CN111945082A - 一种铜基钯涂层复合键合材料 - Google Patents
一种铜基钯涂层复合键合材料 Download PDFInfo
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Abstract
本发明涉及复合键合材料技术领域,具体是一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜70~90份、银30~40份、钯10~20份、锌5~11份、碳纤维增强体9~11份、铬0.3~1.6份、锂0.3~1.6份、钙0.2~2份、铝0.3~1.6份、钇0.05~0.15份;本申请整体材料成分底,成分配制易于得到,并且能够有效解决传统键合引线的价格昂贵、表面易氧化、键合性能差、易出现拉拔断线的问题。
Description
技术领域
本发明涉及复合键合材料技术领域,具体是一种铜基钯涂层复合键合材料。
背景技术
随着社会的发展和科技的不断进步,越来越多的复合材料出现在人们的身边,复合材料作为一种人们运用先进的材料制备技术将不同性质的材料组分优化组合而成的新材料,在航空航天、汽车工业、化工纺织和机械制造等领域得到广泛的应用,促进着现代高科技的发展。复合材料通常分为金属和非金属两大类,其中,金基合金作为金属复合材料的一种,通常是以金为基体,并向其中加入其它金属元素组成的合金。现在的金基银钯复合键合材料的由于材料和工艺的问题,纯度不够,影响产品的质量和使用的寿命。
中国专利(授权公告号:CN111041267A)公布了一种高纯度金基银钯复合键合材料,该发明设计采用配方和工艺制作的金基银钯复合键合材料,但是金本身是非常昂贵的金属材料,虽然居然极好的延展性,但是成本过高,如何降低作业成本,保证复合键合的效果是现有技术需要改进的问题。
发明内容
本发明的目的在于提供一种铜基钯涂层复合键合材料,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜70~90份、银30~40份、钯10~20份、锌5~11份、碳纤维增强体9~11份、铬0.3~1.6份、锂0.3~1.6份、钙0.2~2份、铝0.3~1.6份、钇0.05~0.15份。
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜70份、银40份、钯10份、锌5份、碳纤维增强体9份、铬0.3份、锂0.3份、钙2份、铝1.6份、钇0.15份。
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜90份、银30份、钯20份、锌11份、碳纤维增强体11份、铬1.6份、锂6份、钙0.2份、铝0.3份、钇0.05份。
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜80份、银35份、钯15份、锌8份、碳纤维增强体10份、铬0.8份、锂3份、钙1.5份、铝1.2份、钇0.09份
本申请还公布所述的铜基钯涂层复合键合材料的制备方法,包括以下步骤:
步骤一:按比例称取各原料;
步骤二:将上述各材料用质量浓度为5%~8%的氢氧化钠水溶液清洗,再用去离子水清洗,烘干,得到预处理坯料;
步骤三:将上述预处理坯料将上述预处理坯料中的铜锭投放于真空熔铸炉中,以40~50℃/min的速度升温至500~600℃,保温30min,再以40~50℃/min的速度升温至1100~1200℃,保温30min;后续关闭电源,再将合金熔体冷却,得合金坯块;
步骤四:将上述合金坯块B投入至真空下拉连铸炉中,以50℃/min的速度升温至1100~1200℃,持续加热至完全熔化,精炼30min,静置保温10-25min,得到金属熔融液;
步骤五:采用定向凝固的技术方法,将金属熔融液浇入到模具内,然后通过风冷的方式进行冷却,冷却速度控制在20-25℃/min,当材料温度降至80℃以下时,置于室温下进行自然冷却,得到成品。
作为本发明进一步的方案:步骤三与步骤四均要求于真空环境下作业,待真空度高于5×10-2Pa后,充入高纯氩气。
作为本发明再进一步的方案:步骤五金属熔融液浇铸冷却时,采用变向式风冷作业方式。
与现有技术相比,本发明的有益效果是:
本申请以铜制合金为基础材料,以铜作为基本金属合金主体,以银作为辅助材料,相比较金,银的价格成本更低,但是能够使晶粒细化,也能够有效的提高合金的拉丝延展性;再加入少量锂、钙、铝、钇配置,能够提高铜合金键合引线的抗拉和抗氧化性能,改善铜合金键合引线的机械强度,同时本申请还辅助添加有碳纤维增强体、钙等成分,而缩小铜合金键合引线的线径,提高键合性能;还加入少量的铬,用于提高整体的刚度,钯材料为镀面材料,能够解决表面易氧化的问题。
本申请整体材料成分底,成分配制易于得到,并且能够有效解决传统键合引线的价格昂贵、表面易氧化、键合性能差、易出现拉拔断线的问题。
应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本申请。
具体实施方式
显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例一:
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜70份、银40份、钯10份、锌5份、碳纤维增强体9份、铬0.3份、锂0.3份、钙2份、铝1.6份、钇0.15份。
本实施例所述铜基钯涂层复合键合材料的制备方法,包括以下步骤:
步骤一:按比例称取各原料;
步骤二:将上述各材料用质量浓度为5%~8%的氢氧化钠水溶液清洗,再用去离子水清洗,烘干,得到预处理坯料;
步骤三:将上述预处理坯料将上述预处理坯料中的铜锭投放于真空熔铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以40~50℃/min的速度升温至500~600℃,保温30min,再以40~50℃/min的速度升温至1100~1200℃,保温30min;后续关闭电源,再将合金熔体冷却,得合金坯块;
步骤四:将上述合金坯块B投入至真空下拉连铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以50℃/min的速度升温至1100~1200℃,持续加热至完全熔化,精炼30min,静置保温10-25min,得到金属熔融液;
步骤五:采用定向凝固的技术方法,将金属熔融液浇入到模具内,然后通过风冷的方式进行冷却,金属熔融液浇铸冷却时,可采用变向式风冷作业方式,增加空气对流,提高风冷的速率。冷却速度控制在20-25℃/min,便于对材料温度进行实时掌控,当材料温度降至80℃以下时,置于室温下进行自然冷却,得到成品。
实施例二:
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜70份、银40份、钯10份、锌5份、碳纤维增强体9份、铬0.3份、锂0.3份、钙2份、铝1.6份、钇0.15份。
本实施例所述铜基钯涂层复合键合材料的制备方法,包括以下步骤:
步骤一:按比例称取各原料;
步骤二:将上述各材料用质量浓度为5%~8%的氢氧化钠水溶液清洗,再用去离子水清洗,烘干,得到预处理坯料;
步骤三:将上述预处理坯料将上述预处理坯料中的铜锭投放于真空熔铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以40~50℃/min的速度升温至500~600℃,保温30min,再以40~50℃/min的速度升温至1100~1200℃,保温30min;后续关闭电源,再将合金熔体冷却,得合金坯块;
步骤四:将上述合金坯块B投入至真空下拉连铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以50℃/min的速度升温至1100~1200℃,持续加热至完全熔化,精炼30min,静置保温10-25min,得到金属熔融液;
步骤五:采用定向凝固的技术方法,将金属熔融液浇入到模具内,然后通过风冷的方式进行冷却,金属熔融液浇铸冷却时,可采用变向式风冷作业方式,增加空气对流,提高风冷的速率。冷却速度控制在20-25℃/min,便于对材料温度进行实时掌控,当材料温度降至80℃以下时,置于室温下进行自然冷却,得到成品。
实施例三:
一种铜基钯涂层复合键合材料,由以下重量份的原料组成:包括铜80份、银35份、钯15份、锌8份、碳纤维增强体10份、铬0.8份、锂3份、钙1.5份、铝1.2份、钇0.09份。
本实施例所述铜基钯涂层复合键合材料的制备方法,包括以下步骤:
步骤一:按比例称取各原料;
步骤二:将上述各材料用质量浓度为5%~8%的氢氧化钠水溶液清洗,再用去离子水清洗,烘干,得到预处理坯料;
步骤三:将上述预处理坯料将上述预处理坯料中的铜锭投放于真空熔铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以40~50℃/min的速度升温至500~600℃,保温30min,再以40~50℃/min的速度升温至1100~1200℃,保温30min;后续关闭电源,再将合金熔体冷却,得合金坯块;
步骤四:将上述合金坯块B投入至真空下拉连铸炉中,真空度高于5×10-2Pa后,充入高纯氩气,以50℃/min的速度升温至1100~1200℃,持续加热至完全熔化,精炼30min,静置保温10-25min,得到金属熔融液;
步骤五:采用定向凝固的技术方法,将金属熔融液浇入到模具内,然后通过风冷的方式进行冷却,金属熔融液浇铸冷却时,可采用变向式风冷作业方式,增加空气对流,提高风冷的速率。冷却速度控制在20-25℃/min,便于对材料温度进行实时掌控,当材料温度降至80℃以下时,置于室温下进行自然冷却,得到成品。
对比例一,现有高纯度金基银钯复合键合材料A,由以下重量份的原料组成:金70-90份、银60-80份、钯10-20份、铜3-8份、锌1-2份、铬0.3-1.6份和钌0.5-1.4份。
对比例二,现有高纯度金基银钯复合键合材料B,由以下重量份的原料组成:金60-90份、银5-15份、钯1-5份、铂3-12份、锌5-10份、锡1-5份、铌2-8份、镍6-13份、钽3-9份、铈2-6份。
对比例三,现有高纯度铜银钯多重复合键合材料C,由以下重量份的原料组成:钯13~17份、铜15~25份、硅粉12~14份、钢纤维13~17份、钴2~3份、银2~3份、混合型稀土3~5份。
本发明以钯的纯度不低于99.999%的钯材料为镀面材料,验证本申请所述铜基钯涂层复合键合材料的实用性。
本发明的工作原理是:本申请以铜制合金为基础材料,以铜作为基本金属合金主体,以银作为辅助材料,相比较金,银的价格成本更低,但是能够使晶粒细化,也能够有效的提高合金的拉丝延展性;再加入少量锂、钙、铝、钇配置,能够提高铜合金键合引线的抗拉和抗氧化性能,改善铜合金键合引线的机械强度,同时本申请还辅助添加有碳纤维增强体、钙等成分,而缩小铜合金键合引线的线径,提高键合性能;还加入少量的铬,用于提高整体的刚度,钯材料为镀面材料,能够解决表面易氧化的问题。
本申请整体材料成分底,成分配制易于得到,并且能够有效解决传统键合引线的价格昂贵、表面易氧化、键合性能差、易出现拉拔断线的问题。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
Claims (7)
1.一种铜基钯涂层复合键合材料,其特征在于,由以下重量份的原料组成:包括铜70~90份、银30~40份、钯10~20份、锌5~11份、碳纤维增强体9~11份、铬0.3~1.6份、锂0.3~1.6份、钙0.2~2份、铝0.3~1.6份、钇0.05~0.15份。
2.根据权利要求1所述的铜基钯涂层复合键合材料,其特征在于,由以下重量份的原料组成:包括铜70份、银40份、钯10份、锌5份、碳纤维增强体9份、铬0.3份、锂0.3份、钙2份、铝1.6份、钇0.15份。
3.根据权利要求1所述的铜基钯涂层复合键合材料,其特征在于,由以下重量份的原料组成:包括铜90份、银30份、钯20份、锌11份、碳纤维增强体11份、铬1.6份、锂6份、钙0.2份、铝0.3份、钇0.05份。
4.根据权利要求1所述的铜基钯涂层复合键合材料,其特征在于,由以下重量份的原料组成:包括铜80份、银35份、钯15份、锌8份、碳纤维增强体10份、铬0.8份、锂3份、钙1.5份、铝1.2份、钇0.09份。
5.根据权利要求1-4任一所述的铜基钯涂层复合键合材料的制备方法,其特征在于,包括以下步骤:
步骤一:按比例称取各原料;
步骤二:将上述各材料用质量浓度为5%~8%的氢氧化钠水溶液清洗,再用去离子水清洗,烘干,得到预处理坯料;
步骤三:将上述预处理坯料将上述预处理坯料中的铜锭投放于真空熔铸炉中,以40~50℃/min的速度升温至500~600℃,保温30min,再以40~50℃/min的速度升温至1100~1200℃,保温30min;后续关闭电源,再将合金熔体冷却,得合金坯块;
步骤四:将上述合金坯块B投入至真空下拉连铸炉中,以50℃/min的速度升温至1100~1200℃,持续加热至完全熔化,精炼30min,静置保温10-25min,得到金属熔融液;
步骤五:采用定向凝固的技术方法,将金属熔融液浇入到模具内,然后通过风冷的方式进行冷却,冷却速度控制在20-25℃/min,当材料温度降至80℃以下时,置于室温下进行自然冷却,得到成品。
6.根据权利要求5所述的铜基钯涂层复合键合材料的制备方法,其特征在于,步骤三与步骤四均要求于真空环境下作业,待真空度高于5×10-2Pa后,充入高纯氩气。
7.根据权利要求5所述的铜基钯涂层复合键合材料的制备方法,其特征在于,步骤五金属熔融液浇铸冷却时,采用变向式风冷作业方式。
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