CN111982816A - Upper cover assembly, chip testing mechanism and chip testing all-in-one machine - Google Patents
Upper cover assembly, chip testing mechanism and chip testing all-in-one machine Download PDFInfo
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- CN111982816A CN111982816A CN202011063128.4A CN202011063128A CN111982816A CN 111982816 A CN111982816 A CN 111982816A CN 202011063128 A CN202011063128 A CN 202011063128A CN 111982816 A CN111982816 A CN 111982816A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The invention provides an upper cover assembly, a chip testing mechanism and a chip testing all-in-one machine, wherein the upper cover assembly comprises an upper cover bracket, a lens fixing seat, a lens arranged in the lens fixing seat, an upper pressing sheet, a first heating structure arranged in the upper cover bracket and an upper cover circuit board, one side of the upper cover bracket is provided with a lens cavity, the other side of the upper cover bracket is provided with a pressing sheet cavity, the lens fixing seat is fixed in the lens cavity, the upper pressing sheet fixing seat is fixed in the pressing sheet cavity, and the upper pressing sheet is fixed in the upper pressing sheet fixing seat and is used for. According to the upper cover assembly, the chip testing mechanism and the chip testing all-in-one machine, the lens fixing seat and the upper pressing plate fixing seat are arranged, so that after a chip is replaced, the upper cover assembly, the chip testing mechanism and the chip testing all-in-one machine can be suitable for different chips by adjusting the position of the lens relative to the lens fixing seat or replacing the lens fixing seat, and adjusting the position of the upper pressing plate relative to the upper pressing plate fixing seat or replacing the upper pressing plate fixing seat.
Description
Technical Field
The invention belongs to the technical field of chip testing, and particularly relates to an upper cover assembly, a chip testing mechanism and a chip testing all-in-one machine.
Background
With the gradual development of the chip testing field to automation, the chip testing process adopts automation equipment to complete detection. The grabbing mechanism grabs the chip to the chip testing mechanism for detection, judges whether the chip is good or not after the detection is finished, and then transfers the detected chip to a corresponding position. The chip detection mechanism is generally provided with a plurality of detection positions, and can detect a plurality of chips at a time. When the chip is detected, the chip is placed on the test seat, and the test upper cover presses the chip on the test seat to test the chip. However, the specific structure of the chip detection mechanism is related to the model of the chip itself, so that different test upper covers and test seats are required to be adopted when different chips are detected, and thus, when different chips are detected in a factory, not only the test seats but also the test upper covers need to be redesigned, which increases the test cost.
Disclosure of Invention
The embodiment of the invention aims to provide an upper cover assembly, a chip testing mechanism and a chip testing all-in-one machine, and aims to solve the technical problem that in the prior art, when different chips are detected, different testing upper covers need to be replaced, so that the testing cost is high.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a chip testing mechanism, includes upper cover support, camera lens fixing base, locates camera lens in the camera lens fixing base, go up preforming fixing base, go up the preforming, locate first heating structure and upper cover circuit board in the upper cover support, the lens chamber has been seted up to one side of upper cover support, the preforming chamber has been seted up to the opposite side of upper cover support, the camera lens fixing base is fixed in the camera lens intracavity, it is fixed in to go up the preforming fixing base the preforming intracavity, it is fixed in to go up the preforming fixing base and be used for compressing tightly the chip.
In one embodiment, the upper cover bracket comprises a lens fixing frame, a heat insulation plate and a heating fixing frame which are sequentially stacked, the lens cavity is arranged in the lens fixing frame, the pressing cavity is arranged in the heating fixing frame, and the first heating structure is arranged in the heating fixing frame.
In one embodiment, the first heating structure comprises a heating rod and a first temperature control switch for controlling the temperature of the heating rod, and the heating fixing frame is provided with a heating hole for inserting the heating rod.
In one embodiment, the axial direction of the heating hole is perpendicular to the axial direction of the lens.
In one embodiment, the upper cover bracket is provided with an air flow channel, one end of the air flow channel extends to the upper pressing sheet, and the other end of the air flow channel is connected with an air passage joint.
The invention also provides a chip testing mechanism which comprises the upper cover assembly, a lower cover assembly and a connector, wherein the connector is used for electrically connecting the upper cover assembly and the lower cover assembly.
In one embodiment, the lower cover assembly includes a lower cover support, a second heating structure disposed in the lower cover support, a probe structure disposed in the lower cover support and electrically connected to a chip, a floating plate for placing the chip, an elastic member for buffering the floating plate, and a lower cover circuit board electrically connected to the probe structure, and the connector is used for electrically connecting the upper cover circuit board and the lower cover circuit board.
In one embodiment, the probe structure includes a probe base, a probe body inserted in the probe base, and a needle base cover fixed on the probe base, wherein the needle base cover is fixedly connected with the probe base and the lower cover circuit board, and the needle base cover is arranged between the probe base and the lower cover circuit board.
In one embodiment, the second heating assembly includes a heating ring and a second temperature control switch for controlling the temperature of the heating ring, the probe holder includes a holder body and a boss protruding from the holder body toward the floating piece, the heating ring is sleeved on the periphery of the boss, the floating piece is disposed on the heating ring, and two ends of the elastic member respectively abut against the heating ring and the holder body.
In one embodiment, the lower cover support is provided with a temperature control cavity with a placing opening, the second temperature control switch is arranged in the temperature control cavity, and the placing opening is provided with a temperature control cover for shielding the second temperature control switch.
In one embodiment, the periphery of the floating sheet extends to form a positioning ring, and the positioning ring is clamped between the lower cover support and the heating ring.
In one embodiment, the connector includes a first connecting seat fixed on the upper cover circuit board, a second connecting seat fixed on the lower cover circuit board, and a connector probe, one end of the connector probe is used for passing through the first connecting seat and electrically connecting with the upper cover circuit board, and the other end of the connector probe is used for passing through the second connecting seat and electrically connecting with the lower cover circuit board.
In one embodiment, the connector probe is fixedly and electrically connected to the upper cover circuit board or the lower cover circuit board.
The invention also provides a chip testing integrated machine which comprises the chip testing mechanism.
The upper cover assembly, the chip testing mechanism and the chip testing all-in-one machine have the advantages that: compared with the prior art, the upper cover assembly comprises an upper cover bracket, a lens fixing seat, a lens, an upper pressing sheet fixing seat, an upper pressing sheet, a first heating structure and an upper cover circuit board, and by arranging the lens fixing seat and the upper pressing sheet fixing seat, after a chip is replaced, the upper cover assembly can be suitable for different chips by adjusting the position of the lens relative to the lens fixing seat or replacing the lens fixing seat, and adjusting the position of the upper pressing sheet relative to the upper pressing sheet fixing seat or replacing the upper pressing sheet fixing seat, so that the cost can be saved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a perspective view of a cover assembly according to an embodiment of the present invention;
FIG. 2 is an exploded view of the lid assembly according to an embodiment of the present invention;
FIG. 3 is a perspective view of a chip testing mechanism according to an embodiment of the present invention;
FIG. 4 is a perspective view of a bottom cover assembly according to an embodiment of the present invention;
FIG. 5 is an exploded view of the lower lid assembly according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a lower lid assembly according to an embodiment of the present invention;
fig. 7 is an exploded view of a connector according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1-an upper cover assembly; 11-upper cover support; 111-lens holder frame; 1111-lens cavity; 1112-gas path connection; 112-a heat insulation plate; 113-heating fixed frame; 1131-a tabletting cavity; 1132 — heating holes; 12-lens fixing seat; 121-a first annular flange; 13-a lens; 14-upper pressing sheet fixing seat; 141-a second annular flange; 15-tabletting; 151-pressing the projection; 16-a first heating structure; 161-heating rod; 162-a first temperature control switch; 17-a cover circuit board; 2-a lower cover assembly; 21-lower cover support; 22-probe structure; 221-a probe seat; 2211-a seat body; 2212-boss; 222-a probe body; 223-hub cap; 23-a second heating structure; 231-a heating ring; 232-a second temperature control switch; 233-temperature control cover; 24-a floating sheet; 241-a positioning ring; 242-chip slot; 243-chamfering; 25-an elastic member; 26-lower cover circuit board; 3-a connector; 31-a first connection seat; 32-a second connection seat; 33-connector probe.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The upper cover assembly 1 of the chip testing mechanism according to the embodiment of the present invention will now be described. When testing the chip, the chip is placed in lower cover subassembly 2, and upper cover subassembly 1 is controlled by elevating system, and upper cover subassembly 1 descends to and switches on the back with the chip contact, can test the chip.
In one embodiment of the present invention, referring to fig. 1 and 3, the upper cover assembly 1 includes an upper cover bracket 11, a lens fixing base 12, a lens 13, an upper pressing base 14, an upper pressing plate 15, a first heating structure 16 and an upper cover circuit board 17, wherein one side of the upper cover bracket 11 is provided with a lens cavity 1111, and the other side of the upper cover bracket 11 is provided with a pressing plate cavity 113, wherein the side of the upper cover bracket 11 provided with the pressing plate cavity 113 is used for facing the chip, and the chip is pressed by the upper pressing plate 15. The lens holder 12 is disposed in the lens cavity 1111, and the lens holder 12 can be fixed to the inner wall of the lens cavity 1111 by a fastening member or the like, and the specific fixing manner is not limited herein. The lens 13 is disposed in the lens holder 12, and the lens 13 can be fixed to the lens holder 12 by a connection method such as a threaded connection. The lens 13 is used for condensing light to the chip during chip testing, so that the imaging quality of the chip is improved, and the chip can be subjected to appearance inspection simultaneously. When the size of the chip to be tested is changed or the testing position of a single chip is changed, the position of the lens 13 relative to the lens fixing seat 12 can be changed, if the lens 13 is eccentrically arranged relative to the lens fixing seat 12 to adapt to different chips, the lens fixing seat 12 can also be directly replaced, the overall size of the lens fixing seat 12 is not changed, and the position of the lens fixing seat 12 for mounting the lens 13 is changed to adapt to different chips. The upper pressing sheet fixing seat 14 is disposed in the pressing sheet cavity 113, and the upper pressing sheet fixing seat 14 can be fixed on the inner wall of the pressing sheet cavity 113 by means of fasteners and the like, and the specific fixing manner is not limited herein. Go up preforming 15 and be fixed in on last preforming fixing base 14, accessible screw thread spare etc. are fixed, go up preforming 15 and be used for compressing tightly the chip, prevent that the chip from contact failure when examining, still have the effect that is in the light of being shaded. The first heating structure 16 is arranged in the upper cover bracket 11 and used for heating the chip, and simulating a high-temperature environment during testing the chip, so that the error of a test result is smaller.
The upper cover assembly 1 in the above embodiment, by providing the lens fixing base 12 and the upper pressing plate fixing base 14, after the chip is replaced, the upper cover assembly 1 can be adapted to different chips by adjusting the position of the lens 13 relative to the lens fixing base 12 or replacing the lens fixing base 12, and by adjusting the position of the upper pressing plate 15 relative to the upper pressing plate fixing base 14 or replacing the upper pressing plate fixing base 14, without completely replacing the upper cover assembly 1.
Optionally, the upper cover assembly 1 may simultaneously press and test a plurality of chips, and accordingly, the number of the lens cavity 1111, the lens fixing base 12 and the lens 13 is also plural, and the number of the pressing plate cavity 113, the upper pressing plate fixing base 14 and the upper pressing plate 15 is also plural, and is the same as the number of chips simultaneously tested.
In one embodiment of the present invention, referring to fig. 2, the upper cover bracket 11 includes a lens fixing frame 111, a heat insulating plate 112 and a heating fixing frame 113, wherein the lens fixing frame 111, the heat insulating plate 112 and the heating fixing frame 113 are sequentially stacked and fixed to each other by screws. The upper cover circuit board 17 may be fixed to the heat fixing frame 113. The lens cavity 1111 is disposed in the lens fixing frame 111, the lens fixing base 12 is correspondingly disposed in the lens fixing frame 111, one end of the lens fixing base 12, which is away from the thermal insulation plate 112, is provided with a first annular flange 121, the lens fixing frame 111 is correspondingly provided with a first annular groove, a screw member can conveniently penetrate through the first annular flange 121 to be connected to the inner wall of the first annular groove, and the first annular flange 121 further has an effect of positioning the lens fixing base 12. The heating fixing frame 113 is provided with a pressing sheet cavity 113, the upper pressing sheet fixing seat 14 is correspondingly fixed in the heating fixing frame 113, one end of the upper pressing sheet fixing seat 14, which is far away from the heat insulation plate 112, is provided with a second annular flange 141, the heating fixing frame 113 is correspondingly provided with a second annular groove, a threaded part can conveniently penetrate through the second annular flange 141 to be connected onto the inner wall of the second annular groove, and the second annular flange 141 also has the function of positioning the upper pressing sheet fixing seat 14. The first heating structure 16 is arranged in the heating fixing frame 113 and is closer to the upper pressing sheet 15, so that the chip can be heated conveniently. The heat insulating plate 112 is interposed between the lens fixing frame 111 and the heat fixing frame 113, and can reduce the amount of heat transferred to the lens fixing frame 111. Compared with the integrally formed upper cover bracket, the arrangement of the heat insulation plate 112 can reduce heat loss and accelerate the heating speed of the chip.
Optionally, the first heating structure 16 includes a heating rod 161 and a first temperature controlled switch 162. The number of the heating rods 161 is not limited herein, the heating rods 161 can be electrically heated, the first temperature control switch 162 is used for controlling the temperature of the heating rods 161, and when the temperature of the heating rods 161 is too high, the heating rods 161 can be stopped from being continuously heated, so as to prevent the chips from being damaged. Heating hole 1132 has been seted up to fixed frame 113 of heating, and in the one end of heating rod 161 stretched into heating hole 1132 to heat fixed frame 113 of heating, the other end of heating rod 161 can be connected to the power, realizes the circular telegram to heating rod 161. The axial direction of the heating hole 1132 may be perpendicular to the moving direction of the upper cover assembly 1, and may avoid affecting the structural distribution of the upper cover assembly 1 in the moving direction thereof.
In one embodiment of the present invention, referring to fig. 2, an air flow channel is formed on the upper lid support 11 to allow air to flow through the upper lid support 11, one end of the air flow channel extends to the upper pressing plate 15, the other end of the air flow channel is connected to an air path connector 1112, and the air path connector 1112 can be connected to an air pump for delivering air into the air flow channel or sucking air from the air flow channel. Thus, after the chip detection is completed, the chip can be blown through the airflow channel, and the chip is prevented from being adhered to the upper pressing sheet 15 when the upper cover assembly 1 moves upwards. More specifically, the air flow passage may be provided in the fixing frame 111 of the lens 13 or the heat fixing frame 113 at a position not limited thereto as long as it can extend to the upper pressing plate 15.
In one embodiment of the present invention, please refer to fig. 3, which also provides a chip testing mechanism, wherein the chip testing mechanism includes the upper cover assembly 1 in any one of the embodiments, the lower cover assembly 2 and the connector 3. The connector 3 is used to electrically connect the upper cover assembly 1 and the lower cover assembly 2. The lower cover assembly 2 is used for placing a chip, the upper cover assembly 1 is driven by the lifting mechanism to move downwards to the time of pressing the chip, and the connector 3 is electrically connected with the upper cover assembly 1 and the lower cover assembly 2 and is conducted with the chip to test the chip.
Optionally, referring to fig. 4 and 5, the lower cover assembly 2 includes a lower cover support 21, a second heating structure 23, a probe structure 22, a floating piece 24, an elastic piece 25, and a lower cover circuit board 26, the second heating structure 23 is disposed in the lower cover support 21 and is used for heating the chip, and the first heating structure 16 and the second heating structure 23 cooperate to simulate a temperature of the chip during testing. The chip is placed on the floating piece 24, and the elastic member 25 is used for buffering the floating piece 24 to prevent the chip from being damaged by being pressed without buffering. The probe structure 22 is electrically connected to the lower cover circuit board 26, and the connector 3 is used for electrically connecting the lower cover circuit board 26 and the upper cover circuit board 17. When the upper cover assembly 1 is pressed on the chip, the upper cover circuit board 17 and the lower cover circuit board 26 are electrically connected through the connector 3, the lower cover circuit board 26 is electrically connected with the probe structure 22, and the probe structure 22 is electrically connected with the chip, so that a chip test loop is formed to test the chip.
In one embodiment of the present invention, referring to fig. 5 and 6, the probe structure 22 includes a probe base 221, a probe body 222 and a hub cover 223, the probe body 222 is inserted into the probe base 221, the hub cover 223 is fixed on a side of the probe base 221 away from the floating piece 24, and one end of the probe body 222 is inserted into the hub cover 223 for guiding and positioning the probe body 222. The socket cover 223 is fixed on the lower cover circuit board 26, and the socket cover 223 is sandwiched between the probe socket 221 and the lower cover circuit board 26, so that the probe body 222 can penetrate through the socket cover 223 to be electrically connected with the lower cover circuit board 26. Wherein, the probe seat 221 and the needle seat cover 223 are both arranged in the lower cover bracket 21, so that the lower cover bracket 21 can protect the probe seat 221 and the needle seat cover 223.
Optionally, the second heating structure 23 includes a heating ring 231 and a second temperature control switch 232, the heating ring 231 is used for heating the chip, the second temperature control switch 232 is used for controlling the temperature of the heating ring 231, and when the temperature of the heating ring 231 is too high, the heating ring 231 can be stopped from being continuously heated, so as to prevent the chip from being damaged. The number of heating rings 231 may be selected to be the same as or different from the number of floating pieces 24. In one embodiment, the probe base 221 includes a base body 2211 and a boss 2212, the boss 2212 is formed by one side of the base body 2211 protruding toward the floating piece 24, the probe body 222 can be disposed through the boss 2212, and a connection hole can be formed on the edge of the base body 2211 for a screw to pass through and connect to the needle base cover 223, so as to fix the probe base 221 and the needle base cover 223. The heating ring 231 can be sleeved on the circumference of the boss 2212, so that the heating ring 231 is clamped between the floating piece 24 and the seat body 2211, and the heating ring 231 abuts against the floating piece 24, thereby rapidly heating the chip. Wherein, the elastic member 25 can be selected as a spring, two ends of the elastic member 25 respectively abut against the heating ring 231 and the seat body 2211, the elastic member 25 is arranged to enable the heating ring 231 and the floating piece 24 to be tightly attached to conduct heat rapidly, and the floating piece 24 can retract downwards under the action of the elastic member 25 when being pressed by the upper cover assembly 1, so as to prevent the chip from being damaged by pressing.
Alternatively, the floating piece 24 may be extended to form a positioning ring 241 around the circumference thereof, and a screw member may be inserted through the positioning ring 241 and connected to the heating ring 231 to fix the floating piece 24 to the heating ring 231. In addition, the positioning ring 241 is sandwiched between the inner wall of the lower cover support 21 and the heating ring 231, so that when the floating piece 24 floats upwards under the action of the elastic member 25, the lower cover support 21 can limit the floating piece 24 to prevent the floating piece 24 from exceeding a preset position.
Optionally, a chip groove 242 is formed in the floating piece 24, a downward pressing protrusion 151 which can extend into the chip groove 242 is arranged in a corresponding protrusion of the upper pressing piece 15, and a chamfer 243 is arranged on a side wall of the chip groove 242, so that a chip can be more easily placed into the chip groove 242, the flatness of the chip when placed is also ensured, and the shutdown rate and the chip damage rate are reduced.
In one embodiment of the present invention, referring to fig. 5, the lower cover bracket 21 is provided with a temperature control cavity, and the temperature control cavity has a placing opening, which can be disposed on one side of the lower cover bracket 21 facing the lower cover circuit board 26, so as to hide the temperature control cavity. The second temperature control switch 232 is arranged in the temperature control cavity, the temperature control cover 233 is arranged at the position of the placing opening, and the second temperature control switch 232 can be shielded by the temperature control cover 233. In addition, the temperature control cavity can be disposed at two ends of the lower cover bracket 21, so as to fully utilize the space not used by the probe structure 22, and hide the second temperature control switch 232 inside the lower cover bracket 21, without additionally increasing the volume of the lower cover assembly 2.
In one embodiment of the present invention, referring to fig. 7, the connector 3 includes a first connector seat 31, a second connector seat 32 and a connector probe 33. The first connector holder 31 is fixed to the upper cover circuit board 17, the second connector holder 32 is fixed to the lower cover circuit board 26, and the connector probe 33 may be fixed to the upper cover circuit board 17 or the lower cover circuit board 26. When the connector probe 33 is fixed on the upper cover circuit board 17, one end of the connector probe 33 passes through the first connecting seat 31 and is fixed on the upper cover circuit board 17, and when the upper cover assembly 1 gradually approaches the lower cover assembly 2, the other end of the connector probe 33 passes through the second connecting seat 32 and is electrically connected to the lower cover circuit board 26, so as to form a testing loop. When the connector probe 33 is fixed on the lower cover circuit board 26, one end of the connector probe 33 passes through the second connecting seat 32 and is fixed on the lower cover circuit board 26, and when the upper cover assembly 1 gradually approaches the lower cover assembly 2, the other end of the connector probe 33 passes through the first connecting seat 31 and is electrically connected to the upper cover circuit board 17, so as to form a testing loop.
The invention also provides a chip testing all-in-one machine which comprises the chip testing mechanism in any embodiment. The chip testing all-in-one machine also comprises a lifting mechanism and the like for lifting the upper cover assembly 1. The specific structure of the integrated chip testing machine is not limited herein.
The chip testing integrated machine provided by the invention adopts the chip testing mechanism in any embodiment, and the lens fixing seat 12 and the upper pressing plate fixing seat 14 are arranged, so that after a chip is replaced, the chip testing integrated machine can be suitable for different chips by adjusting the position of the lens 13 relative to the lens fixing seat 12 or replacing the lens fixing seat 12, and adjusting the position of the upper pressing plate 15 relative to the upper pressing plate fixing seat 14 or replacing the upper pressing plate fixing seat 14, and the upper cover assembly 1 does not need to be completely replaced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (14)
1. An upper cover assembly, comprising: the lens pressing device comprises an upper cover support, a lens fixing seat, a lens, an upper pressing sheet fixing seat, an upper pressing sheet, a first heating structure and an upper cover circuit board, wherein the lens is arranged in the lens fixing seat, the upper pressing sheet fixing seat is arranged on the upper pressing sheet, the upper pressing sheet fixing seat is arranged on one side of the upper cover support, the pressing sheet cavity is arranged on the other side of the upper cover support, the lens fixing seat is fixed in the lens cavity, the upper pressing sheet fixing seat is fixed in the pressing sheet cavity, and the upper pressing sheet is fixed on the upper pressing sheet fixing seat and is used.
2. The lid assembly of claim 1, wherein: the upper cover support comprises a lens fixing frame, a heat insulation plate and a heating fixing frame which are sequentially stacked, a lens cavity is arranged in the lens fixing frame, a pressing cavity is arranged in the heating fixing frame, and the first heating structure is arranged in the heating fixing frame.
3. The lid assembly of claim 2, wherein: first heating structure includes the heating rod and is used for control the first temperature detect switch of heating rod temperature, the confession has been seted up to the fixed frame of heating the heating rod male heated hole.
4. The lid assembly of claim 3, wherein: the axial direction of the heating hole is perpendicular to the axial direction of the lens.
5. The lid assembly of claim 1, wherein: an air channel is formed in the upper cover support, one end of the air channel extends to the upper pressing sheet, and the other end of the air channel is connected with an air path connector.
6. A chip testing mechanism is characterized in that: comprising the lid assembly of any one of claims 1-5, further comprising a lid assembly and a connector for electrically connecting the lid assembly and the lid assembly.
7. The chip test mechanism of claim 6, wherein: the lower cover assembly comprises a lower cover support, a second heating structure arranged in the lower cover support, a probe structure arranged in the lower cover support and used for being electrically connected with a chip, a floating piece used for placing the chip, an elastic piece used for buffering the floating piece and a lower cover circuit board electrically connected with the probe structure, and the connector is used for electrically connecting the upper cover circuit board and the lower cover circuit board.
8. The chip test mechanism of claim 7, wherein: the probe structure comprises a probe seat, a probe body inserted in the probe seat and a needle seat cover fixed on the probe seat, wherein the needle seat cover is fixedly connected with the probe seat and the lower cover circuit board, and the needle seat cover is arranged between the probe seat and the lower cover circuit board.
9. The chip test mechanism of claim 8, wherein: the second heating assembly comprises a heating ring and a second temperature control switch used for controlling the temperature of the heating ring, the probe seat comprises a seat body and a boss, the boss is arranged on the seat body and faces the floating piece in a protruding mode, the heating ring is sleeved on the periphery of the boss, the floating piece is arranged on the heating ring, and two ends of the elastic piece are respectively abutted to the heating ring and the seat body.
10. The chip test mechanism of claim 9, wherein: the lower cover support is provided with a temperature control cavity with a placing opening, the second temperature control switch is arranged in the temperature control cavity, and the placing opening is provided with a temperature control cover used for shielding the second temperature control switch.
11. The chip test mechanism of claim 9, wherein: the periphery of the floating piece extends to form a positioning ring, and the positioning ring is clamped between the lower cover support and the heating ring.
12. The chip test mechanism of claim 7, wherein: the connector comprises a first connecting seat fixed on the upper cover circuit board, a second connecting seat fixed on the lower cover circuit board and a connector probe, wherein one end of the connector probe is used for penetrating the first connecting seat and electrically connected with the upper cover circuit board, and the other end of the connector probe is used for penetrating the second connecting seat and electrically connected with the lower cover circuit board.
13. The chip test mechanism of claim 12, wherein: the connector probe is fixed and electrically connected to the upper cover circuit board or the lower cover circuit board.
14. A chip test all-in-one machine which is characterized in that: comprising a chip testing mechanism according to any of claims 6-13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011063128.4A CN111982816A (en) | 2020-09-30 | 2020-09-30 | Upper cover assembly, chip testing mechanism and chip testing all-in-one machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011063128.4A CN111982816A (en) | 2020-09-30 | 2020-09-30 | Upper cover assembly, chip testing mechanism and chip testing all-in-one machine |
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| CN202011063128.4A Pending CN111982816A (en) | 2020-09-30 | 2020-09-30 | Upper cover assembly, chip testing mechanism and chip testing all-in-one machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115900982A (en) * | 2023-01-06 | 2023-04-04 | 鲁欧智造(山东)高端装备科技有限公司 | Semiconductor detection temperature measuring instrument |
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2020
- 2020-09-30 CN CN202011063128.4A patent/CN111982816A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115900982A (en) * | 2023-01-06 | 2023-04-04 | 鲁欧智造(山东)高端装备科技有限公司 | Semiconductor detection temperature measuring instrument |
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