CN111952236B - Fixed processing equipment of computer display card chip - Google Patents
Fixed processing equipment of computer display card chip Download PDFInfo
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- CN111952236B CN111952236B CN202010852933.9A CN202010852933A CN111952236B CN 111952236 B CN111952236 B CN 111952236B CN 202010852933 A CN202010852933 A CN 202010852933A CN 111952236 B CN111952236 B CN 111952236B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to a computer display card chip fixing processing device, which comprises a mounting substrate and a fixing external member, wherein the mounting substrate is provided with the fixing external member, and the invention can solve the following problems existing in the existing display card chip during mounting: a, when the existing display card chip is installed, the pins of the display card chip are damaged when being fixed, so that the display card chip is damaged, and the production efficiency is influenced by great waste cost; b: when current display card chip is depositing, often because of there is certain moisture on the environment reason leads to the display card chip, when the display card chip that contains moisture is installed on the display card after, when switching on, very easily causes the condition that the display card chip burns out to take place, extravagant cost.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a computer display card chip fixing and processing device.
Background
The display chip is a core chip of the display card, the performance of the display chip directly determines the performance of the display card, the main task of the display chip is to process video information input by a system and construct, render and the like the video information, the performance of the display main chip directly determines the performance of the display card, different display chips have differences from the internal structure and the performance of the display chip, the price difference is large, the position of the display chip in the display card is equivalent to that of a CPU in a computer and is the core of the whole display card, and the existing display card chip still has certain defects when being installed on the display card.
The existing display card chip has the following problems when being installed: a, when the existing display card chip is installed, the pins of the display card chip are damaged when being fixed, so that the display card chip is damaged, and the production efficiency is influenced by great waste cost; b: when current display card chip is depositing, often because of there is certain moisture on the environment reason leads to the display card chip, when the display card chip that contains moisture is installed on the display card after, when switching on, very easily causes the condition that the display card chip burns out to take place, extravagant cost.
In order to make up for the defects of the prior art, the invention provides a computer display card chip fixing and processing device.
Disclosure of Invention
The technical problem to be solved by the invention is realized by adopting the following technical scheme: the utility model provides a fixed processing equipment of computer graphics chip, includes mounting substrate and fixed external member, installs fixed external member on the mounting substrate, wherein:
the fixed external member includes the supporting legs, fixed frame, the connecting block, the chip fixed block, lift the board, the extrusion post, the jacking post, adjust pole and spiral chip pole, the supporting legs is evenly installed on mounting substrate through the welded mode, the fixed frame is installed through bolted connection's mode in the mounting substrate upper end, the fixed frame is the style of calligraphy structure, evenly install the connecting block through the welded mode on the fixed frame inner wall, above-mentioned connecting block is the trapezium structure, evenly set up the mounting groove A who uses with the connecting block mutually supporting on the fixed frame inner wall, the fixed frame inner wall evenly is provided with the chip fixed block, link together through the mode of joint between the chip fixed block, chip fixed block lower extreme evenly is provided with the lifting board, the lifting board is located fixed frame inboard, and the lifting board is installed on mounting substrate through spring coupling's mode, the extrusion post is installed through the welded mode to the lifting board lower extreme, the jacking post is supporting against the jacking post, the jacking post is installed on the mounting substrate inner wall through sliding connection mode, the jacking post outside evenly is provided with the regulation pole, the regulation pole is installed on the mounting substrate through sliding connection, the jacking post supports the spiral chip pole, thereby it carries out the chip to drive chip and carry out the chip and dry chip movement after the chip fixed block to the chip, thereby the chip operation of fixing piece.
Seted up on the chip fixed block and led to groove B, it is the notch cuttype structure to lead to groove B, it installs the double-layered sideboard through sliding connection's mode to follow its axial direction on the chip fixed block, it is L type structure to press from both sides the sideboard, double-layered sideboard surface parcel has rubber materials, it evenly is provided with the jacking subassembly along its axial direction on the groove B, the jacking subassembly is located inside the chip fixed block, lead to and install the pin protection shield through sliding connection's mode on the groove B inner wall, the spread groove has been seted up on the chip fixed block outer wall, and the welded mode is installed and is mutually supported the butt joint piece that uses with the spread groove, the butt joint piece is the trapezium structure, in operation, when the manual work is placed the chip on the chip fixed plate, the chip main part is located logical groove B's the top, later double-layered sideboard work, clip the chip main part, simultaneously, the pin of chip inserts in the pin protection shield, pin protection board work carries out drying process to the pin of chip, and protect the chip pin, thereby reach the purpose of fixed protection chip.
As a preferred technical scheme of the invention, the fixing frame is uniformly provided with the warming plates in a sliding connection mode, the warming plates are uniformly provided with the heating blocks inside, the surfaces of the warming plates are uniformly provided with the spring top plates in a spring connection mode, and the spring top plates are positioned right below the chip fixing blocks.
As a preferable technical scheme of the invention, rolling wheels are arranged on the extrusion columns in a bearing connection mode.
According to a preferred technical scheme, the jacking blocks are uniformly mounted on the jacking columns in a sliding connection mode, the jacking blocks are of a circular truncated cone structure, the jacking blocks abut against the extrusion columns, blind grooves C matched with the adjusting rods for use are uniformly formed in the top ends of the jacking blocks, sliding rods are arranged inside the blind grooves C, the sliding rods are mounted on the inner walls of the jacking blocks in a sliding connection mode, the extrusion blocks are uniformly arranged on the sliding rods, inner clamping plates abut against the extrusion blocks, the inner clamping plates are mounted on the inner walls of the extrusion blocks in a sliding connection mode, rectangular teeth are uniformly arranged on the surfaces of the inner clamping plates, and the inner clamping plates abut against the jacking columns.
As a preferred technical scheme, the jacking assembly comprises an extrusion base plate, a downlink rack, a transmission gear, a traction rack and a connecting rod, wherein the downlink rack is installed on a chip fixing block in a sliding connection mode, the extrusion base plate is installed on the downlink rack, the transmission gear which is used in a matched mode is arranged on the outer side of the downlink rack, the transmission gear is installed on the inner wall of the chip fixing block in a bearing connection mode, the traction rack which is used in a matched mode is arranged on the outer side of the transmission gear, the connecting rod is installed on the traction rack, and the connecting rod is connected with the bottom end of a side clamping plate.
As a preferred technical scheme of the invention, the pin protection plate is uniformly provided with pin abdicating grooves D matched with the chip pins for use, and the pin abdicating grooves are filled with absorbent cotton balls.
Compared with the prior art, the invention has the following advantages:
1. the invention can solve the following problems of the prior display card chip during installation: a, when the existing display card chip is installed, the pins of the display card chip are often damaged when being fixed, so that the display card chip is damaged, and the production efficiency is influenced by great waste cost; b: when current display card chip is depositing, often because of there is certain moisture on the environment reason leads to the display card chip, when the display card chip that contains moisture is installed on the display card after, when switching on, very easily causes the condition that the display card chip burns out to take place, extravagant cost.
2. According to the chip fixing block, the chip fixing block is designed, when a chip is manually placed on the chip fixing block, the edge clamping plate works to clamp the chip corners, so that the purpose of fixing the chip is achieved, meanwhile, the chip pins are inserted into the pin protection plate, the pin protection plate protects the chip pins, meanwhile, the butt-joint block on the chip fixing block facilitates the disassembly and butt-joint of different chip fixing blocks, when a single chip is required to be carried, the single chip fixing block can be taken out to be carried, the chip fixing block always protects the chip, and the chip damage caused by the damage of the chip pins is greatly avoided.
3. According to the chip pin drying device, the fixing frame is designed, the spiral rotating rod is manually rotated to drive the extruding plate to extrude the warming plate, the warming plate moves in the fixing frame, the purpose of adjusting the temperature of the chip pin is achieved by controlling the distance between the warming plate and the chip pin, meanwhile, when the warming plate moves, the spring top plate acts to prevent the warming plate and the chip fixing plate from being directly contacted, the situation that the pin is damaged due to overhigh temperature is avoided, when the chip pin is inserted into the pin protecting plate, the chip pin enters the pin receding groove D, water stain on the chip pin is absorbed by the water absorbing cotton ball, meanwhile, due to the effect of the fixing frame, the chip pin and the water absorbing cotton ball are dried, the chip pin is dried while the chip pin is protected, and the situation that the chip is burnt in the subsequent use process due to the fact that moisture exists on the chip pin is greatly avoided.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of a schematic of the structure of the present invention;
FIG. 3 isbase:Sub>A schematic cross-sectional view A-A of FIG. 2 of the present invention;
FIG. 4 is an enlarged schematic view of region A of FIG. 2 of the present invention;
FIG. 5 is a schematic cross-sectional view of the area B of FIG. 3 in accordance with the present invention;
FIG. 6 is an enlarged schematic view of region C of FIG. 3 of the present invention;
Detailed Description
In order to make the technical means, creation features, achievement objects and effects of the invention easy to understand, the invention is further described with reference to fig. 1 to 6.
The utility model provides a fixed processing equipment of computer graphics chip, includes mounting substrate 1 and fixed external member 2, installs fixed external member 2 on the mounting substrate 1, wherein:
the fixing kit 2 comprises supporting legs 21, a fixing frame 22, connecting blocks 23, chip fixing blocks 24, lifting plates 25, extrusion columns 26, jacking columns 27, adjusting rods 28 and spiral rotating rods 29, the supporting legs 21 are uniformly installed on a mounting substrate 1 in a welding mode, the fixing frame 22 is installed at the upper end of the mounting substrate 1 in a bolt connection mode, the fixing frame 22 is of a square structure, the connecting blocks 23 are uniformly installed on the inner wall of the fixing frame 22 in a welding mode, the connecting blocks 23 are of a trapezoidal structure, mounting grooves A matched with the connecting blocks 23 are uniformly formed in the inner wall of the fixing frame 22, the chip fixing blocks 24 are uniformly arranged on the inner wall of the fixing frame 22, the chip fixing blocks 24 are connected together in a clamping mode, the lifting plates 25 are uniformly arranged at the lower ends of the chip fixing blocks 24, and the lifting plates 25 are positioned on the inner side of the fixing frame 22, the lifting plate 25 is installed on the installation base plate 1 in a spring connection mode, the lower end of the lifting plate 25 is provided with an extrusion column 26 in a welding mode, the lower end of the extrusion column 26 abuts against a jacking column 27, the jacking column 27 is installed on the inner wall of the installation base plate 1 in a sliding connection mode, the outer side of the jacking column 27 is uniformly provided with adjusting rods 28, the adjusting rods 28 are installed on the installation base plate 1 in a sliding connection mode, the jacking column 27 abuts against a threaded rotating rod 29, the threaded rotating rod 29 is installed on the outer wall of the installation base plate 1 in a threaded connection mode, during specific work, a chip is manually placed on a chip fixing block 24, a chip fixing plate 24 works to fix the chip, meanwhile, the fixing block 22 works to dry the chip, then the threaded rotating rod 29 is manually rotated to drive the jacking column 27 to move, so as to drive the extrusion plate 26 to move, and thus achieving the purpose of adjusting the height of the lifting plate 25, thereby achieving the purpose of adjusting the internal temperature of the fixed block 22.
Install rolling wheel 261 through the mode that the bearing is connected on the extrusion post 26, during specific work, carry out because of the motion when extrusion post 26 is because of jacking post 27 squeezing action, the rolling wheel 261 effect on the extrusion post 26 assists the extrusion post 26 to move up, avoids the too big card pause phenomenon of appearing of extrusion post 26 resistance to influence the flitch 221 and rise, thereby influence drying effect.
Jacking blocks 271 are uniformly arranged on the jacking column 27 in a sliding connection mode, the jacking blocks 271 are of a circular truncated cone structure, the jacking blocks 271 abut against the extrusion column 26, blind grooves C matched with the adjusting rods 28 for use are uniformly formed in the top ends of the jacking blocks 271, sliding rods 272 are arranged inside the blind grooves C, the sliding rods 272 are arranged on the inner wall of the jacking blocks 271 in a sliding connection mode, extrusion blocks 273 are uniformly arranged on the sliding rods 272, inner clamping plates 274 abut against the inner walls of the extrusion blocks 273, the inner clamping plates 274 are arranged on the inner walls of the extrusion blocks 273 in a sliding connection mode, rectangular teeth are uniformly arranged on the surfaces of the inner clamping plates 274, the inner clamping plates 274 abut against the jacking column 27, when the jacking column 27 works, different adjusting rods 28 are adjusted manually, the adjusting rods 28 block the jacking blocks 271, when the spiral rotating rods 29 are manually to drive the jacking column 27 to move, the jacking blocks 271 under the action of the adjusting rods 28, the action of the sliding rods 272 move to drive the extrusion blocks 273 to move, the inner clamping rods 274 to further loosen the jacking column 27, so that the jacking blocks 271 do not move continuously, thereby the purpose of heating chip in a heating area is achieved, and the chip drying purpose is achieved.
Through groove B has been seted up on chip fixed block 24, it is the notch cuttype structure to lead to groove B, it installs clip sideboard 241 along its axial direction through sliding connection's mode on chip fixed block 24, clip sideboard 241 is L type structure, clip sideboard 241 surface coating has rubber materials, it evenly is provided with jacking subassembly 242 along its axial direction on the groove B to lead to, jacking subassembly 242 is located inside chip fixed block 24, install pin protection plate 243 through sliding connection's mode on leading to the groove B inner wall, the spread groove has been seted up on the chip fixed block 24 outer wall, and the welded mode is installed and is mutually supported butt joint piece 244 that uses with the spread groove on the chip fixed block 24 outer wall, butt joint piece 244 is the trapezium structure, during specific work, on placing chip fixed block 24 with the manual work, clip sideboard 241 work, clip the chip corner, thereby reach the fixed purpose of chip, simultaneously the chip pin inserts to pin protection plate 243, pin protection work is played the chip protection operation to the pin, butt joint piece 244 on chip fixed block 24 makes things convenient for dismantlement and the butt joint between the different chip fixed blocks 24.
The jacking assembly 242 comprises a squeezing cushion 2421, a descending rack 2422, a transmission gear 2423, a traction rack 2424 and a connecting rod 2425, the descending rack 2422 is installed on the chip fixing block 24 in a sliding connection mode, the squeezing cushion 2421 is installed on the descending rack 2422, the transmission gear 2423 which is matched with the descending rack 2422 is arranged on the outer side of the descending rack 2422, the transmission gear 2423 is installed on the inner wall of the chip fixing block 24 in a bearing connection mode, the traction rack 2424 which is matched with the transmission gear 2423 is arranged on the outer side of the transmission gear 2423, the connecting rod 2425 is installed on the traction rack 2424, and the connecting rod 2425 is connected with the bottom end of the edge clamping plate 241.
Evenly be provided with on the pin protection shield 243 and want to return pin groove D of stepping down of cooperation use with the chip pin, the inside packing of pin groove of stepping down has the cotton ball 2431 that absorbs water, concrete during operation, insert to the pin protection shield 243 in when the chip pin, the chip pin gets into in the pin groove D of stepping down, thereby the cotton ball 2431 that absorbs water absorbs the water stain on the chip pin, simultaneously because of fixed frame 22 effect, carry out drying process to the chip pin and the cotton ball 2431 that absorbs water, thereby carry out drying process to the chip pin when protecting the chip pin.
When in work:
s1, chip fixing: manually placing the chip on the chip fixing block 24, and clamping the edges and corners of the chip by the edge clamping plate 241 so as to fix the chip;
s2, temperature adjustment: after the chip is fixed, the spiral rotating rod 29 is manually rotated to drive the jacking column 27 to move, so that the extrusion plate 26 is driven to move, the purpose of adjusting the height of the lifting plate 25 is achieved, the extrusion plate 26 is driven to extrude the warming plate 221, so that the warming plate 221 moves in the fixing frame 22, and the purpose of adjusting the temperature of the chip pins is achieved by controlling the distance between the warming plate 221 and the chip pins;
s3, pin drying: after the temperature adjustment is completed, the warming plate 221 warms the water-absorbing cotton ball 2431, so that the water-absorbing cotton ball 2431 is dried after absorbing the water on the surface of the chip pin, thereby ensuring the dryness of the chip pin and achieving the purpose of drying the pin;
s4, chip taking: the edge clamping plate 241 is pulled manually, the connecting rod 2425 drives the traction rack 2424 to move, so that the transmission gear 2423 is driven to move under the meshing action of the gears, the downward rack 2422 moves upwards, the extrusion point half 2421 is driven to move upwards, and a chip is ejected out, so that the purpose of taking the chip is achieved;
and S5, repeating the steps from S1 to S4, and continuously carrying out the fixing protection operation of the display card chip.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a fixed processing equipment of computer display card chip, includes mounting substrate (1) and fixed external member (2), its characterized in that: install fixed external member (2) on mounting substrate (1), wherein:
the fixing kit (2) comprises supporting legs (21), a fixing frame (22), connecting blocks (23), chip fixing blocks (24), lifting plates (25), extrusion columns (26), jacking columns (27), adjusting rods (28) and spiral rotating rods (29), wherein the supporting legs (21) are uniformly installed on the mounting base plate (1) in a welding mode, the fixing frame (22) is installed at the upper end of the mounting base plate (1) in a bolt connection mode, the fixing frame (22) is of a square structure, the connecting blocks (23) are uniformly installed on the inner wall of the fixing frame (22) in a welding mode, the connecting blocks (23) are of a trapezoid structure, mounting grooves A matched with the connecting blocks (23) for use are uniformly formed in the inner wall of the fixing frame (22), the chip fixing blocks (24) are uniformly arranged on the inner wall of the fixing frame (22), the chip fixing blocks (24) are connected together in a clamping mode, the lifting plates (25) are uniformly arranged at the lower ends of the chip fixing blocks (24), the lifting plates (25) are located on the inner side of the fixing frame (22), the lifting plates (25) are installed on the mounting base plate (1) in a spring connection mode, the lower ends of the jacking columns (26) in a welding mode, the jacking columns (26) are installed on the inner wall of the mounting base plate (27) in a sliding mode, adjusting rods (28) are uniformly arranged on the outer sides of the jacking columns (27), the adjusting rods (28) are installed on the installation base plate (1) in a sliding connection mode, the jacking columns (27) abut against the spiral rotating rods (29), and the spiral rotating rods (29) are installed on the outer wall of the installation base plate (1) in a threaded connection mode;
seted up logical groove B on chip fixed block (24), logical groove B is the notch cuttype structure, it installs double-layered sideboard (241) to follow its axial direction on chip fixed block (24) through sliding connection's mode, double-layered sideboard (241) are L type structure, double-layered sideboard (241) surface coating has rubber materials, it evenly is provided with jacking subassembly (242) along its axial direction on the logical groove B, jacking subassembly (242) are located inside chip fixed block (24), install pin protection shield (243) through sliding connection's mode on leading to the groove B inner wall, the spread groove has been seted up on chip fixed block (24) outer wall, and the welded mode is installed and is mutually supported butt joint piece (244) that use with the spread groove on chip fixed block (24) outer wall, butt joint piece (244) are the trapezium structure.
2. The computer graphics card chip fixing and processing device of claim 1, wherein: the heating die is characterized in that the temperature material plate (221) is evenly installed on the fixing frame (22) in a sliding connection mode, the heating block (222) is evenly installed inside the temperature material plate (221), the spring top plate (223) is evenly installed on the surface of the temperature material plate (221) in a spring connection mode, and the spring top plate (223) is located right below the chip fixing block (24).
3. The computer graphics card chip fixing and processing device of claim 1, wherein: and rolling wheels (261) are arranged on the extrusion columns (26) in a bearing connection mode.
4. The computer graphics card chip fixing and processing device of claim 1, wherein: jacking piece (271) are evenly installed through sliding connection's mode on jacking post (27), jacking piece (271) are round platform shape structure, support and lean on extrusion post (26) on jacking piece (271), jacking piece (271) top evenly is provided with the blind groove C who uses with adjusting pole (28) and mutually support, blind groove C is inside to be provided with slide bar (272), slide bar (272) are installed on jacking piece (271) inner wall through sliding connection's mode, evenly be provided with extrusion piece (273) on slide bar (272), support and lean on interior splint (274) on extrusion piece (273), interior splint (274) are installed on extrusion piece (273) inner wall through sliding connection's mode, interior splint (274) surface evenly is provided with the rectangle tooth, interior splint (274) board is supporting and is leaning on jacking post (27).
5. The computer graphics card chip fixing and processing device of claim 1, wherein: the jacking assembly (242) comprises a squeezing cushion plate (2421), a descending rack (2422), a transmission gear (2423), a traction rack (2424) and a connecting rod (2425), the descending rack (2422) is installed on the chip fixing block (24) in a sliding connection mode, the squeezing cushion plate (2421) is installed on the descending rack (2422), the transmission gear (2423) which is matched with each other for use is arranged on the outer side of the descending rack (2422), the transmission gear (2423) is installed on the inner wall of the chip fixing block (24) in a bearing connection mode, the traction rack (2424) which is matched with each other for use is arranged on the outer side of the transmission gear (2423), the connecting rod (2425) is installed on the traction rack (2424), and the bottom ends of the connecting rod (2425) and the edge clamping plate (241) are connected together.
6. The computer graphics card chip fixing and processing device of claim 1, wherein: the pin protection plate (243) is uniformly provided with pin abdicating grooves D matched with chip pins for use, and the pin abdicating grooves are filled with absorbent cotton balls (2431).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010852933.9A CN111952236B (en) | 2020-08-22 | 2020-08-22 | Fixed processing equipment of computer display card chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010852933.9A CN111952236B (en) | 2020-08-22 | 2020-08-22 | Fixed processing equipment of computer display card chip |
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| Publication Number | Publication Date |
|---|---|
| CN111952236A CN111952236A (en) | 2020-11-17 |
| CN111952236B true CN111952236B (en) | 2023-02-03 |
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| CN202010852933.9A Active CN111952236B (en) | 2020-08-22 | 2020-08-22 | Fixed processing equipment of computer display card chip |
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