CN111962027B - Evaporation nozzle and evaporation point source device - Google Patents

Evaporation nozzle and evaporation point source device Download PDF

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Publication number
CN111962027B
CN111962027B CN202010762895.8A CN202010762895A CN111962027B CN 111962027 B CN111962027 B CN 111962027B CN 202010762895 A CN202010762895 A CN 202010762895A CN 111962027 B CN111962027 B CN 111962027B
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Prior art keywords
nozzle
evaporation
filter
vapor deposition
holes
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CN111962027A (en
Inventor
黄永振
张红信
王晓强
贾凯
陈闻凯
王会
赵景训
闵卿旭
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The application discloses coating by vaporization nozzle and coating by vaporization point source device, coating by vaporization nozzle include nozzle portion and the filter house of connecting the nozzle portion, and nozzle portion and filter house are hollow structure and are equipped with a plurality of intercommunicating pores on the lateral wall of filter house. The application provides an evaporation nozzle and an evaporation point source device, which can reduce the transmission of evaporation particles from the nozzle to a substrate and can avoid the nozzle from being blocked.

Description

Evaporation nozzle and evaporation point source device
Technical Field
The application relates to the field of evaporation processes, in particular to an evaporation nozzle and an evaporation point source device.
Background
The vacuum evaporation method is that a crucible containing organic matters is placed in a vacuum evaporation machine, resistance wires inside the crucible are electrified and heated to evaporate or gasify the organic matters, and then the organic matters are attached to a fixed substrate to finally form a film layer.
Wherein, evaporation source among the coating by vaporization process is coating by vaporization point source device, however this coating by vaporization point source device produces the coating by vaporization granule easily at the coating by vaporization in-process, and this coating by vaporization granule coating by vaporization can lead to coating by vaporization length in time, product encapsulation inefficacy and outward appearance bad to the base plate on, also can lead to the jam of coating by vaporization nozzle simultaneously.
Disclosure of Invention
The application provides an evaporation nozzle and evaporation point source device to solve the evaporation particle evaporation that produces among the evaporation process and lead to length, product encapsulation inefficacy, outward appearance bad and the problem that the evaporation nozzle blockked up when the evaporation to the base plate on.
In order to solve the above technical problem, the present application provides an evaporation nozzle, including: the nozzle part and the filtering part are hollow structures, and a plurality of communicating holes are arranged on the side wall of the filtering part.
Wherein the opening size of the communication hole gradually increases in a direction approaching the nozzle portion.
The filter part comprises at least two blocking plates, the at least two blocking plates are arranged inside the filter part at intervals in the direction of the filter part pointing to the nozzle part, and a plurality of vent holes are formed in the blocking plates.
Wherein orthographic projections of the vent holes on two adjacent baffle plates on a reference plane are staggered with each other, and the reference plane is perpendicular to the direction from the filter part to the nozzle part.
Wherein, the distribution density of the plurality of air holes of each baffle plate is increased in turn along the direction of the filter part pointing to the nozzle part; and/or the opening size of the vent hole of each baffle plate is increased in sequence along the direction of the filter part pointing to the nozzle part.
The evaporation nozzle also comprises a cover plate component, wherein the cover plate component is of a hollow structure and is detachably connected with the nozzle part; the cover plate assembly comprises a reflecting plate, wherein the reflecting plate is wound on the periphery of the nozzle part when the cover plate assembly is covered on the nozzle part.
Wherein the nozzle part and the reflecting plate are frustum-shaped.
The nozzle part is provided with a first buckling part, the cover plate component further comprises a second buckling part, and the first buckling part and the second buckling part can be buckled with each other.
Wherein, the intercommunicating pore is a circular hole or a strip-shaped hole.
In order to solve the technical problem, the application provides a point source device of coating by vaporization, include as above-mentioned coating by vaporization nozzle and coating by vaporization crucible, the filter house of coating by vaporization nozzle inlays and locates in the coating by vaporization crucible.
The beneficial effect of this application is: being different from the prior art, the application provides an evaporation coating nozzle and evaporation coating point source device, and the evaporation coating nozzle includes nozzle portion and the filter house of connecting nozzle portion, and nozzle portion and filter house are hollow structure, and are equipped with a plurality of intercommunicating pores on the lateral wall of filter house to allow the evaporation coating gas of filter house outside to get into the filter house inside through the intercommunicating pore, and transmit to nozzle portion. Because the cylinder wall of the filtering part blocks, the evaporation particles are difficult to output from the communicating hole, the transmission of the evaporation particles from the nozzle part to the substrate can be reduced, and the blockage of the nozzle part by the evaporation particles can be avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is an exploded view of an exemplary deposition nozzle of the present application;
FIG. 2 is a front view of a first embodiment of a filter house of the present application;
FIG. 3 is a front view of a second embodiment of a filter section of the present application;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
FIG. 5 is a cross-sectional view B-B shown in FIG. 3;
FIG. 6 is a cross-sectional view of C-C shown in FIG. 3;
FIG. 7 is a perspective view of an embodiment of a cover plate assembly of the present application;
fig. 8 is an exploded view of an embodiment of an evaporation point source device according to the present application.
Reference numerals: 1. a nozzle portion; 11. a first buckling part; 12. a nozzle opening; 2. a filtering part; 21. a communicating hole; 3. a first barrier plate; 31. a middle region; 32. an annular region; 321. a first vent hole; 4. a second barrier plate; 41. a second vent hole; 5. a third barrier plate; 51. a shielding portion; 52. a spoke; 53. a third vent hole; 6. a cover plate assembly; 61. a reflective plate; 62. a second fastening part; 7. evaporating a crucible.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present application, the following describes an evaporation nozzle and an evaporation point source device provided by the present invention in further detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is an exploded view of an evaporation nozzle according to an embodiment of the present application.
The evaporation nozzle in the embodiment comprises a nozzle part 1 and a filter part 2, wherein the nozzle part 1 is connected with the filter part 2, the nozzle part 1 and the filter part 2 are of hollow structures, namely the nozzle part 1 and the filter part 2 are in a communication state, so that evaporation gas is transmitted from the nozzle part 1 to a substrate through the filter part 2. Meanwhile, a plurality of communication holes 21 are formed on the sidewall of the filter part 2 to allow the evaporation gas outside the filter part 2 to enter the inside of the filter part 2 through the communication holes 21 and to be transferred to the nozzle part 1.
Since the evaporation nozzle and the evaporation crucible mentioned later constitute an evaporation point source device, the filter section 2 is inserted into an evaporation chamber of the evaporation crucible in a process in which the evaporation nozzle is used for evaporating the crucible. The wall of the filter unit 2 is spaced from and not bonded to the sidewall of the evaporation crucible, and a plurality of communication holes 21 are provided in the wall of the filter unit 2 to allow the evaporation gas outside the filter unit 2 to enter the filter unit 2 through the communication holes 21 and to be transferred to the nozzle openings 12 of the nozzle unit 1.
Because among the coating by vaporization process, coating by vaporization granule speed and energy are great relatively, filter 2 bottom does not have intercommunicating pore 21 for most coating by vaporization granule directly collides filter 2 bottom, and can't enter into filter 2 inside. However, a small number of vapor deposition particles enter the space between the wall of the filter unit 2 and the sidewall of the vapor deposition crucible, and the communication hole 21 is provided in the wall of the filter unit 2 to block the vapor deposition particles, so that the vapor deposition particles are not easily discharged from the communication hole 21, and the vapor deposition gas is allowed to enter the filter unit 2 from the outside of the filter unit 2 and is transferred to the nozzle opening 12 of the nozzle unit 1, thereby reducing the transfer of the vapor deposition particles from the nozzle opening 12 of the nozzle unit 1 to the substrate. The communication holes 21 are provided at regular intervals on the wall of the filter unit 2, and may be provided at regular intervals or at irregular intervals, and the specific arrangement of the communication holes 21 is not limited.
Referring to fig. 2, fig. 2 is a front view of a first embodiment of a filter portion of the present application.
In an embodiment, referring to fig. 1, the communication hole 21 is a circular hole or a strip-shaped hole, wherein the circular hole or the strip-shaped hole can reduce the probability that the evaporation particles evaporate out of the evaporation crucible from the side wall of the filter part 2; meanwhile, a plurality of evaporation paths are provided for the evaporation gas. Of course, the elongated holes can also increase the vapor deposition gas flow rate. Preferably, the radius of the circular hole or the width of the long-strip hole is less than or equal to 3mm, which can effectively prevent the vapor deposition particles from directly entering the nozzle opening 12 of the nozzle part 1 from the communication hole 21.
With reference to fig. 1 and fig. 2, in order to allow more vapor deposition gas to enter the nozzle openings 12 of the nozzle portion 1 from the filter portion 2 during the vapor deposition process, the size of the opening of the communication hole 21, i.e. the opening area of the communication hole 21, in the present embodiment is gradually increased in a direction approaching the nozzle portion 1, and the gradually increased communication hole 21 is more beneficial to transmitting more vapor deposition gas. In practice, since there are relatively many vapor deposition particles at the lower portion of the filter unit 2, the size of the opening of the communication hole 21 needs to be relatively small, and since there are relatively few vapor deposition particles near the nozzle unit 1, the sectional area of the communication hole 21 needs to be relatively large, so as to facilitate the passage of a large amount of vapor deposition gas, and also to reduce the transmission of vapor deposition particles from the nozzle opening 12 of the nozzle unit 1 to the substrate, thereby preventing the vapor deposition particles from blocking the nozzle unit 1.
When the vapor deposition nozzle is used for a vapor deposition crucible, the opening size of the communication hole 21 is gradually increased in the direction toward the nozzle section 1, so that the internal pressure in the vapor deposition crucible can be stabilized, and the problem of uneven vapor deposition due to too large internal pressure can be reduced.
In an embodiment, the filter house 2 comprises at least two blocking plates, which are mounted inside the filter house 2. In particular, the blocking plate is fixed inside the filtering portion 2. At least two barrier plates set up inside filter part 2 along the direction interval from filter part 2 directional nozzle portion 1, and a plurality of air vents have been seted up to the barrier plate to make the coating by vaporization granule in proper order successively directly collide barrier plate or air vent, barrier plate etc. thereby reduce coating by vaporization granule and transmit to the base plate from nozzle opening 12 of nozzle portion 1 on, also allow coating by vaporization gas to transmit to nozzle opening 12 department of nozzle portion 1 from the air vent simultaneously, provide many coating by vaporization routes for the coating by vaporization gas. The number of the blocking plates is two, three or more, and the number is not limited.
In order to further prevent the evaporation particles from being transmitted to the nozzle opening 12 of the nozzle portion 1 along with the evaporation gas during the evaporation process, the orthographic projections of the ventilation holes on the two adjacent barrier plates on the reference plane are staggered with each other in the embodiment, and the reference plane is perpendicular to the direction pointing to the nozzle portion 1 from the filter portion 2, thereby reducing the occurrence probability of poor products. Because the evaporation particles must collide with the corresponding barrier plates when passing through the at least two barrier plates in sequence, once the evaporation particles collide with each other once, the energy of the evaporation particles is weakened to be difficult to be transmitted to the nozzle opening 12 of the nozzle part 1 along with the evaporation gas, and then the function of blocking the evaporation particles can be achieved through the at least two barrier plates.
In practice, the blocking plate at the bottom of the filter house 2 serves as its bottom when the bottom of the filter house 2 is free from bottom walls. When the bottom wall of the filter part 2 is provided with the bottom wall, the bottom wall can directly block evaporation particles, wherein the bottom wall can also be provided with vent holes, and the function of the vent holes is the same as that of the blocking plate.
The at least two blocking plates can be arranged perpendicular to the cylinder wall of the filtering part 2 and can also be arranged at an angle with the cylinder wall of the filtering part 2, wherein the blocking plates are arranged in the filtering part 2 in any mode, as long as orthographic projections of the vent holes on the two blocking plates on the reference plane are staggered.
Referring to fig. 3, 4 and 5, fig. 3 is a front view of a second embodiment of the filter portion of the present application; FIG. 4 is a cross-sectional view A-A of FIG. 3; fig. 5 is a sectional view of B-B shown in fig. 3.
For example, the at least two blocking plates include a first blocking plate 3 and a second blocking plate 4, the first blocking plate 3 and the second blocking plate 4 are sequentially disposed inside the filter portion 2, and the second blocking plate 4 is disposed closer to the nozzle portion 1 than the first blocking plate 3.
Wherein the first barrier 3 includes a middle region 31 located at a middle portion of the first barrier 3 and an annular region 32, the annular region 32 being disposed around the middle region 31. The first barrier plate 3 is provided with a plurality of first vent holes 321, and the first vent holes 321 provide evaporation paths for evaporation gases. The plurality of first ventilation holes 321 are disposed on the annular region 32, that is, the number of the first ventilation holes 321 may be one, four, or the like, and the number is not limited.
The second blocking plate 4 is provided with a plurality of second vent holes 41, the number of which is one or more, and the number of the second vent holes is not limited. The plurality of second vent holes 41 are arranged in the middle of the second barrier plate 4 at intervals, and the projections of the plurality of second vent holes 41 on the first barrier plate 3 fall into the middle area 31 of the first barrier plate 3, so that the other areas of the second barrier plate 4 except the second vent holes 41 can shield evaporation particles entering from the annular area 32 provided with the plurality of first vent holes 321.
Specifically, the second blocking plate 4 has only one second vent hole 41, the second vent hole 41 is opened in the middle of the second blocking plate 4, and the outer ring of the second blocking plate 4 is shielded on the annular region 32 provided with the plurality of first vent holes 321. Further, in order to realize that the second blocking plate 4 blocks more of the annular region 32 of the first blocking plate 3, it is considered that a plurality of first vent holes 321 are annularly provided on the annular region 32. Of course, in order to provide more evaporation paths for the evaporation gas, the number of the first vent holes 321 is four, and the four first vent holes 321 are vertically disposed on the annular region 32, as shown in fig. 4.
Referring to FIG. 6, FIG. 6 is a cross-sectional view of C-C shown in FIG. 3;
with reference to fig. 3, 4 and 5, in order to further reduce the vapor deposition particles that sequentially pass through the first barrier plate 3 and the second barrier plate 4 and are output from the nozzle opening of the nozzle portion, in this embodiment, the at least two barrier plates further include a third barrier plate 5, and the vapor deposition particles are further shielded by the third barrier plate 5.
The third barrier 5 has the following specific structure: the third barrier 5 comprises a shield 51 and at least two spokes 52, the shield 51 being connected to the filter house 2 by the at least two spokes 52 for fixing the shield 51. The spokes 52 may be two, three or more in number, and the specific number thereof is not limited. In order to achieve a stable connection of the shield part 51 to the filter part 2, at least two spokes 52 are arranged at intervals in the axial direction of the shield part 51 and are radially spread. Meanwhile, the spokes 52 are connected between the shielding part 51 and the filtering part 2, so that a gap is formed between the shielding part 51 and the filtering part 2, and further a third vent hole 53 is formed between the adjacent spokes 52, and the third vent hole 53 is used for circulation of evaporation gas, thereby providing more evaporation paths for the evaporation gas.
Referring to fig. 1, the projection of the shielding portion 51 on the second barrier plate 4 covers the second ventilation holes 41 to shield the vapor deposition particles passing through the second ventilation holes 41 of the second barrier plate 4, so as to prevent the vapor deposition particles from being deposited on the substrate from the nozzle openings 12 of the nozzle portion 1, which may cause product packaging failure and poor appearance, and blockage of the nozzle portion 1.
Of course, a fourth blocking plate, a fifth blocking plate and the like are further arranged in the filtering part 2, and the transmission of the evaporation particles can be reduced due to the fact that the number of the blocking plates is increased. When the number of the blocking plates is multiple, the vent holes on at least two adjacent blocking plates need to be distributed in a complementary mode.
With reference to fig. 3, fig. 4 and fig. 5, in an embodiment, the distribution density of the plurality of ventilation holes of each barrier plate sequentially increases along the direction from the filter portion 2 to the nozzle portion 1, and during the movement of the evaporation gas toward the nozzle portion 1, the path along which the barrier plate 2 moves is longer as the number of the ventilation holes is larger, the amount of heat lost is larger, and the amount of particles is smaller, so that in the direction close to the nozzle portion 1, the distribution density of the ventilation holes of each barrier plate gradually increases, that is, the number of the ventilation holes of the barrier plate gradually increases, so that the evaporation gas has less damage on the subsequent transmission path, and the evaporation path of the evaporation gas is prevented from being liquefied. Meanwhile, in order to further increase the vapor deposition path of the vapor deposition gas, the size of the openings of the vent holes in each barrier plate is increased in the direction from the filter unit 2 to the nozzle unit 1 in the present embodiment.
Referring to fig. 7, fig. 7 is a perspective view of an embodiment of the cover plate assembly of the present application.
Referring to fig. 1, in an embodiment, the evaporation nozzle further includes a cover plate assembly 6, and the cover plate assembly 6 is a hollow structure and is detachably connected to the nozzle portion 1. The cover plate assembly 6 includes a reflection plate 61, and the number of layers of the reflection plate 61 may be two, three, or more. When the cover plate assembly 6 is covered on the nozzle part 1, the reflective plate 61 is wound on the periphery of the nozzle part 1, so that more heat is reflected on the periphery of the nozzle part 1, and the heat loss of the evaporation gas can be reduced, thereby preventing the evaporation gas from being liquefied and condensed and blocked in the nozzle part 1.
Specifically, the reflecting plate 61 is disposed at the bottom of the cover plate assembly 6, wherein the reflecting plate 61 is disposed around the periphery of the nozzle portion 1, the area of the cross section of the reflecting plate 61 is gradually increased along the direction from the nozzle portion 1 to the filter portion 2, and then the heat between the nozzle portion 1 and the cover plate assembly 6 is reflected to the nozzle portion 1, so as to increase the temperature around the nozzle portion 1, reduce the heat loss of the evaporation gas, and further avoid the nozzle portion 1 from blocking the hole.
Specifically, the area of the cross section of the nozzle part 1 is gradually increased along the direction from the nozzle part 1 to the filter part 2, so that the nozzle part 1 and the reflecting plate 61 are in a frustum shape, the heat radiation of the nozzle part 1 is reduced, the temperature of the cover plate assembly 6 is increased, and the evaporation gas is further favorably evaporated to a product to be evaporated.
It can be seen that the temperature of the cover plate assembly 6 can be more easily increased by the above two methods by installing at least two barrier plates in the filter unit 2 and the fitting engagement between the nozzle unit 1 and the reflection plate 61, thereby preventing the vapor deposition gas from being blocked in the nozzle unit 1.
Specifically, the nozzle unit 1 is provided with a first engaging portion 11, the cover plate unit 6 further includes a second engaging portion 62, and the first engaging portion 11 and the second engaging portion 62 can be engaged with each other, so that the cover plate unit 6 covers the nozzle unit 1. Because a cavity is formed between the second buckling part 62 and the first buckling part 11, the cavity can concentrate the heat in the evaporation crucible between the second buckling part 62 and the first buckling part 11, reduce the heat loss, and improve the temperature of the nozzle part 1.
The evaporation nozzle comprises a nozzle part and a filtering part connected with the nozzle part, wherein the nozzle part and the filtering part are of hollow structures, and the side wall of the filtering part is provided with a plurality of communicating holes so as to allow evaporation gas outside the filtering part to enter the inside of the filtering part through the communicating holes and be transmitted to the nozzle part. Because the cylinder wall of the filtering part blocks, the evaporation particles are difficult to output from the communicating hole, and the transmission of the evaporation particles from the nozzle opening of the nozzle part to the substrate can be reduced.
Referring to fig. 8, fig. 8 is an explosion diagram of an evaporation point source device according to an embodiment of the present application.
The evaporation point source device in this embodiment includes the evaporation nozzle and the evaporation crucible 7 described above, the filter portion 2 of the evaporation nozzle is embedded in the evaporation crucible 7, and the first engaging portion 11 of the evaporation nozzle is engaged with the opening of the evaporation crucible.
It should be noted that the evaporation nozzle in this embodiment is the evaporation nozzle described in the above embodiments, and details are not described herein.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (9)

1. An evaporation nozzle, comprising:
the nozzle part and the filtering part are of hollow structures, and a plurality of communicating holes are formed in the side wall of the filtering part;
the opening size of the communication hole gradually increases in a direction approaching the nozzle portion.
2. The evaporation nozzle according to claim 1, wherein the filter unit comprises at least two blocking plates, the at least two blocking plates are disposed inside the filter unit at intervals along a direction from the filter unit to the nozzle unit, and the blocking plates are provided with a plurality of vent holes.
3. An evaporation nozzle according to claim 2, wherein orthographic projections of the vent holes on two adjacent barrier plates on a reference plane perpendicular to a direction from the filter portion to the nozzle portion are offset from each other.
4. The deposition nozzle according to claim 2,
the distribution density of the plurality of vent holes of each baffle plate is increased in sequence along the direction of the filter part to the nozzle part; and/or
The opening sizes of the vent holes of the blocking plates are sequentially increased along the direction of the filter part towards the nozzle part.
5. The evaporation nozzle according to any one of claims 1 to 4, further comprising a cover plate assembly, wherein the cover plate assembly is a hollow structure and is detachably connected to the nozzle portion; wherein the content of the first and second substances,
the cover plate assembly comprises a reflecting plate, wherein when the cover plate assembly is covered on the nozzle part, the reflecting plate is wound on the periphery of the nozzle part.
6. A vapor deposition nozzle according to claim 5, wherein said reflecting plate and said nozzle portion have a truncated cone shape.
7. The evaporation nozzle according to claim 5, wherein the nozzle portion is provided with a first engaging portion, the cap assembly further comprises a second engaging portion, and the first engaging portion and the second engaging portion are engageable with each other.
8. A deposition nozzle according to any of claims 1 to 4, wherein the communication holes are circular or elongated holes.
9. A vapor deposition point source device comprising the vapor deposition nozzle according to any one of claims 1 to 8 and a vapor deposition crucible, wherein the filter portion of the vapor deposition nozzle is embedded in the vapor deposition crucible.
CN202010762895.8A 2020-07-31 2020-07-31 Evaporation nozzle and evaporation point source device Active CN111962027B (en)

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CN202010762895.8A CN111962027B (en) 2020-07-31 2020-07-31 Evaporation nozzle and evaporation point source device

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Application Number Priority Date Filing Date Title
CN202010762895.8A CN111962027B (en) 2020-07-31 2020-07-31 Evaporation nozzle and evaporation point source device

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CN111962027B true CN111962027B (en) 2022-09-06

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101655315A (en) * 2008-08-22 2010-02-24 三星移动显示器株式会社 Inner plate and crucible assembly for deposition having the same
JP2015067846A (en) * 2013-09-27 2015-04-13 株式会社日立ハイテクファインシステムズ Evaporation source, vacuum deposition apparatus, and method for manufacturing organic el display device
CN104593729A (en) * 2014-12-24 2015-05-06 深圳市华星光电技术有限公司 Crucible capable of preventing evaporation material from splashing and plugging holes
CN107190237A (en) * 2017-06-26 2017-09-22 深圳市华星光电技术有限公司 Evaporation source heating system
CN109666897A (en) * 2017-10-17 2019-04-23 合肥欣奕华智能机器有限公司 A kind of crucible and point-type evaporation source
CN211771523U (en) * 2019-12-14 2020-10-27 苏州盟萤电子科技有限公司 Point source heating device of vacuum evaporation machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101655315A (en) * 2008-08-22 2010-02-24 三星移动显示器株式会社 Inner plate and crucible assembly for deposition having the same
JP2015067846A (en) * 2013-09-27 2015-04-13 株式会社日立ハイテクファインシステムズ Evaporation source, vacuum deposition apparatus, and method for manufacturing organic el display device
CN104593729A (en) * 2014-12-24 2015-05-06 深圳市华星光电技术有限公司 Crucible capable of preventing evaporation material from splashing and plugging holes
CN107190237A (en) * 2017-06-26 2017-09-22 深圳市华星光电技术有限公司 Evaporation source heating system
CN109666897A (en) * 2017-10-17 2019-04-23 合肥欣奕华智能机器有限公司 A kind of crucible and point-type evaporation source
CN211771523U (en) * 2019-12-14 2020-10-27 苏州盟萤电子科技有限公司 Point source heating device of vacuum evaporation machine

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