CN111879813A - Heat transfer performance parameter measuring device for heat-conducting medium for mounting IGBT (insulated Gate Bipolar transistor) module - Google Patents
Heat transfer performance parameter measuring device for heat-conducting medium for mounting IGBT (insulated Gate Bipolar transistor) module Download PDFInfo
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- CN111879813A CN111879813A CN202010678828.8A CN202010678828A CN111879813A CN 111879813 A CN111879813 A CN 111879813A CN 202010678828 A CN202010678828 A CN 202010678828A CN 111879813 A CN111879813 A CN 111879813A
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- 238000012546 transfer Methods 0.000 title claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 238000004088 simulation Methods 0.000 claims abstract description 10
- 238000012544 monitoring process Methods 0.000 claims abstract description 5
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 3
- 238000004321 preservation Methods 0.000 claims abstract description 3
- 238000012360 testing method Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B21/00—Portable power-driven screw or nut setting or loosening tools; Attachments for drilling apparatus serving the same purpose
- B25B21/002—Portable power-driven screw or nut setting or loosening tools; Attachments for drilling apparatus serving the same purpose for special purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/14—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for assembling objects other than by press fit or detaching same
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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Abstract
The invention discloses a heat transfer performance parameter measuring device for a heat-conducting medium for mounting an IGBT module, which comprises a simulation heat source for providing stable heating power, a thermal structure for air-cooled heat dissipation, local heat preservation and heat insulation and temperature measurement, and an intelligent tightening system for providing accurate tightening torque and torque monitoring for the bolt fastening connection of the simulation heat source, the heat-conducting medium and the heat dissipation structure in the thermal structure. The heat-conducting medium parameter measuring device provided by the invention can be used for measuring the heat transfer performance parameters of the heat-conducting medium with specific physical characteristics and dimensional characteristics under specific tightening load.
Description
Technical Field
The invention relates to a heat-conducting medium testing device, in particular to a heat-conducting medium parameter measuring device applied to IGBT module mounting in the production process of an IGBT power assembly of high-power electronic equipment.
Background
In the production process of an IGBT power module of high-power electronic equipment represented by an extra-high voltage converter valve, a direct-current circuit breaker, a wind power converter, an energy storage converter and the like, in order to improve the heat dissipation capacity of the IGBT module, a layer of heat-conducting medium is generally coated between the IGBT module and a thermal structure. Generally, the thermal conductivity of the thermal conductive medium is much lower than that of the IGBT module and the thermal solution metal conductor, and in order to effectively and rapidly conduct the heat of the IGBT module to the thermal solution, physical dimensions such as thickness, uniformity, and gap distribution of the thermal conductive medium need to be set reasonably. The establishment of the physical dimensions needs to be combined with corresponding experimental tests and mathematical statistical analysis to obtain the physical dimensions. The conventional heat-conducting medium parameter measuring device is generally only used for measuring parameters such as the heat conductivity coefficient of a heat-conducting medium, and the like, does not consider the heat-conducting performance parameters when the physical state of the heat-conducting medium changes under the action of different external forces of a connecting body of a heating structure and a heat dissipation structure, and finds that the conventional measuring device cannot stably measure the heat-conducting parameters when the state of the heat-conducting medium of an IGBT module and the external acting force changes when the conventional measuring device is directly transferred to the production process of the IGBT power assembly.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems, the invention provides a heat-conducting medium heat-transfer performance parameter measuring device for the mounting of an IGBT module, which can test the heat-conducting parameters of a heat-conducting medium to be measured under different torque values and provide accurate basic data for the design of the heat-conducting medium of the IGBT module.
The technical scheme is as follows: the invention adopts the technical scheme that the heat transfer performance parameter measuring device for the heat-conducting medium for the mounting of the IGBT module comprises a simulation heat source for providing stable heating power, a thermal structure for air cooling heat dissipation, local heat preservation and heat insulation and temperature measurement, and an intelligent tightening system for providing accurate tightening torque and torque monitoring for the bolt fastening connection of the simulation heat source, the heat-conducting medium and the heat dissipation structure in the thermal structure.
The design scheme of the simulation heat source is that the simulation heat source comprises a heat transfer substrate, a heating tube and a thermal power consumption testing system; the heating tube is a constant power electric heating element; the heat transfer substrate is a high-thermal-conductivity metal structural part which is used for integrating the heating tube and conducting heat to the heat dissipation structure through a heat conducting medium; the thermal power consumption testing system comprises a current transformer and a current collecting system and is used for monitoring the current passing through the heating tube in real time.
Further, the thermal solution includes a heat dissipation structure, a heat insulation structure, a thermal testing system and a cooling system, and the heat dissipation structure is a heat sink for carrying heat conducted from the simulated heat source to the heat dissipation structure; the thermal test system comprises a thermocouple and a data acquisition system, the thermocouple is arranged between the simulated heat source and the heat dissipation structure and clings to the surface of the heat dissipation structure, the thermocouple is arranged in a trisection manner along the length direction of the simulated heat source, and the data acquisition system acquires an electric signal of the thermocouple and is used for measuring real-time temperature data of the heat-conducting medium to be tested.
Preferably, the thermal solution further comprises an insulation structure and a cooling system; the heat insulation structure is made of an ultralow heat conductivity coefficient material and is used for isolating the heat dissipation structure and simulating heat transfer between a heat source and the external environment; the cooling system comprises a cooling fan for performing forced convection heat dissipation on the thermal structure and a confluence fan cover thereof, and is used for performing air cooling heat dissipation on the heat dissipation structure.
The design scheme of the intelligent tightening system is that the intelligent tightening system comprises a tightening motor, a torque and corner sensor and a torque and corner acquisition system; the tightening motor is an electric screwdriver with controllable torque, the operation torque precision reaches +/-0.02% of a target torque value, the torque and corner sensor integrated on the tightening motor and a torque and corner acquisition system connected with the torque and corner sensor are used for measuring the torque value applied to the fastener by the bit in the tightening process of the tightening motor and measuring the rotation angle of the fastener driven by the bit in the process from the moment when the torque value reaches a set value to the moment when the torque value reaches the target value.
Has the advantages that: compared with the prior art, the invention has the following advantages: 1. the invention fully considers the transfer of the thermal power consumption of the IGBT module and the relative thermal isolation with the external environment, simultaneously considers the influence of the tightening process parameters in the mounting process of the IGBT module, provides torque parameter feedback for the test of the heat-conducting medium by arranging an intelligent tightening system, and provides accurate basic data for the design of the heat-conducting medium of the IGBT module; 2. in the measuring process, in order to accurately measure the efficiency of the heat power consumption of the IGBT module transmitted through the heat-conducting medium, the heat-conducting medium parameter measuring device provided by the invention is adopted, so that stable real-time heat power consumption of a heat source can be obtained, and the physical parameters of the heat-conducting medium can be obtained by a steady-state testing method. By adopting the heat-conducting medium parameter measuring device provided by the invention, the influence of the operation process parameters in the mounting process of the IGBT module on the heat-conducting performance parameters of the heat-conducting medium is comprehensively considered, and the measured physical parameters of the heat-conducting medium are more real, so that the heat-conducting medium parameter measuring device has practical significance.
Drawings
FIG. 1 is a schematic view of a heat transfer performance parameter measuring apparatus for a heat transfer medium according to the present invention.
Detailed Description
The technical solutions of the present invention are further described below with reference to the accompanying drawings and examples to fully understand the objects, features and effects of the present invention.
The device for measuring the heat transfer performance parameters of the heat-conducting medium for the mounting of the IGBT module, disclosed by the invention, comprises a simulated heat source, a thermal structure and an intelligent tightening system, as shown in figure 1.
The simulation heat source comprises a heat transfer substrate 11, a heating tube 12 and a thermal power consumption testing system. The heating tube 12 is a constant power electric heating element and provides stable heat power consumption for the measuring device. The heat transfer substrate 11 is a high thermal conductivity metal member for integrating the heat generating tubes and transferring heat generated from the heat generating tubes to a heat dissipation structure in the thermal solution through a heat transfer medium. The thermal power consumption testing system is an electrical parameter testing device consisting of a current transformer 131 and a current acquisition system 132. The current transformer 131 induces a current from the current passing through the heating tube 12, and the current in the current transformer is collected by the current collecting system 132, so as to monitor the flowing current of the heating tube in real time, and determine the heating power of the heating tube.
The thermal solution includes a heat sink 21, a thermal insulation 22, a thermal test system 23, and a cooling system. The heat dissipating structure 22 is a heat sink for carrying heat simulating conduction of a heat source to the heat dissipating structure. The two side surfaces and the bottom surface of the heat dissipation structure 21 and the top of the simulated heat source are provided with heat insulation structures 22, the heat insulation structures 22 are maintenance structures made of materials with ultra-low heat conductivity coefficients and used for isolating the heat dissipation structure 21 and the simulated heat source from the external environment, heat of the simulated heat source is prevented from being dissipated to the environment in a convection mode, and the heat of the simulated heat source is completely transferred to the heat dissipation structure 21 through a heat conducting medium. The thermal test system 23 comprises a thermocouple and a data acquisition system, wherein the thermocouple is used for measuring the real-time temperature between a simulated heat source and the heat dissipation structure 21, is laid between the simulated heat source and the heat dissipation structure 21 and is tightly attached to the surface of the heat dissipation structure 21, and is arranged in trisection along the length direction of the simulated heat source to obtain the real-time temperature of the surface of the heat dissipation structure 21. The data acquisition system is used for acquiring the electric signals of the thermocouples and converting the electric signals into real-time temperature data. The cooling system performs forced convection heat dissipation on the thermal structure, and in this embodiment, the cooling fan 241 and the fan housing 242 thereof are adopted, and the fan housing 242 makes all the cooling air provided by the cooling fan be used for performing convection heat dissipation on the heat dissipation structure 21.
The intelligent tightening system comprises a tightening motor 31, a torque and rotation angle sensor 32 and a torque and rotation angle acquisition system 33. The tightening motor 31 is an electric screwdriver in a sensor control mode, and the operation torque precision reaches +/-0.02% of the target torque value. The torque and rotation angle sensor 32 is a sensor integrated with the tightening motor 31, and is used for measuring a torque value applied to the fastener by the bit during the tightening process of the tightening motor 31 and an angle at which the bit drives the fastener to rotate during the period from when the torque value reaches a certain set value to when the torque value reaches a target value. The torque and rotation angle acquisition system is used to acquire the torque and rotation angle applied to the fastener by the tightening motor 31, which are measured in real time by the torque and rotation angle sensor 32.
When the heat-conducting medium parameter measuring device is used, a 220V alternating current stabilized voltage power supply is input into the heating tube 12, and the current flowing through the heating tube 12 is measured, so that the real-time heating power of the heating tube 12 is obtained. A layer of heat-conducting medium to be tested with a specific gap characteristic and a certain thickness is coated between the heat-transferring substrate 11 and the heat-dissipating structure 21, a torque value is set, the simulated heat source is fixed on the heat-dissipating structure 21 through a fastener, such as a bolt, by using an intelligent tightening system, and real-time temperature data between the simulated heat source and the heat-dissipating structure 21 is tested in real time by using the thermal testing system 23. The method comprises the steps of measuring corresponding surface temperature data of the heat dissipation structure under different torque values, obtaining heat conduction performance parameters of the heat conduction medium through a calculation method of heat steady state conduction, obtaining a change rule of the heat conduction performance parameters of the heat conduction medium along with tightening parameters by adopting a mathematical statistics method, and providing a basis for performance development of the heat conduction medium. And a mathematical model among the physical dimension of the heat-conducting medium, the tightening parameters of the tightening motor, the real-time temperature data of the heat-conducting medium, the cooling air volume of the cooling system, the environmental temperature information and the heat transfer capacity of the heat-conducting medium can be established, and the measurement and the optimized design of the physical parameters of the heat-conducting medium are realized by a numerical optimization method.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are intended to limit the spirit and scope of the invention. Without departing from the design concept of the present invention, those skilled in the art should make various modifications and improvements to the technical solution of the present invention, such as changing the structural form of the simulated heat source, or changing the installation and tightening method of the simulated heat source, or changing the cooling manner of the heat dissipation structure, etc., all of which fall within the protection scope of the present invention, and the technical contents claimed by the present invention are all recited in the claims.
Claims (5)
1. A heat-conducting medium heat transfer performance parameter measuring device for IGBT module mounting is characterized in that: the device comprises a simulated heat source for providing stable heating power, a thermal structure for air cooling heat dissipation, local heat preservation and heat insulation and temperature measurement, wherein the simulated heat source, a heat-conducting medium and a heat dissipation structure in the thermal structure are in bolt fastening connection; the device also includes an intelligent tightening system that provides accurate tightening torque and torque monitoring for the bolt-on connection.
2. The apparatus for measuring heat transfer performance parameters of a heat transfer medium for IGBT module mounting according to claim 1, wherein: the simulation heat source comprises a heat transfer substrate, a heating tube and a heat power consumption testing system; the heating tube is a constant power electric heating element; the heat transfer substrate is a metal piece which is used for integrating the heating tube and transferring heat generated by the heating tube to a heat dissipation structure in the thermal solution through a heat-conducting medium; the thermal power consumption testing system comprises a current transformer and a current collecting system and is used for monitoring the current passing through the heating tube in real time.
3. The apparatus for measuring heat transfer performance parameters of a heat transfer medium for IGBT module mounting according to claim 1, wherein: the thermal structure comprises a heat dissipation structure, a heat insulation structure, a thermal test system and a cooling system, wherein the heat dissipation structure is a radiator used for bearing heat conducted from a simulated heat source to the heat dissipation structure; the thermal test system comprises a thermocouple and a data acquisition system, the thermocouple is arranged between the simulation heat source and the heat dissipation structure and clings to the surface of the heat dissipation structure, the thermocouple is arranged in a trisection manner along the length direction of the simulation heat source, and the data acquisition system acquires an electric signal of the thermocouple and is used for measuring real-time temperature data of the heat-conducting medium to be tested.
4. The apparatus for measuring heat transfer performance parameters of a heat transfer medium for IGBT module mounting according to claim 1, wherein: the heat insulation structure is made of an ultralow heat conductivity coefficient material; the cooling system comprises a cooling fan and a confluence fan cover which are used for carrying out forced convection heat dissipation on the thermal structure.
5. The apparatus for measuring heat transfer performance parameters of a heat transfer medium for IGBT module mounting according to claim 1, wherein: the intelligent tightening system comprises a tightening motor, a torque and corner sensor and a torque and corner acquisition system; the tightening motor is an electric screwdriver with controllable torque, the operation torque precision reaches +/-0.02% of a target torque value, the torque and corner sensor integrated on the tightening motor and a torque and corner acquisition system connected with the torque and corner sensor are used for measuring the torque value applied to the fastener by the bit in the tightening process of the tightening motor and measuring the rotation angle of the fastener driven by the bit in the process from the moment when the torque value reaches a set value to the moment when the torque value reaches the target value.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010678828.8A CN111879813A (en) | 2020-07-15 | 2020-07-15 | Heat transfer performance parameter measuring device for heat-conducting medium for mounting IGBT (insulated Gate Bipolar transistor) module |
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| CN202010678828.8A CN111879813A (en) | 2020-07-15 | 2020-07-15 | Heat transfer performance parameter measuring device for heat-conducting medium for mounting IGBT (insulated Gate Bipolar transistor) module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113033141A (en) * | 2021-02-26 | 2021-06-25 | 中国电子科技集团公司第五十四研究所 | Design and assembly method of heat conducting structure of digital board card |
| CN113391182A (en) * | 2021-06-09 | 2021-09-14 | 中车青岛四方车辆研究所有限公司 | IGBT thermal simulation device and semi-physical IGBT thermal simulation system |
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Application publication date: 20201103 |