CN111941272B - Voltage regulation method of load sensor - Google Patents
Voltage regulation method of load sensor Download PDFInfo
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- CN111941272B CN111941272B CN202010380491.2A CN202010380491A CN111941272B CN 111941272 B CN111941272 B CN 111941272B CN 202010380491 A CN202010380491 A CN 202010380491A CN 111941272 B CN111941272 B CN 111941272B
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000005484 gravity Effects 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 8
- 238000005498 polishing Methods 0.000 description 59
- 238000010586 diagram Methods 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/167—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using piezoelectric means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Provided is a voltage adjustment method for a load sensor, which uses the load sensor to appropriately measure a load. The voltage adjustment unit (9) is adjusted (1 st to 3 rd adjustment steps) so that the voltage values calculated by the measuring device (8) become the same even when a load is applied to the vicinity of any one of the 1 st sensor (71), the 2 nd sensor (72), and the 3 rd sensor (73) in the chuck table (2). In the repeating step, the 1 st to 3 rd adjustment steps are repeated. By adjusting the voltage adjustment unit (9) in this way, when the sensors (71-73) receive a predetermined load, that is, when the vicinity of the sensors (71-73) in the chuck table (2) receive a predetermined load, the total voltage calculated by the measuring instrument (8) can be equalized, and therefore, the measurement value of the load in the measuring instrument (8) can be equalized.
Description
Technical Field
The present invention relates to a voltage adjustment method for a load sensor.
Background
In order to strengthen the flexural strength of the wafer, for example, grinding marks formed on the wafer by grinding with a grinding tool are removed by a grinding process performed with a grinding pad. The polishing process is performed by pressing a polishing pad against a wafer with a predetermined load. That is, the amount of polishing removal varies depending on the magnitude of the load. In the plurality of polishing apparatuses, polishing is performed with the same load, so that the polishing removal amount can be made the same.
For example, as shown in patent document 1, the load applied to the wafer from the polishing pad is detected as follows. The load sensors each composed of a piezoelectric element are disposed at the apexes of a regular triangle having the center of the chuck table as the center of gravity. A total value of the loads measured by the three load sensors is obtained, and the total value is used as the load to which the wafer is subjected.
The load sensor is disposed on the chuck table or the polishing unit in a state where the load sensor is compressed to a certain extent by applying a predetermined compression pressure (pressurization) to the piezoelectric element. The output value of the load sensor is zero-adjusted so as to be zero when no load is applied. When the load sensor is compressed by receiving a load, a positive voltage is generated. The voltage is converted to a load, thereby measuring the load applied to the wafer on the chuck table.
Patent document 1: japanese patent laid-open No. 2015-036166
As described above, a predetermined pressurization is applied to the three load sensors. Here, when the pressurization of each load sensor is different, the voltage generated from each load sensor varies even if the same load is received. In order to prevent such a difference from being generated, it is necessary to equalize the pressures applied to the three load sensors. However, it is difficult to uniformly apply pressure to the three load sensors.
Disclosure of Invention
The purpose of the present invention is to provide a method for adjusting the voltage of a load sensor, which is used to appropriately measure the load.
In the voltage adjustment method (the present adjustment method) of a load sensor according to the present invention, at least three load sensors that generate voltages corresponding to a load to be received are arranged at apexes of a triangle, a load receiving portion is supported by the at least three load sensors, and when a load applied to the load receiving portion is measured by a measurer based on the voltages generated from the at least three load sensors, the voltage received by the measurer from each load sensor is adjusted by a voltage adjustment portion arranged between each load sensor and the measurer so that the measurer receives the same voltage when each load sensor receives a predetermined load, the voltage adjustment method of a load sensor includes: a preparation step of preparing a load applying unit that applies a predetermined load to the load receiving section, and a measuring instrument that receives voltages generated from the 1 st sensor, the 2 nd sensor, and the 3 rd sensor, which are the at least three load sensors, respectively, calculates a total voltage of the 1 st sensor, the 2 nd sensor, and the 3 rd sensor, and measures the load applied to the load receiving section based on the total voltage; and repeating the steps including a 1 st adjustment step, a 2 nd adjustment step, and a 3 rd adjustment step, and repeating the 1 st adjustment step, the 2 nd adjustment step, and the 3 rd adjustment step, wherein the 1 st adjustment step applies the predetermined load to the vicinity of the 1 st sensor in the load receiving section by the load applying means, adjusts the voltage adjusting section for the 1 st sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load, the 2 nd adjustment step applies the predetermined load to the vicinity of the 2 nd sensor in the load receiving section by the load applying means, adjusts the voltage adjusting section for the 2 nd sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load, and the 3 rd adjustment step applies the predetermined load to the vicinity of the 3 rd sensor in the load receiving section by the load applying means, adjusts the voltage adjusting section for the 3 rd sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load, and when the predetermined load can be received by the respective repeated load sensors.
In the voltage adjustment method, the at least three load sensors may be disposed at vertices of a regular triangle, and a center of gravity of the regular triangle may coincide with a center of the load receiving portion.
In the repetition of the adjustment method, the 1 st to 3 rd adjustment steps are performed, and the voltage adjustment unit is adjusted so that the total voltage calculated in the measuring device becomes the same value when a load is applied to the vicinity of any one of the 1 st to 3 rd sensors in the load receiving unit. In the repeating step, the 1 st to 3 rd adjustment steps are repeated.
By adjusting the voltage adjustment unit in this way, when each load sensor receives a predetermined load, that is, when the vicinity of each load sensor in the load receiving unit receives a predetermined load, the total voltage calculated by the measuring instrument can be equalized, and therefore the measurement values of the load in the measuring instrument can be equalized.
Here, the load receiving portion is, for example, a chuck table in the polishing apparatus or a spindle that rotates the polishing pad unit. Therefore, by adjusting the polishing apparatus by the present adjustment method, the load applied to the wafer can be controlled with higher accuracy when polishing the wafer. As a result, the accuracy of the polishing removal amount can be improved.
Further, by adjusting the plurality of polishing apparatuses by the present adjustment method, even when the same load is applied to the load receiving portions of the plurality of polishing apparatuses, the measured values of the load in the measuring instrument can be equalized. Thus, even when polishing a wafer using a plurality of polishing apparatuses, the result of the polishing operation can be made substantially uniform for each polishing apparatus.
Drawings
Fig. 1 is a perspective view showing the structure of the polishing apparatus.
Fig. 2 is an explanatory diagram showing a structure in the vicinity of the chuck table.
Fig. 3 is an explanatory diagram showing a positional relationship between a holding surface of a chuck table and a load sensor.
Fig. 4 is an explanatory diagram showing a state in which the load applying unit is mounted on the chuck table.
Fig. 5 (a) to (f) are explanatory diagrams showing changes in load values in the measuring instrument by the 1 st to 3 rd adjustment steps in the repetition step.
Fig. 6 is a cross-sectional view showing a manner in which a load sensor is disposed between the housing and the bracket.
Fig. 7 is an explanatory diagram showing a positional relationship between the spindle and the load sensor.
Description of the reference numerals
1: a grinding device; 10: a base; 11: a column; 12: a cover; 13: creasing; 2: a chuck table; 20: a suction unit; 20a: a holding surface; 21: a frame; 22: a base station; 3: a grinding unit; 30: a main shaft; 31: a housing; 32: a motor; 33: a mounting base; 34: a polishing pad unit; 340: a circular plate; 341: a polishing member; 4: a grinding feed unit; 40: a ball screw; 41: a guide rail; 42: a motor; 43: a lifting plate; 44: a support; 6: a load applying unit; 60: a cylinder; 61: a piston; 62: an air source; 71: a 1 st sensor; 72: a 2 nd sensor; 73: a 3 rd sensor; 74: a screw; 8: a measurer; 9: a voltage adjustment unit; 91: 1 st adjuster; 92: a 2 nd adjuster; 93: a 3 rd regulator; w: a wafer; wa: the front side of the wafer.
Detailed Description
1 about the polishing apparatus
The polishing apparatus 1 shown in fig. 1 is a polishing apparatus for polishing a wafer W by bringing a polishing member 341 into contact with the wafer W held by a chuck table 2. The polishing apparatus 1 will be described below.
As shown in fig. 1, the polishing apparatus 1 includes: a base 10 extending along the Y-axis direction; and a column 11 erected on the +y direction side of the base 10.
The chuck table 2 is provided on the base 10 of the polishing apparatus 1. The chuck table 2 is a disk-shaped table for holding a wafer W, and the chuck table 2 includes: a suction unit 20 having a holding surface 20a; and a housing 21 that supports the suction unit 20. In a state where the wafer W is placed on the holding surface 20a, the suction force by a suction source, not shown, is transmitted to the holding surface 20a, and the wafer W is sucked and held by the holding surface 20 a.
A cover 12 is disposed around the chuck table 2. The cover 12 is telescopically coupled with the bellows 13. The cover 12 and the chuck table 2 are integrally reciprocated in the Y-axis direction by a moving unit in the Y-axis direction provided in the base 10 during polishing of the wafer W. The wrinkles 13 expand and contract with the Y-axis movement of the cover 12.
The column 11 has a polishing feed unit 4 on a side surface on the-Y direction side for moving the polishing unit 3 up and down.
The polishing feed unit 4 has: a ball screw 40 having a rotation axis in the Z-axis direction; a pair of guide rails 41 disposed parallel to the ball screw 40; a motor 42 that rotates the ball screw 40; a lifting plate 43 in sliding contact with the guide rail 41; and a bracket 44 connected to the lifting plate 43.
A nut portion 45 (see fig. 2) screwed with the ball screw 40 is formed on the back surface of the lifting plate 43. When the ball screw 40 is rotated by the motor 42, the lifting plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction. The holder 44 coupled to the lifting plate 43 is lifted and lowered in the Z-axis direction.
The polishing unit 3 is supported by the holder 44 and moves up and down in the Z-axis direction together with the holder 44.
The polishing unit 3 has: a main shaft 30; a housing 31 that supports the spindle 30; and a motor 32 that rotates the spindle 30 about a rotation axis in the Z-axis direction. A mount 33 is connected to the lower end of the main shaft 30. A polishing pad unit 34 is fixed to the lower surface of the mount 33. The polishing pad unit 34 includes a circular plate 340 coupled to the lower surface of the mount 33, and a polishing member 341 disposed at the lower end of the circular plate 340. The polishing member 341 is made of, for example, nonwoven fabric such as felt.
In the polishing process, as shown in fig. 2, the wafer W is sucked and held on the holding surface 20a of the chuck table 2 with the protective tape T interposed therebetween. The spindle 30 rotates around the rotation axis in the Z-axis direction, and the mount 33 and the polishing pad unit 34 rotate accordingly. The polishing member 341 of the rotating polishing pad unit 34 abuts against the front surface Wa of the wafer W, and polishes the front surface Wa of the wafer W.
As shown in fig. 2, a base 22 for supporting the chuck table 2 is disposed below the chuck table 2. A 1 st sensor 71, a 2 nd sensor 72 (see fig. 3), and a 3 rd sensor 73 as load sensors are disposed between the chuck table 2 and the base 22.
As shown in fig. 3, the sensors 71 to 73 are disposed at positions corresponding to the outer peripheral portions of the circular holding surface 20a of the chuck table 2. The triangle formed by connecting the arrangement positions of the sensors 71 to 73 is a regular triangle having a center of gravity that coincides with the center O1 of the holding surface 20 a.
As shown in fig. 2, the sensors 71 to 73 are screwed between the chuck table 2 and the base 22 by screws 74. Therefore, the sensors 71 to 73 support the chuck table 2, and receive the load applied to the chuck table 2 as the load receiving portion.
The sensors 71 to 73 have piezoelectric elements, and generate voltages corresponding to the loads received. That is, the greater the load received by each of the sensors 71 to 73, the greater the voltage generated. Therefore, for example, when a load is applied to the vicinity of the 1 st sensor 71 in the chuck table 2, the voltage generated from the 1 st sensor 71 is larger than the voltages generated from the 2 nd sensor 72 and the 3 rd sensor 73.
As shown in fig. 3, the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 are connected to the measuring instrument 8 via the voltage adjusting unit 9.
When a load is applied to the chuck table 2 and the sensors 71 to 73 receive the load and a voltage is generated from each of the sensors 71 to 73, the measuring instrument 8 receives the voltage from each of the sensors 71 to 73. The measuring device 8 sums the received voltages to calculate a total voltage, and measures (calculates) the load applied to the chuck table 2 based on the calculated total voltage. The measuring device 8 may display the measured load value on a monitor not shown.
The voltage adjustment unit 9 includes a 1 st voltage adjuster 91 as a voltage adjustment unit for the 1 st sensor 71, a 2 nd voltage adjuster 92 as a voltage adjustment unit for the 2 nd sensor 72, and a 3 rd voltage adjuster 93 as a voltage adjustment unit for the 3 rd sensor 73.
The 1 st voltage regulator 91 is interposed between the 1 st sensor 71 and the measuring instrument 8, and regulates the voltage generated from the 1 st sensor 71 and received by the measuring instrument 8. The 2 nd voltage regulator 92 is interposed between the 2 nd sensor 72 and the measuring instrument 8, and regulates the voltage generated from the 2 nd sensor 72 and received by the measuring instrument 8. The 3 rd voltage regulator 93 is interposed between the 3 rd sensor 73 and the measuring instrument 8, and regulates the voltage generated from the 3 rd sensor 73 and received by the measuring instrument 8.
In the present embodiment, when the sensors 71 to 73 receive a predetermined identical load, that is, when the vicinity of the sensors 71 to 73 in the chuck table 2 receives a predetermined identical load, the voltage adjustment by the voltage adjusters 91 to 93 is performed so that the measuring instrument 8 receives the identical voltage from the sensors 71 to 73.
2 voltage regulating method of load sensor
Next, a voltage adjustment method (this adjustment method) of the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 as load sensors in the polishing apparatus 1 will be described.
In the present adjustment method, when a predetermined identical load is applied to the vicinity of each of the sensors 71 to 73 in the chuck table 2, the measuring device 8 adjusts the voltage adjusters 91 to 93 (specifically, the amplification factors of the voltage adjusters 91 to 93) so that the identical voltages are received from the respective sensors 71 to 73. In the present adjustment method, the amplification factors of the voltage regulators 91 to 93 may be 1 or more, or the amplification factors of the voltage regulators 91 to 93 may be 1 or less.
[ preparation procedure ]
In the present adjustment method, the above-described measuring instrument 8 and the load applying unit 6 shown in fig. 4 are first prepared. The load applying unit 6 is configured to apply a load to the chuck table 2 as a load receiving portion, and is detachably disposed between the chuck table 2 and the polishing member 341 of the polishing pad unit 34.
The load applying unit 6 is an air cylinder having a piston 61 and a cylinder 60 housing the piston 61. The space inside the cylinder 60 is connected to an air source 62.
In the load applying unit 6, air is supplied from the air source 62 into the cylinder 60, so that the piston 61 can be forced from below to raise the piston 61 in the +z direction. As the piston 61 rises, the piston 61 pushes the polishing member 341 upward, and the cylinder 60 pushes the chuck table 2 downward, so that a load can be applied to a set portion of the load applying unit 6 in the chuck table 2.
Further, a predetermined load may be applied to the sensors 71 to 73 in the chuck table 2 by placing a weight on the chuck table 2.
[ 1 st repetition procedure ]
(adjustment procedure 1)
In the 1 st adjustment step, a predetermined load is applied to the vicinity of the 1 st sensor 71 in the chuck table 2 by using the load applying means 6. Specifically, as shown in fig. 4, first, the polishing member 341 of the polishing pad unit 34 is disposed above the chuck table 2 so as to be separated from the chuck table 2 by a predetermined distance.
Next, the load applying unit 6 is positioned in the vicinity of the 1 st sensor 71 in the chuck table 2. Then, air is supplied from the air source 62 to the inside of the cylinder 60, thereby raising the piston 61. Thus, the piston 61 pushes the polishing member 341 upward, and the cylinder 60 pushes the chuck table 2 downward. As a result, a load is applied to the vicinity of the 1 st sensor 71 in the chuck table 2.
In the present adjustment method, the load applied from the load applying unit 6 to the chuck table 2 is a predetermined load set in advance, and in the example shown in the present embodiment, the load is 300N.
When a load of 300N is applied to the vicinity of any one of the sensors (the 1 st sensor 71 in the 1 st adjustment step) in the chuck table 2, the true load value applied to that sensor is 200N, and the true load value applied to the other two sensors (the 2 nd sensor 72 and the 3 rd sensor 73 in the 1 st adjustment step) is 1/4 of 200N, that is, 50N.
As the load is applied, voltages are generated from the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73, respectively, and the total value of the voltages is calculated by the measuring device 8. The measuring device 8 measures the load value applied to the chuck table 2 based on the calculated total voltage and displays the measured load value on a monitor not shown.
Fig. 5 shows an example of the measurement result of the load value. In this example, as shown in fig. 5 (a), in the 1 st adjustment step in the "1 st repetition step", the following precondition is given: before adjustment, the measuring device 8 measures a load value 1.1 times the load received by the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73. Thus, the load value of the total value of the three sensors 71 to 73 measured by the measuring instrument 8 is 330N with respect to the applied load (300N). Thus, there is a 30N difference between the measured value (330N) and the true load value (300N) (before adjustment 1).
For example, if 300N of load is applied directly above the 1 st sensor 71 and the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 are arranged at the apexes of the regular triangle, the load on the 1 st sensor 71 (the load corresponding to the voltage generated from the 1 st sensor 71) is 220N (1.1 times of 200N), and the load on the 2 nd sensor 72 and the 3 rd sensor 73 is 55N (1.1 times of 50N).
If the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 are not arranged at the vertices of the regular triangle, the measuring instrument 8 is a load different from the above-mentioned values, but a load 1.1 times the load received by the respective sensors 71 to 73 is displayed, and the total value is 330N.
In the 1 st adjustment step, the 1 st voltage adjuster 91 is adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the 1 st voltage regulator 91 is adjusted (the amplification factor of the 1 st voltage regulator 91 is changed) so that the value of the voltage generated from the 1 st sensor 71 is reduced by 30N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 1 st).
By this adjustment, for example, the load associated with the 1 st sensor 71 is 190N (0.95 times 200N), and the loads associated with the 2 nd sensor 72 and the 3 rd sensor 73 are 55N (kept 1.1 times 50N).
(the 2 nd adjustment step)
In the 2 nd adjustment step, a predetermined load (300N) is applied to the vicinity of the 2 nd sensor 72 in the chuck table 2 using the load applying means 6. In the example shown in fig. 5 (b), in the 2 nd adjustment step, the load value measured by the measuring instrument 8 is 322.5N. Thus, there is a 22.5N difference between the measured value and the true load value (300N) (before adjustment 2).
In addition, the 1 st voltage regulator 91 is adjusted in the 1 st adjustment step, and the load on the 1 st sensor 71 is 47.5N (0.95 times of 50N). The load on the 2 nd sensor 72 was 220N (1.1 times 200N), and the load on the 3 rd sensor 73 was 55N (1.1 times 50N).
In the 2 nd adjustment step, the 2 nd voltage adjuster 92 is adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the adjustment of the 2 nd voltage adjuster 92 is performed so that the value of the voltage generated from the 2 nd sensor 72 is reduced by 22.5N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 2).
By this adjustment, the load associated with the 2 nd sensor 72 becomes 197.5N (0.988 times of 200N).
(3 rd adjustment step)
In the 3 rd adjustment step, a predetermined load (300N) is applied to the vicinity of the 3 rd sensor 73 in the chuck table 2 by using the load applying means 6. In the example shown in fig. 5 (c), in the 3 rd adjustment step, the load value measured by the measuring instrument 8 is 316.875N. Thus, there is a 16.875N difference between the measured value and the true load value (300N) (before adjustment 3).
In addition, the load of the 2 nd sensor 72 is 49.375N (0.988 times of 50N) considering that the 2 nd voltage regulator 92 is regulated in the 2 nd regulation step. The load on the 1 st sensor 71 was 47.5N (0.95 times 50N), and the load on the 3 rd sensor 73 was 220N (1.1 times 200N).
In the 3 rd step, the 3 rd voltage regulator 93 is adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the adjustment of the 3 rd voltage regulator 93 is performed so that the value of the voltage generated from the 3 rd sensor 73 is reduced by 16.875N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 3).
By this adjustment, the load of the 3 rd sensor 73 becomes 203.125N (1.016 times of 200N).
[ repeat procedure 2 ]
(adjustment procedure 1)
In the "2 nd repetition step", after the 1 st adjustment step, the 2 nd adjustment step, and the 3 rd adjustment step in the "1 st repetition step" are sequentially performed, the 1 st adjustment step, the 2 nd adjustment step, and the 3 rd adjustment step are sequentially performed again in the same manner.
In the 1 st adjustment step, a predetermined load (300N) is applied to the vicinity of the 1 st sensor 71 in the chuck table 2 by using the load applying means 6, similarly to the previous 1 st adjustment step. In the example shown in fig. 5 (d), in the 1 st adjustment step, the load value measured by the measuring instrument 8 is 290.156N. Thus, there is a 9.844N difference between the measured value and the true load value (300N) (before adjustment 1).
In addition, it is considered that the voltage regulators 91 to 93 are adjusted in the "1 st repetition step", the load on the 1 st sensor 71 is 190N (0.95 times of 200N), the load on the 2 nd sensor 72 is 49.375N (0.988 times of 50N), and the load on the 3 rd sensor 73 is 50.781 (1.016 times of 50N).
In the 1 st adjustment step, the 1 st voltage adjuster 91 is also adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the 1 st voltage regulator 91 is adjusted so that the value of the voltage generated from the 1 st sensor 71 increases 9.844N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 1 st).
By this adjustment, the load associated with the 1 st sensor 71 becomes 199.844N (0.999 times 200N).
(the 2 nd adjustment step)
In the 2 nd adjustment step, a predetermined load (300N) is applied to the vicinity of the 2 nd sensor 72 in the chuck table 2 by using the load applying means 6, similarly to the previous 2 nd adjustment step. In the example shown in fig. 5 (e), in the 2 nd adjustment step, the load value measured by the measuring instrument 8 is 298.242N. Thus, there is a 1.758N difference between the measured value and the true load value (300N) (before adjustment 2).
In addition, the 1 st voltage regulator 91 is adjusted in the 1 st adjustment step, and the load on the 1 st sensor 71 is 49.961N (0.999 times 50N). The load on the 2 nd sensor 72 was 197.500N (0.988 times 200N), and the load on the 3 rd sensor 73 was 50.781N (1.016 times 50N).
In the 2 nd adjustment step, the 2 nd voltage adjuster 92 is also adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the adjustment of the 2 nd voltage adjuster 92 is performed so that the value of the voltage generated from the 2 nd sensor 72 increases 1.758N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 2).
By this adjustment, the load associated with the 2 nd sensor 72 becomes 199.258N (0.996 times 200N).
(3 rd adjustment step)
In the 3 rd adjustment step, a predetermined load (300N) is applied to the vicinity of the 3 rd sensor 73 in the chuck table 2 by using the load applying means 6, similarly to the previous 3 rd adjustment step. In the example shown in fig. 5 (f), in the 3 rd adjustment step, the load value measured by the measuring instrument 8 is 302.900N. Thus, there is a 2.900N difference between the measured value and the true load value (300N) (before adjustment 3).
In addition, the load of the 2 nd sensor 72 is 49.814N (0.996 times of 50N) considering that the 2 nd voltage regulator 92 is regulated in the 2 nd regulation step. The load on the 1 st sensor 71 was 49.961N (0.999 times 50N), and the load on the 3 rd sensor 73 was 203.125 (1.016 times 200N).
In the 3 rd adjustment step, the 3 rd voltage adjuster 93 is also adjusted so that the total voltage calculated by the measuring device 8 becomes a voltage corresponding to a predetermined load (300N). Specifically, the 3 rd voltage regulator 93 is adjusted so that the value of the voltage generated from the 3 rd sensor 73 is reduced 2.900N. Thus, the load value measured by the measuring instrument 8 was adjusted to 300N (after adjustment 3).
By this adjustment, the load of the 3 rd sensor 73 becomes 200.225N (1.001 times 200N).
After this adjustment, since the 1 st sensor 71 is 0.999 times, the 2 nd sensor 72 is 0.996 times, and the 3 rd sensor 73 is 1.001 times, for example, when a predetermined load (300N) is applied to the vicinity of the 1 st sensor 71 in the chuck table 2 by using the load applying unit 6, the load value measured by the measuring instrument 8 is 299.650N.
The present invention may further include a control unit that sets a reference for performing the repeating step in advance so that the repeating step is not performed if the difference between the predetermined load and the load value measured by the measuring instrument 8 is 1N or less, and that the repeating step is performed until the reference is reached if the difference between the predetermined load and the load value measured by the measuring instrument 8 is greater than 1N.
The difference between the predetermined load and the load value measured by the measuring device 8 may be a ratio set for the predetermined load, for example, if the predetermined ratio is 0.2% and the predetermined load is 300N, the control unit may repeat the process until the difference falls within a range of 299.4N to 300.6N.
As described above, in the repetition of the present adjustment method, the 1 st to 3 rd adjustment steps are sequentially performed, and the voltage adjustment unit 9 (the 1 st voltage adjuster 91, the 2 nd voltage adjuster 92, and the 3 rd voltage adjuster 93) is adjusted so that the voltage values calculated in the measuring instrument 8 become the same value when the load is applied to the vicinity of any one of the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 in the chuck table 2. In the repeating step, the 1 st to 3 rd adjustment steps are repeated.
By adjusting the voltage adjustment unit 9 in this way, when the respective sensors 71 to 73 receive a predetermined load, that is, when the vicinity of the respective sensors 71 to 73 in the chuck table 2 receive a predetermined load, the total voltage calculated by the measuring instrument 8 can be equalized, and therefore the measurement values of the load in the measuring instrument 8 can be equalized.
Therefore, by adjusting the voltage adjusting unit 9 of the polishing apparatus 1 by the present adjusting method, the load applied to the wafer W can be controlled with higher accuracy when polishing the wafer W. As a result, the accuracy of the polishing removal amount can be improved.
Further, by adjusting the plurality of polishing apparatuses 1 by the present adjustment method, even when the same load is applied to the chuck tables 2 of the plurality of polishing apparatuses 1, the measurement value of the load in the measuring instrument 8 can be equalized. Thus, even when polishing the wafer W using a plurality of polishing apparatuses 1, the result of the polishing operation by each polishing apparatus 1 can be made substantially uniform.
In the present adjustment method, at least the series of adjustment steps of the 1 st adjustment step, the 2 nd adjustment step, and the 3 rd adjustment step are repeated twice. By repeating this series of adjustment steps two or more times, the accuracy of the measurement value of the load in the measuring instrument 8 can be improved.
In the present embodiment, the measured value of the measuring instrument 8 is displayed on a monitor. This allows the voltage adjustment unit 9 to effectively adjust the measurement value of the measuring instrument 8 while monitoring the measurement value. Therefore, the cost required for adjustment can be suppressed.
Further, the polishing apparatus 1 may be provided with a larger number of load sensors such as the 4 th sensor and the 5 th sensor in addition to the three sensors 71 to 73. In this case, after the 3 rd adjustment process with respect to the 3 rd sensor 73 is performed, the adjustment processes with respect to the 4 th sensor and the 5 th sensor are similarly performed.
Further, the 1 st sensor 71, the 2 nd sensor 72, and the 3 rd sensor 73 may be disposed between the cylindrical holder 44 surrounding the spindle 30 and the annular plate 44a supporting the spindle 30 by the bottom plate of the holder 44 as shown in fig. 6, instead of being disposed between the chuck table 2 and the base 22, and screwed by screws 74. In this case, as shown in fig. 7, the sensors 71 to 73 are positioned at the apexes of a regular triangle having a center of gravity coincident with the center O2 of the spindle 30. In this configuration, the sensors 71 to 73 measure the load applied to the spindle 30 as the load receiving portion.
Claims (2)
1. A voltage adjustment method of load sensors, wherein at least three load sensors generating voltages corresponding to the received loads are arranged at the vertexes of a triangle, the load receiving parts are supported by the at least three load sensors, when the load applied to the load receiving parts is measured by a measurer according to the voltages generated from the at least three load sensors, the voltages received by the measurer from the load sensors are adjusted by a voltage adjustment part arranged between the load sensors and the measurer, so that the measurer receives the same voltages when the load sensors bear the specified loads,
the voltage adjustment method of the load sensor comprises the following steps:
a preparation step of preparing a load applying unit that applies a predetermined load to the load receiving section, and a measuring instrument that receives voltages generated from the 1 st sensor, the 2 nd sensor, and the 3 rd sensor, which are the at least three load sensors, respectively, calculates a total voltage of the 1 st sensor, the 2 nd sensor, and the 3 rd sensor, and measures the load applied to the load receiving section based on the total voltage; and
a repeating step including a 1 st adjustment step of applying the predetermined load to the vicinity of the 1 st sensor in the load receiving section by the load applying means, a 2 nd adjustment step of adjusting the voltage adjusting section for the 1 st sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load, and a 3 rd adjustment step of applying the predetermined load to the vicinity of the 2 nd sensor in the load receiving section by the load applying means, adjusting the voltage adjusting section for the 2 nd sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load, and a 3 rd adjustment step of applying the predetermined load to the vicinity of the 3 rd sensor in the load receiving section by the load applying means, adjusting the voltage adjusting section for the 3 rd sensor so that the total voltage calculated by the measuring instrument becomes a voltage corresponding to the predetermined load,
by performing the repetition process, the measuring instrument can receive the same voltage when the load sensors receive a predetermined load.
2. The voltage adjustment method of a load sensor according to claim 1, wherein,
the at least three load sensors are arranged at the vertices of a regular triangle,
the center of gravity of the regular triangle coincides with the center of the load receiving portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019091226A JP7235587B2 (en) | 2019-05-14 | 2019-05-14 | Load sensor voltage adjustment method |
| JP2019-091226 | 2019-05-14 |
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| Publication Number | Publication Date |
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| CN111941272A CN111941272A (en) | 2020-11-17 |
| CN111941272B true CN111941272B (en) | 2024-02-02 |
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| CN202010380491.2A Active CN111941272B (en) | 2019-05-14 | 2020-05-08 | Voltage regulation method of load sensor |
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| Country | Link |
|---|---|
| JP (1) | JP7235587B2 (en) |
| KR (1) | KR20200131742A (en) |
| CN (1) | CN111941272B (en) |
| TW (1) | TWI826686B (en) |
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| TW355692B (en) * | 1997-01-17 | 1999-04-11 | Tokyo Seimitsu Co Ltd | Surface grinding method and apparatus |
| US5957763A (en) * | 1997-09-19 | 1999-09-28 | Speedfam Corporation | Polishing apparatus with support columns supporting multiple platform members |
| WO2002038336A1 (en) * | 2000-09-25 | 2002-05-16 | Center For Tribology, Inc. | A method and apparatus for controlled polishing |
| TW200401687A (en) | 2002-07-26 | 2004-02-01 | Nippon Kogaku Kk | Polishing device |
| US7848832B2 (en) * | 2004-11-30 | 2010-12-07 | Kabushiki Kaisha Yaskawa Denki | Alignment apparatus |
| JP5184910B2 (en) * | 2008-02-13 | 2013-04-17 | 株式会社岡本工作機械製作所 | Substrate surface grinding machine |
| JP6121284B2 (en) | 2013-08-13 | 2017-04-26 | 株式会社ディスコ | Polishing equipment |
| JP7107688B2 (en) | 2017-03-30 | 2022-07-27 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
| JP6827663B2 (en) * | 2017-04-24 | 2021-02-10 | 株式会社荏原製作所 | Substrate polishing device |
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- 2019-05-14 JP JP2019091226A patent/JP7235587B2/en active Active
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- 2020-04-24 KR KR1020200050185A patent/KR20200131742A/en active Search and Examination
- 2020-05-08 TW TW109115425A patent/TWI826686B/en active
- 2020-05-08 CN CN202010380491.2A patent/CN111941272B/en active Active
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| JPH11138419A (en) * | 1997-10-31 | 1999-05-25 | Kashiwara Machine Mfg Co Ltd | Wafer polishing device and wafer pressuring method |
| JP2003110288A (en) * | 2001-07-23 | 2003-04-11 | Fuji Mach Mfg Co Ltd | Circuit board operation system and electronic circuit manufacturing method |
| JP2003326456A (en) * | 2002-05-08 | 2003-11-18 | Disco Abrasive Syst Ltd | Polishing device |
| JP2008246628A (en) * | 2007-03-30 | 2008-10-16 | Disco Abrasive Syst Ltd | Chuck table mechanism |
| KR100933672B1 (en) * | 2009-07-01 | 2009-12-24 | 전덕준 | Base isolation device |
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| JP2018051646A (en) * | 2016-09-27 | 2018-04-05 | 株式会社ディスコ | Grinding device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI826686B (en) | 2023-12-21 |
| TW202041326A (en) | 2020-11-16 |
| KR20200131742A (en) | 2020-11-24 |
| JP2020185638A (en) | 2020-11-19 |
| JP7235587B2 (en) | 2023-03-08 |
| CN111941272A (en) | 2020-11-17 |
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