CN112002742A - OLED display panel and manufacturing method thereof - Google Patents

OLED display panel and manufacturing method thereof Download PDF

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Publication number
CN112002742A
CN112002742A CN202010806891.5A CN202010806891A CN112002742A CN 112002742 A CN112002742 A CN 112002742A CN 202010806891 A CN202010806891 A CN 202010806891A CN 112002742 A CN112002742 A CN 112002742A
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pixel
sub
layer
display panel
oled display
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CN112002742B (en
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蔡振飞
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65OLEDs integrated with inorganic image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses an OLED display panel and a manufacturing method thereof, wherein a display area of the OLED display panel comprises a first display area and a second display area, the second display area is a camera area, and the light transmittance of the second display area is greater than that of the first display area; a plurality of pixel groups are arranged in the display area, and the pixel groups comprise a plurality of first pixel groups and a plurality of second pixel groups; the first type pixel group and the second type pixel group are arranged in the second display area; the second pixel group comprises a first sub-pixel and a second sub-pixel; the first sub-pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel, and the second sub-pixel comprises a yellow sub-pixel, a cyan sub-pixel and a pink sub-pixel.

Description

OLED display panel and manufacturing method thereof
Technical Field
The application relates to the technical field of displays, in particular to an OLED display panel and a manufacturing method thereof.
Background
The organic light-Emitting Diode (OLED for short) mainly has the advantages of being capable of Emitting light autonomously, being provided with a flexible screen, being high in light-Emitting efficiency, being fast in response time and the like. With the rapid development of electronic devices, users have higher and higher requirements for screen occupation ratio, so that the comprehensive screen display of the electronic devices is more and more concerned by the industry. In a conventional electronic device such as a mobile phone, a tablet computer, etc., since a front camera, an earpiece, an infrared sensing element, etc. need to be integrated, a slot is formed in a display screen, and the camera, the earpiece, the infrared sensing element, etc. are disposed in the slot area.
The current new technology of the mobile phone panel is rapidly developed, the under-screen camera is about to become the hot spot technology of the next round, the transparent thin film transistor substrate and the cathode with higher transmittance need to be manufactured to improve the transmittance of the whole panel, but the manufacturing difficulty of the transparent array substrate is very high and almost impossible to realize, only the pixel opening rate is reduced, namely the pixel density of the camera area is reduced to improve the transmittance, the pixel arrangement in the current pixel rendering technology is the conventional RGB pixel arrangement, the RGB pixel quantity is reduced proportionally in the under-screen camera area, which is equivalent to the improvement of the current density, the accelerated aging of the OLED material can be caused, and the final display brightness is not uniform.
Disclosure of Invention
In order to overcome the defects of the prior art, the embodiment of the application provides an OLED display panel and a manufacturing method thereof, and brand new arrangement is performed in a camera area under a screen to improve the transmittance of a thin film transistor, so that the camera technology under the screen is realized.
The embodiment of the invention provides an OLED display panel, wherein a display area of the OLED display panel comprises a first display area and a second display area, the second display area is a camera area, and the light transmittance of the second display area is greater than that of the first display area; a plurality of pixel groups are arranged in the display area, and the pixel groups comprise a plurality of first pixel groups and a plurality of second pixel groups; the first type pixel group and the second type pixel group are arranged in the second display area; the second pixel group comprises a first sub-pixel and a second sub-pixel; the first sub-pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel, and the second sub-pixel comprises a yellow sub-pixel, a cyan sub-pixel and a pink sub-pixel.
According to the OLED display panel provided by the embodiment of the present invention, only the first type of pixel group is disposed in the first display region.
According to the OLED display panel provided by the embodiment of the present invention, the first type of pixel group only includes the first sub-pixel, and the first type of pixel group is arranged by combining the red sub-pixel, the green sub-pixel, and the blue sub-pixel.
According to the OLED display panel provided by the embodiment of the invention, the OLED display panel comprises a thin film transistor layer, a flat layer, an anode layer, a light emitting layer, a cathode layer and an encapsulation layer; a plurality of the pixel groups are disposed within the light emitting layer.
According to the OLED display panel provided in the embodiment of the present invention, the proportion of each of the first type pixel group and the second type pixel group in the second display area is 50%.
According to the OLED display panel provided by the embodiment of the present invention, in the second display region, 50% of the arrangement is made by using the combination of the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% of the arrangement is made by using the blue sub-pixel in the first sub-pixel and the yellow sub-pixel in the second sub-pixel.
According to the OLED display panel provided by the embodiment of the present invention, in the second display area, 50% of the arrangement is made by using the combination of the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% of the arrangement is made by using the green sub-pixel in the first sub-pixel and the pink sub-pixel in the second sub-pixel.
According to the OLED display panel provided by the embodiment of the present invention, in the second display region, 50% of the arrangement is made by using the combination of the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% of the arrangement is made by using the red sub-pixel in the first sub-pixel and the cyan sub-pixel in the second sub-pixel.
The embodiment of the invention also provides a manufacturing method of the OLED display panel, which comprises the following steps:
step S1, preparing a hole transport layer on the anode above the thin film transistor through a photomask;
step S2, using a fine metal mask to sequentially evaporate a red sub-pixel luminous layer, a green sub-pixel luminous layer, a blue sub-pixel luminous layer and a red micro-cavity adjusting layer, a green micro-cavity adjusting layer and a blue micro-cavity adjusting layer corresponding to the red sub-pixel luminous layer, the green sub-pixel luminous layer and the blue sub-pixel luminous layer;
step S3, evaporating a second sub-pixel light-emitting layer and a micro-cavity adjusting layer corresponding to the second sub-pixel light-emitting layer by using a fine metal mask;
step S4, manufacturing an electron transport layer and an electron injection layer by using a photomask;
step S5, forming a cathode layer on the electron injection layer;
and step S6, manufacturing a packaging layer on the cathode layer.
According to the method for manufacturing the OLED display panel, the second sub-pixel light emitting layer comprises a yellow sub-pixel light emitting layer, a cyan sub-pixel light emitting layer and a pink sub-pixel light emitting layer; the second sub-pixel light emitting layer is manufactured only in 50% of the area of the camera head of the OLED display panel.
The invention has the beneficial effects that: according to the OLED display panel and the manufacturing method thereof provided by the embodiment of the invention, the new pixel arrangement is adopted in the under-screen camera area, the original RGB pixel arrangement of half of the pixel arrangement of the under-screen camera area is changed into the arrangement of yellow pixels plus blue pixels or pink pixels plus green pixels or cyan pixels plus red pixels, and the pixel arrangement of the other half still adopts the RGB pixel arrangement. The pixel arrangement of the non-screen lower camera area adopts RGB pixel arrangement. The pixel combination mode of arrangement of yellow pixels plus blue pixels or pink pixels plus green pixels or cyan pixels plus red pixels is adopted in the camera area under the screen, so that the number of pixels is reduced on the premise that the density of display pixels is not reduced, the light transmittance of the thin film transistor substrate is improved, and the camera technology under the screen can be better realized.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic view of an OLED display panel provided in this embodiment.
Fig. 2 is a schematic structural diagram of a second display region of the OLED display panel provided in this embodiment.
Fig. 3 is a schematic structural diagram of the thin film transistor provided in this embodiment.
Fig. 4 is a schematic pixel arrangement diagram of the second display region of the OLED display panel provided in this embodiment.
Fig. 5 is a schematic structural diagram of a second display region of the OLED display panel provided in this embodiment.
Fig. 6 is a schematic view of another pixel arrangement of the second display region of the OLED display panel according to the embodiment.
Fig. 7 is a schematic structural diagram of a second display region of the OLED display panel provided in this embodiment.
Fig. 8 is a schematic view of another pixel arrangement of the second display region of the OLED display panel according to the embodiment.
Fig. 9 is a schematic structural diagram of a second display region of the OLED display panel provided in this embodiment.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
A slotted area is arranged on a display screen of electronic equipment in the prior art, photosensitive devices such as a camera, a receiver and an infrared sensing element are arranged in the slotted area, and external light enters the photosensitive devices through the slotted area. However, since the slotted region cannot display, the full screen display of the electronic device cannot be realized. Through the mode of setting up transparent display screen on above-mentioned electronic equipment, set up the sensitization device in transparent display screen below, can realize electronic equipment's full screen display under the prerequisite of guaranteeing that the sensitization device normally works. And when making the camera under the screen, need to improve the luminousness of the base plate. The transparent thin film transistor substrate and the cathode with high transmittance are manufactured to improve the transmittance of the whole panel, but the transparent array substrate is very difficult to manufacture and almost impossible to realize, and the transmittance is improved only by reducing the pixel aperture ratio, namely reducing the pixel density of a camera area. Generally, the number of RGB pixels is reduced in an equal proportion by adopting a camera area under a screen, which is equivalent to that the current density is increased, so that the accelerated aging of OLED materials can be caused, and finally the display brightness is not uniform.
In order to solve the above problems, embodiments of the present application provide an OLED display panel and a method for manufacturing the same, which can well solve the above problems.
Referring to fig. 1 and fig. 2, as shown in fig. 1, an embodiment of the invention provides a schematic diagram of an OLED display panel. Referring to fig. 1, the OLED display panel includes a first display area 10 and a second display area 20, the second display area 20 is a camera area, and the first display area 10 is a display operation area. Wherein the light transmittance of the second display region 20 is greater than that of the first display region 10. As shown in fig. 2, a schematic view of a second display region structure of an OLED display panel according to an embodiment of the present invention is provided, where the second display region 20 of the OLED display panel includes: a thin film transistor 201 of a substrate, a planarization layer 202 disposed over the thin film transistor 201, an anode layer 203 disposed over the planarization layer 202, a pixel definition layer 204 disposed over the anode layer 203, and a light emitting layer 205 disposed over the pixel definition layer 204, a cathode layer 206 disposed over the light emitting layer 205, and an encapsulation layer 207 disposed over the cathode layer 206. The light-emitting layer 205 further includes a hole transport layer 2051, a first-type pixel group light-emitting layer 2052, a microcavity adjusting layer 2053 corresponding to the first-type pixel group light-emitting layer 2052, a second-type pixel group light-emitting layer 2054, a microcavity adjusting layer 2055 corresponding to the second-type pixel group light-emitting layer 2054, an electron transport layer 2056, and an electron injection layer 2057.
Specifically, a plurality of pixel groups are arranged in the display area, and the pixel groups comprise a plurality of first pixel groups and a plurality of second pixel groups; the first type pixel group and the second type pixel group are arranged in the second display area 20; the second pixel group comprises a first sub-pixel and a second sub-pixel; the first sub-pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel, and the second sub-pixel comprises a yellow sub-pixel, a cyan sub-pixel and a pink sub-pixel. Wherein, only the first type pixel group is disposed in the first display region 10. The first pixel group only comprises first sub-pixels, and the first pixel group is arranged by adopting the combination of the red sub-pixels, the green sub-pixels and the blue sub-pixels. The proportion of the first type pixel group and the second type pixel group in the second display area 20 respectively accounts for 50%. A plurality of the pixel groups are disposed in the light emitting layer 205.
As shown in fig. 3, a schematic structural diagram of the thin film transistor 201 provided in this embodiment is provided, specifically, the thin film transistor 201 includes:
a first polyimide film layer 1 disposed on the bottom; the insulating layer 2 is arranged above the first polyimide film layer 1; a second polyimide film layer 3 of a second polyimideThe polyimide film layer 3 is arranged above the isolation layer 2, and the second polyimide film layer 3 is isolated from the first polyimide film layer 1 through the isolation layer 2. A buffer layer 4, wherein the buffer layer 4 is disposed on the second polyimide thin film layer 3, and in the present embodiment, the buffer layer 4 is silicon oxide (SiO)x) The material is made; an active layer 5, the active layer 5 being disposed above the buffer layer 4, the active layer 5 being subjected to a patterning process; a first gate insulating layer 6, wherein the first gate insulating layer 6 is disposed above the active layer 5 and completely covers the active layer 5, and in the present embodiment, the first gate insulating layer 6 is silicon oxide (SiO)x) The material is made; a first gate layer 7, the first gate layer 7 being disposed on the first gate insulating layer 6, the first gate layer 7 being subjected to a patterning process; a second gate insulating layer 8, the second gate insulating layer 8 being disposed over the first gate layer 7, the second gate insulating layer 8 completely covering the first gate layer 7; a second gate layer 9, the second gate layer 9 being disposed over the second gate insulating layer 8, the second gate layer 9 being subjected to a patterning process; the insulating isolation layer 10 is arranged above the second gate layer 9, and the insulating isolation layer 10 forms a via hole through photoetching and dry etching; the source drain layer 11 penetrates through the insulating isolation layer 10, the first gate insulating layer 6 and the second gate insulating layer 8 through the through holes to be connected with the active layer 5; the source drain layer 11 forms a data pattern by photolithography and wet etching. And the covering layer 12 is arranged above the source drain layer 11.
Specifically, as shown in fig. 4, the pixel arrangement of the second display region of the OLED display panel provided in the embodiment of the present invention is shown; fig. 5 is a schematic structural diagram of an OLED display panel according to an embodiment of the present invention. With reference to fig. 4 and fig. 5, in the OLED display panel, the ratio of the first type pixel group and the second type pixel group in the second display area 20 is 50%, the first type pixel group only includes the first sub-pixel, and the second type pixel group includes the first sub-pixel and the second sub-pixel; the first sub-pixel includes a red sub-pixel 301, a green sub-pixel 302, and a blue sub-pixel 303, and the second sub-pixel includes a yellow sub-pixel 401, a cyan sub-pixel 402, and a pink sub-pixel 403. Referring to fig. 4, in the second display area 20, 50% of the pixels are arranged by using the combination of the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel, and 50% of the pixels are arranged by using the blue sub-pixel 303 in the first sub-pixel and the yellow sub-pixel 401 in the second sub-pixel.
Referring to fig. 5, 50% of the pixel arrangement of the OLED display panel in the second display region 20 is arranged with the blue sub-pixel 303 in the first sub-pixel and the yellow sub-pixel 401 in the second sub-pixel, and 50% of the pixel arrangement is arranged with the red sub-pixel 301, the green sub-pixel 302, and the blue sub-pixel 303 in the first sub-pixel in combination; and the first display region 10 is arranged by combining the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel. When the second display area 20 of the OLED display panel is manufactured, a hole transport layer 2051 is firstly manufactured on the pixel defining layer 204 by using a photomask; then, a red sub-pixel luminous layer 501, a green sub-pixel luminous layer 502, a blue sub-pixel luminous layer 503, and a red microcavity adjusting layer 5011, a green microcavity adjusting layer 5021 and a blue microcavity adjusting layer 5031 which correspond to the red sub-pixel luminous layer, the green sub-pixel luminous layer 502 and the blue sub-pixel luminous layer 503 are sequentially evaporated by using a fine metal mask; continuing to use the fine metal mask to evaporate the yellow sub-pixel light-emitting layer 504 and the corresponding yellow micro-cavity adjusting layer 5041; then, an electron transport layer 2056 and an electron injection layer 2057 are formed by using a photomask; using a mask to fabricate the cathode layer 206; the packaging layer 207 is manufactured by adopting a chemical vapor deposition method and an inkjet printing method, and the packaging layer 207 is made of an inorganic material and an organic material.
Specifically, as shown in fig. 6, the pixel arrangement of the second display region of another OLED display panel provided in the embodiment of the present invention is shown; fig. 7 is a schematic structural diagram of another OLED display panel according to an embodiment of the present invention. With reference to fig. 6 and fig. 7, in the OLED display panel, the ratio of the first type pixel group and the second type pixel group in the second display area 20 is 50%, the first type pixel group only includes the first sub-pixel, and the second type pixel group includes the first sub-pixel and the second sub-pixel; the first sub-pixel includes a red sub-pixel 301, a green sub-pixel 302, and a blue sub-pixel 303, and the second sub-pixel includes a yellow sub-pixel 401, a cyan sub-pixel 402, and a pink sub-pixel 403. Referring to fig. 6, in the second display area 20, 50% of the pixels are arranged by using the combination of the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel, and 50% of the pixels are arranged by using the green sub-pixel 302 in the first sub-pixel and the pink sub-pixel 403 in the second sub-pixel.
Referring to fig. 7, 50% of the pixel arrangement of the OLED display panel in the second display region 20 is arranged using the green sub-pixel 302 in the first sub-pixel and the pink sub-pixel 403 in the second sub-pixel, and 50% of the pixel arrangement is arranged using the red sub-pixel 301, the green sub-pixel 302, and the blue sub-pixel 303 in the first sub-pixel in combination; and the first display region 10 is arranged by combining the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel. When the second display area 20 of the OLED display panel is manufactured, a hole transport layer 2051 is firstly manufactured on the pixel defining layer 204 by using a photomask; then, a red sub-pixel luminous layer 501, a green sub-pixel luminous layer 502, a blue sub-pixel luminous layer 503, and a red microcavity adjusting layer 5011, a green microcavity adjusting layer 5021 and a blue microcavity adjusting layer 5031 which correspond to the red sub-pixel luminous layer, the green sub-pixel luminous layer 502 and the blue sub-pixel luminous layer 503 are sequentially evaporated by using a fine metal mask; continuing to use the fine metal mask to evaporate the pink sub-pixel light-emitting layer 505 and the corresponding pink micro-cavity adjusting layer 5051; then, an electron transport layer 2056 and an electron injection layer 2057 are formed by using a photomask; using a mask to fabricate the cathode layer 206; the packaging layer 207 is manufactured by adopting a chemical vapor deposition method and an inkjet printing method, and the packaging layer 207 is made of an inorganic material and an organic material.
Specifically, as shown in fig. 8, the pixel arrangement of the second display region of another OLED display panel according to the embodiment of the present invention is shown; fig. 9 is a schematic structural diagram of another OLED display panel according to an embodiment of the present invention. With reference to fig. 8 and 9, in the OLED display panel, the ratio of the first type pixel group and the second type pixel group in the second display area 20 is 50%, the first type pixel group only includes the first sub-pixel, and the second type pixel group includes the first sub-pixel and the second sub-pixel; the first sub-pixel includes a red sub-pixel 301, a green sub-pixel 302, and a blue sub-pixel 303, and the second sub-pixel includes a yellow sub-pixel 401, a cyan sub-pixel 402, and a pink sub-pixel 403. Referring to fig. 8, in the second display area 20, 50% of the pixels are arranged by using the combination of the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel, and 50% of the pixels are arranged by using the red sub-pixel 301 in the first sub-pixel and the cyan sub-pixel 402 in the second sub-pixel.
Referring to fig. 9, 50% of the pixel arrangement of the OLED display panel in the second display region 20 is arranged using the red sub-pixel 301 of the first sub-pixel and the cyan sub-pixel 402 of the second sub-pixel, and 50% of the pixel arrangement is arranged using the combination of the red sub-pixel 301, the green sub-pixel 302, and the blue sub-pixel 303 of the first sub-pixel; and the first display region 10 is arranged by combining the red sub-pixel 301, the green sub-pixel 302 and the blue sub-pixel 303 in the first sub-pixel. When the second display area 20 of the OLED display panel is manufactured, a hole transport layer 2051 is firstly manufactured on the pixel defining layer 204 by using a photomask; then, a red sub-pixel luminous layer 501, a green sub-pixel luminous layer 502, a blue sub-pixel luminous layer 503, and a red microcavity adjusting layer 5011, a green microcavity adjusting layer 5021 and a blue microcavity adjusting layer 5031 which correspond to the red sub-pixel luminous layer, the green sub-pixel luminous layer 502 and the blue sub-pixel luminous layer 503 are sequentially evaporated by using a fine metal mask; continuing to use the fine metal mask to evaporate the cyan sub-pixel light-emitting layer 506 and the corresponding cyan micro-cavity adjusting layer 5061; then, an electron transport layer 2056 and an electron injection layer 2057 are formed by using a photomask; using a mask to fabricate the cathode layer 206; the packaging layer 207 is manufactured by adopting a chemical vapor deposition method and an inkjet printing method, and the packaging layer 207 is made of an inorganic material and an organic material.
The embodiment of the invention also provides a manufacturing method of the OLED display panel, which comprises the following steps: step S1, preparing a hole transport layer on the anode above the thin film transistor through a photomask;
step S2, using a fine metal mask to sequentially evaporate a red sub-pixel luminous layer, a green sub-pixel luminous layer, a blue sub-pixel luminous layer and a red micro-cavity adjusting layer, a green micro-cavity adjusting layer and a blue micro-cavity adjusting layer corresponding to the red sub-pixel luminous layer, the green sub-pixel luminous layer and the blue sub-pixel luminous layer;
step S3, evaporating a second sub-pixel light-emitting layer and a micro-cavity adjusting layer corresponding to the second sub-pixel light-emitting layer by using a fine metal mask;
step S4, manufacturing an electron transport layer and an electron injection layer by using a photomask;
step S5, forming a cathode layer on the electron injection layer;
and step S6, manufacturing a packaging layer on the cathode layer.
The second sub-pixel light-emitting layer comprises a yellow sub-pixel light-emitting layer, a cyan sub-pixel light-emitting layer and a pink sub-pixel light-emitting layer; the second sub-pixel light emitting layer is manufactured only in 50% of the area of the camera head of the OLED display panel.
According to the OLED display panel and the manufacturing method thereof provided by the embodiment of the invention, the new pixel arrangement is adopted in the under-screen camera area, the original RGB pixel arrangement of half of the pixel arrangement of the under-screen camera area is changed into the arrangement of yellow pixels plus blue pixels or pink pixels plus green pixels or cyan pixels plus red pixels, and the pixel arrangement of the other half still adopts the RGB pixel arrangement. The pixel arrangement of the non-screen lower camera area adopts RGB pixel arrangement. The pixel combination mode of arrangement of yellow pixels plus blue pixels or pink pixels plus green pixels or cyan pixels plus red pixels is adopted in the camera area under the screen, so that the number of pixels is reduced on the premise that the density of display pixels is not reduced, the light transmittance of the thin film transistor substrate is improved, and the camera technology under the screen can be better realized.
The OLED display panel and the manufacturing method thereof provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation manner of the present application, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (10)

1. The OLED display panel is characterized in that a display area of the OLED display panel comprises a first display area and a second display area, the second display area is a camera area, and the light transmittance of the second display area is greater than that of the first display area; a plurality of pixel groups are arranged in the display area, and the pixel groups comprise a plurality of first pixel groups and a plurality of second pixel groups; the first type pixel group and the second type pixel group are arranged in the second display area; the second pixel group comprises a first sub-pixel and a second sub-pixel; the first sub-pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel, and the second sub-pixel comprises a yellow sub-pixel, a cyan sub-pixel and a pink sub-pixel.
2. The OLED display panel of claim 1, wherein only the first type of pixel group is disposed in the first display area.
3. The OLED display panel of claim 2, wherein the first pixel group comprises only a first sub-pixel, and the first pixel group is arranged by combining the red sub-pixel, the green sub-pixel and the blue sub-pixel.
4. The OLED display panel of claim 1, wherein the OLED display panel comprises a thin film transistor layer, a planarization layer, an anode layer, a light emitting layer, a cathode layer, and an encapsulation layer; a plurality of the pixel groups are disposed within the light emitting layer.
5. The OLED display panel of claim 1, wherein the first type of pixel group and the second type of pixel group each account for 50% of the second display area.
6. The OLED display panel of claim 5, wherein in the second display region, 50% is arranged with the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% is arranged with the blue sub-pixel in the first sub-pixel and the yellow sub-pixel in the second sub-pixel.
7. The OLED display panel of claim 5, wherein in the second display area, 50% is arranged with the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% is arranged with the green sub-pixel in the first sub-pixel and the pink sub-pixel in the second sub-pixel.
8. The OLED display panel of claim 5, wherein in the second display region 50% is arranged with the red sub-pixel, the green sub-pixel and the blue sub-pixel in the first sub-pixel, and 50% is arranged with the red sub-pixel in the first sub-pixel and the cyan sub-pixel in the second sub-pixel.
9. The manufacturing method of the OLED display panel is characterized by comprising the following steps of:
step S1, preparing a hole transport layer on the anode above the thin film transistor through a photomask;
step S2, using a fine metal mask to sequentially evaporate a red sub-pixel luminous layer, a green sub-pixel luminous layer, a blue sub-pixel luminous layer and a red micro-cavity adjusting layer, a green micro-cavity adjusting layer and a blue micro-cavity adjusting layer corresponding to the red sub-pixel luminous layer, the green sub-pixel luminous layer and the blue sub-pixel luminous layer;
step S3, evaporating a second sub-pixel light-emitting layer and a micro-cavity adjusting layer corresponding to the second sub-pixel light-emitting layer by using a fine metal mask;
step S4, manufacturing an electron transport layer and an electron injection layer by using a photomask;
step S5, forming a cathode layer on the electron injection layer;
and step S6, manufacturing a packaging layer on the cathode layer.
10. The method of claim 9, wherein the second sub-pixel light emitting layer comprises a yellow sub-pixel light emitting layer, a cyan sub-pixel light emitting layer, and a pink sub-pixel light emitting layer; the second sub-pixel light emitting layer is manufactured only in 50% of the area of the camera head of the OLED display panel.
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