CN111889834A - Novel structure and manufacturing method of higher-order mode absorber - Google Patents
Novel structure and manufacturing method of higher-order mode absorber Download PDFInfo
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- CN111889834A CN111889834A CN202010640143.4A CN202010640143A CN111889834A CN 111889834 A CN111889834 A CN 111889834A CN 202010640143 A CN202010640143 A CN 202010640143A CN 111889834 A CN111889834 A CN 111889834A
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- oxygen
- free copper
- absorber
- silicon carbide
- copper ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
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Abstract
The invention discloses a novel structure of a high-order mode absorber, which comprises silicon carbide with a barrel-shaped structure, an oxygen-free copper ring and a stainless steel ring, wherein the silicon carbide, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a welding flux groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring. The structure is simple, the volume is small, the manufacture is easy, the strength is high, the reliability is good, and the method is suitable for batch production. Also disclosed is a method of manufacture comprising: a. the feasibility demonstration of the thermal assembly of the oxygen-free copper ring and the silicon carbide; b. welding an oxygen-free copper ring and a stainless steel ring; c. installing an absorber; d. detecting the assembling tightness of the oxygen-free copper ring and the absorber; e. and (5) detecting the pressure of the water path. The method is simple, compact in structure, high in production success rate and short in cycle; meanwhile, chemicals and metal raw materials are less used in production and manufacturing, so that the production risk is reduced, and the environment protection is facilitated.
Description
Technical Field
The invention relates to a novel structure and a manufacturing method of a high-order mode absorber.
Background
The absorber is usually manufactured by adopting a structure of splicing and assembling a plurality of sheets, the manufacturing process is more, the structure is complex, and the absorption efficiency is low because gaps exist among the sheet silicon carbide. For absorption purposes, the structure size can only be increased to increase the silicon carbide area.
Disclosure of Invention
The invention aims to provide a novel structure of a high-order mode absorber, which has the advantages of simple structure, small volume, easy manufacture, high strength, good reliability and suitability for batch production.
The invention also aims to provide a manufacturing method of the high-order mode absorber, which has the advantages of simplicity, compact structure, high production success rate and short period; meanwhile, chemicals and metal raw materials are less used in production and manufacturing, so that the production risk is reduced, and the environment protection is facilitated.
In order to achieve the purpose, the invention provides a novel structure of a high-order mode absorber, which comprises silicon carbide, an oxygen-free copper ring and a stainless steel ring which are of barrel-shaped structures, wherein the silicon carbide, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; wherein the content of the first and second substances,
an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a welding flux groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring.
Preferably, the oxygen-free copper ring is heat shrink-fixed with the silicon carbide.
Preferably, the bucket structure of silicon carbide has dimensions of Φ 90 × Φ 79.6 × 130 mm.
The invention also provides a manufacturing method of the high-order mode absorber, which comprises the following steps:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide;
step b, welding the oxygen-free copper ring and the stainless steel ring;
step c, installing an absorber;
d, detecting the assembling tightness of the oxygen-free copper ring and the absorber;
and e, detecting the pressure of the water path.
Preferably, step a comprises: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber; secondly, the strength of the silicon carbide is demonstrated; then, the feasibility of assembly was demonstrated; and finally, demonstrating the working reliability of the absorber in actual work.
Preferably, a vacuum furnace is used for brazing in the step b, the solder is DHLAgCuPd28-20, and the brazing temperature is 900 ℃.
Preferably, the step c comprises the steps of putting the oxygen-free copper and stainless steel welding piece into a furnace integrally for heating, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving heat; after heat preservation is carried out for 0.5h, the part is taken out of the furnace, silicon carbide is quickly placed into an oxygen-free copper inner cavity, and then the silicon carbide is moved into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the oxygen-free copper or not and whether the end faces of the silicon carbide are obviously protruded or recessed in the circumferential direction or not.
Preferably, the step d comprises heating the assembled assembly to 100 ℃ again after the absorber is installed, and observing whether the absorber and the oxygen-free copper ring have loosening and displacement phenomena; after cooling to normal temperature, injecting alcohol into the joint of the absorber and one end of the oxygen-free copper ring for 1min, and observing whether alcohol exudes from the other end.
Preferably, step e includes connecting a manual pressure test pump to the inlet end of the water cooling pipe of the absorber assembly, pressing the water pump to discharge air in the water path cavity of the absorber assembly, sealing the other end, and pressurizing to 1.0MPa (10 kgf/cm)2) And after the pressure is maintained for 24 hours, whether the water seepage phenomenon exists inside and outside the absorber assembly or not is checked, and whether the silicon carbide is intact or not is checked.
According to the technical scheme, compared with other methods, the method is simple in production and manufacturing, compact in structure, high in production success rate and short in period. Moreover, chemicals and metal raw materials are less used, so that the production risk is reduced, and the environment protection is facilitated. Meanwhile, the material also combines the physical characteristics of the material, and has the advantages of ingenious design, high strength and good reliability.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the components of a higher order mode absorber of the present invention;
FIG. 2 is a schematic view of the welding of an oxygen-free copper ring to a stainless steel ring in the present invention;
FIG. 3 is a schematic structural view of an oxygen-free copper water-cooling ring according to the present invention;
FIG. 4 is a schematic view of a silicon carbide bucket structure according to the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, the directional words "inside, outside" and the like included in a term merely represent the orientation of the term in a conventional use state or a colloquial meaning understood by those skilled in the art, and should not be construed as limiting the term.
Referring to fig. 1 to 4, the present invention provides a novel structure of a high order mode absorber, which comprises a silicon carbide, an oxygen-free copper ring and a stainless steel ring with a barrel-shaped structure, wherein the silicon carbide, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; wherein the content of the first and second substances,
an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a welding flux groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring.
The oxygen-free copper ring and the silicon carbide are fixed by thermal shrinkage.
The dimensions of the barrel structure of silicon carbide are Φ 90 × Φ 79.6 × 130 mm.
The invention also provides a manufacturing method of the high-order mode absorber, which comprises the following steps:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide;
step b, welding the oxygen-free copper ring and the stainless steel ring;
step c, installing an absorber;
d, detecting the assembling tightness of the oxygen-free copper ring and the absorber;
and e, detecting the pressure of the water path.
The step a comprises the following steps: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber:
the size of the SiC ceramic is as follows: phi 90 x phi 79.6 x 130mm
Coefficient of expansion of SiC: 4.0x10-6/℃
The stainless steel has the following expansion coefficient: 17.0x10-6/℃(200℃)
The oxygen-free copper expansion coefficient is as follows: 17.3x10-6/℃(200℃)
The hot assembly temperature is 180 DEG C
Calculating the interference fit amount to be 0.22mm according to the conditions, and designing the inner diameter of the oxygen-free copper by adopting the interference amount of 0.1-0.15mm to select phi 89.85 as the SiC needs to be ensured to be in close contact with the outer sleeve after assembly+0.05mm。
Second, the strength of the silicon carbide is demonstrated:
the Vickers hardness of silicon carbide (SiC) is 22.2 +/-2.2 GPa, the pressure born by the SiC surface is 150MPa when the deformation of the inner surface of the oxygen-free copper is 0.22mm through computer simulation calculation, which is far less than the compressive strength of the material, and the product can be ensured not to be crushed after compression.
Then, the feasibility of the assembly was demonstrated:
according to data calculation, when the hot assembly temperature is 180 ℃, the expansion amount of the oxygen-free copper is 0.28mm, so that the fit clearance selected by us is 0.1-0.15mm, which can completely meet the requirement of hot shrinkage assembly.
Finally, the reliability of the absorber in actual operation is demonstrated, specifically:
since the primary working mechanism of the higher mode absorber is to convert microwave power into thermal power to be consumed, if the working temperature of the absorber is higher than the thermal assembly temperature, the silicon carbide will fall off during the operation. The heat conduction of the high order mode absorber is calculated based on the above reasons, and 3KW power settlement (normal working power is 1KW) is calculated and selected, and the result is as follows:
the temperature rise gradient of the absorption cavity when subjected to 3KW of power was found to be 4.83 ℃ from the results calculated in the table above.
As can be seen from the above calculation, the theoretical calculation shows that the temperature rise of the water is 4.76 ℃ after the 3kW power is completely absorbed by the water.
The welding process of the oxygen-free copper and the stainless steel is mature, the welding material is DHLAgCuPd28-20, the welding temperature is about 900 ℃, and the welding process of the welding material and the two materials is adopted to ensure the strength. The expansion coefficient of stainless steel is 18.2 x10 when the reference temperature reaches 600 DEG C-6K, expansion coefficient of oxygen-free copper is 19.3X 10-6And the difference between the two is small, the stress in the welding process is small, and the deformation of the welded assembly is small.
Step c, putting the oxygen-free copper and stainless steel welding piece into a furnace to be heated, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving heat; after heat preservation is carried out for 0.5h, the part is taken out of the furnace, silicon carbide is quickly placed into an oxygen-free copper inner cavity, and then the silicon carbide is moved into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the oxygen-free copper or not and whether the end faces of the silicon carbide are obviously protruded or recessed in the circumferential direction or not.
The absorber assembly absorbs heat in actual work and is heated up, in order to ensure that the absorber is still firm and not loosened in the work, the step d comprises heating the assembled assembly to 100 ℃ again after the absorber is installed, and observing whether the absorber and the oxygen-free copper ring have loosening and displacement phenomena; after cooling to normal temperature, injecting alcohol into the joint of the absorber and one end of the oxygen-free copper ring for 1min, and observing whether alcohol exudes from the other end.
Because oxygen-free copper is thinner with silicon carbide laminating department oxygen-free copper, and thickness is at 2mm, can warp under water-cooling water pressure's effect, also can extrude silicon carbide simultaneously, in order to ensure product safe and reliable after using, so will do the pressure test. According to computer simulation, when the absorber bears 3kW of power and the water flow rate is 0.15L/S, the cooling water pressure is 0.7Mpa/cm2, and the detection pressure is selected to be 1.0Mpa in consideration of the water pressure pulsation.
Therefore, the step e comprises connecting a manual pressure test pump at the inlet end of the water cooling pipe of the absorber assembly, pressing the water pump to discharge the air in the water channel cavity of the absorber assembly, sealing the other end, and pressurizing to 1.0MPa (10 kgf/cm)2) And after the pressure is maintained for 24 hours, whether the water seepage phenomenon exists inside and outside the absorber assembly or not is checked, and whether the silicon carbide is intact or not is checked.
Therefore, compared with other methods, the invention has the advantages of simple production and manufacture, compact structure, high production success rate and short period. Moreover, chemicals and metal raw materials are less used, so that the production risk is reduced, and the environment protection is facilitated. Meanwhile, the material also combines the physical characteristics of the material, and has the advantages of ingenious design, high strength and good reliability.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (9)
1. A novel structure of a high-order mode absorber is characterized by comprising silicon carbide, an oxygen-free copper ring and a stainless steel ring which are of barrel-shaped structures, wherein the silicon carbide, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; wherein the content of the first and second substances,
an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a welding flux groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring.
2. The novel structure of a higher order mode absorber as claimed in claim 1 wherein the oxygen free copper ring is heat shrink fixed with silicon carbide.
3. The novel structure of a higher order mode absorber as claimed in claim 1, wherein the size of the barrel structure of silicon carbide is Φ 90 x Φ 79.6 x 130 mm.
4. A method of making a higher order mode absorber, comprising:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide;
step b, welding the oxygen-free copper ring and the stainless steel ring;
step c, installing an absorber;
d, detecting the assembling tightness of the oxygen-free copper ring and the absorber;
and e, detecting the pressure of the water path.
5. The method for manufacturing a higher order mode absorber according to claim 4, wherein the step a comprises: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber; secondly, the strength of the silicon carbide is demonstrated; then, the feasibility of assembly was demonstrated; and finally, demonstrating the working reliability of the absorber in actual work.
6. The method for manufacturing a high order mode absorber according to claim 4, wherein step b is performed by soldering using a vacuum furnace, the solder is DHLAgCuPd28-20, and the soldering temperature is 900 ℃.
7. The method for manufacturing a high order mode absorber according to claim 4, wherein the step c comprises putting the oxygen-free copper and stainless steel welded piece into a furnace for heating, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving the heat; after heat preservation is carried out for 0.5h, the part is taken out of the furnace, silicon carbide is quickly placed into an oxygen-free copper inner cavity, and then the silicon carbide is moved into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the oxygen-free copper or not and whether the end faces of the silicon carbide are obviously protruded or recessed in the circumferential direction or not.
8. The method for manufacturing a high order mode absorber according to claim 4, wherein the step d comprises heating the assembled components to 100 ℃ again after the absorber is installed, and observing whether the absorber and the oxygen-free copper ring have loose displacement; after cooling to normal temperature, injecting alcohol into the joint of the absorber and one end of the oxygen-free copper ring for 1min, and observing whether alcohol exudes from the other end.
9. The method for manufacturing a high order mode absorber according to claim 4, wherein the step e comprises connecting a manual pressure test pump to the inlet end of the water cooling pipe of the absorber assembly, pressing the water pump to discharge the air in the water path cavity of the absorber assembly, and sealing the other end to achieve a pressure of 1.0MPa (10 kgf/cm)2) And after the pressure is maintained for 24 hours, whether the water seepage phenomenon exists inside and outside the absorber assembly or not is checked, and whether the silicon carbide is intact or not is checked.
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| DE29820174U1 (en) * | 1998-11-02 | 1999-04-01 | Grigull, Dietmar, 58840 Plettenberg | Absorber pipe connection |
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