CN111902014A

CN111902014A - Heat dissipation module and electronic device

Info

Publication number: CN111902014A
Application number: CN201910370901.2A
Authority: CN
Inventors: 郭智尧; 孙金锴; 朱俊龙; 刘韦承
Original assignee: HTC Corp
Current assignee: HTC Corp
Priority date: 2019-05-06
Filing date: 2019-05-06
Publication date: 2020-11-06
Anticipated expiration: 2039-05-06
Also published as: CN111902014B

Abstract

The invention discloses a heat dissipation module and an electronic device, wherein the heat dissipation module comprises a first heat transfer piece, a second heat transfer piece and a cooling element. The first heat transfer element has a first end and a second end opposite to each other. The second heat transfer element has a third end and a fourth end opposite to each other. The refrigerating element is arranged between the second end part and the third end part and used for allowing or blocking heat to be transferred between the second end part and the third end part.

Description

Heat dissipation module and electronic device

Technical Field

The present invention relates to a module and a device, and more particularly, to a heat dissipation module and an electronic device.

Background

With the continuous progress of technology, the development of various electronic products is faster. Among them, handheld electronic devices such as mobile phones have developed functions using various application programs in addition to being able to make a call. Applications include shooting using a lens of an electronic device, audio-visual entertainment, and the like. When various applications are used, electronic components such as a lens or a processor generate heat rapidly. Therefore, it is an important development direction to dissipate the heat generated by the electronic components to reduce the heat and discomfort experienced by the user holding the electronic device.

Disclosure of Invention

The invention provides a heat dissipation module and an electronic device, which can solve the problem that a user is uncomfortable due to local overheating of the electronic device.

The heat dissipation module of the invention comprises a first heat transfer element, a second heat transfer element and a cooling element. The first heat transfer element has a first end and a second end opposite to each other. The second heat transfer element has a third end and a fourth end opposite to each other. The refrigerating element is arranged between the second end part and the third end part and used for allowing or blocking heat to be transferred between the second end part and the third end part.

In an embodiment of the present invention, the first heat transfer member and the second heat transfer member are heat pipes or vapor chambers.

In one embodiment of the present invention, the cooling element is configured to allow one-way heat transfer between the second end portion and the third end portion.

The electronic device of the invention comprises a first heating element, a second heating element and a heat dissipation module. The heat dissipation module comprises a first heat transfer element, a second heat transfer element and a cooling element. The first heat transfer element has a first end and a second end opposite to each other. The second heat transfer element has a third end and a fourth end opposite to each other. The refrigerating element is arranged between the second end part and the third end part and used for allowing or blocking heat to be transferred between the second end part and the third end part.

In an embodiment of the present invention, wherein when the first heating element generates heat, the cooling element blocks heat transfer between the second end portion and the third end portion.

In an embodiment of the invention, the electronic device further includes a control element. When the power consumption of the second heating element is larger than a preset value, the control element controls the refrigerating element to allow the heat to be transferred between the second end part and the third end part.

In an embodiment of the present invention, the first Heat transfer member and the second Heat transfer member are Heat pipes (Heat pipes) or Vapor chambers (Vapor chambers).

In an embodiment of the invention, the electronic device further includes a printed circuit board. The first heating element and the second heating element are arranged on the printed circuit board.

In an embodiment of the invention, the electronic device further includes a housing and a cover plate. The printed circuit board, the first heating element, the second heating element and the heat dissipation module are arranged in the shell, and the cover plate is combined with the shell.

Based on the above, the heat dissipation module and the electronic device of the invention can control the transfer direction and range of heat in the electronic device through the control element, so that a user can obtain good comfort level under different holding states.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1 is a diagram of an electronic device according to an embodiment of the invention;

FIG. 2 is a partial cross-sectional view of the vicinity of the refrigeration component of FIG. 1;

fig. 3 is a flowchart illustrating an electronic device determining a heat transfer range according to an embodiment of the invention.

Description of the symbols

100: electronic device

110: shell body

120: cover plate

130: printed circuit board

140: first heat generating element

150: second heating element

160: heat radiation module

161: a first heat transfer member

161A: first end part

161B: second end portion

162: second heat transfer member

162A: third end part

162B: fourth end part

163: refrigeration element

163A: condensing surface

163B: heating noodle

170: control element

300: flow chart

301. 302, 303, 304, 305, 306: square block

L: long side

S: short side

Detailed Description

Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the invention. Please refer to fig. 1. The electronic device 100 of the embodiment includes a first heat generating element 140, a second heat generating element 150 and a heat dissipating module 160, and the electronic device 100 may further optionally include a housing 110, a cover plate 120 and a printed circuit board 130. To make the representation of the internal components of the electronic device 100 more clear, the cover 120 and/or the touch panel (not shown) and/or the display panel (not shown) of the electronic device 100 are separated and represented by dotted lines in fig. 1 to facilitate the display of the internal components. The first and second

heat generating elements

140 and 150 are disposed on the printed circuit board 130. The printed circuit board 130, the first heat generating element 140, the second heat generating element 150 and the heat dissipating module 160 are disposed in the housing 100. The cover plate 120 is combined with the case 100. The electronic device 100 is, for example, a mobile phone or a tablet computer, and the invention is not limited thereto.

The printed circuit board 130 is provided with a first heat generating element 140, a second heat generating element 150 and a heat dissipating module 160. The heat dissipation module 160 of the present embodiment includes a first heat transfer element 161, a second heat transfer element 162 and a cooling element 163. The first heat transfer element 161 has a first end 161A and a second end 161B opposite to each other, wherein the first end 161A is in thermal contact with the first heat generating element 140. The second heat transfer element 162 has a third end 162A and a fourth end 162B opposite to each other, wherein the fourth end 162B is in thermal contact with the second heat generating element 150. In the present embodiment, the first heat generating element 140 is, for example, a camera module of the electronic device 100. The second heat-generating component is, for example, a Central Processing Unit (CPU) or other components operating with high performance. The first heat generating element 140 generates less power consumption and heat than the second heat generating element 150. The heat generated by the first and second

heat generating elements

140 and 150 can be conducted through the heat dissipation module 160 to dissipate the heat of the first and second

heat generating elements

140 and 150.

Fig. 2 is a partial cross-sectional view of the vicinity of the refrigeration component in fig. 1. Please refer to fig. 1 and fig. 2. The cooling element 163 is, for example, a thermoelectric cooling chip (thermoelectric cooling unit), and has a condensation surface 163A and a heating surface 163B. The cooling element 163 is disposed between the second end 161B of the first heat transfer member 161 and the third end 162A of the second heat transfer member 162. In the present embodiment, the condensing surface 163A of the cooling element 163 is attached to the second heat transfer element 162, and the heating surface 163B of the cooling element 163 is attached to the first heat transfer element 161. Therefore, the cooling element 163 is used to allow heat to be transmitted from the third end 162A of the second heat transfer element 162 to the second end 161B of the first heat transfer element 161 in a single direction. However, with different designs, heat can be transferred from the second end 161B of the first heat transfer member 161 to the third end 162A of the second heat transfer member 162 in a single direction, or heat can be transferred in two directions, which is not limited in the present invention.

In addition, the electronic device 100 further includes a control element 170 connected to the cooling element 163 for controlling the cooling element 163 to allow or block heat transfer between the second end 161B and the third end 162A. In detail, when the power consumption of the second heat generating element 150 is greater than a predetermined value, for example, when the electronic device 100 is used to perform some high-performance applications, the control element 170 controls the cooling element 163 to allow heat to be transferred between the second end 161B and the third end 162A, so that the heat can be dissipated from the second heat transferring element 162 to the first heat transferring element 161, thereby increasing the heat dissipation efficiency. On the contrary, when the power consumption of the second heat generating element 150 is less than a predetermined value, for example, only the electronic device 100 is used to execute some executable applications that pass through the first heat generating element 140 without additionally turning on or only operating the second heat generating element 150 with low power consumption, the control element 170 controls the cooling element 163 to block the heat transfer between the second end 161B and the third end 162A, so that the heat is retained in the range covered by the first heat transferring element 161 for heat dissipation. That is, when the first heat generating element 140 is used as a main operation unit of the electronic device 100 and generates heat, the cooling element 163 is controlled by the control element 170 to block heat transfer between the second end 161B and the third end 162A. In the embodiment, the first Heat transfer member 161 and the second Heat transfer member 162 may be a Heat Pipe (Heat Pipe) or a Vapor chamber (Vapor chamber), but not limited thereto.

Fig. 3 is a flowchart illustrating an electronic device determining a heat transfer range according to an embodiment of the invention. For a more clear description of the operation principle of the heat dissipation module 160 of the electronic device 100 of the present invention, please refer to fig. 1 and fig. 3.

As shown in block 301 of flowchart 300, after the electronic device 100 is powered on, for example, an Inertial Measurement Unit (IMU) is used to start the function of detecting the holding mode of the user. The holding mode mentioned here is generally divided into an upright holding mode for erecting the electronic apparatus 100 as shown in block 302 and a yaw holding mode for yawing the electronic apparatus 100 as shown in block 303. Specifically, the upright holding means that the user holds the long side L of the electronic apparatus 100 to erect the electronic apparatus 100, and the yaw holding means that the user holds the short side S of the electronic apparatus 100 to yaw the electronic apparatus 100. In the present embodiment, the first thermal transfer member 160 is disposed near the short side S of the electronic device 100. Therefore, when the user holds the electronic device 100 in a vertical manner, the heat dissipation range covered by the first heat transfer member 161 is not easily touched. In contrast, the second thermal conductive member 162 is disposed near the long side L of the electronic device 100. When the user holds the electronic device 100 in a yaw-type manner, the heat dissipation range covered by the second heat transfer member 162 is not easily touched.

In the upright holding state, the electronic device 100 determines, for example, through the cpu or other elements, that the electronic device 100 is in the low power consumption state, such as taking a picture, recording a video or transmitting a text, the function of the electronic device can be achieved only by operating the first heating element or simultaneously operating the second heating element 150 with low power consumption, and the operation of the cooling element 163 is stopped as in block 304. At this time, since the heat generated by the first heat generating element 140 is dissipated through the first heat transfer element 161, the user is not likely to contact the local temperature increase of the electronic device 100 caused by the heat dissipation of the first heat transfer element 161 in the upright holding state, and the comfort of the user in the upright holding state is maintained.

In the yaw grip state, the control unit 170 within the electronic device 100 determines the power consumption of the electronic device 100 as indicated by block 305. Generally, the application program used by the user in the yaw-type holding state is a function that can be completed only by the operation of the second heating element 150, such as watching a movie, a game program or a drawing design. At this time, if the power consumption is lower than a predetermined value, the control element 170 determines that the electronic device 100 is in the low power consumption state, and stops the operation of the cooling element 163 as shown in block 304, so that the heat generated by the second heating element 150 is dissipated only through the second heat transfer element 162. Therefore, the user is not easy to contact the local temperature rise of the electronic device caused by heat dissipation of the second heat transfer member in the yaw holding state, and the comfort level of the user in the yaw holding state is maintained.

When the power consumption is higher than the predetermined value, the control element determines that the electronic device is in a high power consumption state, and turns on the cooling element 163 as shown in block 306, so that the heat generated by the second heat generating element 150 can be dissipated through the first heat transferring element 161 and the second heat transferring element 162 at the same time, thereby avoiding the situation that the electronic device is overheated and crashed due to the heat not being dissipated in time. Since the electronic device 100 simultaneously performs a fast and large-area heat dissipation through the first heat transfer element 161 and the second heat transfer element 162, a local temperature rise of the electronic device 100 is not particularly significant, and a comfortable holding feeling of a user can be maintained.

In summary, the heat dissipation module and the electronic device of the present invention determine the heat dissipation paths of the first heat generating element and the second heat generating element according to whether the cooling element is operated. Adopt different heat dissipation schemes under the state of holding of difference for the user can both keep certain comfort level under what kind of state of holding.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A heat dissipation module, comprising:

a first heat transfer member having a first end and a second end opposite to each other;

a second heat transfer member having a third end and a fourth end opposite to each other; and

and the refrigerating element is arranged between the second end part and the third end part and used for allowing or blocking the heat to be transferred between the second end part and the third end part.

2. The heat dissipation module of claim 1, wherein the first heat transfer member and the second heat transfer member are heat pipes or vapor chambers.

3. The heat dissipating module of claim 1, wherein the cooling element is configured to allow one-way transfer of heat between the second end and the third end.

4. An electronic device, comprising:

a first heat generating element;

a second heating element; and

a heat dissipation module, comprising:

a first heat transfer element having a first end and a second end opposite to each other, wherein the first end is in thermal contact with the first heat generating element;

a second heat transfer element having a third end and a fourth end opposite to each other, wherein the fourth end is in thermal contact with the second heat generating element; and

5. The electronic device of claim 4, wherein the cooling element blocks heat transfer between the second end and the third end when the first heat-generating element generates heat.

6. The electronic device of claim 4, further comprising a control element, wherein the control element controls the cooling element to allow heat transfer between the second end portion and the third end portion when the power consumption of the second heating element is greater than a preset value.

7. The electronic device of claim 6, wherein the first heat transfer member and the second heat transfer member are heat pipes or vapor chambers.

8. The electronic device of claim 6, wherein the cooling element is configured to allow one-way transfer of heat between the second end and the third end.

9. The electronic device of claim 4, further comprising a printed circuit board, wherein the first and second heat-generating elements are disposed on the printed circuit board.

10. The electronic device of claim 9, further comprising a housing and a cover plate, wherein the printed circuit board, the first heat generating element, the second heat generating element and the heat dissipating module are disposed in the housing, and the cover plate is combined with the housing.