升科技有限公司 | Granulation type pouncing paper, preparation method and application thereof |
US20100107509A1 (en) * | 2008-11-04 | 2010-05-06 | Guiselin Olivier L | Coated abrasive article for polishing or lapping applications and system and method for producing the same. |
CN101767318A (en) * | 2010-02-11 | 2010-07-07 | 北京国瑞升科技有限公司 | Granulation polishing film, preparing method thereof and application thereof |
CN102825561A (en) * | 2012-09-07 | 2012-12-19 | 北京国瑞升科技有限公司 | Water-base polishing film and preparation method thereof |
US20160347971A1 (en) * | 2015-02-05 | 2016-12-01 | Uwiz Technology Co.,Ltd. | Chemical mechanical polishing slurry |
CN108369318A (en) * | 2015-12-08 | 2018-08-03 | 米波克斯株式会社 | Have the grinding method and manufacturing method of the abrasive sheet of nano silicon dioxide polishing particles and the optical fiber connector using the abrasive sheet |
CN106117582A (en) * | 2016-06-27 | 2016-11-16 | 北京国瑞升科技股份有限公司 | A kind of Ludox polished film and preparation method and application |
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