CN111892881A - Preparation method of high-temperature-resistant high-holding-viscosity covering film or protective adhesive tape - Google Patents
Preparation method of high-temperature-resistant high-holding-viscosity covering film or protective adhesive tape Download PDFInfo
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- CN111892881A CN111892881A CN202010528706.0A CN202010528706A CN111892881A CN 111892881 A CN111892881 A CN 111892881A CN 202010528706 A CN202010528706 A CN 202010528706A CN 111892881 A CN111892881 A CN 111892881A
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09J2400/00—Presence of inorganic and organic materials
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Abstract
The invention belongs to the field of electronic materials and new materials, and particularly relates to a preparation method of a high-temperature-resistant high-holding-viscosity covering film or a protective adhesive tape. The method comprises the steps of 1, adding glue and performance enhancing components into a solvent to prepare glue; step 2, coating or sputtering glue on a layer of polymer base film, drying and pre-curing the glue by using a tunnel oven, and pasting a release film/paper on the glue layer to obtain a pre-cured covering film/protective adhesive tape; step 3, putting the film into a program type oven for post-curing to obtain a cured covering film/protective adhesive tape; and 4, putting the cured covering film/protective adhesive tape into a medium-low temperature oven for tempering treatment to obtain the product. In the invention, due to the adoption of proper glue, reinforcing components and solvent, the low content and high sustained viscosity of VOC in the cured glue layer are ensured; the process steps are reasonable, the adhesive layer can be gradually cured to completely form a high-quality three-dimensional cross-linked network, and the cohesion, high viscosity, high temperature resistance and stability of the comprehensive performance of the adhesive layer are ensured.
Description
Technical Field
The invention belongs to the field of electronic materials and new materials, and particularly relates to a preparation method of a high-temperature-resistant high-holding-viscosity covering film or a protective adhesive tape.
Background
The covering film/protective adhesive tape is a functional material which is widely applied to the manufacturing or using process of electronics, electrics, microelectronics, integrated packaging and electrical equipment and plays a role in protection. Since it is necessary to remain on the product to exert a continuous function and not to be aged or peeled off, the cover film/protective adhesive is required to have a property of continuously maintaining the adhesive ability in addition to a good protective ability.
However, the current electronic devices are developed to be "thin and light" and "small", and the products are limited by the environmental regulations such as RoHS and REACH, and more special materials and special processes matched with the special materials are used in the production process. The current cover film/protective tape cannot well meet the use requirements in the special process, which is specifically shown in the following steps: firstly, the adhesive is easy to age after being processed at high temperature (more than or equal to 300 ℃) for a long time, cannot ensure high permanent viscosity, and cannot adapt to the application requirements of multi-interface bonding and various bonding strengths; secondly, after a high temperature process, more Volatile Organic Compounds (VOC) overflow, which not only pollutes the product, but also causes serious health hazard to production personnel and environment.
Disclosure of Invention
The invention aims to provide a preparation method of a high-temperature-resistant high-viscosity covering film or a protective adhesive tape, aiming at the problems that the covering film/the protective adhesive tape is easy to age, the viscosity can not be maintained and more VOC overflows in a long-time high-temperature process.
In order to achieve the above purpose, the specific technical scheme of the invention is as follows:
a preparation method of a high-temperature-resistant high-holding-capacity adhesive covering film or protective tape comprises the following steps:
step 1, adding glue and a performance enhancing component into a solvent, and preparing glue for a covering film/a protective adhesive tape;
and 2, coating or sputtering the covering film/protective adhesive tape obtained in the step 1 on a layer of polymer base film by using glue, then baking and intervening and curing the film by using a tunnel oven to enable the glue to become a pre-cured glue layer, and pasting a release film/paper on the glue layer.
The polymer base film is any one of a PI film, a PET film, an LCP film, a PTFE film, a release film, release paper, a PVC film, a PP film, a PC film, a PEN film, a PEEK film, a PPO film, a PPS film, a COP film and a PE film.
Preferably, the polymer base film is one of a PI film, a PET film, an LCP film, a PPS film, a PTFE film, and a release film.
The thickness of the macromolecule basal membrane is 0.005 mm-10.0 mm. Preferably, the thickness is 0.005mm to 0.200 mm.
Step 3, putting the pre-cured covering film/protective adhesive tape obtained in the step 2 into a program oven for post-curing, removing most of VOC through a program with set temperature and corresponding time, and gradually and completely curing the adhesive layer to obtain the cured covering film/protective adhesive tape;
and 4, putting the cured covering film/protective adhesive tape obtained in the step 3 into a medium-low temperature oven for tempering treatment, and combining proper temperature and time to achieve the effects of releasing internal stress, improving adhesive holding capacity of the adhesive layer and removing residual VOC (volatile organic compounds), so as to obtain the high-temperature-resistant high-holding-capacity adhesive covering film or protective adhesive tape, wherein the covering film or the protective adhesive tape is of a single-layer structure.
To prepare a covering film or a protective tape having a two-layer structure, a step 2' is added between step 2 and step 3: and (3) coating or sputtering the covering film/protective adhesive tape obtained in the step (1) on the other surface of the polymer base film with the pre-cured adhesive layer obtained in the step (2) by using glue, then drying and intervening and curing the glue by using a tunnel oven to enable the glue to become the pre-cured adhesive layer, and pasting a release film/paper on the adhesive layer to obtain the pre-cured covering film/protective adhesive tape.
And 3, putting the pre-cured covering film/protective adhesive tape obtained in the step 2' into a program oven for post-curing, removing most of VOC through a program with set temperature and corresponding time, and gradually and completely curing the adhesive layer to obtain the cured covering film/protective adhesive tape.
And 4, putting the cured covering film/protective adhesive tape obtained in the step 3 into a medium-low temperature oven for tempering treatment, and combining proper temperature and time to achieve the effects of releasing internal stress, improving adhesive holding capacity of the adhesive layer and removing residual VOC (volatile organic compounds), so as to obtain the high-temperature-resistant high-holding-capacity adhesive covering film or protective adhesive tape, wherein the covering film or the protective adhesive tape is of a single-layer structure.
The glue comprises the following components in percentage by mass: 0.01 to 5 percent of reinforcing component, 30 to 50 percent of glue and the balance of solvent, and the total mass percentage content is 100 percent.
The glue is organic silica gel or acrylic acid glue; the performance enhancing component is a mixture of hydroxyethyl acrylate and azobisisobutyronitrile; the solvent is any one or a mixture of more of N-methyl pyrrolidone, N-dimethylformamide, dimethyl sulfoxide, N-dimethylacetamide, butanone, acetone, xylene, toluene, ethanol, methanol, ethyl acetate, diethyl ether, dichloromethane, trichloromethane, tetrachloroethane, phenol, benzene, cyclohexane and cyclohexanone.
In the reinforcing component, by weight, 10-50 parts of hydroxyethyl acrylate and 20-30 parts of azobisisobutyronitrile are used.
The reinforcing component can also comprise any one or a mixture of more of an antioxidant, a toughening agent, an accelerator, a curing agent, an anti-aging agent, a stabilizer, a plasticizer, a flame retardant and an ultraviolet absorber.
Preferably, the antioxidant is an antioxidant 1010, the ultraviolet light absorber is UV-531, the toughening agent is ETBN, and the plasticizer is triphenyl phosphate.
Preferably, the solvent is ethyl acetate, diethyl ether, toluene or cyclohexane.
When the polymer base film is coated or sputtered in the step 2, the step 2' and the step 3, the linear velocity of the polymer base film is 5-40m/min, and the coating or sputtering thickness is 0.001 mm-3.0 mm; preferably, the thickness is 0.003mm to 0.100 mm.
And 2, during drying and pre-curing in the steps 2, 2' and 3, setting the temperature of a tunnel oven to be 60-200 ℃, and when the release film/release paper is pasted, pasting the temperature to be 25-180 ℃, and pasting the pressure to be 0.005-0.500 MPa. And (3) setting the linear speed of the polymer base film and the temperature of the tunnel oven according to the difference of the components in the step (1) so as to ensure that the glue made of different components can be fully dried and pre-cured.
The temperature of the program oven for post-curing in the step 3 is set to be 60-200 ℃, and the time is set to be 1-8 hours. The post-curing means that intermolecular reaction basically stops after the adhesive layer is pre-cured, at the moment, the adhesive layer is heated and kept at a constant temperature for a period of time, the molecular reaction continues, and the density is continuously increased; and (3) setting the combination of temperature and time according to the difference of the components in the step (1) and the difference of the polymer base films in the step (2) so as to ensure that the optimal post-curing effect is achieved.
The temperature of the low-temperature oven for tempering treatment in the step 4 is set to be 60-150 ℃, and the time is set to be 1-8 hours. And (3) setting the combination of temperature and time according to the difference of the components in the step (1) and the difference of the polymer base films in the step (2) so as to ensure that the effects of optimally releasing internal stress, improving the adhesive layer viscosity and removing residual VOC are achieved.
Compared with the prior art, the invention has the beneficial effects that:
in the invention, proper glue is adopted, and a reinforcing component and a proper solvent are matched, so that the low content and high sustained viscosity of VOC in the cured glue layer are ensured.
In the invention, the glue layer can be gradually cured to completely form a high-quality three-dimensional cross-linked network due to the adoption of coating/sputtering, pre-curing and post-curing processes, so that the cohesion, high viscosity, high temperature resistance and stability of comprehensive performance of the glue layer are ensured.
In the invention, the cured covering film/protective adhesive tape is put into a medium-low temperature oven for tempering treatment, so that good effects of releasing internal stress, further improving the adhesive layer viscosity and removing residual VOC can be achieved.
In the invention, the low-temperature glue with specific combination can be matched with the processing capacity of medium-low temperature production equipment, and the rolling continuous operation can reduce the comprehensive cost and greatly improve the output efficiency.
Description of the drawings:
fig. 1 is a schematic view of the preparation process of the high temperature resistant high sustained-tack cover film/protective tape of the present invention.
FIG. 2 is a schematic view of a high temperature resistant high retention adhesive cover film/protective tape product stack
Detailed Description
In order to facilitate the understanding of the present invention, the process described in the present invention will be further described with reference to the accompanying drawings and the detailed description. It should not be understood that the scope of the above-described subject matter of the present invention is limited to the following examples.
The long-term temperature resistance measurement method of the cover film/protective tape in the following examples was measured with reference to IPC-TM-650, 2.6.8; IPC-TM-650,2.4.9 for permanent adhesive strength.
Example 1:
the components and contents (wy%) in the glue are as follows: 40% of acrylic acid glue, 4% of performance enhancing component and the balance of solvent ethyl acetate, wherein the total mass percentage is 100%.
The performance enhancing component comprises 40 parts of hydroxyethyl acrylate and 20 parts of azobisisobutyronitrile by weight.
The performance enhancing component additionally contains an antioxidant 1010, an ultraviolet light absorber UV-531 and a toughening agent ETBN. Wherein the addition amount of the antioxidant 1010 is 5 per mill of the total mass of the glue, the addition amount of the ultraviolet light absorber UV-531 is 1 percent, and the addition amount of the flexibilizer ETBN is 1 percent.
Adding the acrylic acid glue and the performance enhancing component into an ethyl acetate solvent according to a proportion, uniformly stirring to prepare the glue for the covering film, wherein the particle size of each substance in the glue is less than 0.5 um. And then coating the prepared glue on a layer of PI base film with the thickness of 0.025mm, wherein the coating thickness is 0.010 mm. Then, the mixture enters a tunnel oven with the temperature of 180 ℃ at the linear speed of 26m/min for drying and pre-curing, and a release film is pasted on the adhesive layer at the temperature of 80 ℃ and the pressure of 0.075 MPa; and repeating the operation (repeating the glue coating and the pre-curing steps) on the other side of the membrane to obtain the pre-cured double-sided covering membrane. And after the coil is unwound, putting the coil into a program oven for post-curing, and baking the coil for 3.0 hours at the temperature of 150 ℃ to finish curing. And finally, putting the film into a medium-low temperature oven for tempering treatment, and treating the film for 2.0 hours at the temperature of 120 ℃ to obtain the high-temperature double-sided high-viscosity covering film. The performance test of the covering film is carried out according to the record in the specific embodiment, the long-term temperature resistance is 360 ℃, the permanent adhesion strength is 3.2kgf/cm, and the VOC overflow in the whole process is 65 ppm.
Example 2:
the components and contents (wy%) in the glue are as follows: 50% of acrylic acid glue, 5% of performance enhancing component and the balance of solvent ether, wherein the total mass percentage sum is 100%.
The performance enhancing component comprises 50 parts of hydroxyethyl acrylate and 26 parts of azobisisobutyronitrile by weight.
The performance enhancing component also additionally contains an antioxidant 1010 and a toughening agent ETBN; the addition amount of the antioxidant 1010 is 3 per mill of the total mass of the glue, and the addition amount of the toughening agent ETBN is 3 percent.
Adding the acrylic acid glue and the performance enhancing component into an ether solvent, uniformly mixing to prepare the glue for the protective adhesive tape, wherein the particle size of each material in the glue is less than 0.5 um. And then coating the prepared glue on a layer of LCP (liquid Crystal Polymer) base film with the thickness of 0.100mm, wherein the coating thickness is 0.003mm, then, entering a tunnel oven with the temperature of 200 ℃ at the linear speed of 32m/min for drying and pre-curing, and pasting a release film on the glue layer at the temperature of 60 ℃ and the pressure of 0.05MPa to obtain the pre-cured single-sided protective adhesive tape. And after the coil is unwound, putting the coil into a program oven for post-curing, and baking the coil at the temperature of 120 ℃ for 1.5h to finish curing. And finally, putting the adhesive tape into a medium-low temperature oven for tempering treatment, and treating at the temperature of 100 ℃ for 3.0h to obtain the high-temperature single-side high-lasting-viscosity protective adhesive tape. The protective tape was subjected to a performance test as described in the detailed description, and the protective tape had a long-term temperature resistance of 340 ℃, a permanent adhesion strength of 2.3kgf/cm, and a VOC overflow in the entire process of 22 ppm.
Example 3:
the components and contents (wy%) in the glue are as follows: 40% of organic silica gel, 4% of performance enhancing component and the balance of solvent toluene, wherein the total mass percentage sum is 100%.
The performance enhancing component comprises 30 parts of hydroxyethyl acrylate and 25 parts of azobisisobutyronitrile by weight.
The performance enhancing component additionally comprises a toughening agent ETBN and a plasticizer triphenyl phosphate; the addition amount of the toughening agent ETBN is 2 percent of the total mass of the glue, and the addition amount of the plasticizer triphenyl phosphate is 3 per mill.
Adding acrylic acid glue and performance enhancing components into solvent toluene in proportion, stirring uniformly to prepare cover film glue, wherein the particle size of each substance in the glue is less than 0.5 um. Coating the prepared glue on a layer of PET base film with the thickness of 0.500mm, wherein the coating thickness is 0.030mm, then, feeding the PET base film into a tunnel oven with the temperature of 160 ℃ at the linear speed of 12m/min for drying and pre-curing, and pasting release paper on the glue layer at the temperature of 60 ℃ and the pressure of 0.06 MPa; the other side of the membrane is repeatedly operated to obtain the pre-cured double-sided covering membrane. And after the coil is unwound, putting the coil into a program oven for post-curing, and baking the coil for 3.0 hours at the temperature of 160 ℃ to finish curing. And finally, putting the film into a medium-low temperature oven for tempering treatment, and treating the film at the temperature of 120 ℃ for 2.h to obtain the high-temperature-resistant double-sided high-lasting-viscosity covering film. The long-term temperature resistance of the covering film is 315 ℃, the permanent adhesive strength is 2.6kgf/cm, and the VOC overflow in the whole process is 70 ppm.
Example 4:
the components and contents (wy%) in the glue are as follows: 45% of acrylic acid glue, 5% of performance enhancing component and the balance of solvent cyclohexane, wherein the total mass percentage is 100%.
The performance enhancing component comprises 45 parts of hydroxyethyl acrylate and 25 parts of azobisisobutyronitrile by weight.
The performance enhancing component additionally includes antioxidant 1010 and plasticizer triphenyl phosphate. The addition amount of the antioxidant 1010 is 3 per mill of the total mass of the glue, and the addition amount of the plasticizer triphenyl phosphate is 1 percent.
Adding the acrylic acid glue and the performance enhancing component into a cyclohexane solvent according to a certain proportion, uniformly stirring to prepare the glue for the protective adhesive tape, wherein the particle size of each substance in the glue is less than 0.5 um.
And then, sputtering the prepared glue on a layer of PTFE (polytetrafluoroethylene) base film with the thickness of 0.200mm, wherein the sputtering thickness is 0.055mm, then, entering a tunnel oven with the temperature of 180 ℃ at the linear speed of 6m/min for drying and pre-curing, and adhering a release film on the glue layer at the temperature of 80 ℃ and the pressure of 0.06MPa to obtain the pre-cured single-sided protective adhesive tape. And after the coil is unwound, putting the coil into a program oven for post-curing, and baking the coil at 165 ℃ for 2.0h to finish curing. And finally, putting the adhesive tape into a medium-low temperature oven for tempering treatment, and treating at the temperature of 130 ℃ for 3.0h to obtain the high-temperature-resistant single-sided high-sustained-viscosity protective adhesive tape. The long-term temperature resistance of the protective tape is 340 ℃, the permanent adhesion strength is 2.2kgf/cm, and the VOC overflow in the whole process is 38 ppm.
Example 5:
the components and contents (wy%) in the glue are as follows: 45% of acrylic acid glue, 5% of performance enhancing component and the balance of solvent cyclohexane, wherein the total mass percentage is 100%.
The performance enhancing component comprises 30 parts of hydroxyethyl acrylate and 25 parts of azobisisobutyronitrile by weight.
The performance enhancing component additionally includes an antioxidant 1010, an ultraviolet light absorber UV-531 and a plasticizer triphenyl phosphate. The addition amount of the antioxidant 1010 is 3 per mill of the total mass of the glue, the addition amount of the ultraviolet light absorbent UV-531 is 1 percent, and the addition amount of the plasticizer triphenyl phosphate is 1 percent.
Adding the acrylic acid glue and the performance enhancing component into an ethyl acetate solvent according to a certain proportion, uniformly stirring to prepare the glue for the protective adhesive tape, wherein the particle size of each substance in the glue is less than 0.5 um.
And then coating glue on the release film, wherein the coating thickness is 0.050mm, then, entering a tunnel oven with the temperature of 150 ℃ at the linear speed of 18m/min for drying and pre-curing, and adhering the release film on the glue layer at the temperature of 70 ℃ and the pressure of 0.055MPa to obtain the pre-cured pure glue layer protective tape. And after the coil is unwound, putting the coil into a program oven for post-curing, and baking at the temperature of 120 ℃ for 2.5H to finish curing. And finally, putting the adhesive tape into a medium-low temperature oven for tempering treatment, and treating at the temperature of 80 ℃ for 3.0H to obtain the high-temperature double-sided high-sustained-viscosity protective adhesive tape. The long-term temperature resistance of the protective adhesive tape is 380 ℃, the permanent adhesive strength is 3.6kgf/cm, and the VOC overflow in the whole process is 63 ppm.
The coverlay films or protective tapes prepared in examples 1 to 5 were subjected to performance tests with conventional coverlay films/protective tapes, and the results were as follows
*: the special process temperature is higher than 300 ℃ and the time is more than 2H, so that the product is required not to have aging permanent adhesion reduction and pollution organic matter separation;
**: according to IPC-TM-650, JIS-C-5016 and other international standards, and by combining with the simulation verification of the actual application process tightening of microelectronic products;
***: the data measured after treatment at 200 ℃ 2H according to international standards such as IPC-TM-650 and JIS-C-5016.
As can be seen from the table above, the covering film or the protective adhesive tape prepared by the method has high long-term temperature resistance, high permanent adhesion strength and VOC (volatile organic compound) overflow rate lower than 100 ppm.
Comparative example 1:
the preparation of the bilayer cover film was carried out according to the method in example 1, eliminating only step 4, i.e. the tempering step. The rest of the procedure was the same as in example 1. The long-term temperature resistance of the finally prepared covering film is 315 ℃, the permanent adhesion strength is 2.01kgf/cm, and the VOC overflow in the whole process is 165 ppm.
Comparative example 2:
preparing a protective tape according to the method in example 2, and only omitting the steps of putting the protective tape into a program oven for post-curing and baking the protective tape for 1.5h at the temperature of 120 ℃; it was subjected to a simple curing treatment (i.e. it was cured for 3h at ambient temperature). The rest of the procedure was the same as in example 2. The long-term temperature resistance of the finally prepared protective adhesive tape is 313 ℃, the permanent adhesion strength is 2.06kgf/cm, and the VOC overflow in the whole process is 168 ppm.
Comparative example 3:
the preparation of the two-layer covering film was carried out according to the method in example 1, except that the pre-curing step in example 1, which was carried out by drying in a tunnel oven at a temperature of 180 ℃ at a line speed of 26m/min, was omitted. The other steps are the same as the example 1, the long-term temperature resistance of the prepared double-layer covering film is 330 ℃, the permanent adhesion strength is 2.2kgf/cm, and the VOC overflow in the whole process is 108 ppm.
Comparative example 4:
the preparation of the double-layer covering film was carried out according to the method in example 1, and the influence of different formulations of the reinforcing component on the performance of the finally prepared double-layer covering film was tested; the test method is described in the same embodiment, and the test results are as follows:
although the present invention has been described in detail with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims.
Claims (10)
1. A preparation method of a high-temperature-resistant high-holding-capacity adhesive covering film or protective tape is characterized by comprising the following steps:
step 1, adding glue and a performance enhancing component into a solvent, and preparing glue for a covering film/a protective adhesive tape;
step 2, coating or sputtering the covering film/protective adhesive tape obtained in the step 1 on a layer of polymer base film by using glue, then baking and intervening and curing the film by using a tunnel oven to enable the glue to become a pre-cured glue layer, and pasting a release film/paper on the glue layer; obtaining a pre-cured cover film/protective tape;
step 3, putting the pre-cured covering film/protective adhesive tape obtained in the step 2 into a program oven for post-curing to obtain a cured covering film/protective adhesive tape;
and 4, putting the cured covering film/protective adhesive tape obtained in the step 3 into a medium-low temperature oven for tempering treatment to obtain the high-temperature-resistant high-holding-viscosity covering film or protective adhesive tape.
2. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: between step 2 and step 3, a step 2' may also be provided: coating or sputtering the covering film/protective adhesive tape obtained in the step (1) on the other surface of the polymer base film with the pre-cured adhesive layer obtained in the step (2) by using glue, then drying and intervening and curing the glue by using a tunnel oven to enable the glue to become the pre-cured adhesive layer, and pasting a release film/paper on the adhesive layer to obtain the pre-cured covering film/protective adhesive tape;
step 3, putting the pre-cured covering film/protective adhesive tape obtained in the step 2' into a program oven for post-curing to obtain a cured covering film/protective adhesive tape;
and 4, putting the cured covering film/protective adhesive tape obtained in the step 3 into a medium-low temperature oven for tempering treatment to obtain the high-temperature-resistant high-holding-viscosity covering film or protective adhesive tape.
3. The method for preparing the high temperature resistant high-retention adhesive cover film or the protective tape according to claim 1, wherein the glue in the step 1 comprises the following components in percentage by mass: 0.01-5% of performance enhancing component, 30-50% of glue and the balance of solvent, wherein the total mass percentage content is 100%.
4. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: the glue in the step 1 is organic silica gel or acrylic acid glue; the performance enhancing component is a mixture of hydroxyethyl acrylate and azobisisobutyronitrile; the solvent is any one or a mixture of more of N-methyl pyrrolidone, N-dimethylformamide, dimethyl sulfoxide, N-dimethylacetamide, butanone, acetone, xylene, toluene, ethanol, methanol, ethyl acetate, diethyl ether, dichloromethane, trichloromethane, tetrachloroethane, phenol, benzene, cyclohexane and cyclohexanone.
5. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 4, wherein: the performance enhancing component comprises, by weight, 10-50 parts of hydroxyethyl acrylate and 20-30 parts of azobisisobutyronitrile.
6. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 4, wherein: the performance enhancing component also comprises one or a mixture of more of an antioxidant, a toughening agent, an accelerant, a curing agent, an anti-aging agent, a stabilizing agent, a plasticizer, a flame retardant and an ultraviolet light absorber.
7. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: the polymer base film in the step 2 is any one of a PI film, a PET film, an LCP film, a PTFE film, a release film, release paper, a PVC film, a PP film, a PC film, a PEN film, a PEEK film, a PPO film, a PPS film, a COP film and a PE film.
8. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: the thickness of the macromolecule basal membrane in the step 2 is 0.005 mm-10.0 mm; and in the coating or sputtering in the step 2 and the step 3, the linear velocity of the polymer base film is 5-40m/min, and the coating or sputtering thickness is 0.001 mm-3.0 mm.
9. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: and (3) when the pre-curing is dried in the step 2, the step 2' and the step 3, the temperature of the tunnel oven is set to be 60-200 ℃, the attaching temperature is 25-180 ℃ when the release film/the release paper is attached, and the attaching pressure is 0.005-0.500 MPa.
10. The method for preparing the high temperature resistant high sustained-adhesion cover film or the protective tape according to claim 1, wherein: the temperature of the after-curing of the baking oven in the step 3 is set to be 60-200 ℃, and the time is set to be 1-8 hours; the temperature of the low-temperature oven for tempering treatment in the step 4 is set to be 60-150 ℃, and the time is set to be 1-8 hours.
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| CN114405750A (en) * | 2022-01-21 | 2022-04-29 | 合肥中科松为科技有限公司 | Preparation process of non-silicon pressure-sensitive adhesive tape |
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| CN114405750A (en) * | 2022-01-21 | 2022-04-29 | 合肥中科松为科技有限公司 | Preparation process of non-silicon pressure-sensitive adhesive tape |
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Application publication date: 20201106 |