CN111970824A - PCB and pad structure suitable for BGA chip thereof - Google Patents
PCB and pad structure suitable for BGA chip thereof Download PDFInfo
- Publication number
- CN111970824A CN111970824A CN202010850429.5A CN202010850429A CN111970824A CN 111970824 A CN111970824 A CN 111970824A CN 202010850429 A CN202010850429 A CN 202010850429A CN 111970824 A CN111970824 A CN 111970824A
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- CN
- China
- Prior art keywords
- solder
- pad structure
- structure suitable
- welding
- bga chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 80
- 238000003466 welding Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 102000001999 Transcription Factor Pit-1 Human genes 0.000 description 16
- 108010040742 Transcription Factor Pit-1 Proteins 0.000 description 16
- 239000007788 liquid Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a bonding pad structure suitable for a BGA chip, which comprises a PCB substrate, a plurality of soldering pits arranged on the surface of the PCB substrate and used for accommodating all solder balls on the back surface of the BGA chip, and through holes arranged at the bottoms of the soldering pits and used for exhausting gas generated during soldering. Therefore, the welding pad structure suitable for the BGA chip provided by the invention can independently contain the welding balls on the BGA chip through the welding pits, so that the welding balls can be respectively contained in the welding pits after being melted, the problem of welding offset between the welding balls and a PCB substrate in the welding process is avoided, and meanwhile, the gas generated in the welding process is discharged by utilizing the through holes, and the poor welding problems such as bubbles, holes and the like can be avoided. The invention also discloses a PCB, which has the beneficial effects as described above.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a bonding pad structure suitable for a BGA chip. The invention also relates to a PCB board.
Background
With the development of the electronic technology in China, more and more electronic devices have been widely used.
Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application program server, a WEB server and the like according to different service types provided by the server.
In the big data era, a large number of IT devices are centrally located in a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each IT device is composed of various hardware board cards, such as a computing module, a memory module, a storage module, a chassis and the like.
With the development of cloud computing applications, informatization gradually covers various fields of society. People's daily life more and more exchanges through the network, and the network data volume is also constantly increasing, also higher to the performance requirement of server, and the consumption is higher and higher, and the circuit on the PCB integrated circuit board is more and more complicated.
In PCB design, BGA (Ball Grid Array) packaged chips are heavily used in server boards to reduce space occupation. When the chip is installed, the back surface of the chip needs to be attached to the surface of the PCB substrate, and then in the welding process, the solder balls on the back surface of the chip are melted in the welding process and are tiled on the bonding pads, so that the chip is welded and connected with the PCB substrate.
However, the solder balls on the chip must be completely matched with the solder pads on the PCB during the soldering process, otherwise poor soldering problems such as offset pillow effect, bridge short circuit, bubble cavity, spattering of solder, cracking and distortion are likely to occur, but the offset condition is likely to occur during the soldering process, resulting in a high defective rate. In case the bad problem of welding appears, need blow whole chip off with the air gun, weld again, and the maintenance degree of difficulty is big, and the risk is high, and maintainability is low, and the cost is higher.
Therefore, how to realize stable soldering of the BGA chip on the PCB substrate and prevent poor soldering is a technical problem faced by those skilled in the art.
Disclosure of Invention
The invention aims to provide a bonding pad structure suitable for a BGA chip, which can realize stable welding of the BGA chip on a PCB substrate and prevent poor welding. Another object of the present invention is to provide a PCB board.
In order to solve the technical problem, the invention provides a bonding pad structure suitable for a BGA chip, which comprises a PCB substrate, a plurality of solder pits formed on the surface of the PCB substrate and used for accommodating solder balls on the back surface of the BGA chip, and through holes formed at the bottom of the solder pits and used for exhausting gas generated during soldering.
Preferably, the weld craters are hemispherical or bowl-shaped.
Preferably, the diameter of the solder pit is 2-3 mil larger than that of the solder ball.
Preferably, the through hole is formed in the center of the bottom of the solder pit.
Preferably, the orientation of the through hole is radial to the solder pit.
Preferably, the surface of the solder pit and the surface of the hole wall of the through hole are both provided with a metal plating layer with preset thickness for combining with the melted solder ball.
Preferably, the end of the through hole is connected with a layer changing signal line of the PCB substrate.
Preferably, the thickness of the metal coating is 1-2 mil.
Preferably, the metal plating layer is a copper plating layer.
The invention also provides a PCB board which comprises the bonding pad structure suitable for the BGA chip.
The invention provides a bonding pad structure suitable for a BGA chip, which mainly comprises a PCB substrate, a welding pit and a through hole. The PCB substrate is a bottom layer structure of the pad structure and is an important component of the PCB, and the BGA chip is mounted on the surface of the PCB substrate and specifically located in a preset mounting area. Each solder pit is arranged in a mounting area (namely a pad area) on the surface of the PCB substrate, and each solder pit is used for accommodating a corresponding solder ball, so that each solder ball can be accommodated in the solder pit after being melted into liquid. The through holes are formed in the bottoms of the welding pits and are mainly used for discharging gas generated during welding, so that poor welding problems such as bubbles and holes are prevented. Therefore, the welding pad structure suitable for the BGA chip provided by the invention can independently contain the welding balls on the BGA chip through the welding pits, so that the welding balls can be respectively contained in the welding pits after being melted, the problem of welding offset between the welding balls and a PCB substrate in the welding process is avoided, and meanwhile, the gas generated in the welding process is discharged by utilizing the through holes, and the poor welding problems such as bubbles, holes and the like can be avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic diagram of a soldering process of solder balls in solder pits.
Wherein, in fig. 1-2:
BGA chip-a, solder ball-b;
PCB substrate-1, solder pit-2, through-hole-3, metal coating-4.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic view of an overall structure of an embodiment of the present invention, and fig. 2 is a schematic view of a soldering process of a solder ball b in a solder pit 2.
In one embodiment of the present invention, a pad structure suitable for a BGA chip mainly includes a PCB substrate 1, solder pits 2, and through holes 3.
The PCB substrate 1 is a bottom layer structure of the pad structure and is also an important component of the PCB, and the BGA chip a is mounted on the surface of the PCB substrate 1 and specifically located in a preset mounting area.
Each of the solder pits 2 is opened in a mounting area (i.e., a land area) on the surface of the PCB substrate 1, and each of the solder pits 2 is used to accommodate a corresponding solder ball b, so that each solder ball b can be accommodated in the solder pit 2 after being melted into a liquid state.
The through holes 3 are formed in the bottom of each welding pit 2 and are mainly used for discharging gas generated during welding, so that poor welding problems such as bubbles and holes are prevented.
So, the pad structure that is applicable to BGA chip that this embodiment provided holds alone through each solder hole 2 solder ball b to BGA chip a, can make each solder ball b melt back splendid attire respectively in each solder hole 2, avoids solder ball b to appear the problem of welding skew with PCB base plate 1 in welding process, utilizes the gas outgoing that produces when through-hole 3 will weld simultaneously, can avoid appearing the bad problem of welding such as bubble, hole.
In a preferred embodiment with respect to solder pits 2, solder pits 2 may be in particular hemispherical or bowl-shaped, taking into account that solder balls b are generally regularly spherical. With the arrangement, the shape of the solder pits 2 is the same as or similar to that of the solder balls b, so that the mounting positions of the solder balls b can be conveniently positioned, and the solder balls b are mounted in the corresponding solder pits 2, thereby preventing the problems of mounting dislocation and offset of the solder balls b. Of course, the specific shape of the welding pit 2 is not limited to a hemisphere or a bowl, and other shapes such as an arc groove shape and the like can be used.
Furthermore, the diameter of the solder pit 2 and the diameter of the solder ball b are 2-3 mil larger, so that the volume of the solder pit 2 is slightly larger than that of the solder ball b, and the solder ball b can be completely contained in the solder pit 2 after being melted, so that the liquid solder ball b is prevented from overflowing the solder pit 2.
In a preferred embodiment of the through hole 3, the through hole 3 may be specifically opened at a bottom center position of the solder pit 2, that is, a projected center position of the solder pit 2, and thus, since the position is also generally a lowest point position of the solder pit 2, when the solder ball b is mounted, the opening position of the through hole 3 may be used as a reference, and the solder ball b is directly placed at an opening position of the through hole 3, so as to ensure that the mounting position of the solder ball b is at the center position of the solder pit 2, and achieve a positioning effect on the solder ball b. At the same time, the solder ball b can automatically slide to the opening position of the through hole 3 under the action of gravity.
Further, the through-hole 3 is oriented in parallel with the radial direction of the solder pit 2 and is generally vertical (or the thickness direction of the PCB substrate 1), and is configured such that the length of the through-hole 3 can be minimized, so that gas generated during soldering can be rapidly discharged from the through-hole 3.
In addition, in order to ensure that the solder ball b can be tightly soldered to the surface of the solder pit 2 after melting, the present embodiment provides a metal plating layer 4 on the surface of the solder pit 2. Specifically, the metal plating layer 4 can be a copper plating layer, etc., and the thickness thereof is generally 1-2 mil, since the solder ball b is generally a solder ball, and the solder ball can form a good solder with the copper plating layer after melting.
Similarly, the present embodiment further provides a metal plating layer 4 on the wall surface of the through hole 3, and the end of the through hole 3 may extend to be connected to the layer-changing signal line of the PCB substrate 1, so that the signal connection between the BGA chip a and the PCB substrate 1 is realized through the connection between the metal plating layer 4 and the layer-changing signal line.
The embodiment also provides a PCB board, which mainly includes a BGA chip a and a pad structure suitable for the BGA chip, wherein the specific content of the pad structure suitable for the BGA chip is the same as the related content, and is not described herein again.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a pad structure suitable for BGA chip, its characterized in that includes PCB base plate (1), sets up a plurality of on PCB base plate (1) surface is used for holding solder pit (2) of each solder ball (b) on BGA chip (a) the back to and set up in each solder pit (2) bottom, be used for gas outgoing's that produces when will welding through-hole (3).
2. Pad structure suitable for BGA chips as claimed in claim 1, characterized in that said solder pits (2) are hemispherical or bowl-shaped.
3. The bonding pad structure suitable for BGA chip of claim 2, wherein the diameter of the solder pit (2) is 2-3 mil larger than that of the solder ball (b).
4. Pad structure suitable for BGA chips as claimed in claim 1, wherein said through hole (3) is opened at the bottom center of said solder pit (2).
5. Pad structure suitable for BGA chips according to claim 4, characterized in that the orientation of the through-hole (3) is radial to the solder pit (2).
6. The pad structure suitable for BGA chip of claim 1, characterized in that the surface of the solder pit (2) and the wall surface of the through hole (3) are provided with a metal plating layer (4) with a predetermined thickness for bonding with the melted solder ball (b).
7. Pad structure suitable for BGA chips as claimed in claim 6, wherein the ends of the through holes (3) are connected to the layer-changing signal lines of the PCB substrate (1).
8. The bonding pad structure suitable for BGA chip of claim 7, wherein the thickness of the metal plating layer (4) is 1-2 mil.
9. The bonding pad structure suitable for BGA chip of claim 8, wherein the metal plating layer (4) is copper plating.
10. A PCB board comprising a pad structure suitable for a BGA chip as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850429.5A CN111970824A (en) | 2020-08-21 | 2020-08-21 | PCB and pad structure suitable for BGA chip thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850429.5A CN111970824A (en) | 2020-08-21 | 2020-08-21 | PCB and pad structure suitable for BGA chip thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111970824A true CN111970824A (en) | 2020-11-20 |
Family
ID=73390654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010850429.5A Pending CN111970824A (en) | 2020-08-21 | 2020-08-21 | PCB and pad structure suitable for BGA chip thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970824A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672539A (en) * | 2020-12-07 | 2021-04-16 | 苏州浪潮智能科技有限公司 | Circuit board chip packaging device and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0917937A (en) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | Mounting structure of bga type integrated circuit |
| JPH10313170A (en) * | 1997-05-09 | 1998-11-24 | Hitachi Aic Inc | Wiring board |
| CN1257607A (en) * | 1997-05-23 | 2000-06-21 | 美国3M公司 | Method for making a patterned array of solder bumps |
| CN107172809A (en) * | 2017-06-08 | 2017-09-15 | 冯俊谊 | A kind of BGA welding methods |
| CN207612466U (en) * | 2017-11-17 | 2018-07-13 | 歌尔科技有限公司 | A kind of pcb board |
| CN109309069A (en) * | 2018-09-19 | 2019-02-05 | 深圳市心版图科技有限公司 | Welded ball array encapsulates chip and its welding method |
-
2020
- 2020-08-21 CN CN202010850429.5A patent/CN111970824A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0917937A (en) * | 1995-06-27 | 1997-01-17 | Matsushita Electric Works Ltd | Mounting structure of bga type integrated circuit |
| JPH10313170A (en) * | 1997-05-09 | 1998-11-24 | Hitachi Aic Inc | Wiring board |
| CN1257607A (en) * | 1997-05-23 | 2000-06-21 | 美国3M公司 | Method for making a patterned array of solder bumps |
| CN107172809A (en) * | 2017-06-08 | 2017-09-15 | 冯俊谊 | A kind of BGA welding methods |
| CN207612466U (en) * | 2017-11-17 | 2018-07-13 | 歌尔科技有限公司 | A kind of pcb board |
| CN109309069A (en) * | 2018-09-19 | 2019-02-05 | 深圳市心版图科技有限公司 | Welded ball array encapsulates chip and its welding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672539A (en) * | 2020-12-07 | 2021-04-16 | 苏州浪潮智能科技有限公司 | Circuit board chip packaging device and method |
| CN112672539B (en) * | 2020-12-07 | 2022-06-10 | 苏州浪潮智能科技有限公司 | Circuit board chip packaging device and method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201120 |
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| RJ01 | Rejection of invention patent application after publication |