CN111996413A - Preparation method of lead-tin-based solder alloy and prepared solder alloy - Google Patents
Preparation method of lead-tin-based solder alloy and prepared solder alloy Download PDFInfo
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- CN111996413A CN111996413A CN202010849846.8A CN202010849846A CN111996413A CN 111996413 A CN111996413 A CN 111996413A CN 202010849846 A CN202010849846 A CN 202010849846A CN 111996413 A CN111996413 A CN 111996413A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 86
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 67
- 239000000956 alloy Substances 0.000 title claims abstract description 67
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 126
- 238000005245 sintering Methods 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 20
- 238000002156 mixing Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 10
- 239000010439 graphite Substances 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000003801 milling Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 21
- 238000000498 ball milling Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 abstract description 17
- 230000008018 melting Effects 0.000 abstract description 17
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000011812 mixed powder Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 14
- 238000003825 pressing Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000002490 spark plasma sintering Methods 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1051—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding by electric discharge
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a preparation method of a lead-tin-based solder alloy, which comprises the following steps: (1) milling: mixing the following raw materials in percentage by weight: 45-60% of Sn powder, 25-35% of Pb powder, 10-25% of In powder, 1.5-5% of Bi powder, 0.02-0.08% of Tb powder, 0.1-0.7% of Zr powder, 0.7% of Fe powder and the balance of Se powder; (2) and (3) sintering: and placing the mixed powder into a graphite mold, prepressing, placing the prepressed mold into a discharge plasma sintering furnace, vacuumizing, heating to 520 ℃ at the sintering pressure of 50Mpa at the heating rate of 45 ℃/min, keeping the temperature for 5min, and cooling along with the furnace to obtain the lead-tin-based solder alloy. The invention also provides the solder alloy prepared by the preparation method. The invention has the beneficial effects that: the lead-tin based solder alloy has uniform and compact microstructure, improves the wetting property of the solder alloy and has lower melting point.
Description
Technical Field
The invention relates to the technical field of solder alloys, in particular to a preparation method of a lead-tin-based solder alloy and the prepared solder alloy.
Background
In the field of electronic goods manufacturing, soldering is a very important process, and the choice of solder is also crucial in order to obtain an excellent soldered connection. Solder is a generic term for metal materials that are added to welds, weld layers, and braze seams. Mainly comprises welding wires, brazing filler metal, welding rods and the like. The solder has various types, and can be classified into lead-tin solder, copper solder, silver solder and the like according to different components, and can be classified into soft solder and hard solder according to different melting points. Lead-tin solder is mostly adopted, A, B, E insulation grade click wire end welding adopts lead-tin alloy solder, and F, H grade click wire end welding adopts pure tin solder. The melting point temperature, mechanical strength, oxidation resistance and other properties of the solder can greatly influence the welding performance.
The important point is the melting point of the solder, the welding process is to heat the solder and the weldment together to the melting temperature of the solder, the solder is melted below the melting point of the weldment so as to wet the welding surface, new alloy can be formed between the solder and the weldment through interatomic diffusion, and if the melting point of the solder is too high, the electronic components can be damaged. At present, most common solder alloys contain lead alloy, and have low cost, excellent electric and heat conducting properties and processability, so that the lead alloy becomes a preferred welding material. The Spark Plasma Sintering (SPS) technique is a new research focus in recent years, and is a plasma sintering technique in which metal powder is charged into a graphite mold, and powder pressure is applied using upper and lower molds, and plasma is generated by a pulse current.
The patent with publication number CN101972902A discloses an aluminum alloy solder for copper-aluminum welding and a preparation method thereof, wherein the aluminum alloy solder comprises the following components in percentage by weight: 60-72% of Al; 25-35% of Cu or Ge; 1-5% of Si; 1-5% of Mg; li or Sb or Bi is less than or equal to 1 percent. However, the aluminum alloy welding flux for copper and aluminum welding prepared in the prior art has the melting point of 500-580 ℃, has higher melting point and is easy to damage electronic elements in the welding process.
Disclosure of Invention
The invention aims to solve the technical problems that the solder alloy in the prior art has higher melting point and is easy to damage electronic elements in the welding process, and provides a preparation method of a lead-tin-based solder alloy.
The invention solves the technical problems through the following technical means:
a preparation method of a lead-tin-based solder alloy comprises the following steps:
(1) milling: mixing the following raw materials in percentage by weight: 45-60% of Sn powder, 25-35% of Pb powder, 10-25% of In powder, 1.5-5% of Bi powder, 0.02-0.08% of Tb powder, 0.1-0.7% of Zr powder, 0.7% of Fe powder and the balance of Se powder;
(2) and (3) sintering: and (2) putting the powder mixed in the step (1) into a graphite die, prepressing, then putting into a discharge plasma sintering furnace, vacuumizing, sintering, and cooling along with the furnace to obtain the lead-tin-based solder alloy.
Has the advantages that: the lead-tin-based solder alloy prepared by adopting the raw materials in percentage by weight and the preparation method has uniform and compact microstructure, and shows good comprehensive performance in performance test, the components of the prepared solder alloy are mutually diffused, mutually influenced and interacted, the wettability of the solder alloy is improved, and meanwhile, the melting point is lower, and when the percentage by weight is not in the range, the surface of the prepared lead-tin-based solder alloy has obvious defects.
The preparation method is simple, and has the advantages of low energy consumption, time saving and high efficiency.
Preferably, the following raw materials in percentage by weight are mixed in the step (1): 52% of Sn powder, 30% of Pb powder, 15% of In powder, 1.5% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
Has the advantages that: when the raw materials of the lead-tin-based solder alloy are the percentage, the solidus temperature of the prepared solder alloy is 238 ℃, the liquidus temperature is 248 ℃, and the shearing strength is 37N/mm2。
Preferably, the following raw materials in percentage by weight are mixed in the step (1): 47% of Sn powder, 35% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
Has the advantages that: when the raw materials of the lead-tin-based solder alloy are the percentage, the solidus temperature of the prepared solder alloy is 233 ℃, the liquidus temperature is 240 ℃, and the shearing strength is 35N/mm2。
Preferably, the following raw materials in percentage by weight are mixed in the step (1): 55% of Sn powder, 25% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
Preferably, all the raw materials in the step (1) are mixed and then placed in a vacuum ball milling tank, and are mixed and stirred for 300min under the condition of 300 r/min.
Preferably, the pressure of the pre-pressing in the step (2) is 5 MPa.
Preferably, in the step (2), the sintering pressure is 50MPa, the heating rate is 45 ℃/min, and the temperature is kept for 5min after being increased to 520 ℃.
The invention aims to solve the technical problems that the melting point of the solder alloy in the prior art is higher, and the electronic element is easily damaged in the welding process, and provides the lead-tin-based solder alloy prepared by adopting the preparation method.
Has the advantages that: the components of the solder alloy prepared by the invention are mutually diffused, mutually influenced and interacted, the wettability of the solder alloy is improved, and the solder alloy has a lower melting point.
The invention has the advantages that: the preparation method is simple, and has the advantages of low energy consumption, time saving and high efficiency.
The lead-tin-based solder alloy prepared by adopting the raw materials in percentage by weight and the preparation method has uniform and compact microstructure, and shows good comprehensive performance in performance test, the components of the prepared solder alloy are mutually diffused, mutually influenced and interacted, the wettability of the solder alloy is improved, and meanwhile, the melting point is lower, and when the percentage by weight is not in the range, the surface of the prepared lead-tin-based solder alloy has obvious defects.
Drawings
FIG. 1 is a scanning electron micrograph of a solder alloy according to example 1 of the present invention;
FIG. 2 is a scanning electron micrograph of a solder alloy according to comparative example 1 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Test materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
The specific techniques or conditions not specified in the examples can be performed according to the techniques or conditions described in the literature in the field or according to the product specification.
Example 1
Method for preparing lead-tin-based solder alloy by spark plasma sintering
(1) Milling: mixing the following raw materials in percentage by weight: putting 52% of Sn powder, 30% of Pb powder, 15% of In powder, 1.5% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder into a vacuum ball milling tank, and stirring and mixing for 300min at 300 r/min;
(2) and (3) sintering: putting the powder mixed in the step (1) into a graphite die, pre-pressing the powder, adjusting the pre-pressing pressure to 5Mpa, putting the graphite die filled with the powder into an SPS furnace cavity, and vacuumizing to 10 DEG C-1Pa, sintering pressure of 50Mpa, heating rate of 45 ℃/min, keeping the temperature for 5min after the temperature is raised to 520 ℃, and cooling along with the furnace to obtain the lead-tin-based solder alloy, wherein figure 1 is a scanning electron microscope image of the solder alloy prepared in the embodiment, and can be seen that the prepared sample is uniform and compact.
Example 2
Method for preparing lead-tin-based solder alloy by spark plasma sintering
(1) Milling: mixing the following raw materials in percentage by weight: putting 47% of Sn powder, 35% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder into a vacuum ball milling tank, and stirring and mixing for 300min at 300 r/min;
(2) and (3) sintering: putting the powder mixed in the step (1) into a graphite die, pre-pressing the powder, wherein the pre-pressing pressure is 5Mpa, putting the pre-pressed die into a discharge plasma sintering furnace, vacuumizing to 10 DEG C-1Pa, sintering pressure of 50Mpa, heating rate of 45 ℃/min, keeping the temperature for 5min after the temperature is raised to 520 ℃, and cooling along with the furnace to obtain the lead-tin-based solder alloy.
Example 3
Method for preparing lead-tin-based solder alloy by spark plasma sintering
(1) Milling: mixing the following raw materials in percentage by weight: 55% of Sn powder, 25% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder, placing the above powders In a vacuum ball milling tank, and stirring and mixing for 300min at 300 r/min;
(2) and (3) sintering: putting the powder mixed in the step (1)Putting into a graphite mold, pre-pressing the powder at a pre-pressing pressure of 5Mpa, placing the pre-pressed mold in a discharge plasma sintering furnace, and vacuumizing to 10%-1Pa, sintering pressure of 50Mpa, heating rate of 45 ℃/min, keeping the temperature for 5min after the temperature is raised to 520 ℃, and cooling along with the furnace to obtain the lead-tin-based solder alloy.
Comparative example 1
Preparation method of solder alloy
(1) Milling: mixing the following raw materials in percentage by weight: placing 60% of Sn powder, 25% of Pb powder, 12% of In powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder In a vacuum ball milling tank, and stirring and mixing for 300min at the speed of 300 r/min;
(2) and (3) sintering: and (2) placing the powder mixed in the step (1) into a graphite mould, prepressing the powder, placing the mould after prepressing into a discharge plasma sintering furnace, vacuumizing, heating to 520 ℃ at a heating rate of 45 ℃/min and keeping the temperature for 5min, and cooling along with the furnace to obtain the lead-tin-based solder alloy. Fig. 2 is a scanning electron micrograph of the solder alloy prepared in this comparative example, and it can be seen that the prepared sample was not dense.
Comparative example 2
Preparation method of solder alloy
(1) Milling: mixing the following raw materials in percentage by weight: putting 50% of Sn powder, 35% of Pb powder and 15% of In powder into a vacuum ball milling tank, and stirring and mixing for 300min at the speed of 300 r/min;
(2) and (3) sintering: putting the powder mixed in the step (1) into a graphite die, pre-pressing the powder, wherein the pre-pressing pressure is 5Mpa, putting the pre-pressed die into a discharge plasma sintering furnace, vacuumizing to 10 DEG C-1Pa, sintering pressure of 50Mpa, heating rate of 45 ℃/min, keeping the temperature for 5min after the temperature is raised to 520 ℃, and cooling along with the furnace to obtain the lead-tin-based solder alloy.
Example 4
The properties of the solder alloys obtained in examples 1 to 3 and comparative examples 1 to 2 were measured by the prior art method, and the results are shown in table 1.
Table 1 shows properties of solder alloys in examples 1 to 3 and comparative examples 1 to 2
| Group of | Solidus temperature (. degree.C.) | Liquidus temperature (. degree.C.) | Shear strength (N/mm)2) |
| Example 1 | 238 | 248 | 37 |
| Example 2 | 233 | 240 | 35 |
| Example 3 | 229 | 237 | 34 |
| Comparative example 1 | 248 | 259 | 31 |
| Comparative example 2 | 260 | 270 | 28 |
As can be seen from table 1, the lead-tin-based solder alloy prepared by the present invention has a low melting point, and when the solder alloy does not contain Bi powder, the melting point of the prepared solder alloy is increased, and when the solder alloy contains only Sn powder, Pb powder, and In powder, the melting point of the prepared solder alloy is significantly increased, and the shear strength is significantly reduced.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A preparation method of a lead-tin-based solder alloy is characterized by comprising the following steps: the method comprises the following steps:
(1) milling: mixing the following raw materials in percentage by weight: 45-60% of Sn powder, 25-35% of Pb powder, 10-25% of In powder, 1.5-5% of Bi powder, 0.02-0.08% of Tb powder, 0.1-0.7% of Zr powder, 0.7% of Fe powder and the balance of Se powder;
(2) and (3) sintering: and (2) putting the powder mixed in the step (1) into a graphite mould, prepressing, putting the mould after prepressing into a discharge plasma sintering furnace, vacuumizing, heating to 520 ℃ at a sintering pressure of 50Mpa at a heating rate of 45 ℃/min, preserving heat for 5min, and cooling along with the furnace to obtain the lead-tin-based solder alloy.
2. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: in the step (1), the following raw materials in percentage by weight are mixed: 52% of Sn powder, 30% of Pb powder, 15% of In powder, 1.5% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
3. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: in the step (1), the following raw materials in percentage by weight are mixed: 47% of Sn powder, 35% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
4. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: in the step (1), the following raw materials in percentage by weight are mixed: 55% of Sn powder, 25% of Pb powder, 15% of In powder, 2% of Bi powder, 0.02% of Tb powder, 0.1% of Zr powder, 0.7% of Fe powder and the balance of Se powder.
5. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: and (2) mixing all the raw materials in the step (1), putting the mixture into a vacuum ball-milling tank, and mixing and stirring the mixture for 300min at the speed of 300 r/min.
6. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: the pressure of the prepressing in the step (2) is 5 Mpa.
7. The method of producing a lead-tin based solder alloy according to claim 6, characterized in that: in the step (2), the sintering pressure is 50MPa, the heating rate is 45 ℃/min, and the temperature is kept for 5min after being increased to 520 ℃.
8. The method of producing a lead-tin-based solder alloy according to claim 1, characterized in that: in the step (2), vacuumizing is carried out to 10-1Pa。
9. A lead-tin-based solder alloy obtained by the method for producing a lead-tin-based solder alloy according to any one of claims 1 to 8.
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