CN111893573A - Wafer rack positioning device in sensor monocrystalline silicon etching process - Google Patents
Wafer rack positioning device in sensor monocrystalline silicon etching process Download PDFInfo
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- CN111893573A CN111893573A CN202010783901.8A CN202010783901A CN111893573A CN 111893573 A CN111893573 A CN 111893573A CN 202010783901 A CN202010783901 A CN 202010783901A CN 111893573 A CN111893573 A CN 111893573A
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- reaction chamber
- monocrystalline silicon
- etching process
- positioning device
- silicon etching
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/12—Etching in gas atmosphere or plasma
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Weting (AREA)
Abstract
The invention relates to a wafer rack positioning device in a sensor monocrystalline silicon etching process, which comprises a reaction chamber, wherein an air inlet pipe is fixedly arranged at the top of the reaction chamber in a penetrating manner, one end part of the air inlet pipe is fixedly connected with an air source chamber in a penetrating manner, the bottom of one side of the reaction chamber is fixedly provided with an air outlet pipe in a penetrating manner, one end part of the air outlet pipe is fixedly connected with a vacuum pump, the bottom of the reaction chamber is fixedly provided with a driving motor, the driving motor can drive a driving belt pulley to rotate, the driving belt pulley can drive a driven belt pulley to rotate through a belt, the driven belt pulley can drive a convex turntable to rotate through a shaft lever, so that the wafer rack can be driven to rotate, the contact uniformity of monocrystalline silicon and plasma can be increased, a positioning ring can be supported and fixed by, the reaction chamber is suitable for reaction chambers with different diameters, and the sleeve is fixed on the outer side of the top of the sheet frame through the fixing bolt, so that the sleeve is convenient to disassemble and assemble.
Description
Technical Field
The invention relates to a wafer rack positioning device in a sensor monocrystalline silicon etching process, and belongs to the technical field of sensor part processing devices.
Background
In the existing etching process, a plurality of monocrystalline silicon are often stacked on a wafer rack, reaction gas is led into the position of the wafer rack, the reaction gas generates plasma in an electric field environment, the monocrystalline silicon is etched, the wafer rack generally needs to rotate in the etching process to increase the contact uniformity of the monocrystalline silicon and the plasma, however, the rotation of the wafer rack can cause the deviation of the wafer rack, so that the contact unevenness between the monocrystalline silicon and the plasma is caused, and the etching effect of the wafer rack is further influenced.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the existing defects, and provide a wafer holder positioning device in the process of etching monocrystalline silicon of a sensor, which can position a wafer holder, can prevent the wafer holder from shaking during etching and processing and influencing the etching effect, and through arranging a gas source chamber, the gas source chamber can fill reaction gas into the inner cavity of a reaction chamber through a gas inlet pipe, so as to facilitate etching operation, through arranging a driving motor, the driving motor can drive a driving belt pulley to rotate, the driving belt pulley can drive a driven belt pulley to rotate through a belt, the driven belt pulley can drive a convex turntable to rotate through a shaft rod, so as to drive the wafer holder to rotate, so as to increase the contact uniformity of the monocrystalline silicon and plasma, through arranging a telescopic positioning rod, a positioning ring can be supported and fixed, and through rotating a threaded cylinder, the length of the telescopic positioning rod, the reaction chamber that is fit for different diameters uses, and the sleeve passes through fixing bolt to be fixed in the sheet frame top outside, and the installation of conveniently dismantling, through setting up locating lever and leading wheel, locating lever and leading wheel can fix a position the sheet frame when not influencing the sheet frame rotation, can prevent that the sheet frame from rocking when rotatory, influence sculpture effect, through setting up the rubber sleeve, the rubber sleeve can absorb the mechanical vibration that the rotatory in-process of leading wheel produced, can effectively solve the problem in the background art.
In order to solve the technical problems, the invention provides the following technical scheme:
a wafer rack positioning device in the process of etching monocrystalline silicon by using a sensor comprises a reaction chamber, wherein an air inlet pipe is fixedly arranged at the top of the reaction chamber in a penetrating manner, one end part of the air inlet pipe is fixedly connected with a gas source chamber in a penetrating manner, an air outlet pipe is fixedly arranged at the bottom of one side of the reaction chamber in a penetrating manner, one end part of the air outlet pipe is fixedly connected with a vacuum pump, a driving motor is fixedly arranged at the bottom of the reaction chamber, a driving belt pulley is fixedly arranged at the end part of a driving shaft of the driving motor, a base is fixedly arranged at the bottom of an inner cavity of the reaction chamber, a notch is arranged in the middle of the base, a convex turntable is arranged in the inner cavity of the notch in a rotating manner through a rotating shaft, a shaft lever is fixedly arranged at the bottom of, the fixed locating lever that is equipped with of sleeve outside circumference equidistance, the fixed U-shaped frame that is equipped with of locating lever end, U-shaped frame inner chamber rotates through the pivot and is equipped with the leading wheel, the leading wheel periphery is equipped with the location ring, the fixed flexible locating lever that is equipped with of location ring outside circumference equidistance, flexible locating lever includes the threaded rod, a threaded rod pot of pot head, the fixed backing plate that is equipped with of threaded pot one end.
As further description of the technical scheme, a rubber pad is fixedly arranged on one side of the base plate.
As further description of the technical scheme, the anti-skid protrusions are fixedly arranged on the outer side of the threaded cylinder at equal intervals in the circumferential direction.
As the further description of the technical scheme, fixing bolts are inserted in the circumferential direction of the outer side of the sleeve at equal intervals.
As a further description of the above technical solution, a circular slide rail is fixedly arranged on the inner wall of the positioning ring.
As a further description of the above technical solution, a rubber sleeve is fixedly sleeved outside the guide wheel.
As a further description of the above technical solution, a flow control valve is provided on the outlet pipe.
As a further description of the above technical solution, electromagnetic coils are fixedly arranged on the outer side of the reaction chamber at equal intervals.
The invention has the beneficial effects that: 1. the gas source chamber is arranged, the gas source chamber can fill reaction gas into the inner cavity of the reaction chamber through the gas inlet pipe, etching operation is facilitated, the driving motor can drive the driving belt pulley to rotate, the driving belt pulley can drive the driven belt pulley to rotate through a belt, the driven belt pulley can drive the convex turntable to rotate through the shaft rod, the wafer frame can be driven to rotate, and contact uniformity of monocrystalline silicon and plasma can be improved;
2. the positioning ring can be supported and fixed by arranging the telescopic positioning rod, the length of the telescopic positioning rod can be adjusted by rotating the threaded cylinder, the operation is convenient, the disassembly and the fixation are convenient, the device is suitable for reaction chambers with different diameters, and the sleeve is fixed on the outer side of the top of the sheet frame through the fixing bolt, so that the disassembly and the installation are convenient;
3. through setting up the guide bar, through setting up locating lever and leading wheel, locating lever and leading wheel can fix a position the sheet rack when not influencing the sheet rack rotation, can prevent to rock when the sheet rack is rotatory, influence sculpture effect, through setting up the rubber sleeve, the rubber sleeve can absorb the mechanical vibration that the rotatory in-process of leading wheel produced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a cross-sectional view of a wafer holder positioning device in a sensor single crystal silicon etching process.
FIG. 2 is a top cross-sectional view of a reaction chamber of a wafer holder positioning device during a sensor single crystal silicon etching process of the present invention.
FIG. 3 is a cross-sectional view of a base of a wafer holder positioning device in a sensor single crystal silicon etching process according to the present invention.
FIG. 4 is a cross-sectional view of the telescopic positioning rod of the wafer holder positioning device in the sensor monocrystalline silicon etching process.
FIG. 5 is a front view of a guide wheel of the wafer holder positioning device in the sensor single crystal silicon etching process.
Reference numbers in the figures: 1. a reaction chamber; 2. an air inlet pipe; 3. a gas source chamber; 4. an air outlet pipe; 5. a vacuum pump; 6. a drive motor; 7. a drive pulley; 8. a base; 9. a notch; 10. a convex turntable; 11. a shaft lever; 12. a driven pulley; 13. a belt; 14. a sheet rack; 15. a sleeve; 16. positioning a rod; 17. a U-shaped frame; 18. a guide wheel; 19. positioning the circular ring; 20. a telescopic positioning rod; 21. a threaded rod; 22. a threaded barrel; 23. a base plate; 24. a rubber pad; 25. anti-skid projections; 26. fixing the bolt; 27. a circular slide rail; 28. a rubber sleeve; 29. a flow control valve; 30. an electromagnetic coil.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Referring to fig. 1-5, the present invention provides a technical solution: a wafer rack positioning device in a sensor monocrystalline silicon etching process comprises a reaction chamber 1, wherein an air inlet pipe 2 is fixedly arranged at the top of the reaction chamber 1 in a penetrating manner, one end part of the air inlet pipe 2 is fixedly connected with an air source chamber 3 in a penetrating manner, the air source chamber 3 can fill reaction gas into an inner cavity of the reaction chamber 1 through the air inlet pipe 2, an air outlet pipe 4 is fixedly arranged at the bottom of one side of the reaction chamber 1 in a penetrating manner, one end part of the air outlet pipe 4 is fixedly connected with a vacuum pump 5, a driving motor 6 is fixedly arranged at the bottom of the reaction chamber 1, the driving motor 6 can drive a driving pulley 7 to rotate, the driving pulley 7 can drive a driven pulley 12 to rotate through a belt 13, the driven pulley 12 can drive a convex turntable 10 to rotate through a shaft lever 11, and further can drive a wafer rack 14 to rotate, the bottom of the inner cavity of the reaction chamber 1 is fixedly provided with a base 8, the middle part of the base 8 is provided with a notch 9, the inner cavity of the notch 9 is provided with a convex turntable 10 through a rotating shaft in a rotating way, the bottom of the convex turntable 10 is fixedly provided with a shaft lever 11, the bottom of the shaft lever 11 is fixedly provided with a driven belt pulley 12, a belt 13 is connected between the driven belt pulley 12 and a driving belt pulley 7, the top of the convex turntable 10 is fixedly provided with a sheet frame 14, the outer side of the top of the sheet frame 14 is sleeved with a sleeve 15, the outer side of the sleeve 15 is circumferentially and equidistantly fixedly provided with positioning rods 16, the end part of each positioning rod 16 is fixedly provided with a U-shaped frame 17, the inner cavity of the U-shaped frame 17 is provided with a guide wheel 18 through the rotating shaft in a rotating way, the positioning rods 16 and the guide wheel 18 can position the sheet frame 14, the fixed flexible locating lever 20 that is equipped with of location ring 19 outside circumference equidistance, adjusts the length of flexible locating lever 20 through rotatory screw thread section of thick bamboo 22, and flexible locating lever 20 can support fixedly location ring 19, flexible locating lever 20 includes threaded rod 21, threaded rod 21 pot head is equipped with screw thread section of thick bamboo 22, screw thread section of thick bamboo 22 one end is fixed and is equipped with backing plate 23.
Specifically, as shown in fig. 1, the gas outlet pipe 4 is provided with a flow control valve 29, the exhaust flow can be controlled by the flow control valve 29, and electromagnetic coils 30 are fixed at equal intervals outside the reaction chamber 1.
Specifically, as shown in fig. 2, the equidistant interlude of sleeve 15 outside circumference is equipped with fixing bolt 26, and fixing bolt 26 can lock fixedly sleeve 15, the fixed cover in leading wheel 18 outside is equipped with rubber sleeve 28, and rubber sleeve 28 can absorb the mechanical vibration that leading wheel 18 rotatory in-process produced.
Specifically, as shown in fig. 3, a notch 9 is formed in the middle of the base 8, and a convex turntable 10 is rotatably arranged in an inner cavity of the notch 9 through a rotating shaft, so that the convex turntable 10 can rotate.
Specifically, as shown in fig. 4, a rubber pad 24 is fixedly arranged on one side of the backing plate 23, the rubber pad 24 is arranged to improve the supporting stability, the anti-slip bumps 25 are fixedly arranged on the outer side of the thread cylinder 22 in the circumferential equidistant mode, the anti-slip bumps 25 can improve the friction force on the surface of the thread cylinder 22, and the thread cylinder 22 can be rotated conveniently.
Specifically, as shown in fig. 5, a circular slide rail 27 is fixedly arranged on the inner wall of the positioning ring 19, and the circular slide rail 27 can guide and limit the guide wheel 18.
The working principle of the invention is as follows: the gas source chamber 3 can fill reaction gas into the inner cavity of the reaction chamber 1 through the gas inlet pipe 2, the driving motor 6 can drive the driving pulley 7 to rotate, the driving pulley 7 can drive the driven pulley 12 to rotate through the belt 13, the driven pulley 12 can drive the convex turntable 10 to rotate through the shaft rod 11, and further can drive the wafer rack 14 to rotate, the contact uniformity of monocrystalline silicon and plasma can be increased, the positioning rod 16 and the guide wheel 18 can position the wafer rack 14 while not influencing the rotation of the wafer rack 14, the wafer rack 14 can be prevented from shaking during rotation, the etching effect is influenced, the length of the telescopic positioning rod 20 is adjusted through the rotary threaded barrel 22, the telescopic positioning rod 20 can support and fix the positioning ring 19, and the rubber sleeve 28 can absorb the mechanical vibration generated in the rotating process of the guide wheel 18.
The above embodiments are preferred embodiments of the present invention, and those skilled in the art can make variations and modifications to the above embodiments, therefore, the present invention is not limited to the above embodiments, and any obvious improvements, substitutions or modifications made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer frame positioner in sensor monocrystalline silicon etching process, includes reaction chamber (1), its characterized in that: the reaction chamber is characterized in that an air inlet pipe (2) is fixedly communicated with the top of the reaction chamber (1), one end of the air inlet pipe (2) is fixedly communicated with an air source chamber (3), an air outlet pipe (4) is fixedly communicated with the bottom of one side of the reaction chamber (1), a vacuum pump (5) is fixedly connected with one end of the air outlet pipe (4), a driving motor (6) is fixedly arranged at the bottom of the reaction chamber (1), a driving belt pulley (7) is fixedly arranged at the end of a transmission shaft of the driving motor (6), a base (8) is fixedly arranged at the bottom of an inner cavity of the reaction chamber (1), a notch (9) is arranged in the middle of the base (8), a convex turntable (10) is rotatably arranged in an inner cavity of the notch (9) through a rotating shaft, a shaft lever (11) is fixedly arranged at the bottom of the convex turntable (10), a driven belt pulley (12, convex carousel (10) top is fixed and is equipped with sheet frame (14), sheet frame (14) top outside cover is equipped with sleeve (15), sleeve (15) outside circumference equidistance is fixed and is equipped with locating lever (16), locating lever (16) end fixing is equipped with U-shaped frame (17), U-shaped frame (17) inner chamber is rotated through the pivot and is equipped with leading wheel (18), leading wheel (18) periphery is equipped with location ring (19), location ring (19) outside circumference equidistance is fixed and is equipped with flexible locating lever (20), flexible locating lever (20) include threaded rod (21), threaded rod (21) pot head is equipped with screw thread section of thick bamboo (22), screw thread section of thick bamboo (22) one end is fixed and is equipped with backing plate (23).
2. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: and a rubber pad (24) is fixedly arranged on one side of the backing plate (23).
3. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: the outer side of the threaded cylinder (22) is circumferentially and equidistantly fixedly provided with anti-skid projections (25).
4. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: the fixing bolts (26) are arranged on the outer side of the sleeve (15) in a circumferential equidistant manner in a penetrating mode.
5. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: and a circular sliding rail (27) is fixedly arranged on the inner wall of the positioning circular ring (19).
6. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: and a rubber sleeve (28) is fixedly sleeved on the outer side of the guide wheel (18).
7. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: and a flow control valve (29) is arranged on the air outlet pipe (4).
8. The wafer rack positioning device in the sensor monocrystalline silicon etching process, according to claim 1, is characterized in that: electromagnetic coils (30) are fixedly arranged on the outer side of the reaction chamber (1) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783901.8A CN111893573A (en) | 2020-08-06 | 2020-08-06 | Wafer rack positioning device in sensor monocrystalline silicon etching process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783901.8A CN111893573A (en) | 2020-08-06 | 2020-08-06 | Wafer rack positioning device in sensor monocrystalline silicon etching process |
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| CN111893573A true CN111893573A (en) | 2020-11-06 |
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| CN202010783901.8A Pending CN111893573A (en) | 2020-08-06 | 2020-08-06 | Wafer rack positioning device in sensor monocrystalline silicon etching process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112853500A (en) * | 2021-01-08 | 2021-05-28 | 张利峰 | Wafer rack positioning device in sensor monocrystalline silicon etching process |
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| CN204825135U (en) * | 2015-07-09 | 2015-12-02 | 江苏德尔森传感器科技有限公司 | Rack positioner among sensor monocrystalline silicon etching process |
| CN109461672A (en) * | 2018-09-29 | 2019-03-12 | 蚌埠市龙子湖区金力传感器厂 | A kind of uniform sensor monocrystalline silicon etching device of etching |
| CN109745572A (en) * | 2019-01-22 | 2019-05-14 | 河南省中医院（河南中医药大学第二附属医院） | Ultrasonic image probe cleaning device |
| CN210188504U (en) * | 2019-07-01 | 2020-03-27 | 吉铁精密机械(苏州)有限公司 | Blanking device of numerical control lathe |
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2020
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5660425B2 (en) * | 2010-03-04 | 2015-01-28 | 独立行政法人物質・材料研究機構 | Epitaxial growth method of graphene film |
| CN204825135U (en) * | 2015-07-09 | 2015-12-02 | 江苏德尔森传感器科技有限公司 | Rack positioner among sensor monocrystalline silicon etching process |
| CN109461672A (en) * | 2018-09-29 | 2019-03-12 | 蚌埠市龙子湖区金力传感器厂 | A kind of uniform sensor monocrystalline silicon etching device of etching |
| CN109745572A (en) * | 2019-01-22 | 2019-05-14 | 河南省中医院（河南中医药大学第二附属医院） | Ultrasonic image probe cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112853500A (en) * | 2021-01-08 | 2021-05-28 | 张利峰 | Wafer rack positioning device in sensor monocrystalline silicon etching process |
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Application publication date: 20201106 |