CN111883516A - Packaging structure and packaging method of integrated module and electronic equipment - Google Patents
Packaging structure and packaging method of integrated module and electronic equipment Download PDFInfo
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- CN111883516A CN111883516A CN202010727355.6A CN202010727355A CN111883516A CN 111883516 A CN111883516 A CN 111883516A CN 202010727355 A CN202010727355 A CN 202010727355A CN 111883516 A CN111883516 A CN 111883516A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
Abstract
The invention discloses a packaging structure of an integrated module, a packaging method of the packaging structure and electronic equipment, wherein the packaging structure of the integrated module comprises a first substrate, a plurality of components, a sensor and a shielding structure, the plurality of components comprise a radio frequency front-end module and an array antenna, and the plurality of components are arranged on the first substrate; the sensor is arranged on the first substrate and used for sensing the temperature of the first substrate; the shielding structure is arranged corresponding to the radio frequency front end module. According to the invention, the sensor is arranged on the first substrate, and when the temperature of the first substrate is too high, the sensor can sense the temperature change in time, so that the function of monitoring the temperature of the integrated module is achieved; the shielding structure is arranged corresponding to the radio frequency front end module, so that electromagnetic radiation emitted by the array antenna during working can be shielded, the electromagnetic interference of the array antenna on the radio frequency front end module is reduced, and the radio frequency front end module can stably run.
Description
Technical Field
The invention relates to the technical field of wireless communication, in particular to a packaging structure of an integrated module, a packaging method of the packaging structure and electronic equipment.
Background
With the advent of the 5G era, the transmission rate of data has dramatically increased due to the application of array antennas. The array antenna is an antenna system formed by arranging and combining a plurality of same antennas according to a certain rule. Compared with a single antenna, the array antenna effectively enhances the directivity of the antenna, improves the gain of the antenna, and can realize beam scanning by changing the phase difference between adjacent antennas, so that the optimal transmitting direction moves along with a user, and the quality of data transmission is ensured. However, for the MIMO array antenna for 5G communication, each antenna unit needs to be configured with a PA (power amplifier), a LNA (low noise amplifier), a switch (radio frequency switch), and other radio frequency devices, so that a large number of radio frequency devices are gathered at the radio frequency front end, and a large number of antennas are arranged on the array antenna, so that the power consumption of the 5G radio frequency front end is large, and further, a problem of large heat generation occurs.
Disclosure of Invention
The invention mainly aims to provide an integrated module packaging structure, an integrated module packaging method and electronic equipment, and aims to solve the problem of high heat productivity of a radio frequency front-end module.
In order to achieve the above object, the present invention provides a package structure of an integrated module, which includes:
a first substrate;
the plurality of components comprise a radio frequency front end module and an array antenna, and are arranged on the first substrate;
the sensor is arranged on the first substrate and used for sensing the temperature of the first substrate; and the number of the first and second groups,
and the shielding structure is arranged corresponding to the radio frequency front-end module.
Optionally, the plurality of components and the sensor are respectively arranged on two opposite side surfaces of the first substrate; and/or the presence of a gas in the gas,
the sensor comprises an electrode plate and a nickel oxide thin film layer, wherein the electrode plate is arranged on the first substrate, and the nickel oxide thin film layer covers one side of the electrode plate, which deviates from the first substrate.
Optionally, one side of the first substrate, where the radio frequency front-end module is disposed, is a mounting side, the package structure of the integrated module further includes a second substrate disposed on the mounting side of the first substrate, and the shielding structure is disposed on the second substrate.
Optionally, the second substrate has an inner side surface facing the first substrate and an outer side surface facing away from the first substrate, and a first groove for accommodating the radio frequency front end module is formed on the inner side surface of the second substrate;
the shielding structure includes:
the metal layer is arranged on the outer side surface of the second substrate and corresponds to the first groove; and the number of the first and second groups,
a plurality of connecting members arranged at intervals in the circumferential direction of the metal layer and provided through the metal layer and the second substrate;
the metal layer and the plurality of connecting pieces form a shielding area, and the first groove is located in the shielding area.
Optionally, a plurality of connection holes are formed through the second substrate, the connection holes are arranged at intervals along the circumferential direction of the metal layer and penetrate through the metal layer and the second substrate, and a metal filler is filled in each connection hole to form the connecting member.
Optionally, the first substrate has a ground layer;
the plurality of connectors are electrically connected with the ground layer.
Optionally, a distance between every two adjacent connecting pieces is smaller than 1/4 wavelengths of electromagnetic waves emitted by the radio frequency front end module.
Optionally, the plurality of components further include an array antenna;
the second substrate is provided with an inner side surface facing the first substrate, and a second groove used for accommodating the array antenna is formed in the inner side surface of the second substrate.
In addition, the invention also provides an integrated module packaging method, which comprises the following steps:
providing a first substrate, a sensor, a shielding structure and a plurality of components, wherein the plurality of components comprise a radio frequency front end module and an array antenna;
disposing the sensor and the plurality of components on the first substrate, respectively;
and arranging the shielding structure corresponding to the radio frequency front end module.
Optionally, one side of the first substrate, on which the radio frequency front-end module is disposed, is a mounting side;
the step of setting the shielding structure corresponding to the radio frequency front end module comprises:
providing a second substrate, wherein the second substrate is provided with an inner side face and an outer side face which are oppositely arranged;
forming a metal layer on the outer side surface of the second substrate;
forming a plurality of connecting holes which are arranged at intervals along the circumferential direction of the metal layer and penetrate through the metal layer and the second substrate;
filling metal fillers into the connecting holes to form a plurality of connecting pieces, wherein the metal layer and the connecting pieces jointly form a shielding structure;
etching the area enclosed by the shielding structure to form a first groove on the inner side surface of the second substrate;
and correspondingly arranging the second substrate on the mounting side of the first substrate, so that the radio frequency front end module is accommodated in the first groove.
Optionally, after the step of providing the second substrate having the inner side surface and the outer side surface which are oppositely disposed, before the step of disposing the second substrate on the mounting side of the first substrate and accommodating the rf front end module in the first groove, the method further includes:
and etching the inner side surface of the second substrate to form a second groove corresponding to the array antenna.
Optionally, the first substrate has a ground layer;
after the step of correspondingly arranging the second substrate on the mounting side of the first substrate and accommodating the radio frequency front end module in the first groove, the method further comprises the following steps:
electrically connecting a plurality of the connectors to the ground layer.
Furthermore, the present invention also provides an electronic device, comprising:
a temperature control device;
the package structure of the integrated module as described above; and the number of the first and second groups,
and the controller is electrically connected with the temperature control device and the sensor of the packaging structure of the integrated module, and is used for controlling the temperature control device to work when the sensor senses the temperature of the first substrate of the packaging structure of the integrated module.
According to the technical scheme, the packaging structure of the integrated module comprises a first substrate, a plurality of components and sensors arranged on the first substrate, and a shielding structure, wherein the sensors are arranged on the first substrate, so that when the temperature of the first substrate is too high, the sensors can sense temperature changes in time, and the effect of monitoring the temperature of the integrated module is achieved; the shielding structure is arranged corresponding to the radio frequency front end module, so that electromagnetic radiation emitted by the array antenna during working can be shielded, the electromagnetic interference of the array antenna on the radio frequency front end module is reduced, and the radio frequency front end module can stably run.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a package structure of an integrated module according to the present invention;
FIG. 2 is a schematic diagram of a sensor package structure of the integrated module of FIG. 1;
FIG. 3 is a top view of a package structure of the integrated module of FIG. 1;
FIG. 4 is a flowchart illustrating a packaging method of an integrated module according to a first embodiment of the present invention;
FIG. 5 is a flowchart illustrating a packaging method for an integrated module according to a second embodiment of the present invention;
FIG. 6 is a flowchart illustrating a packaging method for an integrated module according to a third embodiment of the present invention;
fig. 7 is a flowchart illustrating a fourth embodiment of a packaging method for an integrated module according to the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
With the advent of the 5G era, the transmission rate of data has dramatically increased due to the application of array antennas. The array antenna is an antenna system formed by arranging and combining a plurality of same antennas according to a certain rule. Compared with a single antenna, the array antenna effectively enhances the directivity of the antenna, improves the gain of the antenna, and can realize beam scanning by changing the phase difference between adjacent antennas, so that the optimal transmitting direction moves along with a user, and the quality of data transmission is ensured. However, for the MIMO array antenna for 5G communication, each antenna unit needs to be configured with a PA (power amplifier), a LNA (low noise amplifier), a switch (radio frequency switch), and other radio frequency devices, so that a large number of radio frequency devices are gathered at the radio frequency front end, and a large number of antennas are arranged on the array antenna, so that the power consumption of the 5G radio frequency front end is large, and further, a problem of large heat generation occurs.
When the temperature of the integrated module is too high, the resistance of the metal parts in the integrated module is increased, which can cause the radiation efficiency of the antenna to be reduced; the temperature change causes the size of the antenna and the dielectric constant of the module material to change, thereby shifting the working frequency band of the antenna. In extreme cases, the array antenna and the rf device may even be burned.
In view of this, the present invention provides an electronic device, which may be a mobile terminal, a notebook computer, a 5G base station or other 5G devices, and the electronic device includes a temperature control device, an integrated module package structure 100 and a controller, wherein the integrated module package structure 100 includes a first substrate 1, a plurality of components, a sensor 3 and a shielding structure 4, the temperature control device may be a fan, a water cooling system, and the like, and the controller is electrically connected to the temperature control device and the sensor 3, respectively, and is configured to control the temperature control device to operate when the sensor 3 senses the temperature of the first substrate 1. When the temperature of first base plate 1 was too high, temperature parameter was monitored to sensor 3 to give the controller with signal transmission, when the controller was made the monitoring temperature and is higher than predetermined temperature threshold value, control temperature control device work, in order to cool down first base plate 1, make integrated module can move under suitable temperature, played the effect of protection integrated module.
Fig. 1 to fig. 3 are specific embodiments of the package structure 100 of the integrated module according to the present invention, and the structure of the package structure 100 of the integrated module will be described in detail with reference to the drawings.
Referring to fig. 1, the package structure 100 of the integrated module includes a first substrate 1, a plurality of components, a sensor 3, and a shielding structure 4, where the plurality of components include a radio frequency front end module 21 and an array antenna (not shown in the figure), and the plurality of components are disposed on the first substrate 1; the sensor 3 is arranged on the first substrate 1 and used for sensing the temperature of the first substrate 1; the shielding structure 4 is disposed corresponding to the rf front-end module 21 for providing shielding between the array antenna and the rf front-end module 21.
In the technical scheme of the invention, the packaging structure 100 of the integrated module comprises a first substrate 1, a plurality of components and sensors 3 arranged on the first substrate 1, and a shielding structure 4, wherein the sensors 3 are arranged on the first substrate 1, and when the temperature of the first substrate 1 is too high, the sensors 3 can sense the temperature change in time, so that the temperature of the integrated module is monitored; the shielding structure 4 is arranged corresponding to the radio frequency front end module 21, so that electromagnetic radiation emitted by the array antenna during working can be shielded, electromagnetic interference of the array antenna on the radio frequency front end module 21 is reduced, and the radio frequency front end module 21 can stably operate.
Among them, the first substrate 1 is used for mounting various components and sensors 3, and considering that high-frequency loss is large in 5G applications, the material of the first substrate 1 may be selected from high-resistance silicon, glass, ceramic or other materials with low loss, and a silicon wafer is preferable in this embodiment.
The plurality of components may be antennas, radio frequency devices, and the like, which need to be integrated on the first substrate 1. In this embodiment, the plurality of components include a radio frequency front end module 21 and an array antenna (not shown in the figure), wherein the radio frequency front end module 21 includes radio frequency components such as a power amplifier, a low noise amplifier, and a radio frequency switch.
Wherein, the sensor 3 is a temperature sensor 3 for sensing the temperature of the first substrate 1. The sensor 3 can be installed at any position of the first substrate 1, and in consideration of reducing the size of the package structure 100 of the integrated module, the sensor 3 and the plurality of components are preferably separately arranged on two opposite sides of the first substrate 1, as shown in fig. 1, the first substrate 1 has an upper side and a lower side, the plurality of components are installed on the upper side, and the sensor 3 is installed on the lower side, so that the space utilization degree of the first substrate 1 is improved, and the miniaturization requirement of a 5G product is favorably met.
The shielding structure 4 is used to provide a shielding environment for the radio frequency front end module 21 to avoid electromagnetic radiation of other components such as the array antenna, and the specific implementation form of the shielding structure 4 is not limited in the present invention, and may be any structure capable of playing a shielding effect, for example, a metal mesh, a metal cover, and the like, and the shielding structure 4 is arranged corresponding to the radio frequency front end module 21 to shield electromagnetic radiation emitted by the array antenna during operation, so as to reduce electromagnetic interference of the array antenna on the radio frequency front end module 21, and enable the radio frequency front end module 21 to operate stably.
Referring to fig. 2, in the embodiment, the sensor 3 includes the electrode plate 31 and the nickel oxide thin film layer 32, the electrode plate 31 is disposed on the first substrate 1, the nickel oxide thin film layer 32 covers a side of the electrode plate 31 away from the first substrate 1, the nickel oxide is a thermal sensitive material, and its thermal resistance is in a better linear relationship with temperature within a range of 0 to 200 ℃. In addition, the sensor 3 of the embodiment can be prepared by itself, the preparation process is simple, and the cost of the sensor 3 is reduced.
It is understood that RDL wiring layers are disposed on both upper and lower sides of the first substrate 1, as shown in fig. 1, a first wiring layer 11 is disposed on a lower side of the first substrate 1, and a second wiring layer 12 is disposed on an upper side of the first substrate 1, wherein the second wiring layer 12 is a radio frequency reference ground, i.e., a ground layer of the first substrate 1, and the first wiring layer 11 and the second wiring layer 12 are electrically connected through an electrical connection hole 15 penetrating the first substrate 1. In addition, in the present embodiment, it is preferable that the sensor 3 is mounted on the lower side of the first substrate 1, the component is mounted on the upper side (mounting side) of the first substrate 1, in order to ensure that the component and the sensor 3 operate normally, the sensor 3 is electrically connected to the first wiring layer 11, meanwhile, the third wiring layer 14 is disposed above the second wiring layer 12, the insulating layer 13 is filled between the second wiring layer 12 and the third wiring layer 14, the insulating layer 13 is penetrated by a plurality of vias 16 communicating the second wiring layer 12 and the third wiring layer 14, the second wiring layer 12 and the third wiring layer 14 are electrically connected by the vias 16, and the component is disposed on the third wiring layer 14, specifically, the third wiring layer 14 has a wiring point corresponding to the radio frequency front end module 21 and an array antenna wiring point 141 corresponding to the array antenna. The connection mode makes the high-frequency loss of the substrate smaller, which is beneficial to the application of 5G high-frequency occasions, and makes the connection between the devices shorter, which effectively reduces the signal loss.
Referring to fig. 1, a second substrate 5 may be disposed on the mounting side of the first substrate 1, and the shielding structure 4 is disposed on the second substrate 5, so that on one hand, the shielding effect may be achieved, and on the other hand, the second substrate 5 may protect the component. The material of the second substrate 5 may be high-resistance silicon, glass, ceramic, or the like with low loss, and a silicon wafer is preferable in this embodiment.
The second substrate 5 is stacked on the mounting side of the first substrate 1, and the second substrate 5 has an inner side facing the first substrate 1 and an outer side facing away from the first substrate 1. In order to enable the first substrate 1 and the second substrate 5 to be bonded to each other, the shielding structure 4 can cover the radio frequency front end module 21, so as to achieve the shielding effect, a first groove 51 for accommodating the radio frequency front end module 21 is formed on the inner side surface of the second substrate 5 in this embodiment.
A metal shielding layer may be provided on the groove bottom and the groove wall of the first groove 51, thereby forming the shielding structure 4; as shown in fig. 1 and 3, the shielding structure 4 may include a metal layer 41 and a plurality of connecting members 42. The metal layer 41 is arranged on the outer side surface of the second substrate 5 and is arranged corresponding to the first groove 51, and the plurality of connecting pieces 42 are arranged at intervals along the circumferential direction of the metal layer 41 and penetrate through the metal layer 41 and the second substrate 5; wherein the plurality of connectors 42 and the metal layer 41 enclose a shielding region, and the first recess 51 is located in the shielding region. The shielding structure 4 of the present embodiment is easy to process and has a low process cost.
Specifically, the second substrate 5 has a plurality of connection holes formed therethrough, the plurality of connection holes being spaced apart from each other in the circumferential direction of the metal layer 41 and being formed through the metal layer 41 and the second substrate 5, and each of the connection holes being filled with a metal filler to form the connection member 42. Among them, the material of the metal layer 41 and the metal filler is preferably copper.
Further, the distance S between every two adjacent connecting pieces 42 is smaller than 1/4 wavelengths of electromagnetic waves emitted by the radio frequency front end module 21, so that the electromagnetic shielding effect is ensured.
In addition, to further enhance the shielding effect, the plurality of connecting members 42 are electrically connected to the ground layer.
In addition, in order to reduce the influence of the second substrate 5 on the radiation frequency of the array antenna, in this embodiment, a second groove 52 is formed on the inner side surface of the second substrate 5 facing the first substrate 1, when the second substrate 5 is stacked on the mounting side of the first substrate 1, the second groove 52 corresponds to the array antenna, and the array antenna is accommodated in the second groove 52, and due to the arrangement of the second groove 52, the thickness of the second substrate 5 above the array antenna is reduced, so that the radiation efficiency of the array antenna is enhanced.
In addition, the present invention further provides a packaging method of an integrated module, which is used for manufacturing the packaging structure 100 of the integrated module. Fig. 4 is a first embodiment of a packaging method of an integrated module according to the present invention.
Referring to fig. 4, in the present embodiment, the method for packaging an integrated module includes the following steps:
step S10, providing the first substrate 1, the sensor 3, the shielding structure 4, and a plurality of components including the rf front-end module 21 and the array antenna.
The first substrate 1 is used for mounting various components and sensors 3, and considering that high-frequency loss is large in 5G application, the material of the first substrate 1 can be selected from high-resistance silicon, glass, ceramic and other materials with low loss, and a silicon wafer is preferred in the embodiment; the multiple components comprise a radio frequency front end module 21 and an array antenna, wherein the radio frequency front end module 21 comprises radio frequency components such as a power amplifier, a low noise amplifier and a radio frequency switch; the sensor 3 is a temperature sensor 3, preferably a sensor 3 which is composed of an electrode plate 31 and a nickel oxide film layer 32 grown in the middle area of the electrode plate 31 through magnetron sputtering; the shielding structure 4 is used to provide a shielding environment for the radio frequency front-end module 21 to avoid electromagnetic radiation of other components such as the array antenna, and the specific implementation form of the shielding structure 4 is not limited in the present invention, and may be any structure capable of playing a shielding effect, for example, a metal mesh, a metal cover, and the like.
In a specific implementation, a first wiring layer 11(RDL trace) may be disposed on the lower side of the first substrate 1, and a second wiring layer 12 may be disposed on the upper side, and the second wiring layer 12 is used as a radio frequency reference ground, i.e., a ground layer of the first substrate 1. Meanwhile, a plurality of electrical connection holes 15(TSV holes) are formed through the first substrate 1, and each electrical connection hole 15 is filled with a conductive material, such as a copper pillar, a copper wire, a silver paste, or the like, so that an electrical connection is formed between the first wiring layer 11 and the second wiring layer 12. An insulating material, such as MPI (modified polyimide), is then applied to the second wiring layer 12 to form an insulating layer 13, and a plurality of vias 16 are opened in the insulating layer 13 to expose portions of the second wiring layer 12 during application. Finally, a third wiring layer 14 is electroplated on the insulating layer 13 to form a radio frequency front end module 21 wiring point for mounting the radio frequency front end module 21 and an array antenna wiring point 141 for setting an array antenna, and a conductor is filled in the via hole 16, so that the third wiring layer 14 can be electrically communicated with the second wiring layer 12 through the via hole 16.
Due to the adoption of RDL wiring and TSV technology, on one hand, the high-frequency loss of the substrate is small, the application of 5G high-frequency occasions is facilitated, on the other hand, the connection line between the device and the device is short, and the signal loss is effectively reduced.
Step S20 is to dispose the sensor 3 and the plurality of components on the first substrate 1, respectively.
Preferably, the present embodiment mounts the sensor 3 on the lower side of the first substrate 1, and is connected to the first wiring layer 11; a plurality of components are disposed on the upper side of the first substrate 1 and connected to the third wiring layer 14, specifically, the array antenna is disposed on the array antenna wiring point 141 and electrically connected to the third wiring layer 14, the rf front-end module 21 is mounted at the wiring point of the rf front-end module 21 in an FC flip-chip manner, so that the bottom bump of the rf front-end module 21 is bonded to the second wiring layer 12 to form an electrical connection, and the bottom of the rf front-end module 21 is filled.
Step S30, the shielding structure 4 is set corresponding to the radio frequency front end module 21.
In this embodiment, the shielding structure 4 is disposed corresponding to the radio frequency front end module 21, and can shield the electromagnetic radiation emitted by the array antenna during operation, so as to reduce the electromagnetic interference of the array antenna to the radio frequency front end module 21, and enable the radio frequency front end module 21 to operate stably. Specifically, the shielding structure 4 may be disposed on a side of the first substrate 1 where the rf front-end module 21 is disposed, and the rf front-end module 21 is covered therein, so as to achieve an isolation effect on the rf front-end module 21.
In the method, the sensor 3 is arranged on the first substrate 1, and when the temperature of the first substrate 1 is too high, the sensor 3 can sense the temperature change in time, so that the function of monitoring the temperature of the integrated module is achieved. When the packaging structure 100 of the integrated module manufactured by the method of the embodiment is applied to electronic equipment such as a smart phone, temperature parameters can be monitored through the sensor 3, signals are sent to the controller, and when the controller monitors that the temperature is higher than a preset temperature threshold value, the temperature control device is controlled to work to cool the first substrate 1, so that the integrated module can operate at a proper temperature, and the integrated module is protected. Through setting up shielding structure 4 corresponding radio frequency front end module 21, can shield the electromagnetic radiation that array antenna during operation sent to reduce array antenna and to the electromagnetic interference of radio frequency front end module 21, make radio frequency front end module 21 steady operation. In addition, in the method of the embodiment, the array antenna, the radio frequency front-end module 21 and the sensor 3 are integrated in one package, so that a single device is realized, and the requirement for miniaturization of a 5G product is met.
Referring to fig. 5, a second embodiment of the packaging method of the integrated module according to the present invention is provided based on the first embodiment.
In the present embodiment, step S30 includes:
step S31, providing a second substrate 5, where the second substrate 5 has an inner side and an outer side oppositely disposed.
Among them, the material of the second substrate 5 is preferably a silicon wafer. RDL wiring is arranged on the outer side face and the inner side face of the second substrate 5, and the RDL layers on the two sides are electrically communicated through TSV holes.
In step S32, a metal layer 41 is formed on the outer surface of the second substrate 5.
A metal layer 41 is electroplated on the RDL layer on the outer side, the metal layer 41 preferably being a copper layer.
Step S33, forming a plurality of connection holes on the metal layer 41, the connection holes being arranged at intervals along the circumferential direction of the metal layer 41 and penetrating through the metal layer 41 and the second substrate 5.
In the present embodiment, a plurality of connection holes are formed in the metal layer 41 at intervals along the circumferential direction of the metal layer 41, and each connection hole penetrates through the metal layer 41 and the second substrate 5. And to ensure the electromagnetic shielding effect, the distance S between every two adjacent connecting holes is preferably smaller than 1/4 wavelengths of the electromagnetic wave emitted by the rf front-end module 21.
Step S34, filling a metal filler into the plurality of connection holes to form a plurality of connection pieces 42, where the metal layer 41 and the plurality of connection pieces 42 together form the shielding structure 4.
And electroplating and growing a metal filler in each connecting hole, wherein the metal filler is connected with the metal layer 41 to form a connecting piece 42, and the metal layer 41 and the plurality of connecting pieces 42 jointly enclose to form a structure which is the shielding structure 4. Among them, the metal filler is preferably metallic copper.
Step S35, etching the area enclosed by the shielding structures 4 to form a first groove 51 on the inner side of the second substrate 5.
The lower ends of the connecting members 42 define a shielding region on the inner side surface of the second substrate 5, and the shielding region is etched, so that a first groove 51 is formed on the inner side surface of the second substrate 5, and the first groove 51 is located in a region enclosed by the plurality of connecting members 42 and the metal layer 41.
Step S36, the second substrate 5 is correspondingly disposed on the mounting side of the first substrate 1, so that the rf front end module 21 is accommodated in the first recess 51.
In the embodiment, a wafer level packaging method is selected, and the second substrate 5 is disposed on the mounting side of the first substrate 1, so that the first groove 51 is ensured to correspond to the radio frequency front end module 21, so that the radio frequency front end module 21 is accommodated in the first groove 51, and the radio frequency front end module 21 is covered by the shielding structure 4, thereby playing a shielding role. In addition, the second substrate 5 may also protect components.
Referring to fig. 6, a third embodiment of the packaging method of the integrated module according to the present invention is provided based on the second embodiment.
In a specific implementation, after step S31 and before step S36, the method may further include:
step S37, etching the inner side surface of the second substrate 5 to form a second groove 52 corresponding to the array antenna.
In order to reduce the influence of the second substrate 5 on the radiation frequency of the array antenna, in this embodiment, the area corresponding to the array antenna on the inner side surface of the second substrate 5 is etched to form a second groove 52 corresponding to the array antenna on the inner side surface of the second substrate 5, when the second substrate 5 is correspondingly disposed on the mounting side of the first substrate 1, the array antenna is accommodated in the second groove 52, and due to the arrangement of the second groove 52, the thickness of the second substrate 5 above the array antenna becomes thinner, so that the radiation efficiency of the array antenna is enhanced.
It should be noted that step S37 only needs to be performed after step S31 and before step S36, and there is no precedence relationship between step S32 and step S35.
Further, referring to fig. 7, a fourth embodiment of the packaging method of the integrated module according to the present invention is provided based on the second embodiment.
After step S36, the method may further include the following steps:
step S38 is to electrically connect the plurality of connectors 42 to the ground layer.
After the second substrate 5 is disposed on the mounting side of the first substrate 1, the RDL layer on the inner surface of the second substrate 5 is brought into contact with the third wiring layer 14 on the first substrate 1, and the RDL layer and the third wiring layer 14 are bonded by solder, whereby the plurality of connectors 42 can be electrically connected to the ground layer, and the shield structure 4 can be grounded.
In addition, after step S38, the ball may be mounted on the lower side of the first substrate 1, and then the two substrates may be cut to obtain a single package structure.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (13)
1. An integrated module package structure, comprising:
a first substrate;
the plurality of components comprise a radio frequency front end module and an array antenna, and are arranged on the first substrate;
the sensor is arranged on the first substrate and used for sensing the temperature of the first substrate; and the number of the first and second groups,
and the shielding structure is arranged corresponding to the radio frequency front-end module.
2. The package structure of an integrated module according to claim 1, wherein the plurality of components and the sensor are respectively disposed on two opposite sides of the first substrate; and/or the presence of a gas in the gas,
the sensor comprises an electrode plate and a nickel oxide thin film layer, wherein the electrode plate is arranged on the first substrate, and the nickel oxide thin film layer covers one side of the electrode plate, which deviates from the first substrate.
3. The package structure of the integrated module according to claim 1, wherein the side of the first substrate on which the rf front-end module is disposed is a mounting side, the package structure of the integrated module further comprises a second substrate disposed on the mounting side of the first substrate, and the shielding structure is disposed on the second substrate.
4. The package structure of the integrated module according to claim 3, wherein the second substrate has an inner side facing the first substrate and an outer side facing away from the first substrate, the inner side of the second substrate being formed with a first recess for receiving the radio frequency front end module;
the shielding structure includes:
the metal layer is arranged on the outer side surface of the second substrate and corresponds to the first groove; and the number of the first and second groups,
a plurality of connecting members arranged at intervals in the circumferential direction of the metal layer and provided through the metal layer and the second substrate;
the metal layer and the plurality of connecting pieces form a shielding area, and the first groove is located in the shielding area.
5. The package structure of an integrated module according to claim 4, wherein a plurality of connection holes are formed through the second substrate, the plurality of connection holes are spaced apart from each other along a circumferential direction of the metal layer and are formed through the metal layer and the second substrate, and each of the connection holes is filled with a metal filler to form the connection member.
6. The package structure of an integrated module according to claim 4, wherein the first substrate has a ground layer;
the plurality of connectors are electrically connected with the ground layer.
7. The package structure of the integrated module according to claim 4, wherein a distance between every two adjacent connectors is less than 1/4 wavelengths of the electromagnetic waves emitted from the RF front-end module.
8. The package structure of the integrated module according to claim 3, wherein the second substrate has an inner side facing the first substrate, and the inner side of the second substrate is formed with a second recess for receiving the array antenna.
9. A method for packaging an integrated module is characterized by comprising the following steps:
providing a first substrate, a sensor, a shielding structure and a plurality of components, wherein the plurality of components comprise a radio frequency front end module and an array antenna;
disposing the sensor and the plurality of components on the first substrate, respectively;
and arranging the shielding structure corresponding to the radio frequency front end module.
10. The method for packaging an integrated module according to claim 9, wherein the side of the first substrate on which the rf front-end module is disposed is a mounting side;
the step of setting the shielding structure corresponding to the radio frequency front end module comprises:
providing a second substrate, wherein the second substrate is provided with an inner side face and an outer side face which are oppositely arranged;
forming a metal layer on the outer side surface of the second substrate;
forming a plurality of connecting holes which are arranged at intervals along the circumferential direction of the metal layer and penetrate through the metal layer and the second substrate;
filling metal fillers into the connecting holes to form a plurality of connecting pieces, wherein the metal layer and the connecting pieces jointly form a shielding structure;
etching the area enclosed by the shielding structure to form a first groove on the inner side surface of the second substrate;
and correspondingly arranging the second substrate on the mounting side of the first substrate, so that the radio frequency front end module is accommodated in the first groove.
11. The method for packaging an integrated module according to claim 10, wherein after the step of providing the second substrate having the inner side and the outer side opposite to each other, before the step of disposing the second substrate on the mounting side of the first substrate and accommodating the rf front-end module in the first recess, the method further comprises:
and etching the inner side surface of the second substrate to form a second groove corresponding to the array antenna.
12. The method for packaging an integrated module according to claim 10 or 11, wherein the first substrate has a ground layer;
after the step of correspondingly arranging the second substrate on the mounting side of the first substrate and accommodating the radio frequency front end module in the first groove, the method further comprises the following steps:
electrically connecting a plurality of the connectors to the ground layer.
13. An electronic device, comprising:
a temperature control device;
an integrated module package structure according to any one of claims 1 to 8; and the number of the first and second groups,
and the controller is electrically connected with the temperature control device and the sensor of the packaging structure of the integrated module, and is used for controlling the temperature control device to work when the sensor senses the temperature of the first substrate of the packaging structure of the integrated module.
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| CN202010727355.6A CN111883516A (en) | 2020-07-24 | 2020-07-24 | Packaging structure and packaging method of integrated module and electronic equipment |
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| CN202010727355.6A CN111883516A (en) | 2020-07-24 | 2020-07-24 | Packaging structure and packaging method of integrated module and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125859A (en) * | 2021-03-10 | 2021-07-16 | 青岛歌尔智能传感器有限公司 | Packaging structure for testing shielding effectiveness and shielding effectiveness testing method |
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