CN111952208A - 侦测晶圆设定范围内平整度变化的方法 - Google Patents
侦测晶圆设定范围内平整度变化的方法 Download PDFInfo
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- CN111952208A CN111952208A CN202010700113.8A CN202010700113A CN111952208A CN 111952208 A CN111952208 A CN 111952208A CN 202010700113 A CN202010700113 A CN 202010700113A CN 111952208 A CN111952208 A CN 111952208A
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 235000012431 wafers Nutrition 0.000 claims abstract description 106
- 238000001514 detection method Methods 0.000 claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 26
- 238000005498 polishing Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052710 silicon Inorganic materials 0.000 abstract description 12
- 239000010703 silicon Substances 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 4
- 230000002159 abnormal effect Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 12
- 238000004364 calculation method Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010700113.8A CN111952208B (zh) | 2020-07-17 | 侦测晶圆设定范围内平整度变化的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010700113.8A CN111952208B (zh) | 2020-07-17 | 侦测晶圆设定范围内平整度变化的方法 |
Publications (2)
Publication Number | Publication Date |
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CN111952208A true CN111952208A (zh) | 2020-11-17 |
CN111952208B CN111952208B (zh) | 2024-07-30 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005164A (ja) * | 2004-06-17 | 2006-01-05 | Shin Etsu Handotai Co Ltd | ウエーハの形状評価方法及び管理方法 |
US20140114597A1 (en) * | 2012-10-19 | 2014-04-24 | Kla-Tencor Corporation | Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool |
CN107243826A (zh) * | 2017-07-06 | 2017-10-13 | 天津华海清科机电科技有限公司 | 调整cmp后晶圆膜厚均匀性的方法 |
WO2020049911A1 (ja) * | 2018-09-05 | 2020-03-12 | 信越半導体株式会社 | ウェーハ形状データ化方法 |
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005164A (ja) * | 2004-06-17 | 2006-01-05 | Shin Etsu Handotai Co Ltd | ウエーハの形状評価方法及び管理方法 |
US20140114597A1 (en) * | 2012-10-19 | 2014-04-24 | Kla-Tencor Corporation | Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool |
US10379061B1 (en) * | 2012-10-19 | 2019-08-13 | Kla-Tencor Corporation | Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool |
CN107243826A (zh) * | 2017-07-06 | 2017-10-13 | 天津华海清科机电科技有限公司 | 调整cmp后晶圆膜厚均匀性的方法 |
WO2020049911A1 (ja) * | 2018-09-05 | 2020-03-12 | 信越半導体株式会社 | ウェーハ形状データ化方法 |
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Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant before: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20230517 Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Applicant after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. |
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Country or region after: China Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Applicant after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region before: China Applicant before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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