CN112038506B - Display substrate manufacturing method, display substrate, display panel and display device - Google Patents
Display substrate manufacturing method, display substrate, display panel and display device Download PDFInfo
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- CN112038506B CN112038506B CN202010994432.4A CN202010994432A CN112038506B CN 112038506 B CN112038506 B CN 112038506B CN 202010994432 A CN202010994432 A CN 202010994432A CN 112038506 B CN112038506 B CN 112038506B
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- H—ELECTRICITY
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- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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Abstract
The present disclosure relates to a method for manufacturing a display substrate, a display panel, and a display device, the method comprising: forming a driving layer including an auxiliary electrode layer and an insulating layer covering the driving layer on one side of the substrate; forming a flat layer on one side of the insulating layer, which is away from the substrate, and forming a concave part on the flat layer at a position corresponding to the auxiliary electrode layer; forming a via hole exposing the auxiliary electrode layer on the flat layer and the insulating layer; forming a first electrode layer on one side of the flat layer, which is away from the insulating layer, wherein the first electrode layer comprises a first sub-electrode layer which is connected with the auxiliary electrode layer and is at least partially positioned in the concave part; forming a pixel defining layer including a through hole communicating with the recess portion on a side of the first electrode layer facing away from the substrate; forming a light-emitting layer on one side of the pixel defining layer, which is away from the substrate, wherein the light-emitting layer covers the through hole and the concave part; and dissolving the light-emitting layer positioned on the through hole and the concave part, so that the light-emitting layer is positioned in the concave part after being dissolved, and the first sub-electrode layer positioned in the concave part is exposed from the through hole.
Description
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a manufacturing method of a display substrate, a display panel and a display device.
Background
An OLED (Organic Light-Emitting Diode) is a thin film Light Emitting device made of an Organic semiconductor material, and has a self-luminous property. The top emission is one of large-size OLED panel structures, the aperture opening ratio is large, the service life can be effectively prolonged, and the picture quality can be improved. Top emission requires a cathode with a matched work function, higher transmittance and lower resistivity. Since the work function affects optical parameters such as luminous efficiency, higher transmittance is a necessary requirement since the top-emitted light is transmitted through the cathode, and the voltage uniformity is determined by the resistivity, and if the resistivity is too high, the cathode resistance is too high, and the luminance uniformity is poor.
However, the transmittance and the resistivity are a pair of contradictory parameters, and increasing the cathode thickness can reduce the resistivity, but can reduce the transmittance. The auxiliary cathode is a method for effectively solving the contradiction between resistivity and transmittance. However, since the large-sized OLED is an Open Mask, the entire AA area (display area) is covered with EL material (light emitting material), and how to penetrate the EL, and thus the connection of the cathode and the auxiliary cathode is a major difficulty of the auxiliary cathode.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The disclosure aims to provide a manufacturing method of a display substrate, the display substrate, a display panel and a display device, and the lap joint of an auxiliary electrode and a cathode is effectively realized.
According to an aspect of the present disclosure, there is provided a manufacturing method of a display substrate, the manufacturing method including:
providing a substrate, forming a driving layer and an insulating layer on one side of the substrate, wherein the insulating layer covers the driving layer, and the driving layer comprises an auxiliary electrode layer;
forming a flat layer on one side of the insulating layer, which is away from the substrate, and forming a concave part on the flat layer at a position corresponding to the auxiliary electrode layer; forming a via hole exposing the auxiliary electrode layer on the flat layer and the insulating layer;
forming a first electrode layer on one side of the flat layer, which is away from the insulating layer, wherein the first electrode layer comprises a first sub-electrode layer connected with the auxiliary electrode layer through the via hole, and the first sub-electrode layer is at least partially positioned in the concave part;
forming a pixel defining layer on one side of the first electrode layer away from the substrate, wherein the pixel defining layer comprises a through hole communicated with the concave part;
forming a light-emitting layer on one side of the pixel defining layer, which is away from the substrate, wherein the light-emitting layer covers the through hole and the concave part;
dissolving the light-emitting layer positioned on the through hole and the concave part, so that the light-emitting layer is positioned in the concave part after being dissolved, and the first sub-electrode layer positioned in the concave part is exposed from the through hole;
and forming a second electrode layer on one side of the light-emitting layer, which is away from the substrate, wherein the second electrode layer covers the light-emitting layer and the first sub-electrode layer positioned in the concave part.
In an exemplary embodiment of the present disclosure, dissolving the light emitting layer located on the through hole and the recess to be located in the recess after dissolving and exposing the first sub-electrode layer located in the recess from the through hole includes:
dissolving the luminescent layer positioned on the through hole and the concave part through a preset solvent to form a solution with the luminescent layer;
and removing the preset solvent in the solution, depositing the light-emitting layer in the concave part, and exposing the first sub-electrode layer positioned in the concave part from the through hole.
In one exemplary embodiment of the present disclosure, the display substrate is subjected to printing of the preset solvent to the light emitting layer located on the through hole and the recess portion through a printing process under a preset gas environment.
In one exemplary embodiment of the present disclosure, the preset solvent in the solution is removed through a drying process.
In one exemplary embodiment of the present disclosure, the recess extends through the planar layer.
In an exemplary embodiment of the disclosure, the recess is tapered toward a side of the planar layer facing away from the substrate.
In one exemplary embodiment of the present disclosure, the through-hole is tapered toward a side of the pixel defining layer facing away from the substrate.
According to another aspect of the present disclosure, there is provided a display substrate including:
a substrate;
a driving layer located at one side of the substrate, the driving layer including an auxiliary electrode layer;
an insulating layer located at one side of the substrate and covering the driving layer;
the flat layer is positioned on one side of the insulating layer, which is away from the substrate, a concave part is formed on the flat layer at a position corresponding to the auxiliary electrode layer, and a via hole exposing the auxiliary electrode layer is formed on the flat layer and the insulating layer;
the first electrode layer is positioned on one side of the flat layer, which is away from the insulating layer, and comprises a first sub-electrode layer connected with the auxiliary electrode layer through the via hole, and the first sub-electrode layer is at least partially positioned in the concave part;
a pixel defining layer located on a side of the first electrode layer facing away from the substrate, the pixel defining layer including a through hole communicating with the recess;
a light emitting layer located at a side of the pixel defining layer facing away from the substrate, a sidewall of the through hole not covering the light emitting layer, the light emitting layer being located in the recess, and the first sub-electrode layer located in the recess being exposed from the through hole;
and the second electrode layer is positioned on one side of the light-emitting layer, which is away from the substrate, and covers the light-emitting layer and the first sub-electrode layer positioned in the concave part.
According to still another aspect of the present disclosure, there is provided a display panel including the above display substrate.
According to still another aspect of the present disclosure, there is provided a display device including the above display panel.
According to the manufacturing method of the display substrate, the concave part is formed at the position corresponding to the auxiliary electrode layer on the flat layer, the first sub-electrode layer is formed on the concave part along with the shape and connected with the auxiliary electrode layer, the through hole and the concave part are covered after the whole layer of the light-emitting layer is formed, the light-emitting layer material in the through hole and the concave part flows to the bottom of the concave part through dissolution in the through hole and the concave part, so that the light-emitting layer material in the through hole and the concave part is disconnected from the light-emitting layer material on the surface of the pixel defining layer, and the first sub-electrode layer on the concave part is exposed, and therefore when the second electrode layer is formed on the front surface, the second electrode layer material in the through hole and the concave part can be laminated with the first sub-electrode layer, and the purpose that the second electrode layer penetrates through the light-emitting layer and is connected with the auxiliary electrode layer through the first sub-electrode layer is achieved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.
FIG. 1 is a flow chart of a method for manufacturing a display substrate according to an embodiment of the disclosure;
fig. 2-5 are process diagrams of display substrate manufacturing according to one embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the present disclosure. One skilled in the relevant art will recognize, however, that the aspects of the disclosure may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted. The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not intended to limit the number of their objects.
In this exemplary embodiment, there is provided a method for manufacturing a display substrate, including, as shown in fig. 1:
step S100, providing a substrate, forming a driving layer and an insulating layer on one side of the substrate, wherein the driving layer is covered by the insulating layer, and the driving layer comprises an auxiliary electrode layer;
step 200, forming a flat layer on one side of the insulating layer, which is away from the substrate, and forming a concave part on the flat layer at a position corresponding to the auxiliary electrode layer; forming a via hole exposing the auxiliary electrode layer on the flat layer and the insulating layer;
step S300, forming a first electrode layer on one side of the flat layer, which is away from the insulating layer, wherein the first electrode layer comprises a first sub-electrode layer connected with the auxiliary electrode layer through a via hole, and the first sub-electrode layer is at least partially positioned in the concave part;
step S400, forming a pixel defining layer on one side of the first electrode layer, which is away from the substrate, wherein the pixel defining layer comprises a through hole communicated with the concave part;
step S500, forming a light-emitting layer on one side of the pixel defining layer, which is away from the substrate, wherein the light-emitting layer covers the through hole and the concave part;
step S600, dissolving the luminescent layer positioned on the through hole and the concave part, so that the luminescent layer is positioned in the concave part after being dissolved, and exposing the first sub-electrode layer positioned in the concave part from the through hole;
and step S700, forming a second electrode layer on one side of the light-emitting layer, which is away from the substrate, wherein the second electrode layer covers the light-emitting layer and the first sub-electrode layer positioned in the concave part.
According to the manufacturing method of the display substrate, the concave part is formed at the position corresponding to the auxiliary electrode layer on the flat layer, the first sub-electrode layer is formed on the concave part along with the shape and connected with the auxiliary electrode layer, the through hole and the concave part are covered after the whole layer of the light-emitting layer is formed, the light-emitting layer material in the through hole and the concave part flows to the bottom of the concave part through dissolution in the through hole and the concave part, so that the light-emitting layer material in the through hole and the concave part is disconnected from the light-emitting layer material on the surface of the pixel defining layer, and the first sub-electrode layer on the concave part is exposed, and therefore when the second electrode layer is formed on the front surface, the second electrode layer material in the through hole and the concave part can be laminated with the first sub-electrode layer, and the purpose that the second electrode layer penetrates through the light-emitting layer and is connected with the auxiliary electrode layer through the first sub-electrode layer is achieved.
Next, each step of the method for manufacturing a display substrate in this exemplary embodiment will be further described.
In step S100, a substrate is provided, and a driving layer and an insulating layer are formed on one side of the substrate, wherein the insulating layer covers the driving layer, and the driving layer includes an auxiliary electrode layer.
Specifically, a substrate 10 is provided, the material of the substrate 10 may be an inorganic material, and the inorganic material may be a glass material such as soda lime glass, quartz glass, sapphire glass, or a metal material of various metals such as stainless steel, aluminum, nickel, or alloys thereof; the material of the substrate 10 may also be an organic material, which may be polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyethersulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or a combination thereof; the material of the substrate 10 may also be a flexible material, such as polyimide.
The substrate 10 may be provided with a plurality of pixel areas arranged in an array, and each pixel area is used for providing an OLED (light emitting unit) and a pixel circuit, and the pixel circuit is used for controlling the OLED to emit light. The driving layer includes a plurality of pixel circuits, and in one pixel region, the pixel circuits may include a switching transistor and a driving transistor, the driving transistor and the switching transistor are polysilicon transistors, source and gate electrodes of the switching transistor are connected to a control Integrated Circuit (IC), drain electrodes of the switching transistor are connected to gate electrodes of the driving transistor, and source and drain electrodes of the driving transistor are connected in series to the control IC and the OLED, respectively. When the OLED in the pixel region needs to be controlled to emit light, the control IC may first input a first turn-on voltage to the gate of the switching transistor to turn on the switching transistor, and input a second turn-on voltage to the source of the switching transistor, so that the second turn-on voltage is input from the drain of the switching transistor to the gate of the driving transistor to turn on the driving transistor. Then, the control IC may input a driving voltage to the source of the driving transistor, and the driving transistor may input a driving current to the OLED according to the driving voltage, so that the OLED emits light under the driving current.
The transistor at least comprises a source-drain metal layer and a gate metal layer in the forming process, and the auxiliary electrode layer 20 can be formed simultaneously with the source-drain metal layer or the gate metal layer, so that the process steps are reduced, and the process difficulty is reduced.
Specifically, the insulating layer 30 may be formed on the side of the substrate 10 where the driving layer is provided by a Physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), spin Coating (SC), or the like, and the insulating layer 30 covers the driving layer. The material of the insulating layer 30 may be silicon oxide, silicon oxynitride, silicon nitride, or other suitable insulating substance (e.g., organic polymer compound) or a combination of the above materials.
In step S200, a flat layer is formed on a side of the insulating layer facing away from the substrate, and a recess is formed on the flat layer at a position corresponding to the auxiliary electrode layer; a via hole exposing the auxiliary electrode layer is formed on the planarization layer and the insulating layer.
Specifically, as shown in fig. 2, the planarization layer 40 may be formed on the side of the insulating layer 30 facing away from the substrate 10 by a Physical Vapor Deposition (PVD), a Chemical Vapor Deposition (CVD), a Spin Coating (SC), or the like, and the planarization layer 40 may be made of any of butadiene rubber, polyurethane, polyvinyl chloride, polyamide, polycarbonate, polyimide, polyether-alum resin, and epoxy resin.
Wherein a photoresist is coated over the planarization layer 40, and then a predetermined pattern is formed by exposure and development, and a recess 410 is formed on the planarization layer 40 by etching. The recess 410 may be formed by a dry etching process of gas etching, and after a portion of the flat layer is etched by a vertical gas flow, the flat layer is also etched laterally, and the upper portion of the flat layer is etched laterally, and then etched laterally, so that the recess 410 is formed by dry etching in a gradually expanding manner toward a side of the flat layer 40 facing away from the substrate 10. The specific angle may be adjusted by adjusting various parameters of the dry etching process, such as pressure, gas ratio, voltage, etc., which is not limited by the present disclosure.
Specifically, a via hole communicating with the drain or source of the driving transistor may be formed in the planarization layer 40 through a mask etching process for the first electrode 520 to be connected with the driving transistor. A via hole communicating with the auxiliary electrode layer 20 may be formed on the planarization layer 40 and the insulation layer 30 through a mask etching process to connect the first sub-electrode with the auxiliary electrode layer 20.
In step S300, a first electrode layer is formed on a side of the flat layer facing away from the insulating layer, the first electrode layer includes a first sub-electrode layer connected to the auxiliary electrode layer through a via hole, and the first sub-electrode layer is at least partially located in the recess portion.
Specifically, as shown in fig. 2, a patterned first electrode layer 50 may be formed on a side of the planarization layer 40 facing away from the insulating layer 30 through a Physical Vapor Deposition (PVD), chemical Vapor Deposition (CVD), spin Coating (SC), or the like, and the first electrode layer 50 includes a first electrode 520 connected to a source or drain electrode of the transistor, and a first sub-electrode layer 510 connected to the auxiliary electrode layer 20. The material of the first electrode layer 50 may include a metal, a conductive oxide, or a combination thereof. For example, the metal may be titanium (Ti), platinum (Pt), ruthenium (Ru), gold (Au), silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), neodymium (Nd), chromium (Cr), tantalum (Ta), or alloys thereof, or combinations thereof, and the conductive oxide may be IZO, AZO, ITO, GZO, ZTO, or combinations thereof.
As shown in fig. 2, the first sub-electrode layer 510 completely covers the recess 410, and the first sub-electrode layer 510 conformally covers the recess 410 while forming a recess of the same shape. Then, both sides of the first sub-electrode layer 510 are connected to the auxiliary electrode layer 20 through vias, respectively. Of course, the first sub-electrode layer 510 may partially cover the recess 410, which is not limited by the present disclosure.
In step S400, a pixel defining layer is formed on a side of the first electrode layer facing away from the substrate, the pixel defining layer including a via hole communicating with the recess.
Specifically, as shown in fig. 2, a pixel defining layer 60 is formed on a side of the first electrode layer 50 facing away from the substrate 10, and the pixel defining layer 60 includes pixel openings, each of which corresponds to a position of each of the first electrodes 520. As shown in fig. 2, the pixel defining layer 60 further includes a through hole 610 communicating with the recess 410, and the through hole 610 may be formed in a tapered shape in a direction of a side of the pixel defining layer 60 facing away from the substrate 10 by etching or the like.
In step S500, a light emitting layer is formed on a side of the pixel defining layer facing away from the substrate, the light emitting layer covering the through hole and the recess.
Specifically, as shown in fig. 2, the light emitting layer 70 is formed on the side of the pixel defining layer 60 facing away from the substrate 10 by an open mask, and the light emitting layer 70 may include a hole injection layer, a hole transport layer, a resistance blocking layer, a light emitting material layer, a hole blocking layer, an electron transport layer, and an electron input layer, which are stacked. Since the light emitting layer 70 is formed by using the open mask, the light emitting layer 70 is a whole layer covering the sidewall of the through hole 610 and the recess 410 and the first sub-electrode layer 510 on the recess 410.
In step S600, the light emitting layer located on the through hole and the recess is dissolved, and then the dissolved light emitting layer is located in the recess, and the first sub-electrode layer located in the recess is exposed from the through hole.
Specifically, as shown in fig. 3 and 4, the light emitting layer 70 on the through hole 610 and the recess 410 is dissolved by a predetermined solvent, so that the predetermined solvent and the light emitting layer 70 form a solution; the predetermined solvent in the solution is removed, so that the light emitting layer 70 is deposited in the recess 410, and the first sub-electrode layer 510 located in the recess 410 is exposed from the through hole 610.
The display substrate is subjected to a printing process to print a predetermined solvent onto the light emitting layer 70 disposed on the through hole 610 and the recess 410 in a predetermined gas environment. By adopting the preset gas, the water oxygen in the environment can be removed, so that the water oxygen in the organic light-emitting layer can be avoided in the process of dissolving the light-emitting layer, and the reliability of the manufacturing method is improved. Wherein the predetermined gas may be N 2 Thereby removing water and oxygen in the surrounding environment and leading the display substrate to be N 2 The preset solvent is printed by the printing apparatus onto the light emitting layer 70 positioned on the through hole 610 and the recess 410. N (N) 2 The acquisition method is simple, the cost is low, and the method has no pollution to the surrounding environment of the manufacturing site. Of course, the predetermined gas may be CO 2 The gas can remove water and oxygen in the environment and does not react with the organic luminescent material; among them, the preset solvent may be an organic solvent having a low boiling point, such as acetone (boiling point: 56 °), diethyl ether, methylene chloride, etc., which is not limited in the present disclosure.
Wherein, the solvent in the solution is volatilized and deposited to leave the solute (and luminescent material) by a drying process, for example, by heating in a heating furnace.
Specifically, as shown in fig. 4, the recess 410 penetrates through the flat layer 40, and the first sub-electrode layer 510 is conformally covered on the recess 410, so that a larger accommodating space can be provided, so that the deposition leaves the luminescent material at the bottom of the recess 410, and more of the first electrode layer 50 is exposed. Of course, the recess 410 may not penetrate the planarization layer 40, and may have a sufficient depth to volatilize the solvent in the solution, deposit the solute, and expose a sufficient area of the first electrode layer 50, which is not limited in this disclosure.
Specifically, as shown in fig. 4, by making the through hole 610 taper in a direction of the pixel defining layer 60 facing away from the substrate 10 and making the recess 410 taper in a direction of the pixel defining layer 60 facing away from the substrate 10, an accommodating space with an inverted trapezoid structure can be formed, and the side walls of the through hole 610 and the recess 410 can be made to be inclined, so that the luminescent material on the through hole 610 and the recess 410 can be dissolved and then flow to the bottom of the recess 410, thereby improving the reliability of the manufacturing process.
In addition, as shown in fig. 4, the light emitting layer 70 of each pixel cell is disconnected by dissolving the light emitting material on the through hole 610 and the recess 410 and the light emitting layer 70 on the surface of the pixel defining layer 60, so that crosstalk between adjacent pixel cells is avoided, and display performance is improved.
In step S700, a second electrode layer is formed on a side of the light emitting layer facing away from the substrate, the second electrode layer covering the light emitting layer and the first sub-electrode layer in the recess.
Specifically, as shown in fig. 5, the second electrode layer 80 may be formed on a side of the light emitting layer 70 facing away from the substrate 10 by a Physical Vapor Deposition (PVD), a Chemical Vapor Deposition (CVD), a Spin Coating (SC), or the like, and a material of the second electrode layer 80 may include a metal, an electrically conductive oxide, or a combination thereof, for example, the metal may be titanium (Ti), platinum (Pt), ruthenium (Ru), gold (Au), silver (Ag), molybdenum (Mo), aluminum (Al), tungsten (W), copper (Cu), neodymium (Nd), chromium (Cr), tantalum (Ta), or an alloy thereof, or a combination thereof, and the electrically conductive oxide may be IZO, AZO, ITO, GZO, ZTO, or a combination thereof.
As shown in fig. 5, the second electrode layer 80 may be a common electrode layer, connected to the light emitting layer 70 of each pixel unit, and connected to the first sub-electrode layer 510 on the recess 410, and connected to the auxiliary electrode layer 20 through the first sub-electrode layer 510, so as to achieve the purpose of connecting the second electrode layer 80 to the auxiliary electrode layer 20.
The first electrode 520 may be an anode, the second electrode layer 80 may be a common cathode layer, and the auxiliary electrode layer 20 may be an auxiliary cathode layer. Of course, specific properties of the first electrode and the second electrode layer may be set by those skilled in the art according to actual needs, which is not limited in this disclosure.
Furthermore, although the steps of the methods in the present disclosure are depicted in a particular order in the drawings, this does not require or imply that the steps must be performed in that particular order or that all illustrated steps be performed in order to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step to perform, and/or one step decomposed into multiple steps to perform, etc.
The following are examples of the apparatus of the present invention which may be manufactured by the method of the present invention. For details not disclosed in the embodiments of the apparatus of the present invention, please refer to the embodiments of the method of the present invention.
There is also provided a display substrate in this example embodiment, as shown in fig. 5, the display substrate including: the substrate 10, the driving layer, the insulating layer 30, the planarization layer 40, the first electrode layer 50, the pixel defining layer 60, the light emitting layer 70, and the second electrode layer 80. The driving layer is located at one side of the substrate 10, and includes an auxiliary electrode layer 20; the insulating layer 30 is located at one side of the substrate 10 and covers the driving layer; the flat layer 40 is located at one side of the insulating layer 30 away from the substrate 10, a recess 410 is formed on the flat layer 40 at a position corresponding to the auxiliary electrode layer 20, and a via hole exposing the auxiliary electrode layer 20 is formed on the flat layer 40 and the insulating layer 30; the first electrode layer 50 is located on a side of the flat layer 40 facing away from the insulating layer 30, the first electrode layer 50 includes a first sub-electrode layer 510 connected to the auxiliary electrode layer 20 through a via hole, and the first sub-electrode layer 510 is at least partially located in the recess 410; the pixel defining layer 60 is located on a side of the first electrode layer 50 facing away from the substrate 10, and the pixel defining layer 60 includes a through hole 610 communicating with the recess 410; the light emitting layer 70 is located at a side of the pixel defining layer 60 facing away from the substrate 10, the side wall of the through hole 610 is not covered with the light emitting layer 70, the light emitting layer 70 is located in the recess 410, and the first sub-electrode layer 510 located in the recess 410 is exposed from the through hole 610; the second electrode layer 80 is located on a side of the light emitting layer 70 facing away from the substrate 10, and the second electrode layer 80 covers the light emitting layer 70 and the first sub-electrode layer 510 located in the recess 410.
In the display substrate provided by the present disclosure, the recess 410 is formed on the flat layer 40 at the position corresponding to the auxiliary electrode layer 20, the first sub-electrode layer 510 is formed on the recess 410 along with the shape and connected with the auxiliary electrode layer 20, the light emitting layer 70 covers the through hole 610 and the recess 410, the light emitting layer 70 material in the through hole 610 and the recess 410 is located at the bottom of the recess 410, thereby being disconnected from the light emitting layer 70 material on the surface of the pixel defining layer 60 and exposing the first sub-electrode layer 510 located on the recess 410, so that the second electrode layer 80 and the first sub-electrode layer 510 located in the through hole 610 and the recess 410 are laminated together, thereby achieving the purpose that the second electrode layer 80 passes through the light emitting layer 70 and is connected with the auxiliary electrode layer 20 through the first sub-electrode layer 510.
The details of the above display substrate have been described in detail in the corresponding manufacturing method of the display substrate, and reference is made to the discussion of the manufacturing method for further advantages, which are not repeated here.
Embodiments of the present disclosure also provide a display panel, which may include the above display substrate. Alternatively, the display panel may be a flexible display panel. Alternatively, the display panel may be an OLED display panel. The beneficial effects of the method are as described above with reference to the method for manufacturing a display substrate, and are not described herein.
The embodiment of the disclosure also provides a display device comprising the display panel. The display device may be: any product or component with display function, such as a liquid crystal panel, electronic paper, organic Light Emitting Diode (OLED) panel, active Matrix Organic Light Emitting Diode (AMOLED) panel, mobile phone, tablet, television, display, notebook, digital photo frame, or navigator. The advantages of this method are as described above with reference to the manufacturing method, and are not described here again.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (8)
1. A method for manufacturing a display substrate, comprising:
providing a substrate, forming a driving layer and an insulating layer on one side of the substrate, wherein the insulating layer covers the driving layer, and the driving layer comprises an auxiliary electrode layer;
forming a flat layer on one side of the insulating layer, which is away from the substrate, and forming a concave part on the flat layer, which is corresponding to the auxiliary electrode layer, wherein the concave part is gradually expanded towards one side of the flat layer, which is away from the substrate; forming a via hole exposing the auxiliary electrode layer on the flat layer and the insulating layer;
forming a first electrode layer on one side of the flat layer, which is away from the insulating layer, wherein the first electrode layer comprises a first sub-electrode layer connected with the auxiliary electrode layer through the via hole, and the first sub-electrode layer is at least partially positioned in the concave part;
forming a pixel defining layer on one side of the first electrode layer away from the substrate, wherein the pixel defining layer comprises a through hole communicated with the concave part;
forming a light-emitting layer on one side of the pixel defining layer, which is away from the substrate, wherein the light-emitting layer covers the through hole and the concave part;
dissolving the light-emitting layer positioned on the through hole and the concave part, so that the light-emitting layer is positioned in the concave part after being dissolved, and the first sub-electrode layer positioned in the concave part is exposed from the through hole;
forming a second electrode layer on one side of the light-emitting layer, which is away from the substrate, wherein the second electrode layer covers the light-emitting layer and the first sub-electrode layer positioned in the concave part;
wherein dissolving the light emitting layer on the through hole and the recess, and exposing the first sub-electrode layer in the recess from the through hole, comprises:
dissolving the luminescent layer positioned on the through hole and the concave part through a preset solvent to form a solution with the luminescent layer;
and removing the preset solvent in the solution, depositing the light-emitting layer in the bottom of the concave part, and exposing the first sub-electrode layer in the concave part from the through hole.
2. The method according to claim 1, wherein the display substrate is subjected to printing of the predetermined solvent to the light emitting layer on the through hole and the recess portion by a printing process under a predetermined gas atmosphere.
3. The manufacturing method according to claim 1, wherein the predetermined solvent in the solution is removed by a drying process.
4. The method of manufacturing according to claim 1, wherein the recess penetrates the planar layer.
5. The method of manufacturing according to claim 1, wherein the through-holes are tapered in a direction toward a side of the pixel defining layer facing away from the substrate.
6. A display substrate, comprising:
a substrate;
a driving layer located at one side of the substrate, the driving layer including an auxiliary electrode layer;
an insulating layer located at one side of the substrate and covering the driving layer;
the flat layer is positioned on one side of the insulating layer, which is away from the substrate, a concave part is formed on the flat layer at a position corresponding to the auxiliary electrode layer, and a via hole exposing the auxiliary electrode layer is formed on the flat layer and the insulating layer;
the first electrode layer is positioned on one side of the flat layer, which is away from the insulating layer, and comprises a first sub-electrode layer connected with the auxiliary electrode layer through the via hole, and the first sub-electrode layer is at least partially positioned in the concave part; the concave part is gradually expanded towards one side of the flat layer away from the substrate;
a pixel defining layer located on a side of the first electrode layer facing away from the substrate, the pixel defining layer including a through hole communicating with the recess;
a light emitting layer located at a side of the pixel defining layer facing away from the substrate, a sidewall of the through hole not covering the light emitting layer, the light emitting layer being located in a bottom of the recess, and the first sub-electrode layer located in the recess being exposed from the through hole;
and the second electrode layer is positioned on one side of the light-emitting layer, which is away from the substrate, and covers the light-emitting layer and the first sub-electrode layer positioned in the concave part.
7. A display panel comprising the display substrate of claim 6.
8. A display device comprising the display panel of claim 7.
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