CN112003018A - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
CN112003018A
CN112003018A CN202010869355.XA CN202010869355A CN112003018A CN 112003018 A CN112003018 A CN 112003018A CN 202010869355 A CN202010869355 A CN 202010869355A CN 112003018 A CN112003018 A CN 112003018A
Authority
CN
China
Prior art keywords
antenna
frame
metal layer
electronic device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010869355.XA
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Chinese (zh)
Inventor
邾志民
简宪静
王义金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN202010869355.XA priority Critical patent/CN112003018A/en
Publication of CN112003018A publication Critical patent/CN112003018A/en
Priority to PCT/CN2021/113499 priority patent/WO2022042414A1/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30Arrangements for providing operation on different wavebands
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use

Abstract

The application provides an electronic device, including: the antenna comprises a metal frame body and a first antenna, wherein a first through hole is formed in one frame of the metal frame body, and a first filling medium is arranged in the first through hole; the first antenna is located on the inner side of the frame and comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked, the first metal layer faces the frame, a second through hole is formed in the first metal layer, and the orthographic projection of the first through hole on the first metal layer is at least partially overlapped with the second through hole. This can effectively improve the radiation performance of the first antenna.

Description

Electronic device
Technical Field
The present application relates to the field of communications technologies, and in particular, to an electronic device.
Background
At present, when the millimeter wave radar antenna is arranged on electronic equipment such as a mobile phone, because nonmetal materials such as a screen of the electronic equipment such as the mobile phone have large influence on the millimeter wave radar antenna, the resonance frequency of the millimeter wave radar antenna is often caused to deviate, the bandwidth is narrowed, and the radiation pattern is distorted, so that the performances such as the identification distance and the precision of the millimeter wave radar antenna are influenced.
Therefore, the millimeter wave antenna of the conventional electronic device has the problem of poor performance.
Disclosure of Invention
The embodiment of the application provides an electronic device, which can solve the problem that the performance of a millimeter wave antenna of the conventional electronic device is poor.
In order to solve the above technical problem, the present application is implemented as follows:
an embodiment of the present application provides an electronic device, including: a metal frame and a first antenna, wherein,
a first through hole is formed in one frame of the metal frame body, and a first filling medium is arranged in the first through hole;
the first antenna is located on the inner side of the frame and comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked, the first metal layer faces the frame, a second through hole is formed in the first metal layer, and the orthographic projection of the first through hole on the first metal layer is at least partially overlapped with the second through hole.
In the embodiment of the application, the first through hole is formed in the frame, and the first filling medium is arranged in the first through hole so as to maintain the structural integrity of the frame; simultaneously, the first antenna is arranged at the position corresponding to the first through hole, and the first antenna can generate higher-frequency resonance in a required frequency band and can excite current on the first through hole of the frame, so that the lower-frequency resonance in the required frequency band is generated, the bandwidth characteristic is realized by enabling the two resonances to be close to each other, and the purpose of improving the radiation performance of the first antenna is realized.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;
fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
fig. 3 is an impedance matching diagram of a millimeter wave radar antenna provided in an embodiment of the present application;
FIG. 4 is an efficiency diagram of a millimeter wave radar antenna provided by an embodiment of the present application;
fig. 5 is a maximum gain diagram of the millimeter wave radar antenna provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
As shown in fig. 1 to 5, an embodiment of the present application provides an electronic device, including a metal frame 10 and a first antenna 20, wherein:
a first through hole 111 is formed in one side frame 11 of the metal frame 10, and a first filling medium (not shown) is provided in the first through hole 111;
the first antenna 20 is located inside the frame 11, and includes a first metal layer 21, a substrate 22, and a second metal layer 23 that are sequentially stacked, where the first metal layer 21 is disposed facing the frame 11, the first metal layer 21 is provided with a second through hole 211, and an orthographic projection of the first through hole 111 on the first metal layer 21 at least partially coincides with the second through hole 211.
In this embodiment, a first through hole 111 is formed in the frame 11, and a first filling medium is disposed in the first through hole 111 to maintain the structural integrity of the frame; meanwhile, the first antenna 20 (i.e., a slot antenna) is arranged at a position corresponding to the first through hole 111, and because the first antenna 20 can generate higher-frequency resonance in a required frequency band, and the first antenna 20 can also excite current on the first through hole 111 of the frame 11, lower-frequency resonance in the required frequency band is generated, so that the two resonances are close to each other to realize a bandwidth characteristic, and the purpose of improving the radiation performance of the first antenna 20 is realized.
The first antenna 20 may be a Substrate Integrated Waveguide (SIW) slot antenna, and the SIW is a new microwave transmission form that uses metal vias to implement a field propagation mode of the Waveguide on a dielectric Substrate.
As shown in fig. 2, the first metal layer 21 and the second metal layer 23 may be electrically connected through the metalized via 24, so that the first metal layer 21 and the second metal layer 23 form a SIW cavity, and the second through hole 211 is disposed on the first metal layer 21 for radiation, so that the first antenna 20 can generate a higher frequency resonance in a desired frequency band, and can also excite a current on the first through hole 111 of the bezel 11 to generate a lower frequency resonance in the desired frequency band, thereby achieving the purpose of enabling the two resonances to approach each other to achieve a bandwidth characteristic, and achieving an improvement in a radiation performance of the first antenna 20.
The substrate 22 may be a circuit board substrate having a dielectric constant of 2.2; in practical application, the circuit board substrate can be flexibly selected according to requirements.
The first antenna 20 in the present application has a bandwidth characteristic, and the SIW slot antenna based on a Liquid Crystal Polymer (LCP) material can generate a higher frequency resonance in a desired frequency band, and simultaneously, it excites a current on the first through hole 111 of the metal frame 11, thereby generating a lower frequency resonance in the desired frequency band, and making two resonances close to each other to realize the bandwidth characteristic.
The electronic equipment in the application can be used for fully shielding the electronic equipment, the first through hole 111 is formed in the frame 11, and the first antenna 20 is arranged corresponding to the first through hole 111, so that the good antenna performance can be obtained on the premise of ensuring the appearance of the full screen and the metal frame 10, and no extra space is required to be arranged for placing the first antenna; therefore, on the basis of high screen occupation ratio, the space coverage of bandwidth and high gain is realized.
The electronic device further includes a back cover plate (not shown), a display screen (not shown), and a glass cover plate (not shown), and the metal frame 10 is located between the back cover plate and the display screen, and can be bonded to the back cover plate and the display screen by an adhesive, such as glue. The back cover plate can be a shell or a battery cover, and the manufacturing material of the back cover plate can be plastic, glass, ceramic or the like; the display screen is located to glass apron lid to protect the display screen.
In this way, by arranging the first antenna 20 inside the frame 11, it is avoided that the first antenna 20 is arranged below the screen 30, so that the distortion of the screen 40 to the radiation pattern of the antenna can be effectively weakened, and the functions of face recognition or gesture recognition and the like can be better realized.
The first antenna 20 may be located directly above the back cover plate or directly below the glass cover plate.
The metal frame 10 may further include a frame on which a radiator (not shown) of the second antenna is disposed, and the frame 11 on which the first through hole 111 is disposed is different from the frame on which the radiator is disposed. The second antenna may be a non-millimeter wave communication antenna, such as 4G LTE or the like.
Moreover, the first antenna 20 in the present application may be a millimeter wave antenna, and may be designed to be integrated with a cellular antenna or a non-cellular antenna, that is, the cellular antenna or the non-cellular antenna includes a millimeter wave antenna, so as to save the occupied space required by the antenna.
In addition, the electronic device further includes a grounding structure, and the metal frame 10 is conductively connected to the grounding structure so as to ground the metal frame 10.
Optionally, the antenna further includes a first antenna chip 40, and the first antenna chip 40 is electrically connected to the first metal layer 21 through a trace 50, so as to implement the radio frequency function of the first antenna 20.
In this embodiment, the trace 50 may be an LCP trace made of LCP material.
The first filling medium may be plastic or silica gel, etc. to ensure the integrity of the appearance of the metal frame 10; moreover, the color of the exposed surface of the first filling medium can be consistent with the color of the metal frame body 10, so as to improve the integrity of the metal frame body 10.
For example, when the metal frame 10 is gold, a gold plastic material or a gold silicon crystal may be used as the first filling medium to maintain the integrity of the appearance of the metal frame 10.
A second filling medium 60 capable of playing a role of buffering may be further disposed between the frame 11 and the first antenna 20, and the second filling medium 60 may be plastic or silicon rubber.
Specifically, a buffer layer, such as a plastic layer or a silicon layer, may be disposed between the bezel 11 and the first antenna 20, so that when the bezel 11 is impacted, the impact force applied to the first antenna 20 may be reduced through the buffer layer, and the damage of the external impact force to the first antenna 20 may be reduced.
Optionally, the first metal layer 21 is further provided with a groove for impedance matching, and the groove can improve the impedance matching effect of the first antenna 20, so as to improve the radiation performance of the first antenna 20.
Wherein, the shape of the groove can be square, arc and the like.
Further, a microstrip feed line 213 may be formed on the first metal layer 21, and electrically connected to the first antenna chip 40 through the microstrip feed line 213, specifically, electrically connected to the trace 50 through the microstrip feed line 213, and electrically connected to the first antenna chip 40 through the trace 50, so as to feed the first antenna 20 through the microstrip feed line 213.
In practical application, the feeding form, such as coaxial feeding, coplanar waveguide feeding and the like, can be flexibly configured according to practical requirements.
The slot may be divided into at least two sub-slots 212 by the microstrip feed line 213, and the number of the sub-slots 212 may be set according to the coverage frequency band of the first antenna 20.
Optionally, the number of sub-grooves 212 is two, i.e. the microstrip feed line 213 divides the groove into two sub-grooves 212.
Also, two sub-grooves 212 separated by the microstrip feed line 213 may be symmetrically disposed with respect to the microstrip feed line 213 to further improve the radiation performance of the first antenna 20.
A plurality of first through holes 111 may be disposed on the frame 11, a plurality of first antennas 20 may be disposed corresponding to the first through holes 111, and the plurality of first antennas 20 may be linearly disposed on the frame 11, so as to improve the performance identification effect of the first antennas 20.
It should be noted that, on the premise of ensuring the appearance of the electronic device, the frame 11 may be further provided with a plurality of first through holes 111, and a plurality of first antennas 20 are disposed corresponding to the plurality of first through holes 111 to form a millimeter wave array antenna, and the purpose of improving the antenna radiation performance of the electronic device may be achieved without additionally disposing a space for placing the millimeter wave array antenna.
Moreover, on the premise of maintaining the appearance design of the metal frame 10 of the electronic device, the space coverage of bandwidth and high gain can be realized under the condition of high screen occupation ratio without increasing the whole size of the electronic device.
As shown in fig. 3, the first antenna 20 is a millimeter wave radar antenna, and the-6 dB return loss is calculated, the coverable frequency band of the proposed millimeter wave radar antenna is 56 GHz-65.2 GHz, which can meet the bandwidth requirement (57 GHz-64 GHz) of the currently general millimeter wave radar antenna.
Based on the total efficiency diagram of the millimeter wave radar antenna shown in fig. 4 and the maximum gain diagram of the millimeter wave radar antenna shown in fig. 5, the proposed millimeter wave radar antenna has an efficiency of more than-3 dB and a maximum gain of more than 4.5dB within the impedance bandwidth, and the overall radiation performance of the proposed millimeter wave radar antenna is good.
Moreover, the radiation pattern of the millimeter wave radar antenna at 60GHz basically faces the screen 30 side, and the fluctuation of the radiation pattern is small, so that better performance can be satisfied.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. An electronic device, comprising: a metal frame and a first antenna, wherein,
a first through hole is formed in one frame of the metal frame body, and a first filling medium is arranged in the first through hole;
the first antenna is located on the inner side of the frame and comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked, the first metal layer faces the frame, a second through hole is formed in the first metal layer, and the orthographic projection of the first through hole on the first metal layer is at least partially overlapped with the second through hole.
2. The electronic device of claim 1, further comprising a first antenna chip electrically connected to the first metal layer by a trace.
3. The electronic device of claim 2, wherein the first metal layer is further provided with a groove for impedance matching.
4. The electronic device of claim 3, further comprising a microstrip feed line for electrically connecting the first metal layer and the trace, the microstrip feed line separating the groove into two sub-grooves.
5. The electronic device of claim 4, wherein two of the sub-slots are symmetrically disposed with respect to the microstrip feed line.
6. The electronic device of claim 3, wherein the recess is square, arcuate in shape.
7. The electronic device of any of claims 2-6, wherein a second fill medium is disposed between the first metal layer and the bezel.
8. The electronic device according to any of claims 2-6, wherein the traces are liquid crystal polymer traces.
9. The electronic device according to any one of claims 2 to 6, wherein the first filling medium is any one of plastic and silicone.
10. The electronic device according to any one of claims 2 to 6, wherein the metal frame further includes a frame on which a radiator of the second antenna is disposed, and the frame on which the first through hole is disposed is different from the frame on which the radiator is disposed.
CN202010869355.XA 2020-08-26 2020-08-26 Electronic device Pending CN112003018A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010869355.XA CN112003018A (en) 2020-08-26 2020-08-26 Electronic device
PCT/CN2021/113499 WO2022042414A1 (en) 2020-08-26 2021-08-19 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010869355.XA CN112003018A (en) 2020-08-26 2020-08-26 Electronic device

Publications (1)

Publication Number Publication Date
CN112003018A true CN112003018A (en) 2020-11-27

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WO (1) WO2022042414A1 (en)

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WO2022042414A1 (en) * 2020-08-26 2022-03-03 维沃移动通信有限公司 Electronic device
WO2022262770A1 (en) * 2021-06-16 2022-12-22 维沃移动通信有限公司 Electronic device

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WO2022262770A1 (en) * 2021-06-16 2022-12-22 维沃移动通信有限公司 Electronic device

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Application publication date: 20201127