CN111979540A

CN111979540A - Method, equipment and system for processing inner hole coating of part

Info

Publication number: CN111979540A
Application number: CN202010818816.0A
Authority: CN
Inventors: 周崇; 李冬杰; 齐欢
Original assignee: Tianjin Huirui Laser Technology Co ltd
Current assignee: Tianjin Huirui Laser Technology Co ltd
Priority date: 2020-08-14
Filing date: 2020-08-14
Publication date: 2020-11-24

Abstract

The invention discloses a method, equipment and a system for processing a coating of an inner hole of a part, which relate to the technical field of laser additive manufacturing and are used for processing the coating of the inner hole of the part and prolonging the service life of the part. The processing method of the inner hole coating of the part comprises the following steps: a preform having a pore structure is provided. And controlling the laser cladding equipment to form a coating in the hole structure of the prefabricated part according to a coating cladding strategy to obtain a part blank, wherein the coating cladding strategy is determined by the structural parameters of the hole structure. And controlling the heat treatment equipment to carry out heat treatment on the part blank. The terminal device includes: a processor and a communication interface, so as to realize the processing method of the inner hole coating of the part. The processing method of the inner hole coating of the part is used for preparing the inner hole wear-resistant coating.

Description

Method, equipment and system for processing inner hole coating of part

Technical Field

The invention relates to the technical field of laser additive manufacturing, in particular to a method, equipment and a system for processing a coating of an inner hole of a part.

Background

In the engineering field of mining machinery and the like, due to the fact that the service environment is severe, and the inner hole of the metal part is repeatedly rubbed with the drawing head, the phenomena of part abrasion, part corrosion and the like are easily caused, and the service life of the part is shortened. In the prior art, the inner hole of the part is subjected to surface modification treatment by a coating adding mode, but the processing space of the inner hole is not open, so that the processing and repairing difficulty of the inner hole of the part is higher.

At present, the methods for preparing the inner hole coating of the part mainly comprise a thermal spraying method and a surfacing method, but because the inner hole has the problems of small operation space and high operation difficulty, the stability of the coating process is poor, and the defects of cracks, holes and the like are easy to appear. And the prepared coating and the surface layer of the part have low bonding force and the part is easy to deform due to overlarge thermal stress, so that the product yield of the prepared part with the coating is low.

Disclosure of Invention

The invention aims to provide a method, equipment and a system for processing a coating of an inner hole of a part, which are used for processing the coating of the inner hole of the part and prolonging the service life of the part.

In a first aspect, the invention provides a method for processing an inner bore coating of a part. The processing method of the inner hole coating of the part comprises the following steps: a preform having a pore structure is provided. And controlling the laser cladding equipment to form a coating in the hole structure of the prefabricated part according to a coating cladding strategy to obtain a part blank, wherein the coating cladding strategy is determined by the structural parameters of the hole structure. And controlling the heat treatment equipment to carry out heat treatment on the part blank.

According to the processing method of the inner hole coating of the part, provided by the invention, the laser cladding equipment is controlled to form the coating in the hole structure of the prefabricated part according to the coating cladding strategy, so that the formed coating and the surface of the inner hole of the part are in a metallurgical bonding state, the bonding strength of the coating and the surface of the inner hole of the part is increased, the stability of the coating process is better, and the phenomenon that the coating of the part falls off in a severe service environment is prevented. Meanwhile, when the coating is prepared by using laser, the diameter of a laser beam is smaller, and the requirement on an operation space is smaller, so that the coating is prepared easily by using laser cladding equipment in an inner hole of a part without openness. On the basis, the heat treatment equipment is controlled to carry out heat treatment on the part blank, so that the temperature gradient before and after the part coating is formed is small, the thermal stress is small, and the risk of part deformation and even cracking can be reduced.

In a second aspect, the present invention further provides a terminal device, including: a processor and a communication interface. The communication interface is coupled with a processor, and the processor is used for operating computer programs or instructions to realize the machining method of the inner hole coating of the part.

Compared with the prior art, the terminal equipment provided by the invention has the same beneficial effects as the processing method of the inner hole coating of the part in the technical scheme, and the description is omitted here.

In a third aspect, the present invention further provides a system for machining a bore coating in a part, including: the laser cladding device comprises a terminal device, a laser cladding device communicated with the terminal device, a heat treatment device communicated with the terminal device, and a machining device communicated with the terminal device.

Compared with the prior art, the beneficial effects of the part inner hole coating processing system provided by the invention are the same as those of the part inner hole coating processing method in the technical scheme, and the details are not repeated here.

In a fourth aspect, the present invention also provides a computer storage medium. The computer storage medium has stored therein instructions that, when executed, cause the above-described method of machining a bore coating in a part to be performed.

Compared with the prior art, the beneficial effects of the computer storage medium provided by the invention are the same as those of the processing method of the inner hole coating of the part in the technical scheme, and the description is omitted here.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic structural diagram of a system for processing a coating of an inner hole of a part according to an embodiment of the present invention;

FIG. 2 is a first schematic structural view of a three-dimensional model of a preform having a pore structure according to an embodiment of the present invention;

FIG. 3 is a second schematic structural view of a three-dimensional model of a preform having a pore structure according to an embodiment of the present invention;

FIG. 4 is a third schematic structural view of a three-dimensional model of a preform having a pore structure according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a cladding region model in an embodiment of the invention;

FIG. 6 is a fourth schematic structural view of a three-dimensional model of a preform having a hole structure according to an embodiment of the present invention;

FIG. 7 is a first schematic diagram of a method for machining an inner hole coating of a part according to an embodiment of the present invention;

FIG. 8 is a second schematic diagram of a method for forming a coating on an inner hole of a part according to an embodiment of the present invention;

FIG. 9 is a block diagram of an apparatus for processing a coating on an inner hole of a part according to an embodiment of the present invention;

fig. 10 is a schematic diagram of a hardware structure of a terminal device in the embodiment of the present invention;

fig. 11 is a schematic structural diagram of a chip according to an embodiment of the present invention.

Detailed Description

In order to facilitate clear description of technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish the same items or similar items having substantially the same functions and actions. For example, the first threshold and the second threshold are only used for distinguishing different thresholds, and the sequence order of the thresholds is not limited. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

It is to be understood that the terms "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

In the present invention, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a and b combination, a and c combination, b and c combination, or a, b and c combination, wherein a, b and c can be single or multiple.

In the engineering fields of mining machinery, nuclear power industry and the like, the inner hole of a metal part is repeatedly rubbed and jacked and pulled with a traction head, and the service environment is severe, so that the inner hole of the part is easy to lose effectiveness such as abrasion and corrosion. In order to prolong the service life of parts as much as possible, the surface modification treatment is generally carried out on an inner hole by adopting a mode of increasing a coating in the prior art. However, the inner hole is an internal structure different from an external surface and a plane, and the processing space has no openness, which puts higher requirements on preparing or repairing the wear-resistant coating of the inner hole.

At present, the methods for preparing the wear-resistant coating of the inner hole mainly comprise a thermal spraying method (flame and plasma) and a surfacing method (electric arc and flame), and at present, the methods are mainly applied to the preparation and repair of the wear-resistant coating of the inner hole of the part. However, the operation space is small, the operation difficulty is high, so that the process stability is poor, and the defects of cracks, holes and the like are easy to occur. The coating prepared by the process has low bonding force with the surface of the inner hole and is easy to fall off. Meanwhile, when the coating is prepared by using the method, parts are easy to deform due to overlarge thermal stress, and the product yield is low. Therefore, a better method for preparing the inner bore wear-resistant coating is required to be searched.

The embodiment of the invention provides a method for processing a coating of an inner hole of a part, which can be used for processing the coating at the inner hole of the part. The inner hole of the part can be a through hole or a groove, but is not limited to the above. The processing method of the inner hole coating of the part can be applied to a processing system of the inner hole coating of the part.

FIG. 1 is a schematic structural diagram of a machining system for inner hole coatings of parts according to an embodiment of the invention. As shown in FIG. 1, the processing system for the inner bore coating of the part comprises: a terminal device 100, a laser cladding device 200 in communication with the terminal device 100, a heat treatment device 300 in communication with the terminal device 100, and a machining device 400 in communication with the terminal device 100. The heat treatment apparatus 300 may be a heating furnace, an annealing furnace, or the like, but is not limited thereto. The machining apparatus 400 may be a machine tool or the like, but is not limited thereto. The terminal device 100 can generate both a preform manufacturing strategy and a coating cladding strategy and implement a part bore coating method. At this time, the terminal apparatus 100 may control the laser cladding apparatus 200 and the machining apparatus 400 such that a coating layer is formed on the surface of the preform having the hole structure. And then the deformation and cracking proportion of the parts is reduced and the quality of the parts is improved by controlling the heat treatment equipment 300. The terminal device 100 may be an industrial personal computer or a mobile phone, a tablet computer and other terminal devices 100 capable of realizing the functions of the industrial personal computer and capable of controlling the coating cladding strategy.

The communication connection mode in the embodiment of the invention can be wireless communication or wired communication. The wireless communication may be based on networking technologies such as wifi, zigbee, and the like. Wired communication may implement a communication connection based on a data line or a power line carrier. For example, the terminal device may use an I2C (Inter-Integrated Circuit) bus communication, and may also use a power line carrier communication technology to implement a communication connection with a laser cladding device, a heat treatment device, or a machining device.

Specifically, as shown in fig. 1, the terminal device 100 controls the machining device 400 to machine the part according to the coating cladding strategy, and after receiving the control information of the terminal device 100, the machining device 400 machines the part according to the coating cladding strategy. After obtaining the preform having the hole structure, the machining device 400 transmits information of the completion of the machining to the terminal device 100. The heat treatment apparatus 300 is controlled by the terminal apparatus 100 to heat-treat the preform having the hole structure, and in the case where the heating temperature and the heating time are satisfied, the heat treatment apparatus 300 transmits a signal of completion of heating to the terminal apparatus 100. The terminal device 100 controls the laser cladding device 200 to form a coating on the prefabricated member with the hole structure according to the coating cladding strategy, and after a part blank is obtained, the laser cladding device 200 transmits a signal of obtaining the part blank to the terminal device 100. The heat treatment apparatus 300 is controlled by the terminal apparatus 100 to heat-treat the part blank, and after the heat treatment is completed, the heat treatment apparatus 300 transmits information of the completion of the heat treatment to the terminal apparatus 100. The terminal device 100 controls the machining device 400 to grind the heat-treated part blank.

As shown in fig. 1 to 5, the coating cladding strategy is determined by the structural parameters of the pore structure. For example, a part made of SUS306 stainless steel is selected as a preform having a hole structure, and a three-dimensional model of the preform 1 having a hole structure is constructed using three-dimensional modeling software such as CATIA, CAD, Soidworks, UG, or a three-dimensional scanner, which is defined as M1. Based on the three-dimensional model M1 of the part constructed, the thickness of the coating region is deleted at the inner hole of the part by using one of the three-dimensional modeling software, and a three-dimensional model of the prefabricated member 2 with the hole structure of the coating region deleted is obtained, and the model is defined as M2. On the basis of the model M2, a cladding area is designed at the position of an inner hole of a part parent material by taking an axis which passes through the center of a hole structure of the prefabricated member and is vertical to a plane of the hole structure as a central line, wherein the cladding area can be a bilaterally symmetrical opposite-vertex conical structure, and the diameter of the minimum position of the bilaterally symmetrical opposite-vertex conical structure is not smaller than the hole diameter of the prefabricated member with the hole structure. The three-dimensional model of the preform 3 having a hole structure with a cladding region at this time is defined as M3. And removing the area of the model M3 at the corresponding position in the model M1 by adopting any one of the three-dimensional modeling software, and defining the obtained model as M4, namely obtaining the cladding area 4 model. And correcting and repairing the cladding region model file by using slicing software such as Magic, Cura or Slic3r and the like, and slicing and partitioning the cladding region model file into a plurality of separated pieces according to a certain thickness to generate CLI format slice data. The CLI-format slice data may express data corresponding to a plurality of slices. And importing the CLI format slice data into filling software, and adding the laser scanning path data of each partition of each layer slice in the CLI format slice data. In other words, the laser scan path of each partition of each slice of the layer is filled with filling software. And after the path planning is finished, CLI format slice data containing laser scanning path information or a numerical control program which can be read by laser cladding equipment can be output, and the formulation of a coating cladding strategy is finished.

Based on the part inner bore coating processing system, the embodiment of the invention also provides a part inner bore coating processing method, and the part inner bore coating processing method can be executed by terminal equipment or a chip applied to the terminal equipment. The following embodiments are described with the terminal device as the main execution subject.

Fig. 7 is a schematic diagram illustrating a method for processing an inner hole coating of a part according to an embodiment of the present invention, which is applied to the system for processing an inner hole coating of a part shown in fig. 1. As shown in fig. 7, the method for processing the inner hole coating of the part provided by the embodiment of the invention comprises the following steps:

s100: a preform having a pore structure is provided. The preform having the hole structure herein includes, but is not limited to, a preform having an inner through hole, a preform having a groove, and the like.

In practical application, the prefabricated member with the hole structure is placed on a laser cladding platform of laser cladding equipment and is fixed, so that subsequent laser cladding can be conveniently carried out.

S110: and the terminal equipment controls the laser cladding equipment to form a coating in the hole structure of the prefabricated part according to the coating cladding strategy to obtain a part blank. The coating cladding strategy is determined by the structural parameters of the pore structure. The laser cladding equipment at least comprises a laser, a powder feeder, a processing workbench and the like, wherein the laser comprises a laser cladding head.

The laser cladding process for forming the coating in the hole structure of the prefabricated member is synchronous laser cladding according to the supply mode of coating powder.

Illustratively, when the laser cladding process is synchronous laser cladding, the terminal device controls the laser cladding device to form the coating in the hole structure of the preform according to the coating cladding strategy, specifically, the terminal device controls a powder feeder in the laser cladding device to preheat coating powder according to the coating cladding strategy, and after preheating is completed, the powder feeder in the laser cladding device transmits preheating completion information to the terminal device. And the terminal equipment controls the laser cladding head to clad along with the surface of the prefabricated part according to the coating cladding strategy, and simultaneously controls a powder feeder in the laser cladding equipment to synchronously feed coating powder into the light spot through the nozzle in the cladding process, and the coating is formed along with the movement of the light spot on the surface of the workpiece. The laser spot diameter is 2mm to 7mm, and for example, the laser spot diameter may be 2mm, 5mm, 7mm, or the like. And after laser cladding is finished, the laser cladding head transmits the information of finishing the laser cladding to the terminal equipment, and the terminal equipment controls a powder feeder in the laser cladding equipment to finish powder feeding to obtain a part blank. The material of the coating powder may be Stellite 6 cobalt-based alloy, or high-hardness nickel-based alloy powder. The powder feeding amount of the laser cladding equipment is 200 g/h-1500 g/h, for example, the powder feeding amount of the laser cladding equipment can be 200g/h, 500g/h, 1500g/h and the like. The control of the powder feeding amount of the powder feeder improves the efficiency of laser cladding and avoids the waste of coating powder. The laser power of the laser cladding equipment is 1 KW-6 KW, for example, the laser power of the laser cladding equipment can be 1KW, 5KW, 6KW and the like. The laser scanning speed is 1m/min to 45m/min, for example, the laser scanning speed may be 1m/min, 25m/min, 45m/min, or the like. By limiting the laser cladding parameters, the stable shape and the yield of the inner hole coating of the part prepared by the laser cladding technology are higher.

S120: and the terminal equipment controls the heat treatment equipment to carry out heat treatment on the part blank.

In practical application, before the terminal equipment receives a signal of laser cladding ending sent by the laser cladding equipment, the terminal equipment controls the heat treatment equipment to be heated to 400-500 ℃. And after the terminal equipment receives a signal of laser cladding ending sent by the laser cladding equipment, the terminal equipment controls heat treatment equipment which is preheated to 400-500 ℃ to carry out heat treatment on the part blank. The time of the heat treatment is 60min to 150 min. At this time, the heat treatment process can prevent the risk of cracking of the part blank and the like caused by the excessively high temperature drop speed of the part blank. Meanwhile, the coating of the pore structure of the part blank and the structure and the coating performance of the surface of the pore structure of the part blank can be improved through heat treatment, so that the formed coating has more excellent wear resistance.

In one example, the heat treatment apparatus may be a heat treatment furnace. After the terminal equipment receives a signal of finishing laser cladding sent by the laser cladding equipment, immediately putting the obtained part blank into a heat treatment furnace preheated to 450 ℃, controlling the heat treatment furnace by the terminal equipment to carry out heat preservation treatment on the part blank for 120min, sending a heat treatment finishing signal to the terminal equipment by the heat treatment furnace, controlling the heat treatment furnace by the terminal equipment to stop heat treatment, and cooling the part blank to room temperature along with the furnace.

As a possible implementation manner, as shown in fig. 7, after the heat treatment equipment is controlled to perform the heat treatment on the part blank, the method for processing the inner hole coating of the part further includes:

s130: and the terminal equipment controls the machining equipment to polish the heat-treated part blank.

In practical application, after the terminal equipment receives a signal of finishing the heat treatment of the part blank sent by the heat treatment equipment, the terminal equipment controls the machining equipment to polish the heat-treated part blank, and a part finished product with an inner hole provided with a wear-resistant coating is obtained.

As a possible implementation manner, fig. 8 illustrates a schematic diagram of a machining method for an inner hole coating of a part in an embodiment of the invention. As shown in fig. 8, after providing the preform with the hole structure, before controlling the laser cladding device to form a coating in the hole structure of the preform according to the coating cladding strategy to obtain a part blank, the method for processing the inner hole coating of the part further includes:

s1001: and the terminal equipment controls the machining equipment to polish the hole structure of the prefabricated part with the hole structure, so that the aperture of the hole structure is larger than the original aperture. The phenomenon that the preparation effect of the part hollow framework coating is unstable due to the small operation space of the part hole structure is solved.

In practical application, the terminal equipment controls the machining equipment to polish the hole structure of the prefabricated part with the hole structure according to a coating cladding strategy. For example, the terminal equipment controls the machining equipment to machine the hole structure of the prefabricated member with the hole structure into a two-surface symmetrical opposite-vertex conical structure according to a coating cladding strategy. And after polishing is finished, the machining equipment transmits polishing finishing information to the terminal equipment.

S1002: and the terminal equipment controls the heat treatment equipment to carry out heat treatment on the polished prefabricated member with the hole structure.

In practical application, after the terminal device receives a polishing completion signal transmitted by the machining device, the terminal device controls the heat treatment device to perform heat treatment on the polished prefabricated member with the hole structure according to a coating cladding strategy, and after the heat treatment is finished, the heat treatment device sends heat treatment finishing information to the terminal device. The heat treatment can prevent the part from easily generating cracks and the like during high-temperature laser irradiation, and simultaneously, the stress can be removed through the heat treatment, so that the success rate of the inner hole coating of the part is improved. The temperature range for carrying out heat treatment on the polished prefabricated member with the pore structure is 350-450 ℃, and the time for heat treatment is 100-150 min. For example, the end device controls the processing device to heat up to 400 ℃ according to the coating cladding strategy, and carries out heat treatment on the polished prefabricated member with the hole structure for 125min, and then the heat treatment device sends heat treatment end information to the terminal device.

In practical application, before the polished prefabricated member with the pore structure is subjected to heat treatment, the polished prefabricated member with the pore structure is cleaned to remove surface oil stains so as to prevent potential safety hazards of combustion of the oil stains under laser irradiation, and meanwhile, S, C, O element-containing compounds generated by combustion of the oil stains are prevented from being melted into a laser molten pool to influence coating performance. The degreasing mode can be alcohol or acetone cleaning. After the terminal device controls the heat treatment device to perform heat treatment on the polished prefabricated member with the hole structure, the terminal device can also control the machining device to polish the hole structure of the prefabricated member so as to remove oxides, such as iron oxide, titanium oxide and the like, on the surface of the hole structure of the prefabricated member.

The laser deposition manufacturing segmented forming method in the embodiment of the invention is further described below with reference to the embodiment and the accompanying drawings.

Example 1

In this example, an additive manufacturing part (material: SUS306 stainless steel) was selected as a preform having a hole structure. The material of the coating powder is Stellite 6 cobalt-based alloy. As shown in fig. 6, the specific implementation process of the present invention is as follows:

step S1: a preform having a pore structure is provided.

Step S2: and grinding an opposite-vertex conical structure with two symmetrical surfaces at the position of an inner hole of the base material of the part by using a handheld angle grinder by taking an axis which passes through the center of the hole structure of the prefabricated member and is vertical to the plane of the hole structure as a central line, wherein the diameter of the minimum position of the opposite-vertex conical structure with two symmetrical surfaces is not less than the aperture of the prefabricated member with the hole structure.

Step S3: and removing oil stains on the surface of the prefabricated member with the pore structure after polishing by using alcohol, and polishing and cleaning the oxide skin with the pore structure of the prefabricated member with the pore structure by using machining equipment. And then preheating the polished prefabricated member with the hole structure by using a heating furnace, wherein the preheating temperature is 350 ℃, and the preheating time is 100 min. And (4) placing the preheated prefabricated member on a laser cladding platform, and fixing the prefabricated member according to the starting point position specified by a coating cladding strategy. And meanwhile, the dried coating powder with uniform particle size is loaded into a powder feeder of laser cladding equipment, and the powder feeder in the laser cladding equipment is controlled by terminal equipment to carry out preheating treatment on the coating powder.

Step S4: and cladding coating powder on the fixed prefabricated member with the hole structure according to the coating cladding strategy and the laser cladding parameters in the table 1 to finish the preparation of the upper conical hole wear-resistant coating.

Step S5: and (5) turning the prefabricated member with the hole structure in the step S4, repeating the step S4, and finishing the preparation of the lower taper hole wear-resistant coating to obtain a part blank 5.

Step S6: and after cladding, immediately putting the part blank into a heat treatment furnace preheated to 400 ℃, preserving heat for 150min, cooling to room temperature along with the furnace, and discharging.

Step S7: and (4) machining the part blank cooled in the step S6 to the shape of the preform with the hole structure in the step S1 by using the machining equipment.

TABLE 1 laser cladding parameters

Parameter(s)	Spot diameter	Laser power	Scanning speed	Amount of powder fed
					Value of	4mm	2.5KW	10m/min	500g/h

According to the processing method of the inner hole coating of the part, the laser cladding head is controlled by the terminal equipment to be coupled with the powder through a coating cladding strategy, symmetrical opposite-vertex conical structures are processed on two sides of a prefabricated part with a hole structure, metallurgical bonding of the coating and a base material is realized in a liquid drop state, the bonding strength is extremely high, the melting degree of the base material is small, and the whole part is not deformed. The clad Stellite 6 cobalt-based alloy has excellent wear resistance, and can be used for preparing an inner hole wear-resistant coating with excellent wear resistance.

Example 2

In this example, an additive manufacturing part (material: SUS306 stainless steel) was selected as a preform having a hole structure. The material of the coating powder is Stellite 6 cobalt-based alloy. The specific implementation process of the invention is as follows:

step S1: a preform having a pore structure is provided.

Step S2: and grinding a single-sided conical structure at the position of the inner hole of the part base material by using a hand-held angle grinder by taking an axis which passes through the center of the hole structure of the prefabricated member and is vertical to the plane of the hole structure as a central line, wherein the diameter of the minimum position of the single-sided conical structure is not less than the aperture of the prefabricated member with the hole structure.

Step S3: and removing oil stains on the surface of the prefabricated member with the pore structure after polishing by using alcohol, and polishing and cleaning the oxide skin with the pore structure of the prefabricated member with the pore structure by using machining equipment. And then, preheating the polished prefabricated member with the pore structure by using a heating furnace, wherein the preheating temperature is 450 ℃, and the preheating time is 150 min. And (4) placing the preheated prefabricated member on a laser cladding platform, and fixing the prefabricated member according to the starting point position specified by a coating cladding strategy. And meanwhile, the dried coating powder with uniform particle size is loaded into a powder feeder of laser cladding equipment, and the powder feeder in the laser cladding equipment is controlled by terminal equipment to carry out preheating treatment on the coating powder.

Step S4: and cladding coating powder on the fixed prefabricated member with the hole structure according to the coating cladding strategy and the laser cladding parameters in the table 2 to finish the preparation of the upper conical hole wear-resistant coating.

Step S5: and (5) turning the prefabricated member with the hole structure in the step S4, repeating the step S4, and finishing the preparation of the lower taper hole wear-resistant coating to obtain a part blank.

Step S6: and after cladding, immediately putting the part blank into a heat treatment furnace preheated to 500 ℃, preserving heat for 60min, cooling to room temperature along with the furnace, and discharging.

TABLE 2 laser cladding parameters

Parameter(s)	Spot diameter	Laser power	Scanning speed	Amount of powder fed
					Value of	5mm	2.8KW	15m/min	600g/h

The processing method of the inner hole coating of the part can prepare the inner hole wear-resistant coating on the part hole structure (blind hole structure) in batches, defects such as cracks and holes are not found when ultrasonic nondestructive testing is used, the Rockwell hardness of the coating can reach about HRC43, and after processing, the sizes of the part and the coating meet the design requirements.

The above description mainly introduces the scheme provided by the embodiment of the present invention from the perspective of the terminal device. It is understood that the terminal device includes hardware structures and/or software modules for performing the respective functions in order to implement the functions. Those of skill in the art will readily appreciate that the present invention can be implemented in hardware or a combination of hardware and computer software, with the exemplary elements and algorithm steps described in connection with the embodiments disclosed herein. Whether a function is performed as hardware or computer software drives hardware depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

In the embodiment of the present invention, the terminal device may be divided into the functional modules according to the above method example, for example, each functional module may be divided corresponding to each function, or two or more functions may be integrated into one processing module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. It should be noted that, the division of the modules in the embodiment of the present invention is schematic, and is only a logic function division, and there may be another division manner in actual implementation.

Fig. 9 shows a block diagram of a device 600 for processing inner hole coating of a part according to an embodiment of the present invention, in a case where a corresponding integrated unit is used. The processing device 600 for coating the inner hole of the part can be the terminal device 100 shown in fig. 1, and can also be a chip applied to the terminal device 100 shown in fig. 1.

As shown in fig. 9, the apparatus 600 for processing inner bore coating of a part comprises: a communication unit 601 and a processing unit 602. Optionally, the apparatus 600 for machining bore coating in parts may further include a storage unit 603 for storing program codes and data of the apparatus 600 for machining bore coating in parts.

In one example, as shown in fig. 9, the processing unit 602 is configured to support the part inner bore coating processing device 600 to perform steps 110 to 120, which are performed by the terminal device 100 shown in fig. 1 in the above embodiment.

In one possible implementation manner, as shown in fig. 9, the processing unit 602 is configured to support the laser deposition manufacturing segmented forming control apparatus 600 to perform steps 1001 to 1002 performed by the terminal device 100 shown in fig. 1 in the embodiment described above.

In one possible implementation manner, as shown in fig. 9, the processing unit 602 is configured to support the laser deposition manufacturing segmented forming control apparatus 600 to execute the step 130 executed by the terminal device 100 shown in fig. 1 in the above embodiment.

The Processing Unit 602 may be a Processor or a controller, such as a Central Processing Unit (CPU), a general-purpose Processor, a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a transistor logic device, a hardware component, or any combination thereof. Which may implement or perform the various illustrative logical blocks, modules, and circuits described in connection with the disclosure. A processor may also be a combination of computing functions, e.g., comprising one or more microprocessors, a DSP and a microprocessor, or the like. The communication unit 601 may be a transceiver, a transceiving circuit or a communication interface, etc. The storage unit 603 may be a memory.

When the processing unit 602 is a processor, the communication unit 601 is a transceiver, and the storage unit 603 is a memory, the laser deposition manufacturing segment forming apparatus 600 according to the embodiment of the present invention can be a hardware structure diagram of the terminal device shown in fig. 10.

Fig. 10 is a schematic diagram illustrating a hardware structure of the terminal device 100 according to an embodiment of the present invention. As shown in fig. 7, the terminal device 100 includes a processor 110 and a communication interface 130.

As shown in fig. 10, the processor 110 may be a general processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more ics for controlling the execution of programs according to the present invention. The number of the communication interfaces may be one or more. The communication interface 130 may use any transceiver or the like for communicating with other devices or communication networks.

As shown in fig. 10, the terminal device 100 may further include a communication line 140. Communication link 140 may include a path for transmitting information between the aforementioned components.

Optionally, as shown in fig. 10, the terminal device 100 may further include a memory 120. The memory 120 is used to store computer-executable instructions for performing aspects of the present invention and is controlled for execution by the processor 110. The processor 110 is configured to execute computer-executable instructions stored in the memory 120 to implement the methods provided by the embodiments of the present invention.

As shown in fig. 10, the memory 120 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a Random Access Memory (RAM) or other types of dynamic storage devices that can store information and instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, blu-ray disc, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to such. The memory 120 may be separate and coupled to the processor 110 via a communication link 140. The memory 120 may also be integrated with the processor.

Optionally, the computer-executable instructions in the embodiment of the present invention may also be referred to as application program codes, which is not specifically limited in this embodiment of the present invention.

In one implementation, as shown in FIG. 10, processor 110 may include one or more CPUs, such as CPU0 and CPU1 of FIG. 10, for example.

In one embodiment, as shown in fig. 10, terminal device 100 may include a plurality of processors, such as processor 110 and processor 150 in fig. 10. Each of these processors may be a single core processor or a multi-core processor.

Fig. 11 is a schematic structural diagram of a chip 700 according to an embodiment of the present invention. As shown in fig. 11, the chip 700 includes one or more (including two) processors 710 and a communication interface 720.

Optionally, as shown in fig. 11, the chip 700 further includes a memory 730, and the memory 730 may include a read only memory 730 and a random access memory 730, and provides operating instructions and data to the processor 710. The portion of memory may also include non-volatile random access memory (NVRAM).

In some embodiments, as shown in FIG. 11, memory 730 stores elements, execution modules or data structures, or a subset thereof, or an expanded set thereof.

In the embodiment of the present invention, as shown in fig. 11, by calling an operation instruction stored in the memory 730 (the operation instruction may be stored in an operating system), a corresponding operation is performed.

As shown in fig. 11, the processor 710 controls processing operations of any one of the terminal devices 100, and the processor 710 may also be referred to as a Central Processing Unit (CPU).

As shown in fig. 11, memory 730 may include both read-only memory and random access memory, and provides instructions and data to processor 710. A portion of the memory 730 may also include NVRAM. For example, in-application memory 730, communication interface 720, and memory 730 are coupled together by a bus system that may include a power bus, a control bus, a status signal bus, etc., in addition to a data bus. For clarity of illustration, however, the various buses are labeled as bus system 440 in FIG. 8.

As shown in fig. 11, the method disclosed in the above embodiments of the present invention may be applied to the processor 710, or implemented by the processor 710. The processor 710 may be an integrated circuit chip 700 having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 710. The processor 710 may be a general purpose processor, a Digital Signal Processor (DSP), an ASIC, an off-the-shelf programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, or discrete hardware components. The various methods, steps and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in the memory 730, and the processor 710 reads the information in the memory 730 and performs the steps of the above method in combination with the hardware thereof.

An embodiment of the present invention further provides a computer-readable storage medium, where instructions are stored in the computer-readable storage medium, and when the instructions are executed, the functions performed by the terminal device 100 in the foregoing embodiments are implemented.

In one aspect, a chip 700 is provided, where the chip 700 is applied to a terminal device 100, the chip 700 includes at least one processor 710 and a communication interface 720, the communication interface 720 is coupled to the at least one processor 710, and the processor 710 is configured to execute instructions to implement the functions performed by the terminal device 100 in the foregoing embodiments.

In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. The procedures or functions of the embodiments of the invention are performed in whole or in part when the computer program or instructions are loaded and executed on a computer. The computer may be a general purpose computer, a special purpose computer, a computer network, a terminal, user equipment, or other programmable device. The computer program or instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer program or instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wire or wirelessly. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The available media may be magnetic media, such as floppy disks, hard disks, magnetic tape; or optical media such as Digital Video Disks (DVDs); it may also be a semiconductor medium, such as a Solid State Drive (SSD).

While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

While the invention has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A method for processing a coating of an inner hole of a part is characterized by comprising the following steps:

providing a preform having a pore structure;

controlling laser cladding equipment to form a coating in the hole structure of the prefabricated part according to the coating cladding strategy to obtain a part blank; the coating cladding strategy is determined by structural parameters of the pore structure;

and controlling heat treatment equipment to carry out heat treatment on the part blank.

2. The method for processing inner bore coating of parts according to claim 1, wherein after providing the preform with the bore structure, before controlling the laser cladding device to form the coating in the bore structure of the preform according to the coating cladding strategy to obtain the part blank, the method for processing inner bore coating of parts further comprises:

controlling a machining device to polish the hole structure of the prefabricated member with the hole structure, so that the hole diameter of the hole structure is larger than the original hole diameter;

and controlling a heat treatment device to carry out heat treatment on the polished prefabricated member with the pore structure.

3. The processing method for the inner hole coating of the part as claimed in claim 2, wherein the temperature for performing the heat treatment on the polished prefabricated member with the hole structure is 350-450 ℃; and the time for carrying out heat treatment on the polished prefabricated member with the pore structure is 100-150 min.

4. The method for machining an inner bore coating of a part as claimed in claim 1, wherein the coating is made of Stellite 6 cobalt-based alloy.

5. The method of claim 1, wherein said controlling the heat treatment device to heat treat the part blank comprises:

controlling heat treatment equipment preheated to 400-500 ℃ to carry out heat treatment on the part blank; and/or the presence of a gas in the gas,

and the time for controlling the heat treatment equipment to carry out heat treatment on the part blank is 60-150 min.

6. The method for machining an inner hole coating of a part as claimed in claim 1, wherein after the controlling heat treatment device performs heat treatment on the part blank, the method for machining an inner hole coating of a part further comprises:

and controlling the machining equipment to polish the heat-treated part blank.

7. The processing method of the inner hole coating of the part as claimed in any one of claims 1 to 6, wherein the powder feeding amount of the laser cladding equipment is 200g/h to 1500 g/h; and/or the presence of a gas in the gas,

the controlling of cladding parameters of the laser cladding equipment for forming the coating in the hole structure of the prefabricated part according to the coating cladding strategy comprises the following steps: the diameter of a laser spot is 2-7 mm, the laser power is 1-6 KW, and the laser scanning speed is 1-45 m/min.

8. A terminal device, comprising: a processor and a communication interface, the communication interface coupled to the processor, the processor being configured to run a computer program or instructions to implement the method of machining a bore coating in a part according to any of claims 1-7.

9. A system for processing a bore coating in a part, comprising:

the terminal device of claim 8;

the laser cladding equipment is communicated with the terminal equipment;

a thermal processing device in communication with the terminal device;

and a machining device in communication with the terminal device.

10. A computer storage medium having stored thereon instructions that, when executed, cause a method of machining bore coatings in parts according to any of claims 1 to 7 to be performed.