CN111916372A - Packaging device with guide mechanism for circuit substrate production - Google Patents
Packaging device with guide mechanism for circuit substrate production Download PDFInfo
- Publication number
- CN111916372A CN111916372A CN202010570600.7A CN202010570600A CN111916372A CN 111916372 A CN111916372 A CN 111916372A CN 202010570600 A CN202010570600 A CN 202010570600A CN 111916372 A CN111916372 A CN 111916372A
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- Prior art keywords
- circuit substrate
- handle
- fixedly connected
- shell
- substrate production
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- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 230000007246 mechanism Effects 0.000 title claims abstract description 46
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 241000252254 Catostomidae Species 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 5
- 241000883990 Flabellum Species 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011418 maintenance treatment Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a packaging device with a guide mechanism for circuit substrate production, which belongs to the technical field of circuit substrate production and comprises a first shell, wherein a plurality of suckers are arranged on the lower surface of the first shell, the upper surfaces of the suckers are communicated through the same connecting pipe, a connecting block is arranged in the connecting pipe, and the upper surface of the connecting block is communicated with the bottom end of an air inlet pipe. This circuit substrate production is with packaging hardware that has guiding mechanism, through setting up the air pump, the intake pipe, first rotary mechanism, second rotary mechanism, fixed block and drive belt, make that the staff can be convenient take off the circuit substrate and maintain, and when taking off, only need with the screw cap joint in the fixed block, the process of taking off the circuit substrate can be realized to the reverse start-up air pump afterwards, effectual having reduced uses glue to the circuit substrate fixed back, the too fastening of part of glue and circuit substrate adhesion is difficult to the condition of split.
Description
Technical Field
The invention belongs to the technical field of circuit substrate production, and particularly relates to a packaging device with a guide mechanism for circuit substrate production.
Background
In the packaging process of the common dust collecting circuit board, the integrated circuit board generally needs to be fixed by using a glue dispensing device, and the integrated circuit board can be permanently fixed after glue is solidified, however, when the integrated circuit board has a problem, and a worker needs to take out the integrated circuit board for maintenance, a long time is needed, and the part adhered by the glue is easily broken in the process of taking the integrated circuit board down, so that the integrated circuit board is damaged.
Disclosure of Invention
Technical problem to be solved
In order to overcome the defects of the prior art, the invention provides a packaging device with a guide mechanism for circuit substrate production, which solves the problems that after an integrated circuit board is installed by glue, when the circuit board is damaged, workers need to take out the integrated circuit board for maintenance treatment, a long time is needed at the moment, and the part adhered by the glue is easily broken off in the process of taking off the integrated circuit board, so that the integrated circuit board is damaged.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a circuit substrate production is with packaging hardware that has guiding mechanism, includes first casing, the lower surface of first casing is provided with a plurality of sucking disc, and the upper surface of a plurality of sucking disc is linked together through same connecting pipe, be provided with the connecting block in the connecting pipe, the upper surface of connecting block is linked together with the bottom of intake pipe, the other end of intake pipe passes first casing and is linked together with pneumatic device's right flank, pneumatic device's lower surface and the lower fixed surface of the first in command inner wall are connected, the right flank of the first in command and the left surface fixed connection of the first casing, pneumatic device's blast pipe passes the first in command and is linked together with telescopic sleeve's top, telescopic sleeve's bottom is passed the second in command and is linked together with the upper surface of a bundling section of.
As a further scheme of the invention: the lower surface joint of second handle inner wall has first rotary mechanism, first rotary mechanism's top fixedly connected with action wheel, the upper surface of action wheel is provided with the flabellum, the action wheel passes through the drive belt and is connected with four transmission from the driving wheel.
As a further scheme of the invention: the right flank of second handle and the left surface fixed connection of second casing, four from the equal fixedly connected with second rotary mechanism of driving wheel lower surface, and four second rotary mechanism joints in the four corners department of second shells inner wall lower surface respectively.
As a further scheme of the invention: the upper surface of the driven wheel is fixedly connected with a third rotating mechanism, the third rotating mechanism is clamped on the upper surface of the second shell, the top end of the third rotating mechanism is fixedly connected with a fixing block, and a threaded cap is clamped in the fixing block.
As a further scheme of the invention: the upper surface of sucking disc is provided with circuit substrate, the four corners department of circuit substrate upper surface all is provided with fastening screw, fastening screw's bottom is passed circuit substrate and is corresponding with the position of screw cap, four fastening screw's upper surface all is provided with the plum blossom fixed head, the lower fixed surface of the upper surface of plum blossom fixed head and first casing is connected.
As a further scheme of the invention: the outer surfaces of the first shell and the second shell are respectively provided with a protective sleeve, and the opposite surfaces of the first handle and the second handle are respectively fixedly connected with the two ends of the elastic device.
As a further scheme of the invention: the air pressure device comprises a fixed seat, the lower surface of the fixed seat is fixedly connected with the lower surface of the inner wall of the first handle, the upper surface of the fixed seat is fixedly connected with an air pump, an air inlet and an air outlet of the air pump are respectively communicated with the left end of an air inlet pipe and the top end of a telescopic rod, and the front surface and the back surface of the air pump are respectively communicated with the front surface and the back surface of the inner wall of the first handle.
As a further scheme of the invention: the elastic device comprises a telescopic rod, a spring is sleeved on the outer surface of the telescopic rod, and two ends of the telescopic rod and the spring are fixedly connected with opposite surfaces of the first handle and the second handle respectively.
(III) advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
1. when workers need to take down the circuit substrate for maintenance detection, the positions of the four quincuncial fixed heads are only required to be attached to the groove positions on the upper surface of the fastening screws, then the workers can start the air pump, air of the second handle is pumped out through the bundling cylinder, at the moment, outside air enters the second handle and drives the fan blades to rotate reversely, the threaded caps are driven by the transmission belts to rotate reversely, the threaded caps are slowly separated from the fastening screws, the workers can conveniently take down the circuit substrate for maintenance, and when the circuit substrate is taken down, the threaded caps are only required to be clamped in the fixed blocks, and then the process of taking down the circuit substrate can be realized by reversely starting the air pump, the condition that the part of glue and circuit substrate adhesion is too tight and difficult to split after glue is used to fix the circuit substrate is effectively reduced.
2. The packaging device with the guide mechanism for the production of the circuit substrate is characterized in that the air pump, the air inlet pipe and the sucker are arranged, when a worker determines the position of the circuit substrate to be mounted, the worker can horizontally move the first handle and the second handle in opposite directions, the threaded cap can slowly move upwards under the support of the second shell, the air pump can discharge the pumped air into the second handle through the collecting cylinder while the air pump pumps the air, the driving wheel can drive the driven wheel to rotate through the driving belt, so that the threaded cap slowly rotates, the threaded cap can rotate to the surface of the fastening screw along the threads, the circuit substrate is fixed on a plate to be mounted, the worker can conveniently fix the circuit substrate, and the circuit substrate is not fixed by glue, so that the circuit substrate is not easily corroded by the glue due to the fact that the glue is used for fixing, and the time required for the worker to mount the circuit substrate is reduced.
3. This packaging hardware that circuit substrate production was used has guiding mechanism through setting up spring and telescopic link, when the staff no longer extrudeed the first in command and the second in command, the first in command and the second in command will be at the effect of spring force orientation removal down for first casing and second casing slowly keep away from, make this packaging hardware of reuse that the staff can be convenient.
Drawings
FIG. 1 is a schematic cross-sectional view of the front view of the present invention;
FIG. 2 is an enlarged schematic view of the structure of the present invention at A;
FIG. 3 is a schematic perspective view of the chuck of the present invention;
in the figure: the air pump comprises a first shell, a sucker, a connecting pipe, a connecting block, a gas inlet pipe, a gas pressure device, an air pump 61, a fixed seat 62, a first handle 7, an expansion sleeve 8, a second handle 9, a bundling cylinder 10, a first rotating mechanism 11, a driving wheel 12, fan blades 13, a driving belt 14, a driven wheel 15, a second rotating mechanism 16, a second shell 17, a third rotating mechanism 18, a fixed block 19, a threaded cap 20, a circuit substrate 21, a fastening screw 22, a plum blossom-shaped fixed head 23, a protective sleeve 24, an elastic device 25, a telescopic rod 251 and a spring 252.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
As shown in fig. 1-3, the present invention provides a technical solution: a packaging device with a guide mechanism for production of circuit substrates comprises a first shell 1, wherein a plurality of suckers 2 are arranged on the lower surface of the first shell 1, the upper surfaces of the suckers 2 are communicated through a same connecting pipe 3, a connecting block 4 is arranged in the connecting pipe 3, the upper surface of the connecting block 4 is communicated with the bottom end of an air inlet pipe 5, the other end of the air inlet pipe 5 penetrates through the first shell 1 to be communicated with the right side surface of an air pressure device 6, the lower surface of the air pressure device 6 is fixedly connected with the lower surface of the inner wall of a first handle 7, the right side surface of the first handle 7 is fixedly connected with the left side surface of the first shell 1, an exhaust pipe of the air pressure device 6 penetrates through the first handle 7 to be communicated with the top end of a telescopic sleeve 8, the bottom end of the telescopic sleeve 8 penetrates through a second handle 9 to be communicated with the upper surface of, start air pump 61 machine when the staff, make screw cap 20 reverse rotation under the drive of drive belt 14, make screw cap 20 slowly break away from fastening screw 22 when, the staff just can be convenient take off circuit substrate 21 and maintain, and when taking off, only need with screw cap 20 joint in fixed block 19, the process of taking off circuit substrate 21 can be realized to reverse start air pump 61 afterwards, the effectual glue that has reduced uses is fixed the back to circuit substrate 21, the too tight condition that is difficult to the split of part of glue and the adhesion of circuit substrate 21.
Specifically, as shown in fig. 1, a first rotating mechanism 11 is fastened to the lower surface of the inner wall of the second handle 9, a driving wheel 12 is fixedly connected to the top end of the first rotating mechanism 11, fan blades 13 are disposed on the upper surface of the driving wheel 12, the driving wheel 12 is in transmission connection with four driven wheels 15 through a transmission belt 14, due to the arrangement of the driving wheel 12 and the transmission belt 14, when the driving wheel 12 is driven by the fan blades 13 to rotate, the driving wheel 12 drives the four driven wheels 15 to rotate through the transmission belt 14, so that a worker can conveniently control the rotation of the four driven wheels 15, a circuit substrate 21 is disposed on the upper surface of the suction cup 2, fastening screws 22 are disposed at four corners of the upper surface of the circuit substrate 21, the bottom ends of the fastening screws 22 penetrate through the circuit substrate 21 to correspond to positions of threaded caps 20, and due to the arrangement of the fastening screws 22 and the, and because the screw cap 20 is communicated with the fastening screw 22 through the screw thread, the screw cap 20 is not easy to be separated from the fastening screw 22, so that the circuit substrate 21 is not easy to fall off, the upper surfaces of the four fastening screws 22 are respectively provided with the quincuncial fixed heads 23, the upper surfaces of the quincuncial fixed heads 23 are fixedly connected with the lower surface of the first shell 1, the outer surfaces of the first shell 1 and the second shell 17 are respectively provided with the protective sleeves 24, the opposite surfaces of the first handle 7 and the second handle 9 are respectively fixedly connected with the two ends of the elastic device 25, due to the arrangement of the protective sleeves 24, the packaging device is not easy to be damaged due to collision with external equipment, the air pressure device 6 comprises a fixed seat 62, the lower surface of the fixed seat 62 is fixedly connected with the lower surface of the inner wall of the first handle 7, the upper surface of the fixed seat 62 is fixedly connected with an air pump 61, an air inlet and an air outlet of the air, due to the arrangement of the telescopic sleeve 8, while the supporting point is added to the packaging device, the first handle 7 and the second handle 9 are not easy to be grasped by workers, and the dead situation appears, and the gas that air pump 61 discharges appears and gathers in the section of thick bamboo 10 through telescopic sleeve 8 too, the front and the back of air pump 61 communicate with front and the back of the inner wall of the first handle 7 respectively, the resilient means 25 includes the telescopic link 251, because there are spring 252 and telescopic link 251, when the worker no longer presses the first handle 7 and the second handle 9, the first handle 7 and the second handle 9 are moved in a direction by the elastic force of the spring 252, make first casing 1 and second casing 17 slowly keep away from for the staff can be convenient reuse this packaging hardware, the spring 252 has been cup jointed to the surface of telescopic link 251, the both ends of telescopic link 251 and spring 252 respectively with the opposite face fixed connection of first handle 7 and second handle 9.
Specifically, as shown in fig. 1 and 2, the right side surface of the second handle 9 is fixedly connected with the left side surface of the second housing 17, the lower surfaces of the four driven wheels 15 are fixedly connected with the second rotating mechanisms 16, and the four second rotating mechanisms 16 are respectively clamped at four corners of the lower surface of the inner wall of the second housing 17, because the third rotating mechanisms 18 and the second rotating mechanisms 16 are arranged, the driven wheels 15 are not easily scratched on the surface of the second housing 17 when driving the fixed block 19 to rotate, so that the rotating friction force of the fixed block 19 is reduced, the fixed block 19 is more smooth when rotating, the upper surface of the driven wheels 15 is fixedly connected with the third rotating mechanisms 18, the third rotating mechanisms 18 are clamped on the upper surface of the second housing 17, the top ends of the third rotating mechanisms 18 are fixedly connected with the fixed block 19, and the threaded caps 20 are clamped in the fixed block 19.
The working principle of the invention is as follows:
s1, when the suction cup is used, a worker only needs to place the four threaded caps 20 in the four fixing blocks 19 respectively, then the worker can enable the four fastening screws 22 to penetrate through the fixing holes of the circuit substrate 21 respectively, at the moment, the worker can start the air pump 61, so that the air pump 61 pumps air in the suction cup 2 out, and then the worker can move the circuit substrate 21 to a position needing to be installed;
s2, when the worker determines the position of the circuit substrate 21 to be mounted, the worker can hold the first handle 7 and the second handle 9, so that the first handle 7 and the second handle 9 move horizontally towards each other, at the same time, the screw cap 20 moves upwards slowly under the support of the second housing 17, and when the air pump 61 pumps air, the air pump 61 discharges the pumped air into the second handle 9 through the collecting barrel 10, so that the fan blades 13 rotate slowly while discharging the air, at the same time, the driving wheel 12 drives the driven wheel 15 to rotate through the driving belt 14, so that the screw cap 20 rotates slowly, and when the screw cap 20 contacts with the bottom end of the fastening screw 22, the screw cap 20 rotates to the surface of the fastening screw 22 along the screw, so that the circuit substrate 21 is fixed on the board to be mounted;
s3, when the staff needs to take down the circuit substrate 21 for maintenance detection, the positions of the four plum blossom-shaped fixing heads 23 are attached to the groove positions of the upper surface of the fastening screws 22, the staff can start the air pump 61 and pump out the air of the second handle 9 through the bundling cylinder 10, and at the moment, the external air enters the second handle 9 and drives the fan blades 13 to rotate reversely, so that the screw cap 20 rotates reversely under the driving of the driving belt 14, and the screw cap 20 is separated from the fastening screws 22 slowly.
In the description of the present invention, it should be noted that, unless explicitly fixed or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (8)
1. A packaging hardware with guiding mechanism for circuit substrate production, includes first casing (1), its characterized in that: the lower surface of the first shell (1) is provided with a plurality of suckers (2), the upper surfaces of the suckers (2) are communicated through a same connecting pipe (3), a connecting block (4) is arranged in the connecting pipe (3), the upper surface of the connecting block (4) is communicated with the bottom end of the air inlet pipe (5), the other end of the air inlet pipe (5) passes through the first shell (1) and is communicated with the right side surface of the air pressure device (6), the lower surface of the air pressure device (6) is fixedly connected with the lower surface of the inner wall of the first handle (7), the right side surface of the first handle (7) is fixedly connected with the left side surface of the first shell (1), an exhaust pipe of the air pressure device (6) passes through the first handle (7) and is communicated with the top end of the telescopic sleeve (8), the bottom end of the telescopic sleeve (8) is communicated with the upper surface of the bundling cylinder (10) through a second handle (9).
2. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 1, wherein: the lower surface joint of second handle (9) inner wall has first rotary mechanism (11), the top fixedly connected with action wheel (12) of first rotary mechanism (11), the upper surface of action wheel (12) is provided with flabellum (13), action wheel (12) are connected with four transmission from driving wheel (15) through drive belt (14).
3. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 2, wherein: the right flank of second handle (9) and the left flank fixed connection of second casing (17), four from the equal fixedly connected with second rotary mechanism (16) of driving wheel (15) lower surface, and four second rotary mechanism (16) joint respectively are in the four corners department of second casing (17) inner wall lower surface.
4. A packaging apparatus with a guiding mechanism for circuit substrate production as claimed in claim 3, wherein: the upper surface of the driven wheel (15) is fixedly connected with a third rotating mechanism (18), the third rotating mechanism (18) is connected to the upper surface of the second shell (17) in a clamped mode, a fixing block (19) is fixedly connected to the top end of the third rotating mechanism (18), and a threaded cap (20) is connected to the inside of the fixing block (19) in a clamped mode.
5. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 1, wherein: the upper surface of sucking disc (2) is provided with circuit substrate (21), the four corners department of circuit substrate (21) upper surface all is provided with fastening screw (22), the position that circuit substrate (21) and screw cap (20) were passed to the bottom of fastening screw (22) is corresponding, four the upper surface of fastening screw (22) all is provided with plum blossom fixed head (23), the upper surface of plum blossom fixed head (23) is connected with the lower fixed surface of first casing (1).
6. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 4, wherein: the outer surfaces of the first shell (1) and the second shell (17) are respectively provided with a protective sleeve (24), and the opposite surfaces of the first handle (7) and the second handle (9) are respectively fixedly connected with two ends of an elastic device (25).
7. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 1, wherein: air pressure equipment (6) include fixing base (62), the lower surface of fixing base (62) and the lower fixed surface of the first in command (7) inner wall are connected, the last fixed surface of fixing base (62) is connected with air pump (61), the air inlet and the gas vent of air pump (61) are linked together with the left end of intake pipe (5) and the top of telescopic link (251) respectively, the front and the back of air pump (61) are linked together with the front and the back of the first in command (7) inner wall respectively.
8. The packaging device with guiding mechanism for circuit substrate production as claimed in claim 6, wherein: the elastic device (25) comprises a telescopic rod (251), a spring (252) is sleeved on the outer surface of the telescopic rod (251), and two ends of the telescopic rod (251) and two ends of the spring (252) are fixedly connected with opposite surfaces of the first handle (7) and the second handle (9) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010570600.7A CN111916372A (en) | 2020-06-19 | 2020-06-19 | Packaging device with guide mechanism for circuit substrate production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010570600.7A CN111916372A (en) | 2020-06-19 | 2020-06-19 | Packaging device with guide mechanism for circuit substrate production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111916372A true CN111916372A (en) | 2020-11-10 |
Family
ID=73226159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010570600.7A Pending CN111916372A (en) | 2020-06-19 | 2020-06-19 | Packaging device with guide mechanism for circuit substrate production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111916372A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5722527A (en) * | 1995-03-28 | 1998-03-03 | U.S. Philips Corporation | Method of positioning a printed circuit board in a component placement machine and component place machine therefore |
| JP3086478U (en) * | 2001-04-20 | 2002-06-21 | 金鎮 鄭 | Fully automatic chamfering equipment for external connection terminals on multi-surface printed circuit boards |
| KR20150010252A (en) * | 2013-07-18 | 2015-01-28 | 에버테크노 주식회사 | Antidrop unit of printed circuit board transffering apparatus |
| CN208424941U (en) * | 2018-07-16 | 2019-01-22 | 昆山市正大电路板有限公司 | Fixture is used in a kind of rotatable pcb board production |
| CN209169115U (en) * | 2018-03-27 | 2019-07-26 | Jmj韩国株式会社 | The intermediate plate bonding apparatus and intermediate plate pick-up of semiconductor packages |
| CN209861479U (en) * | 2019-03-04 | 2019-12-27 | 吉安市君源电子科技有限公司 | Multifunctional full-angle plug-in machine head plug-in mechanism |
| CN210174238U (en) * | 2019-05-23 | 2020-03-24 | 淮安市鸿富瀚科技有限公司 | Bubble-free back glue laminating clamping and pressing device |
-
2020
- 2020-06-19 CN CN202010570600.7A patent/CN111916372A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5722527A (en) * | 1995-03-28 | 1998-03-03 | U.S. Philips Corporation | Method of positioning a printed circuit board in a component placement machine and component place machine therefore |
| JP3086478U (en) * | 2001-04-20 | 2002-06-21 | 金鎮 鄭 | Fully automatic chamfering equipment for external connection terminals on multi-surface printed circuit boards |
| KR20150010252A (en) * | 2013-07-18 | 2015-01-28 | 에버테크노 주식회사 | Antidrop unit of printed circuit board transffering apparatus |
| CN209169115U (en) * | 2018-03-27 | 2019-07-26 | Jmj韩国株式会社 | The intermediate plate bonding apparatus and intermediate plate pick-up of semiconductor packages |
| CN208424941U (en) * | 2018-07-16 | 2019-01-22 | 昆山市正大电路板有限公司 | Fixture is used in a kind of rotatable pcb board production |
| CN209861479U (en) * | 2019-03-04 | 2019-12-27 | 吉安市君源电子科技有限公司 | Multifunctional full-angle plug-in machine head plug-in mechanism |
| CN210174238U (en) * | 2019-05-23 | 2020-03-24 | 淮安市鸿富瀚科技有限公司 | Bubble-free back glue laminating clamping and pressing device |
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Application publication date: 20201110 |